STPS20H100CT/CF/CG/CR/CFP

HIGH VOLTAGE POWER SCHOTTKY RECTIFIER

MAIN PRODUCT CHARACTERISTICS
IF(AV)

2 x 10 A

A1

VRRM

100 V

A2

Tj

175C

VF (max)

0.64 V

A1
A2

NEGLIGIBLE SWITCHING LOSSES

HIGH JUNCTION TEMPERATURE CAPABILITY
GOOD TRADE OFF BETWEEN LEAKAGE CURRENT AND FORWARD VOLTAGE DROP
LOW LEAKAGE CURRENT
AVALANCHE RATED
INSULATED PACKAGE: ISOWATT220AB,
TO-220FPAB
Insulating Voltage = 2000V DC
Capacitance = 45 pF

DESCRIPTION
Dual center tap schottky rectifier designed for
high frequency miniature Switched Mode
Power Supplies such as adaptators and on
board DC/DC converters.

A1

A2

TO-220AB
STPS20H100CT

FEATURES AND BENEFITS

ISOWATT220AB
STPS20H100CF
A2
K
A1

A1

TO-220FPAB
STPS20H100CFP

A2
K

I2PAK
STPS20H100CR

A2
A1

D2PAK
STPS20H100CG

ABSOLUTE RATINGS (limiting values, per diode)

Symbol

Parameter

Value

Unit

VRRM

Repetitive peak reverse voltage

100

IF(RMS)

RMS forward current

30

10
20

250

IF(AV)

Average forward
current = 0.5

TO-220AB
D2PAK / I2PAK

Tc = 160C

per diode
per device

ISOWATT220AB Tc = 145C
TO-220FPAB
IFSM

Surge non repetitive forward current

tp = 10 ms sinusoidal

IRRM

Repetitive peak reverse current

tp = 2 s square F = 1kHz

IRSM

Non repetitive peak reverse current

tp = 100 s square

Tstg

Storage temperature range

- 65 to + 175

175

10000

V/s

Tj

Maximum operating junction temperature *

dV/dt Critical rate of rise of reverse voltage

dPtot
1
thermal runaway condition for a diode on its own heatsink
* :
<
dTj
Rth( j a )
August 2002 - Ed: 3G

1/7

STPS20H100CT/CF/CG/CR/CFP
THERMAL RESISTANCES
Symbol

Parameter

Rth (j-c)

Junction to case

Unit
C/W

TO-220AB / D PAK / I PAK

Per diode

1.6

ISOWATT220AB / TO-220FPAB

Per diode

TO-220AB / D PAK / I PAK

Total

0.9

ISOWATT220AB / TO-220FPAB

Total

3.2

TO-220AB / D PAK / I PAK

Coupling

0.15

ISOWATT220AB / TO-220FPAB

Coupling

2.5

Rth (c)

Value

C/W

When the diodes 1 and 2 are used simultaneously :

Tj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c)
STATIC ELECTRICAL CHARACTERISTICS (per diode)
Symbol

Parameter

Tests conditions

IR *

Reverse leakage current

Tj = 25C

Min.

VR = VRRM

Tj = 125C
VF **

Forward voltage drop

Pulse test :

Typ.

Max.

Unit

4.5

mA
V

Tj = 25C

IF = 8 A

0.71

Tj = 25C

IF = 10 A

0.77

Tj = 25C

IF = 16 A

0.81

Tj = 25C

IF = 20 A

0.88

Tj = 125C

IF = 8 A

0.56

0.58

Tj = 125C

IF = 10 A

0.59

0.64

Tj = 125C

IF = 16 A

0.65

0.68

Tj = 125C

IF = 20 A

0.67

0.73

* tp = 5 ms, < 2%
** tp = 380 s, < 2%

To evaluate the maximum conduction losses use the following equation :

P = 0.55 x IF(AV) + 0.009 x IF2(RMS)

Fig. 1: Average forward power dissipation versus

average forward current (per diode).

Fig. 2: Average forward current versus ambient

temperature (=0.5, per diode).

