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Lap Shear Strength
In subject area: Engineering
Lap shear strength is defined as the measure of the adhesive's ability to
resist shear forces in a bonded assembly, typically determined by applying
in-plane shear stress to adhesive joints configured in a single lap shear
test. It is expressed in megapascals (MPa) based on the average strength of
multiple specimens.
AI generated definition based on: Handbook of Adhesives and Surface
Preparation, 2011
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Chapter
Selecting adhesives for marine
environments and pre-design
2012, Adhesives in Marine Engineering
J.R. Weitzenböck
Lap-shear test – strength
This is the most common test used for all types of adhesives. Lap-
shear strength is measured before and after ageing to assess the
ability of the adhesives to withstand adverse environments. The
relevant test standards are: ASTM D 1002, DIN EN 1465, ISO 4587.
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Chapter
Adhesives and Sealants
2006, Handbook of Adhesives and Sealants
Guy Rabilloud
4.5.1 Lap Shear Strength Measurement
The mechanical properties of adhesive joints are primarily
determined by applying an in-plane shear stress to the assemblies.
Fig. 23 shows the single lap shear configuration recommended in
ASTM D 1002, Federal Specification MMM-A 132 and Federal Test
Method Standard No. 175.
Figure 23. Lap shear strength determination: (a) test specimen
recommended in ASTM D1002 standard; (b) multilayer process used
to bond titanium alloy coupons with thermoplastic Larc TPI
polyimide adhesive.
The adhesive layer is applied between two aluminium coupons
(2024-T3 alloy), etched with chromic acid prior to bonding, typical
dimensions of which are 15.24 cm length, 2.54 cm width, and 0.15 cm
thickness, with an overlap length of 1.27 cm, leading to a bonding
area of 3.226 cm2. The assembly is maintained with one or two
clamps exerting a slight pressure and cured in an air-circulating
oven according to the appropriate thermal schedule. The lap shear
strength is then measured with a tensile machine at a pull rate of 1
to 2 mm min− 1 and expressed in MPa on an average of five
specimens. Obviously, this lap shear configuration combines a
predominant shear stress with significant peel and cleavage stresses
arising from the adhered bending. The lap shear strength method is
of universal use in the adhesive industry because of its ease in
specimen preparation and testing alike. In addition, the variation of
the lap shear strength as a function of the test temperature can be
easily determined by using a heating chamber. The adhesive
strength values discussed in the following sections have been
obtained by this standard method.
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Chapter
Accelerated curing of bonded joints
2023, Advances in Structural Adhesive Bonding (Second
Edition)
Morten VoßTill Vallée
30.2.2 Lap shear strength
In a subsequent step [54], the influence of accelerated curing using
CP on the second important metric for adhesives, lap shear strength,
was investigated. Three different substrates were considered:
aluminum, G-FRP, and wood. For wood and G-FRP, temperatures
were not controlled, and the induction ran at full power; for
aluminum, the time-temperature history was prescribed.
The mechanical results for all SLJ series produced with aluminum
and G-FRP are shown in Fig. 30.5 with attained lap shear strengths,
τu, being sorted by adherend material and adhesive. In addition, the
curing degree α was calculated as a function of measured curing
temperatures for the point in time mechanical testing was
performed using appropriate kinetic models developed in Ref. [55].
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Chapter
Test and Inspection Methods
2011, Adhesives Technology for Electronic Applications (Second
Edition)
James J. Licari, Dale W. Swanson
[Link] Tensile strength
Tensile strength is evaluated by pull testing on metal “lap-shear”
coupons, most often aluminum. A standard test method is ASTM
D1002, Apparent Shear Strength of Single-Lap-Joint Adhesively Bonded
Metal Specimens by Tension Loading (Metal-to-Metal).49 Aluminum
coupons are overlapped by 1/2 in (typical) and a wire is used as a
spacer to control bond line thickness. Method 5011, paragraph
[Link] of MIL-STD-883F references this specific method. Other
tensile lap-shear strength measurement tests are described in BSEN
1465, Adhesives Determination of Tensile Lap-Shear Strength of
Rigid-to-Rigid Bonded Assemblies (1995) and ISO 4587, Adhesives
Determination of Tensile Lap-Shear Strength of Rigid-to Rigid
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Chapter
Adhesive Bonding and Integrally
Cocured Structure: A Way to Reduce
Assembly Costs through Parts
Integration
2004, Manufacturing Processes for Advanced Composites
F.C. Campbell
8.4 Adhesive Testing
Adhesive bond strength is usually measured by the simple single lap
shear test as shown in Fig. 9. The lap shear strength is reported as
the failure stress in the adhesive, which is calculated by dividing the
failing load by the bond area. Since the stress distribution in the
adhesive is not uniform over the bond area (it peaks at the edges of
the joint as previously shown in Fig. 3), the reported shear stress is
lower than the true ultimate strength of the adhesive. While this test
specimen is relatively easy to fabricate and test, it does not give a
true measure of the shear strength due to adherend bending and
induced peel loads. In addition, there is no method of measuring the
shear strain and, thus, of calculating the adhesive shear modulus
required for structural analysis. To measure the shear stress versus
shear strain properties of an adhesive as previously shown in Fig. 4,
an instrumented thick adherend test can be run where the
adherends are so thick that the bending forces are negligible.
