TMA, DMA, DSC and TGA of lead free solders

John H. Lau
Express Packaging Systems, Inc., Palo Alto, California, USA
Chris Chang
Express Packaging Systems, Inc., Palo Alto, California, USA

Keywords (1) Introduction where A is the material before reaction, B is the material
Analysis, Electronics packaging,
The low-cost tin-lead solders have been used as joining after reaction, ∆H is the heat absorbed or released, and k is
Solder
materials in the electronics industry for many years [1-11]. Arrhenius rate constant.
Their unique physical and mechanical properties have The Arrhenius equation is given by:
Abstract facilitated printed circuit board (PCB) assembly choices k = Zexp( − E a /RT)
Most of the electronics packaging
that have fueled creative advance packaging developments,
materials, especially solders, are where Z is the pre-exponential constant, Ea is the activation
such as solder bumped flip chip [1-4], ball grid array (BGA)
temperature dependent. Their energy of the reaction, R is the universal gas constant (8.314
packages [2, 3, 5] and chip scale packages (CSP) [1-3]. For
temperature-dependent material J/°C/mole), and T is the absolute temperature in degree
these packaging technologies, the Sn-Pb solder is the
properties can be obtained by Kelvin.
electrical and mechanical “glue” of the assembly.
TMA (thermal mechanical analy- The rate of reaction (dx/dt) can be directly measured by
In the past few years, different bills have been introduced
sis), DMA (dynamic mechanical DSC and can be expressed as:
at the US Congress to ban lead from a wide variety of uses,
analysis), DSC (differential
which include solders. The reasons are, among others: dx/dt = k(1 − x) n
scanning calorimetry), and TGA
(thermogravimetric analysis). In
1 lead and its compounds are ranked as one of the top ten
hazardous materials; and where dx/dt is the rate of reaction, x is the fraction reacted, t
this study, the thermal coefficient is the time, k is the Arrhenius rate constant, and n is the
of expansion (TCE), storage 2 lead is the number one environmental threat to children.
order of reaction.
modulus, moisture uptake, and Since then, many major US electronics companies, national Combining all the above equations and assuming a nth
melting point of two lead free laboratories, universities, research organizations, and solder order reaction kinetics and constant program rate, activation
solders, 96.5wt%Sn-3.5wt%Ag vendors worldwide have responded by initialing research energy, and pre-exponential constant, yielding:
and 42wt%Sn-58wt%Bi provided programs to eliminate lead from solders [12-35].
from two different vendors, are dx/dt = Zexp( − E a /RT)(1 − x) n
Today, 96.5wt%Sn-3.5wt%Ag (or simply 96.5Sn-3.5Ag)
measured by, respectively, TMA, and 42wt%Sn-58wt%Bi (42Sn-58Bi) are two of the most
DMA, TGA, and DSC. For compari- The fraction reacted x is directly related to the fractional
promising ones. Due to its higher melting temperature, area of the DSC reaction peak. The kinetic parameters Z,
son purpose, the 63wt%Sn- 96.5Sn-3.5Ag solder is suitable for high temperature environ-
37wt%Pb solder is also Ea, and n are determined by using an advanced multi-linear
ments such as automotive applications. On the other hand, for regression method (MLR).
considered.
low temperature applications such as flexible circuits and In this study, the solders are put into an aluminum pan
smart cards assemblies, 42Sn-58Bi solder is a good candidate (weight ~ 10 mg) and then put in DSC equipment. Thermal
due to its low melting temperature. It should be noted from a scan is carried out at a 2°C/min heating rate ranging from 40
cost perspective that Pb is $0.48/pound, tin is $3.56/pound, to 260°C. Figure 2 shows the typical heat flow verses tem-
Bi is $3.92/pound, and Ag is $100.08/pound (January, 1998), perature (endothermic) curve of the solders from Vendor A
i.e. Pb is many times cheaper than the others. and Figure 3 shows those from Vendor B. As is expected,
In this study, the TCE, storage modulus, moisture uptake, there is no reaction observed during the melting of solders.
and melting point of 96.5Sn-3.5Ag and 42Sn-58Bi solders Table I summarizes the average melting temperature of
provided from two different solder vendors are determined, these solders from Vendor A and Vendor B. (Since all the
respectively, by TMA, DMA, TGA, and DSC. These physi- solders under consideration are eutectic solders, they only
cal and mechanical properties are very important for the have a single melting point, i.e. the solidus temperature is
understanding (through finite element analysis) of the the same as the liquidus temperature.) It can be seen that the
solders’ behaviors and responses when they are used in a melting temperature (corresponding to the peak of the heat
packaging system. flow) of 63Sn-37Pb solder is about 183°C, of 96.5Sn-3.5Ag
is about 221°C, and of 42Sn-58Bi is about 138.89°C
(slightly higher than 138°C). These values are very close to
(2) Melting temperature of lead free those reported in the literature [3,11]. Also, the melting
solders by DSC temperature of the solders from Vendor A and Vendor B is
The objective of DSC is to measure the amount of energy almost the same.
(heat) absorbed or released by a sample as it is heated,
cooled or held at a constant (isothermal) temperature. The Figure 1
instrument design consists of two independent furnaces, one Specimen set-up for DSC (Differential Scanning Calorimeter)
for the sample and one for the reference, Figure 1. When an
exothermic or endothermic change occurs in the sample
material, energy is applied or removed to one or both
furnaces to compensate for the energy change occurring in
the sample. Since the system is always directly measuring
Received January 1999 energy flow to or from the samples, DSC can directly
Revised February 1999 measure melting temperature, glass transition temperature,
temperature onset of crystallization, and temperature onset
of curing. The kinetic software enables the user to analyze a
Soldering & Surface Mount
DSC peak to obtain specific kinetic parameters that charac-
Technology terize a reaction process.
11/2 [1999] 17–24 Any material reaction can be represented by the
following equation:
© MCB University Press k
[ISSN 0954-0911] A→B + ∆ H

