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LED Datasheet

The document provides detailed specifications and characteristics for the MN-S3535 RGBW LED, including its dimensions, electrical features, and reflow soldering guidelines. It highlights applications such as landscape, intelligent, and stage lighting, while also addressing reliability tests and precautions for handling and installation. The document emphasizes the importance of following specified conditions to ensure optimal performance and safety.

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0% found this document useful (0 votes)
45 views9 pages

LED Datasheet

The document provides detailed specifications and characteristics for the MN-S3535 RGBW LED, including its dimensions, electrical features, and reflow soldering guidelines. It highlights applications such as landscape, intelligent, and stage lighting, while also addressing reliability tests and precautions for handling and installation. The document emphasizes the importance of following specified conditions to ensure optimal performance and safety.

Uploaded by

midhun
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd

--c

MN-S3535
RGBW Color

Features: Table of Content:


Characteristics.....................................2
• 4in1 SMD LED
Part Number Nomenclature................2
• High cost performance
• Ceramic base Specifications......................................2
• Small distance between chips Spectral features.................................3
• Excellent color mixing effect Electrical Features...............................4
• RoHS compliant, EN62471 Dimension...........................................4
• high thermal conductivity Reflow Soldering.................................5
• Reflow soldering available
Reliability Test....................................6
Packaging.. …......................................7

• Landscape lighting Precautions........................................8

• Intelligent Lighting Precautions........................................9


• Smart Lighting
• Stage lighting
• General decorative lighting

ADD: 3rd floor, Junqi Industrial Park, Xitou Industrial Zone, Songgang
Shenzhen Moonleds Opto-electronics Co., Ltd Street, Bao'an District Shenzhen, China
Web: www.moon-leds.com
E-mail: [email protected]
GT-COB2828-XX
Characteristics
Characteristics Unit Min Typical Max

Dimension L*W mm 3.5*3.5


Beam Angle 2θ1/2 deg. 120 140
Wavelength WL nm 450 660
Color Temperature CCT K 2700 12000
Power Dissipation PD W 4
Operating Temperature Top °C -40 +85
Storage Temperature Tst °C -40 +85
Testing Point Tc °C 85
Junction Temperature Tj °C 125
Reverse Current (Vr=5V) Ir uA 10
Thermal Resistance Rj-c °C/W 16
ESD (HBM) V 2000
Reflow Soldering(Lead-Free) ST °C 230
Moisture Sensitivity Level, MSL Level 4

Part Number Nomenclature


MN —— S3535 —— RGBWC60 —— 4

Company
SMD type Color Type Power
Name
R: 620-630nm
G: 520-530nm
MOON 3535 4: 4W
B: 455-465nm
W60: 6000-6500K

Specifications (Tc = 25°C)

Wavelength
Color Voltage (V) Current (mA) Lumen (LM) Part Number
(nm)

620-625 2.0-2.6 350 50-70


MN-S3535RGBWC304
520-525 2.8-3.4 350 110-130
MN-S3535RGBWC404
RGBW 455-460 2.8-3.4 350 20-30
2800-3200K MN-S3535RGBWC604
4000-4500K 2.8-3.4 350 110-130
6000-6500K

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GT-COB2828-XX
Spectral Features(Tc = 25°C)

Forward Volt vs. Forward Current (Tc = 25°C)

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The information in this document is subject to change without notice.
GT-COB2828-XX
LM vs. Luminous intensity (Tc = 25°C)

Dimension (Unit:mm) Tolerance+/-0.1mm

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4
The information in this document is subject to change without notice.
Reflow Soldering

Reflow Soldering Characteristics lead-free solder


Average Ramp Up (Ts max to Tp) 1.2 °C/second max.

Preheat (Tsmin) 120 °C

Preheat (Tsmax) 170 °C

Preheat (tsmin to tsmax) 60-150 seconds

Temp Maintenance: (TL) 217 °C

Time Maintenance :(tL) 50-90 seconds

Peak Temp (Tp) 235-245 °C

(5°C before Reach 220 °C)(tp) 20-40 seconds

Ramp Down 6 °C/second max.