However, the single lap shear test is an effective screening and
process control test for evaluating adhesives, surface preparations,
and for in-process control. There are many other tests for
characterizing adhesive systems, many of which are summarized in
Ref. 4.
Fig. 9. Typical Single Lap Shear Test Specimen
When testing or characterizing adhesive materials, there are several
important points that should be considered: (1) all test conditions
must be carefully controlled including the surface preparation, the
adhesive and the bonding cycle; (2) tests should be run on the actual
joint(s) that will be used in production; and (3) a thorough
evaluation of the in-service conditions must be carried out,
including temperature, moisture and any solvents or fluids that the
adhesive will be exposed to during its service life. The failure modes
for all test specimens should be examined. Some acceptable and
unacceptable failure modes are shown in Fig. 10. For example, if the
specimen exhibits an adhesive failure at the adherend-adhesive
interface rather than a cohesive failure within the adhesive, it may
be an indication of a surface preparation problem that will result in
decreased joint durability.
Fig. 10. Typical Failure Modes of Bonded Joints
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Chapter
Adhesives for Electronics
2011, Handbook of Adhesives and Surface Preparation
Guy Rabilloud
[Link] Bond Strength
A major requirement for devices attached with an organic material is
an adhesive strength sufficient to last the life of the circuits and to
withstand the environmental, thermal, and mechanical exposures
during processing and testing. Generally, shear strength is not a
problem with epoxies because values over 20 MPa are easily
attainable. However, to obtain reliable results, the properties of the
materials and the process parameters must be carefully controlled.
In particular, the surfaces to be bonded are thoroughly cleaned with
both polar and nonpolar solvents to remove all organic and inorganic
residues. Because of its general use in the semiconductor industry to
remove traces of organic materials, plasma cleaning is now widely
accepted to produce clean surfaces before die attachment. In the
case of gold-plated surfaces, the adhesive strength is improved
either by abrading the gold layer or by using a primer or a coupling
agent. The qualification of an adhesive for a given application
requires a series of tests to determine the process parameters, the
resistance to organic solvents, and the behavior of the assembly
during thermal aging and environmental stressing. The procedures
and conditions for the bond-shear strength are given in MSFC-SPEC-
592 for dice, substrates, and capacitors bonded with organic
adhesives. It specifies measurements at room temperature, at 150 °C,
after solvent immersion, after temperature cycling, and after aging
for 1000 h at 150 °C. For the last three conditions, a 70–80% retention
of the initial bond strength is required.
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Chapter
Advances in polyurethane structural
adhesives
2010, Advances in Structural Adhesive Bonding
Bernd Burchardt
3.2.1 Lap shear strength
In technical data sheets, structural adhesives are usually
characterised by LSS, determined according to DIN 53283. The
design of the test samples is shown in Fig. 3.3, where the width I is
usually 25 mm and the overlap length b is 12.5 mm. The LSS values
give an indication of the strength of an adhesive, but can never be
used to calculate the strength of a bonded structure, since this is
strongly related to the geometry of the samples and the mechanical
properties of the substrates. When measuring the LSS of high
strength PUR or EP adhesives with thin metal sheets (e.g. 1.6 mm
with Al and 1.0 mm with steel) the strength is usually determined by
the yield strength of the substrate. As soon as the metal starts to
yield, the stress at the end of the overlap becomes too high and the
adhesive cracks. In special cases, such as crash-resistant EP/PUR
hybrid adhesives, the metal breaks first (Fig. 3.4). Only the strength
of the metal is measured in this case.