[ 17 ]
John H. Lau and Chris Chang Figure 2
TMA, DMA, DSC, and TGA of lead Heat flow versus temperature curve for melting point of solders from vendor A
free solders
Soldering & Surface Mount 100
Technology
11/2 [1999] 17–24 90

80

70
Heat flow (mW)

60

50

40 63% Sn/37% Pb 96.5% Sn/3.5% Ag 58% Bi/42% Sn

Peak 182.83°C Peak 221.33°C Peak 139.22°C
30
Area 376.995 mJ Area 841.403 mJ Area 669.100 mJ
20 ∆H 49.605 J/g ∆H 75.987 J/g ∆H 55.518 J/g

10 Height 22.984 mW Height 31.900 mW Height 28.775 mW

0
0 50 100 150 200 250 300
Temperature (°C)

Figure 3
Heat flow versus temperature curve for melting point of solders from vendor B

120

100

80
Heat flow (mW)

60

58% Bi/42% Sn 63% Sn/37% Pb 96.5% Sn/3.5% Ag

40
Peak 138.89°C Peak 182.63°C Peak 220.99°C
Area 787.491 mJ Area 574.511 mJ Area 838.951 mJ
20 ∆H 55.089 J/g ∆H 53.304 J/g ∆H 74.866 J/g
Height 43.731 mW Height 34.067 mW Height 26.456 mW
0
0 50 100 150 200 250 300
Temperature (°C)
Table I
Physical and mechanical properties of solders temperature. The instrument design consists of the platinum
Storage modulus (GPa) Moisture absorption (per cent) wound furnace system which can be operated from –170°C
Type of M.P. TCE 20 hours of to 1,000°C range, Figure 4. The scan rate is from 0.1°C/min
solder (°C) (ppm) 30°C 70°C 125°C Dry steam aging to 100°C/min. The specimen is mounted between a quartz
63Sn37Pb platform and probe, then a static load (Fs) is applied to
Vendor A 182.8 20.5 31 28.6 18.3 0.015 0.017 specimen while the dimension of the specimen is monitored
63Sn37Pb by the linear variable differential transducer (LVDT)
Vendor B 182.6 20 30 27.3 21.2 0.014 0.017 throughout the analysis, Figure 5. The TCE of the material is
96.5Sn3.5Ag obtained by the slope of the dimension change verses tem-
Vendor A 221.3 22.1 34 32.2 18.7 0.022 0.023 perature curve, and glass transition of the material is
96.Sn3.5Ag obtained by the onset of the two different slopes of the curve.
Vendor B 221 23.2 33 32.7 29.2 0.012 0.015 In this study, the sample dimensions are 6.4 ± 0.2mm in
58Bi 42Sn diameter and 1.6 ± 0.1mm in height and they are measured
Vendor B 138.8 15.5 35.4 30.5 4.28 0.013 0.018 in an expansion quartz system (from 50 to 160°C except
48Sn-52Bi solder which is from 50 to 120°C). The heating
rate is 5°C/min. The typical expansion versus temperature
(3) TCE of lead free solders by TMA curves for solders from Vendor A is shown in Figure 6 and
The objective of TMA is to measure the change in dimen- from Vendor B is shown in Figure 7. It can be seen that,
sion of a sample (such as expansion or contraction) as the for 63Sn-37Pb solder the TCE is about 21 × 10–6 /°C, for
sample is heated, cooled or held at a constant (isothermal) 96.5Sn-3.5Ag solder the TCE is about 22.5, and for