25°C(Time to Reach Peak Temp) 4 minutes max.

Notes: The data in the document is juts for reference. Pleases do the initial inspection in accordance with the reflow soldering
characteristics in data sheet strictly (Tolerance should be considered). Do not proceed mass production before initial
inspection in order to avoid unnecessary loss.

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GT-COB2828-XX

Reliability Tests

Test Items Test Conditions Sample Quantity Ac/Re

IF=350mA Ta=25°C×1000hrs 22 0/1


Aging Test
IF=350mA Ta=85°C×1000hrs 22 0/1
High Temperature
100℃ × 1000 hours 22 0/1
Storage
Low Temperature
-40℃ × 1000 hours 22 0/1
Storage
High Temp &
IF=350mA 85°C, 85 %RH for 1000 hours 22 0/1
Humidity

Temperature Shock -40℃ × 30 minutes – +100℃ × 30 minutes, 100 cycle 22 0/1

ESD (HBM) 2000V HBM/Time 10 0/1

Criteria for Judging Led Failure (Tc=25°C)

Items Symbol Test Conditions Criteria for Judging LED Failure

Forward Voltage VF IF=350mA >U × 1.1

Reverse Current IR VR=5V IR≥10μA

Luminous Flux φv IF=350mA <S × 0.7

U refers to max value;S refers to initial value.


Notes:Judging criteria based on Tc=25°C.

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The information in this document is subject to change without notice.
GT-COB2828-XX
Packaging (Unit:mm)
Tape Specs.

Reel Specs. 1000pcs/reel

Moisture Barrier Bag

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Precautions

Product Specifications

This is a product family data sheet without extra emphasis on a specific model. The specifications in the document refers to its
general value under certain test conditions. Please consult sales representative or technical people if encounters specs that are not
listed. (Tolerance should be considered).

Operation Tips

1. Middle temperature solder paste is recommended to lead-free reflow soldering. The maximum temperature set up to 220 °C ±
5 °C (the actual temperature of the tunnel furnace should be daily measured). The time of peak temperature must less than 45
seconds. Over-temperature, overtime will lead to lens off, deformation. Please do not put any pressure on the product during
reflow soldering process. When the product cool to the room temperature, it can go to the following manufacturing process.

2. Stencil thickness recommended 0.08mm.


3. Please don’t use heating platform to solder the LEDs.
4. To protect the LED from damage, please don’t impact or pile up the LEDs after reflow soldering.

Service Conditions

1.The LEDs should be dehumidified @65 °C ± 5 °C for 12 Hours when the aluminum moisture-proof bag opened for 1 week.
2. The products must be operated within the rated range of parameters. Constant current drivers are recommended.

Installation

The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the top of package. The pressure to
the top surface will be influence to the reliability of the LEDs. Precautions should be taken to avoid the strong pressure on the
encapsulated part. So when use the picking up nozzle, the pressure on the silicone resin should be proper.

Handle the component along the side surface by using forceps or appropriate tools; Do not directly touch
or handle the silicone lens surface, it may damage the internal circuitry.

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Precautions

Do not stack together assembled PCBs containing LEDs. Not suitable to operate in acidic envi-ronment, PH<7
Impact may scratch the silicone lens or damage the
Internal circuitry

ESD Protection

Statics or surge volt would cause LED failure. When using the products, we suggest wearing anti‐static wrist strap or gloves. All
devices, equipment and machinery must be grounded. Precautions should be taken to protect the products from the surge voltage
generated by the devices.

Heat Dissipation

The thermal design of the end product is particularly important, please consider it seriously. Do avoid high temperature
condensation on the product.

Cleaning

Recommend ethanol as the only clean solvent.

Others

The bright light emitted by LED may hurt the eyes. Do not look directly at the products when not wearing protective glasses. The
strong irritant glare makes people feel uncomfortable and precautions should be taken during usage.

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The information in this document is subject to change without notice. 11

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