POLYIMIDES

Presented by: Saikrushna Jena

[Link] 1st yr.
2K19/PTE/02

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 OUTLINES:
 Introduction
 History
 Trade names & grades
 Chemical structure & monomer
 Classifications
 Synthesis
 Properties
 Additives
 Processing techniques
 Applications
 Global market
 Conclusion

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INTRODUCTION

 Most important highly heat resistant plastics

referred to as “exotics”.
 Mass production since 1955.
 High perfermance polymer of imide monomer
which contain 2 carbonyl groups (c=o) bonded to
nitrogen.
 Exist in two formats: i.e, thermosetting &
thermoplastic.
 Characterized by the imide group.

Imide linkage
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HISTORY

•Firstly in 1908 PI is synthesized but the report is

not so recognized.

•In 1950 synthesis of aromatic PI of high molecular

weight marking it as a true polymer material.

•Since 60- 80 years, the United States DuPont ,

Amoco corporation synthesized PI.

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TRADE NAMES & GRADES
 DuPont synthesized 3 grades of PI i.e,
1) film form (KAPTON)
2) block form( VESPEL)
3) laminates (PYROLINE)
VESPEL is available in 5 different formulation.

Trade Names: Arimid, Avimid, Denka Malecca,

KAPTON, Kay Fox, Kerimid , Larc , Parimid ,
Polyimidel, Skybond, Vespel.

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 MONOMERS & STRUCTURE :
 Synthesized from dianhydride (aromatic/ aliphatic) &
diamine ( aromatic/ aliphatic)
 Dianhydride used:
a)pyromellitic dianhydride
b)benzoquinone tetracarboxylic dianhydride
c) napthalene tetracarboxylic dianhydride
 Diamines used:
a) m-phenyl diamine
b) 4,4’-oxydianiline

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 Structure of monomers

Pyromellitic Benzoquinone Naphthalene tetracarboxylic

dianhydride tetracarboxylic dianhydride dianhydride

m-phenylene diamine
4,4’-oxydianiline

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CLASSIFICATIONS
 Depending upon the constituent of their main chain
classified as below-
a) Aromatic: aromatic dianhydride + aromatic diamine
b) Semi aromatic: any one part of the monomer aromatic.
c) Aliphatic : aliphatic anhydride + diamine.

 Depending on type of interaction between main chain

a) thermoplastic ( often called pseudo
thermoplastic)
b) thermosetting

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SYNTHESIS
 Synthesized by
a) polycondensation reaction
b) polyaddition reaction
 Polycondensation:
2 stage process
1st stage:
pyromellitic dianhydride
+
m- phenylene diamine (in dimethyl acetamide solvent)
|
poly(amic acid) soluable prepolymer
 Temperature to be maintained 20°c
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Synthesis(continued..)

2nd stage:
poly (amic acid) poly(m-phenylene
pyromellitimide)
poly(amic acid) undegoes cyclodehydration at
250°c – 300°c to form polyimide ( fullycured
insoluable & infusible)
 Elimination of by product like water.
 Highly exothermic process.

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Continued…

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Continued..

 Solvents used : dimethyl formamide, dimethyl

acetamide, N,N’-dimethyl pyrrolidene, dimethyl
sulfoxide etc.

 can be thermoplastic or thermosets.

 Aromatic PI 1st ly synthesized in 1908 but

commercially synthesized by DuPont in 1960 by
synthesis of pyromellitic anhydride & 4,4’-
oxydianiline.

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Continued...

Polyaddition :
 Mainly produce short chain prepolymer.
 Have unsaturated aliphatic end groups
 No liberation of volatile groups
 Have lower heat stability then polycondensed
PI.
 Only suitable as thermoset.

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 PROPERTIES:
Heterocyclic compounds in the chain are closely
packed. So it has

 High strength over wide temp.( > 500°c)

 High stiffness & hardness.
 High thermal stability due to the presence of
inert imide ring & high interchain interaction.
 High heat stability
 Excellent chemical resistance( except strong
alkali & oxidants)
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Properties..

