Galvanic Series
Galvanic series is a series in which the metals and alloys are arranged
in the order of their corrosion tendencies. Metals placed at the top of
the series is more anodic and undergo corrosion faster.
Corrosion current: Corrosion current per unit area is another
parameter to be measured for judging corrosion rate of metals and
alloys. It is measured by coupling the metal with inert electrode like
graphite and immersed in sea water (4% NaCl solution)
Comparison between electrochemical series and galvanic series
Electrochemical series Galvanic series
E0 is measured for metals and E0 is measured for metals and alloys
nonmetals
E0 is measured by dipping pure metals E0 is measured by dipping metals and
in their IM salt solution. alloys in unpolluted sea water
SHE is used as reference electrode. Calomel electrode is used as reference
electrode
Position of a metal is fixed Position of metal and alloy may change
It predicts the relative displacement It predicts the relative corrosion
tendencies tendencies.
Cathodic protection (CP)
Cathodic protection is a technique used to control the corrosion of a
metal surface by making it the cathode of an electrochemical cell.
Force the metal to be protected as cathode so that corrosion can be
prevented.
There are two types of cathodic protection
1. Sacrificial anodic protection
2. Impressed current cathodic protection:
Sacrificial anodic protection or galvanic
protection: Here the metallic structure (e.g.
Underground pipe lines, cables, ship hulls
etc) to be protected is connected by a wire to
a more anodic metal. So the anodic metal
sacrifices and undergoes corrosion. Metals
like Mg, Zn and Al and their alloys are used
as sacrificial anode.
Impressed current cathodic protection:
In this method an impressed current is
applied to convert the corroding metal from
anode to a cathode. A direct current from a
DC source is applied to an anode (inert
material like graphite) which is buried
inside the soil and to the corroding metal
structure to be protected.
Electroless plating
Electroless plating is defined as a controlled autocatalytic deposition
of a continuous layer of a noble metal from its salt solution on a
surface of the base metal by using a suitable reducing agent without
using electrical energy.
Stability of plating: The stability of electroless plating depends on the
substrate material, the pretreatment process, the type of solution used,
pH and temperature during plating
The process of electroless plating involves the following
1. Preparation of the surface to be plated:
(a) Etching- Removal of impurities by acid treatment.
(b)Electroplating - A thin layer of the metal to be plated is coated on
the surface of the object.
(c) Chemical Treatment - The plastic objects and printed circuit
boards are treated with SnCl2 and PdCl2. A thin layer of Pd is
coated on the treated surface
2. Preparation of plating bath
a. Soluble salt of the metal (like chloride or sulphate)
b. Complexing agents like EDTA, tartarate, citrate etc to prevent
excess deposition.
c. Reducing agents like sodium thiosulphite, formaldehyde etc
d. Exaltants or accelerators like succinates, fluorides etc to enhance
the plating rate.
e. Stabilizers like calcium ions, lead ions, thiourea etc to prevent
decomposition of the bath and to impart stability to the solution.
f. Buffer solution like Boric acid to maintain pH.
Procedure: The article to be plated is immersed in the bath containing
metal salt and reducing agent. The deposition is controlled by the
amount of reducing agent.
Advantages
1. Electroless plating can be made on both metals and plastics.
2. Electrical power and other accessories are not required.
3. Gives uniform coating even on the objects with irregular shapes
4. Coating provides better wear resistance
Electroless Copper plating
Electroless copper plating is used to deposit a layer of copper on a
substrate without the use of electrical energy.
The object to be plated is degreased using organic solvent,
followed by acid treatment. This object is then immersed in plating
bath containing cupric salt, reducing agent, buffer and complexing
agent.
At Cathode: Cu2+ + 2e → Cu E = +0.34V ------------(1)
Overall reaction (1) + (2)
Cu2+ + 2HCHO + 40H- → Cu + 2HCO0- + 2H2O + H2
Electroless copper solutions, utilizing formaldehyde as reducing agent
and pH is above 12.
Uses
1. This type of coating is mainly used in double or multilayerd printed
circuit boards in which plating through holes is required.
2. This is used as base coating for subsequent electroplating
Electroless Nickel Plating
Metals like Al, Fe Cu and alloys like brass are plated with nickel.
Non-metallic materials like glass, plastic and quartz are pretreated
with SnCl2 in acid medium followed by treatment with PdCl 2
solution.
The pretreated object is immersed in the plating bath containing
nickel salt and reducing agent like sodium hypophosphite for a
certain time so that following reactions will occur and nickel gets
coated over the object.
Reactions
At cathode: Ni2+ +2e →Ni E0 = -0.26V -------------(1)
Anode: H2PO2- + H2O → H3PO3- +2H+ +2e E0 = -0.499V ------(2)
Over all reaction (1) +(2)
Ni2+ + H2PO2- + H2O →Ni + H3PO3- +2H+
As H+ ions are released in the reaction, pH of the solution increases To
maintain pH buffer solutions are generally used. This gives a uniform
fine grained plating.
Uses
1. In Aerospace components: For wear resistance, corrosion protection,
chemical resistivity and lubricity on valves, pistons, engine shafts etc.
2. In packing and handling machinery: Due to wear resistance,
cleanliness and attractive finish.
3. In chemical manufacturing: Used in chemical manufacturing and
storage equipment because it is chemical resistant.
4. In Automotive component: wear resistance and corrosion resistance
on pistons, cylinders, gears, fuel injector etc