PF(av)(W)
8

IF(av)(A)
= 0.05

= 0.1

= 0.2

12

= 0.5

Rth(j-a)=Rth(j-c)

TO220AB

10

=1

Rth(j-a)=15C/W

ISOWATT220AB
TO-220FPAB

Rth(j-a)=40C/W

2
=tp/T

IF(av) (A)
0

2/7

10

=tp/T

tp

12

25

tp

Tamb(C)
50

75

100

125

150

175

STPS20H100CT/CF/CG/CR/CFP
Fig. 3: Non repetitive surge peak forward current
versus overload duration (maximum values, per
diode) (TO-220AB, D2PAK, I2PAK)
IM(A)
200
180
160
140
120
100
80
60
40 IM
20
0
1E-3

Fig. 4: Non repetitive surge peak forward current

versus overload duration (maximum values, per
diode) (ISOWATT220AB, TO-220FPAB).

120
100
Tc=50C
Tc=75C

80

Tj=75C

40
IM

20
t

t(s)

=0.5

1E-2

1E-1

1E+0

1.0

0.8

0.8
0.6
0.4

= 0.2
= 0.1

0.2

0.2

tp(s)
0.0
1E-3

1E-2

1E-1

1E+0

1E-1

1E+0

= 0.5

= 0.2

= 0.1
Single pulse

tp(s)

tp

Fig. 7: Reverse leakage current versus reverse

voltage applied (typical values, per diode).

1E+4

1E-2

Zth(j-c)/Rth(j-c)

Single pulse

=tp/T

t(s)

Fig. 6: Relative variation of thermal impedance

junction to case versus pulse duration (per diode)
(ISOWATT220AB, TO-220FPAB).

Zth(j-c)/Rth(j-c)

= 0.5

Tj=125C
t

=0.5

0
1E-3

1.0

0.4

Tj=50C

60

Tc=125C

Fig. 5: Relative variation of thermal impedance

junction to case versus pulse duration (per diode)
(TO-220AB, D2PAK, I2PAK).

0.6

IM(A)

140

0.0
1E-2

1E-1

1E+0

1E+1

Fig. 8: Junction capacitance versus reverse

voltage applied (typical values, per diode).
C(pF)

IR(A)

1000
F=1MHz
Tj=25C

Tj=150C

1E+3
Tj=125C

1E+2

500

Tj=100C

1E+1
1E+0

1E-2

200

Tj=25C

1E-1

VR(V)

VR(V)
0

10

20

30

40

50

60

70

80

90 100

100

10

20

50

100

3/7

STPS20H100CT/CF/CG/CR/CFP
Fig. 9: Forward voltage drop versus forward
current (maximum values, per diode).

100.0

Fig. 10: Thermal resistance junction to ambient

versus copper surface under tab (Epoxy printed circuit
board FR4, copper thickness: 35m) (D2PAK).
Rth(j-a) (C/W)

IFM(A)
80
70
60

Tj=150C
Typical values

10.0

50

Tj=125C

Tj=125C
Typical values

40
Tj=25C

30

1.0

20
10

VFM(V)

0.1
0.0

0.2

0.4

0.6

0.8

1.0

1.2

S(Cu) (cm)
0

10

15

20

25

30

35

PACKAGE MECHANICAL DATA

TO-220AB
REF.
H2

L5
L7
Dia

OPTIONAL

L6

L2

L9
D

F2
F1(x2)
L4

F
E

G1
G

4/7

A
C
D
E
F
F1
F2
G
G1
H2
L2
L4
L5
L6
L7
L9
M
Dia.

DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
4.30
4.60
0.169
0.181
1.22
1.32
0.048
0.052
2.40
2.72
0.094
0.107
0.33
0.70
0.013
0.028
0.61
0.93
0.024
0.037
1.14
1.70
0.045
0.067
1.14
1.70
0.045
0.067
4.95
5.15
0.195
0.202
2.40
2.70
0.094
0.106
10.00
10.40
0.394
0.409
16.00 Typ.
0.630 Typ.
13.00
14.00
0.512
0.551
2.65
2.95
0.104
0.116
14.80
15.75
0.583
0.620
6.20
6.60
0.244
0.260
3.40
3.94
0.134
0.155
2.60 Typ.
0.102 Typ.
3.75
3.89
0.148
0.153

40

STPS20H100CT/CF/CG/CR/CFP
PACKAGE MECHANICAL DATA
ISOWATT220AB
DIMENSIONS
REF.

Millimeters
Min.

A
B
D
E
F
F1
F2
G
G1
H
L2
L3
L4
L6
L7
Diam

Max.