[ 18 ]
John H. Lau and Chris Chang Figure 4 42Sn-58Bi solder the TCE is about 15.5. Again, these
TMA, DMA, DSC, and TGA of lead Schematic diagram of a TMA (thermal mechanical analyzer) values (also shown in Table I) are very similar to those
free solders and DMA (dynamic mechanical analyzer). TMA force motor reported in the literature and there is not significant differ-
applies static load while DMA force motor applies dynamic ence between the solders from Vendor A and Vendor B.
Soldering & Surface Mount
load on specimen
Technology
11/2 [1999] 17–24
(4) Storage modulus of lead free
solders by DMA
FORCE The dynamic (storage) modulus of the solders is measured
MOTOR with a three-point bending specimen (3.0 ± 0.3mm × 2.9 ±
0.3mm × 19 ± 3mm) in a DMA unit (30 to 130°C) at a
heating rate of 5°C/min, Figures 4 and 8. The objective of
DMA is to measure mechanical properties, such as modulus
as a function of time, temperature, frequency, stress or
combinations of these parameters. The instrument design
POSITION
SENSOR consists of the force motor which can be programmed to
apply constant stress, dynamic stress, or combinations of
both, Figures 4 and 8. The core rod applies stress to the
sample and is held in place using an electromagnetic sus-
pension. The ceramic furnace with platinum furnace
element is capable of heating and cooling at a very high rate
and also can be heated up to 1,000°C. For electronics
SPECIMEN FURNACE packaging materials, the flexural properties such as flexural
modulus and dynamic mechanical properties such as
storage modulus, loss modulus, and tan delta (tan8) can be
obtained with DMA.
The storage (dynamic) modulus, Es is a measure of the
energy stored per cycle of deformation and can be expressed
Figure 5 as:
Outlook of quartz tube, probe and specimen of TMA for TCE
measurement F x 3 cos δ
Es = d 3
4 y z∆
Fs
where Fd is the dynamic load, δ is the phase angle, x is the
clear-span between the supports, y and z are the dimensions
of the specimen, and ∆ is the maximum dynamic deflection
of the three-point bending solder specimen. Figure 9 shows
the typical dynamic flexural storage modulus, Es, as a
function of temperatures for the solders from Vendor A and
HEIGHT (y) Figure 10 shows those from Vendor B. It can be seen from
Figures 9 and 10 that the storage modulus is a function of
temperature, the higher the temperature the lower the
storage modulus. Table I shows the average Es at various
temperatures. It can be seen that near room temperature (at
30°C), the storage modulus of 63Sn-37Pb solder is about
30.5 GPa, 96.5Sn-3.5Ag solder is about 33.5 GPa, and
DIAMETER (d) 42Sn-58Bi solder is about 35.4 GPa. Thus, near room