3.3. Lap shear specimen.
3.4. Bonded lap shear specimen broken in the steel (1mm gauge).
Assuming a yield strength of 280 MPa, thickness of 1.0 mm and
width of 25 mm, the yield stress will be 7000 kN. With a bonded
area of 300 mm2, this results in a calculated LSS of 23.3 MPa. Testing
the same adhesive according to DIN 54451 often gives an LSS of
more than 40 MPa, but since LSS is easy to measure, it can be used
for quick quality tests to check surface preparation and the control of
adhesive batches.
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Chapter
Thermoplastic Elastomers Based on
Polyamides
2014, Handbook of Thermoplastic Elastomers (Second Edition)
Jiri George Drobny
10.8.2 Adhesion
The adhesive properties of PEA were measured on lap shear
specimens prepared from wire-brushed, unprimed aluminum sheets
and thin PEA films by compression molding. Lap shear strength
values ranging from 7.6 to 9.2 MPa (1100–1300 psi) were obtained at
room temperature [30].
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Chapter
Weldability appraisement of
dissimilar metal joints: application of
ultrasonic spot welding to Li-ion
batteries
2020, Modern Manufacturing Processes
Mantra Prasad Satpathy, ... Susanta Kumar Sahoo
3.5.1 Tensile and T-peel strength results
Tensile shear and T-peel tests are employed to analyze the
mechanical strength of the USW joints. Fig. 3.5A demonstrates the
relationship of lap shear tensile strength with various welding times
of the anodized and nonanodized AA1050/Cu samples. It is clearly
ascertained that the samples are not appropriately welded when the
welding time is less than 0.35 s. The lap shear tensile strength
increases gradually, with the welding time increased. Fig. 3.5B
presents a traditional lap shear tensile tested sample that has crack
surfaces with two types of fracture modes. The fracture modes
change from interfacial debonding to base material fracture when
the welding time increases up to a particular level during the USW
process. For base material fractured samples, the lap shear tensile
strength increases up to a certain limit after that it decreases further
with increasing welding time. This is due to the vigorous softening
of aluminum alloy, and more amount of plastic deformation
occurred in the weld zone at the elevated temperature. At various
welding times, lap shear strength of the nonanodized aluminum-
based samples is higher than anodized aluminum-based samples.
This is due to the presence of residual anodic aluminum oxide layer
on the weld zone, which directly affects the mechanical strength of
Al/Cu samples.
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Chapter
Test and Inspection Methods
2011, Adhesives Technology for Electronic Applications (Second
Edition)
James J. Licari, Dale W. Swanson
7.5.5 Bond strength
Bond strength is measured to assure that bonding materials retain
adhesion at temperature and after aging or exposure to
thermomechanical stresses. Bond strength may be measured in
tensile, peel, or shear. Bond strength is measured as tensile strength
for SMT adhesives and as shear strength for component and
substrate adhesives. Specialized adhesive test methods are also used
for flip-chip and substrate strength, and centrifuge testing is used to
evaluate both die and substrate adhesion.
[Link] Tensile strength
Tensile strength is evaluated by pull testing on metal “lap-shear”
coupons, most often aluminum. A standard test method is ASTM
D1002, Apparent Shear Strength of Single-Lap-Joint Adhesively Bonded
Metal Specimens by Tension Loading (Metal-to-Metal).49 Aluminum
coupons are overlapped by 1/2 in (typical) and a wire is used as a
spacer to control bond line thickness. Method 5011, paragraph
[Link] of MIL-STD-883F references this specific method. Other
tensile lap-shear strength measurement tests are described in BSEN
1465, Adhesives Determination of Tensile Lap-Shear Strength of
Rigid-to-Rigid Bonded Assemblies (1995) and ISO 4587, Adhesives
Determination of Tensile Lap-Shear Strength of Rigid-to Rigid
Bonded Assemblies (2003).
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Related terms:
Room Temperature, Shear Strength,
Adhesive Joints, Joints (Structural Components),
Welds, Epoxy Adhesive, Tensiles, Polyurethan,
Polyetheretherketone, Ultimate Tensile Strength.
Recommended publications
International Journal of Adhesion and Adhesives
Journal
Composites Part B: Engineering
Journal
Materials & Design (1980-2015)
Journal
Composites Science and Technology
Journal
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