 Presence of rigid imide & aromatic ring give

excellent mechanical toughness.
 Molecular ordering due to linearity & stiffness of
cyclic bacbone results lower coefficient of
thermal expansion then thermoplastic.
 Excellent dielectric properties.
 High resistance to high energy radiation.
 Highly flame resistant.

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general properties:
PROPERTIES VALUE
Density 1.48 grm/ cm³
Glass transition temp 250°c to 340°c
Thermal co efficient of expansion 5.5* 10 ¯⁵ /°c
Maximum service temp > 500°c
Dielectric strength 22 to 27.6 KV/min
Water absorption 0.32 mg
Tensile strength 75-100N/ mm²
Elongation at break 90%
flexibility 2.48-4.1GPa

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ADDITIVES:

 As melt processing is difficult for thermoset

PI, so functional additives & reinforcement
are importance.
 Functional additives: molybodenum (MoS₂),
graphite & PTFE.
 Reinforcements: carbon fiber, glass fiber &
aramide fiber.

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PROCESSING OF PI:
 Processing temp – 380°c to 430 °c.
 Drying before processing at 180 °c for 10 hr or
200°c for 5 hr.
 Although row PI is crystalline but extruded &
injection molded products are generally
amorphous.
 In order to increase servicing temp annealing
is done.
 For injection temp- 170°c to 200°c
 For extrusion temp- 400°c
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Continued...
 Some commercially available as semifinished
product which are manufactured by powder
sintering technique.
 Some are processed by compression
molding(annealing at 200°c.
 Multiple laminates are manufactured by
heated presses, by vaccume bag method or
low pressure autoclaves, filament winding.
 Some c- fiber reinforced PI based composite
processed by autoclave and RTM. Have
application above 370°c.
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Manufacturing of PI film:

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APPLICATIONS:

PI ( known as KAPTON) is widely used in

aerospace, automotive & electrical industry.
Insulation & passivation film:
 Flexible cables, insulating fils as magentic wire. (
ex- in laptop/ computer cable that connects the
main logic board to the display )
 electronics: test holder, chip trays, hard disk
drive,electricconnector, coil bobbins
 PI film : insulating integrated circuit board
high temp powder coating
transformer
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Continued...

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Continued..

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In solar cell:

 For high thermal stability toughness &

flexibility PI film is used in SOLAR CELL for
photovoltaic application.
 As substrate in cell phone antennas.

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Continued...
 Multilayred insulation as on spacecraft made
of PI coated with thin layer of Al. DuPont
VASPEL used for aerospace valve, seat &
seals.

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Continued...

 Mechanical parts:
Shape by sintering technique...
used as: brushing, bearing, sockets etc. PI
parts & sockets include P84NT, VTEC PI,
Meldin etc.

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Continued...

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Continued..

 Medical Applications:
cardiovascular catheters, retrieval devices,
neurological devices, drug delivery system
due to flexibility, high tensile
strength,biocompatibility, transparency &
smooth surface.

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TYPES of POLYIMIDE:

 Three imide polymers are found:

a) polyimides (PI)
b) polyamide imide ( PAI)
c) polyether imide (PEI)
POLYAMIDE IMIDE :
Produced in 1964.
Manufaturer: AMOCO (US)
Other name : Torlon
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synthesis

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continued..

POLYETHER IMIDE:
Produced in 1982
Manufacturer: SABIC, RTP company, Polyone
etc
High performance amorophous thermoplastic
based polymer.
Developed to overcome challenges associated
with PI i.e, problem in make the PI melt
processiable.
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GLOBAL MARKET OF PI:

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Continued..

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growth rate of PI films:

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REFERENCES:

 “Plastic Material” by John Bydson

 Wikipedia
 [Link]
guide/polyimide-pi-plastic
[Link]
asses/Polyetherimide%[Link]
 [Link]
als-science/polyimide.

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THANK YOU

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