Figure 6
Expansion versus temperature curve for TCE of solders from Vendor A

1.329

63% Sn/37% Pb
1.328
96.5% Sn/3.5% Ag
1.327 58% Bi/42% Sn
Expansion (mm)

1.326
TCE = 22.05 ppm
1.325

1.324 TCE = 20.48 ppm

1.323

1.322 TCE = 15.08 ppm

1.321
50 70 90 110 130 150
Temperature (°C)

[ 19 ]
John H. Lau and Chris Chang Figure 7
TMA, DMA, DSC, and TGA of lead Expansion versus temperature curve for TCE of solders from Vendor B
free solders
1.06
Soldering & Surface Mount
Technology
11/2 [1999] 17–24
1.058
TCE = 20.01 ppm

Expansion (mm) 1.056

1.054
TCE = 23.17 ppm

1.052

63% Sn/37% Pb
1.05 96.5% Sn/3.5% Ag
TCE = 15.51 ppm 58% Bi/42% Sn
1.048
50 70 90 110 130 150
Temperature (°C)

temperature, the 42Sn-58Bi solder has the largest storage

Figure 8 modulus.
DMA three-point bending specimen setup for dynamic (Fd) At higher temperature (60 ~ 70 °C), however, the storage
load modulus of 42Sn-58Bi solder is smaller than that of 96.5Sn-
3.5Ag solder (even it is still larger than that of 63Sn-37Pb
Fd solder). This could be because at these temperatures, it
exceeds half the melting temperature of 42Sn-58Bi solder.
At about 83 ~ 93 °C, the storage modulus of the 42Sn-58Bi
solder starts to become smaller than that of the 63Sn-37Pb
solder and drops rapidly to much smaller values as the
y z temperatures are approaching the melting temperature
(138.89 °C).
Modulus represents the stiffness of the material. The
higher the stiffness the stronger the material. Thus, near
room temperature, the strength of the 42Sn-58Bi solder is
higher than that of the 63Sn-37Pb and 96.5Sn-3.5Ag solders.
x
However, at higher temperatures (especially beyond 85°C),
the 42Sn-58Bi solder becomes very soft and should not be

Figure 9
Storage modulus versus temperature curve of solders from Vendor A

40

35

30
Storage Modulus (Gpa)

25

20

15 63% Sn/37% Pb

10 96.5% Sn/3.5% Ag

58% Bi/42% Sn
5

0
30 50 70 90 110 130 150
Temperature (°C)

[ 20 ]
John H. Lau and Chris Chang Figure 10
TMA, DMA, DSC, and TGA of lead Storage modulus versus temperature curve of solders from Vendor B
free solders
Soldering & Surface Mount 40
Technology
11/2 [1999] 17–24
35

Storage Modulus (Gpa) 30

25

20

15

58% Bi/42% Sn
10
63% Sn/37% Pb
5
96.5% Sn/3.5% Ag
0
30 50 70 90 110 130 150
Temperature (°C)

used as joining material for electronic packaging and inter- Figure 11

connections operated at these conditions. Liquidus temperatures of Sn-Pb-Bi system. “E” – ternary
Another drawback of 42Sn-58Bi solder is that it is not eutectic, “P” – ternary peritectic, and “e” – binary eutectic
compatible with components and substrates with lead
coated finishing. Even with a very small amount (~ 1 wt%)
of lead in the surface coating, it may significantly reduce the
thermal-fatigue life of the 42Sn-58Bi solder joint [32]. This
is because tiny amount of lead diffuses into the 42Sn-58Bi
solder and forms a small amount of 16Sn-32Pb-52Bi
ternary eutectic whose melting point is 95°C, Figure 11. The
ternary eutectic is shown as point “E” in the liquidus
temperature profiles of Sn-Bi-Pb system [33].
Comparing the storage modulus between the 63Sn-37Pb
and 96.5Sn-3.5Ag solders, it is found that the stiffness
(strength) of the 96.5Sn-3.5Ag solder is higher than that of
the 63Sn-37Pb solder. Also, it is noted that at higher tempera-
tures (>100°C), the storage modulus of the 63Sn-37Pb and
96.5Sn-3.5Ag solders from Vendor B is higher than that from
Vendor A. This could be due to the purity, contamination, or
preparation methods by Vendor A and Vendor B.