4.40
4.60
2.50
2.70
2.50
2.75
0.40
0.70
0.75
1.00
1.15
1.70
1.15
1.70
4.95
5.20
2.40
2.70
10.00
10.40
16.00 typ.
28.60
30.60
9.80
10.60
15.90
16.40
9.00
9.30
3.00
3.20

Inches
Min.

Max.

0.173
0.181
0.098
0.106
0.098
0.108
0.016
0.028
0.030
0.039
0.045
0.067
0.045
0.067
0.195
0.205
0.094
0.106
0.394
0.409
0.630 typ.
1.125
1.205
0.386
0.417
0.626
0.646
0.354
0.366
0.118
0.126

PACKAGE MECHANICAL DATA

TO-220FPAB
REF.

A
B

Dia
L6
L2

L7

L3
L5
D
F1
L4
F2

F
G1
G

A
B
D
E
F
F1
F2
G
G1
H
L2
L3
L4
L5
L6
L7
Dia.

DIMENSIONS
Millimeters

Inches

Min.
Max.
4.4
4.6
2.5
2.7
2.5
2.75
0.45
0.70
0.75
1
1.15
1.70
1.15
1.70
4.95
5.20
2.4
2.7
10
10.4
16 Typ.
28.6
30.6
9.8
10.6
2.9
3.6
15.9
16.4
9.00
9.30
3.00
3.20

Min.
Max.
0.173
0.181
0.098
0.106
0.098
0.108
0.018
0.027
0.030
0.039
0.045
0.067
0.045
0.067
0.195
0.205
0.094
0.106
0.393
0.409
0.63 Typ.
1.126
1.205
0.386
0.417
0.114
0.142
0.626
0.646
0.354
0.366
0.118
0.126

5/7

STPS20H100CT/CF/CG/CR/CFP
PACKAGE MECHANICAL DATA
D2PAK
DIMENSIONS
REF.

Min.

C2

L2

D
L
L3
A1
B2

B
G
A2
2.0 MIN.
FLAT ZONE
V2

FOOT PRINT DIMENSIONS (in millimeters)

16.90

10.30

5.08
1.30

3.70
8.90

6/7

Millimeters

A
A1
A2
B
B2
C
C2
D
E
G
L
L2
L3
R
V2

Typ. Max. Min.

Inches
Typ. Max.

4.30
4.60 0.169
0.181
2.49
2.69 0.098
0.106
0.03
0.23 0.001
0.009
0.70
0.93 0.027
0.037
1.25 1.40
0.049 0.055
0.45
0.60 0.017
0.024
1.21
1.36 0.047
0.054
8.95
9.35 0.352
0.368
10.00
10.28 0.393
0.405
4.88
5.28 0.192
0.208
15.00
15.85 0.590
0.624
1.27
1.40 0.050
0.055
1.40
1.75 0.055
0.069
0.40
0.016
0
8
0
8

STPS20H100CT/CF/CG/CR/CFP
PACKAGE MECHANICAL DATA
I2PAK
DIMENSIONS
REF.

Inches

Min.

Typ. Max. Min.

Typ. Max.

4.30

4.60 0.169

0.181

A1

2.49

2.69 0.098

0.106

0.70

0.93 0.028

0.037

b1

1.20

1.38 0.047

0.054

b2

1.25

0.45

0.60 0.018

0.024

C2

1.21

1.36 0.048

0.054

8.95

9.35 0.352

0.368

1.40

0.049 0.055

2.44

2.64 0.096

0.104

10.00

10.28 0.394

0.405

13.10

13.60 0.516

0.535

L1

3.48

3.78 0.137

0.149

L2

1.27

1.40 0.050

0.055

Ordering type

Marking

Package

Weight

Base qty

Delivery mode

STPS20H100CT

STPS20H100CT

TO-220AB

2.20g

50

Tube

STPS20H100CF

STPS20H100CF

ISOWATT220AB

2.08g

50

Tube

STPS20H100CFP

STPS20H100CFP

TO-220FPAB

STPS20H100CR

STPS20H100CR

STPS20H100CG

STPS20H100CG

STPS20H100CG-TR

Millimeters

STPS20H100CG

2.0 g

50

Tube

1.49g

50

Tube

1.48g

50

Tube

1.48g

1000

Tape & reel

I PAK
D PAK
D PAK

Epoxy meets UL94,V0

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use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
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The ST logo is a registered trademark of STMicroelectronics

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