(5) Moisture absorption of lead free

solders by TGA
Figure 12
Two sets of tests are carried out to determine the moisture High sensitivity weight measurements with TGA (thermal
content of the solders, one is for a dry specimen and the gravimetric analyzer)
other is for a steam aged specimen. The steam aged speci-
men is prepared under steam evaporation for 20 hours in a
closed hot water bath. All the specimen weights are about
20 ~ 40 mg. Weight loss of solders is measured with the
TGA equipment (Figure 12) under 102°C for two hours.
The objective of TGA is to measure the change in mass
of a sample as the sample is heated, cooled or held at a
constant (isothermal) temperature. The instrument design
consists of the micro-balance, which allows the sensitive
measurement of weight changes as small as a few micro-
grams, a furnace, and sample holder area. The vertical
analytical design also serves to isolate the balance mecha-
nism from the furnace, eliminating temperature fluctuations
which cause drifts and non-linearity. This system can
measure curie point, decomposition temperature, moisture
uptake, and component separation.
The change in mass during a thermal scan can be
expressed as:
Wf − Wi
× 100 per cent
Wi

[ 21 ]
John H. Lau and Chris Chang
where Wf is the final weight after thermal scan and Wi is finite element analysis of packaging and interconnection
TMA, DMA, DSC, and TGA of lead the initial weight before thermal scan. Figures 13 and 14 systems with these solders. Some important results are
free solders respectively show the typical percentage weight change summarized as follows.
(moisture content) of solders (before and after 20 hours of • TMA, DMA, DCS, and TGA are very useful tool for
Soldering & Surface Mount
Technology
steam again) from Vendor A, while Figures 15 and 16 show determining the temperature-dependent material
11/2 [1999] 17–24 those from Vendor B. Their average moisture contents are properties of solders.
shown in Table I. It can be seen, as expected, that the mois- • The measured TCE and melting temperature of these
ture absorption of these solders is too small (<0.023 per solders are very close to those reported in the literature.
cent) to be significant. • The moisture absorption of these solders is too small to
be significant for most of the packaging applications.
• The storage modulus of these solders is strongly tempera-
(6) Summary ture dependent. The higher the temperature the lower the
The temperature-dependent physical and mechanical storage modulus.
properties such as the TCE, storage modulus, moisture • Near room temperatures, the storage modulus (stiffness)
uptake, and melting temperature of 96.5Sn-3.5Ag, 42Sn- of the 42Sn-58Bi solder is higher than that of 96.5Sn-
58Bi, and 63Sn-37Pb solders have been measured by the 3.5Ag and 63Sn-37Pb solders. However, at higher tem-
TMA, DMA, DSC, and TGA. These data are very useful for peratures (especially near 85°C) the storage modulus

Figure 13
Weight change ratio versus temperature curve of solders from Vendor A before steam aging

100.1

100.09

100.08 ∆y = 0.024% ∆y = 0.015%

100.07
Weight change ratio (%)

100.06
∆y = 0.022%
100.05

100.04

100.03
63% Sn/37% Pb
100.02

100.01 96.5% Sn/3.5% Ag

100 58% Bi/42% Sn

99.99
40 50 60 70 80 90 100 110 120
Temperature (°C)

Figure 14
Weight change ratio versus temperature curve of solders from Vendor A after 20 hours of steam aging

100.08

100.07 63% Sn/37% Pb

96.5% Sn/3.5% Ag
100.06
∆y = 0.025%
58% Bi/42% Sn
Weight change ratio (%)

100.05

100.04 ∆y = 0.017% ∆y = 0.023%

100.03

100.02

100.01

100

99.99
40 50 60 70 80 90 100 110 120
Temperature (°C)

[ 22 ]
John H. Lau and Chris Chang Figure 15
TMA, DMA, DSC, and TGA of lead Weight change ratio versus temperature curve of solders from Vendor B before steam aging
free solders
Soldering & Surface Mount 100.06
Technology
11/2 [1999] 17–24
100.05
∆y = 0.012%
∆y = 0.013%
Weight change ratio (%)
100.04

100.03 ∆y = 0.014%

100.02

100.01
63% Sn/37% Pb
96.5% Sn/3.5% Ag
100
58% Bi/42%Sn

99.99
30 50 70 90 110 130
Temperature (°C)

Figure 16
Weight change ratio versus temperature curve of solders from Vendor B after 20 hours of steam aging

100.06
63% Sn/37% Pb
100.05 96.5% Sn/3.5% Ag
58% Bi/42% Sn ∆y = 0.017%
Weight change ratio (%)

100.04

100.03
∆y = 0.018%

100.02
∆y = 0.015%

100.01

100

99.99
40 50 60 70 80 90 100 110 120
Temperature (°C)

(strength) of the 42Sn-58Bi solder is smaller than that of 4. Lau, J.H., Flip Chip Technologies, McGraw-Hill, New York,
the 96.5Sn-3.5Ag and 63Sn-37Pb solders and drops NY, 1996.
rapidly to very small values (i.e. becomes very soft). 5. Lau, J.H., Ball Grid Technology, McGraw-Hill, New York, NY,
1995.
• Do not use 42Sn-58Bi solder as joining material in 6. Lau, J.H., Chip On Board Technologies for Multichip Modules,
packaging systems which must be operated at higher than Van Nostrand Reinhold, New York, NY, 1994.
85°C environment. 7. Lau, J.H., Handbook of Fine Pitch Surface Mount Technology,
• The storage modulus of 96.5Sn-3.5Ag solder is higher Van Nostrand Reinhold, New York, 1994.
than that of 63Sn-37Pb solder. 8. Frear, D., Morgan, H., Burchett, S. and Lau, J., The Mechanics
of Solder Alloy Interconnects, Van Nostrand Reinhold, New
York, 1994.
References 9. Lau, J.H., Thermal Stress and Strain in Microelectronics
1. Lau, J. H. and Lee, W-S.R., Chip Scale Package: Design, Packaging, Van Nostrand Reinhold, New York, 1993.
Materials, Process, Reliability, and Applications, McGraw-Hill, 10. Lau, J.H., Handbook of Tape Automated Bonding, Van Nostrand
New York, NY, 1999. Reinhold, New York, NY, November 1992.
2. Lau, J. H., Wong, C.P., Prince, J.L. and Nakayama, W., 11. Lau, J.H., Solder Joint Reliability, Theory and Applications, Van
Electronics Packaging: Design, Materials, Process, and Nostrand Reinhold, New York, NY, 1991.
Reliability, McGraw-Hill, New York, NY, 1998. 12. Glazer, J., “Microstructure and mechanical properties of Pb-free
3. Lau, J.H. and Pao, Y.-H., Solder Joint Reliability of BGA, CSP, solder alloy for low-cost electronic assembly: a review”,
Flip Chip, and Fine Pitch SMT Assemblies, McGraw-Hill, New Journal of Electronic Material, Vol. 23 No. 8, 1994,
York, NY, 1997. pp. 693-700.

[ 23 ]
 13. Kang, S.K., “Lead (Pb) – free solders for electronic packaging”, 24. Yang, W., Felton, L.E. and Messler, R.W., “The effect of
John H. Lau and Chris Chang
Journal of Electronic Material, Vol. 23 No. 8, 1994, pp. 701-7. soldering process variables on the microstructure and mechani-
TMA, DMA, DSC, and TGA of lead
14. Shangguan, D., Achari, A. and Green, W., “Application of lead- cal properties of eutectic Sn-Ag/Cu solder joints”, Journal of
free solders
free eutectic Sn-Ag solder in no-clean thick film electronic Electronic Materials, Vol. 24 No. 10, 1995, pp. 1465-72.
Soldering & Surface Mount modules”, IEEE Transactions on Components, Packaging and 25. Darveaus, R. and Banerji, K., “Constitutive relations for tin-
Technology Manufacturing Technology – Part B, Vol. 17 No. 4, 1994, based solder joints”, Proceedings of the IEEE Electronic
11/2 [1999] 17–24 pp. 603-11. Components & Technology Conference, May 1992, pp. 538-51.
15. Shangguan, D.A. and Gao, G., “Lead-free and no-clean solder- 26. Stromswold, E.I., “Characterization of eutectic tin-silver solder
ing for automotive electronics”, Soldering & Surface Mount
joints”, PhD dissertation, The University of Rochester, 1993.
Technology, Vol. 9 No. 2, July 1997, pp. 5-8.
27. McCormack, M. and Jin, S., “Progress in the design of new
16. Hwang, J.S., Solder Paste in Electronics Packaging, Van
lead-free solders alloys”, Journal of Metals, Vol. 45 No. 7, July
Nostrand Reinhold, New York, NY, 1989.
17. Hwang, J.S., Modern Solder Technology for Competitive 1993, pp. 14-19.
Electronics Manufacturing, McGraw-Hill, New York, NY, 28. Felton, L.E., Taeder, C.H. and Knorr, D.B., “The properties of
1996. tin-bismuth alloys”, Journal of Metals, Vol. 45 No. 7, July 1993,
18. Frear, D.R., “The mechanical behavior of interconnect materials pp. 14-19.
for electronic packaging”, Journal of Metals, May 1996, 29. Grusd, A., “Lead free solders in electronics”, Proceedings of
pp. 49-53. Surface Mount International Conference, August 1998,
19. Vianco, P., Rejent, J., Artaki, I., Ray, U., Finley, D. and Jackson, pp. 648-61.
A., “Compatibility of lead-free solders with lead containing 30. Biocca, P., “Global update on lead-free solders”, Proceedings of
surface finishes as a reliability issue in electronic assemblies”, Surface Mount International Conference, August 1998,
Proceedings of the IEEE Electronic Components & Technology pp. 705-9.
Conference, May 1996, pp. 1172-83. 31. Wege, S., Habenicht, G. and Bergmann, R., “Manufacture and
20. Iida, A., Kizaki, Y., Fukuda, Y. and Mori, M., “The development reliability of alternate solder alloys”, Proceedings of Surface
of repairable Au-Al solid phase diffusion flip-chip bonding”, Mount International Conference, August 1998, pp. 699-704.
Proceedings of the IEEE Electronic Components & Technology 32. Mei, Z. and Holder, H., “A thermal fatigue failure mechanism
Conference, May 1997, pp. 101-7.
of 58Bi-42Sn solder joints”, ASME Transactions, Journal of
21. Vianco, P.T., Erickson, K.L. and Hopkins, P.L., Solid State
Electronic Packaging, Vol. 118, June 1996, pp. 62-6.
Intermetallic Compound Growth Between Copper and High
33. Humpston, G. and Jacobson, D., Principle of Soldering and
Temperature, Tin-Rich Solder – Part 1: Experimental Analysis,
Sandia National Labs (Contract Number DE-AC04- Brazing, ASM International, 1993.
94AL85000) Report, 1994. 34. Lau, J.H., “Creep of 96.5Sn-3.5Ag solder interconnects”,
22. Vianco, P.T. and D.R., “Issues in the replacement of lead- Soldering & Surface Mount Technology, Vol. 15, September
bearing solders”, Journal of Metals, Vol. 45 No. 7, July 1993, 1993, pp. 45-9.
pp. 36-40. 35. Ren, W., Lu, M., Liu, S. and Shangguan, D., “Thermal mechani-
23. Kand, S.K., and Sarkhel, A.K., “Lead (Pb) – free solders for cal property testing of new lead-free solder joints”, Soldering &
electronic packaging”, Journal of Electronic Materials, Vol. 23 Surface Mount Technology, Vol. 9 No. 3, October 1997,
No. 8, August 1994, pp. 701-8. pp. 37-40.

[ 24 ]