HEF4069UB
HEF4069UB
1. General description
The HEF4069UB is a hex unbuffered inverter. Inputs include clamp diodes. This enables the use of
current limiting resistors to interface inputs to voltages in excess of VDD.
3. Applications
• Oscillator
4. Ordering information
Table 1. Ordering information
Type number Package
Temperature range Name Description Version
HEF4069UBT -40 °C to +125 °C SO14 plastic small outline package; 14 leads; SOT108-1
body width 3.9 mm
HEF4069UBTT -40 °C to +125 °C TSSOP14 plastic thin shrink small outline package; SOT402-1
14 leads; body width 4.4 mm
Nexperia HEF4069UB
Hex unbuffered inverter
5. Functional diagram
1 2
1A 1Y
3 4
2A 2Y
5 6
3A 3Y
9 8
4A 4Y VDD
11 10
5A 5Y
A Y
13 12
6A 6Y
VSS
001aag152 001aag154
6. Pinning information
6.1. Pinning
1A 1 14 VDD
1Y 2 13 6A
2A 3 12 6Y
2Y 4 HEF4069UB 11 5A
3A 5 10 5Y
3Y 6 9 4A
VSS 7 8 4Y
001aag153
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7. Limiting values
Table 3. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VDD supply voltage -0.5 +18 V
IIK input clamping current VI < -0.5 V or VI > VDD + 0.5 V - ±10 mA
VI input voltage -0.5 VDD + 0.5 V
IOK output clamping current VO < -0.5 V or VO > VDD + 0.5 V - ±10 mA
II/O input/output current - ±10 mA
IDD supply current - 50 mA
Tstg storage temperature -65 +150 °C
Tamb ambient temperature -40 +125 °C
Ptot total power dissipation Tamb = -40 °C to +125 °C [1] - 500 mW
P power dissipation per output - 100 mW
[1] For SOT108-1 (SO14) package: Ptot derates linearly with 10.1 mW/K above 100 °C.
For SOT402-1 (TSSOP14) package: Ptot derates linearly with 7.3 mW/K above 81 °C.
9. Static characteristics
Table 5. Static characteristics
VSS = 0 V; VI = VSS or VDD; unless otherwise specified.
Symbol Parameter Conditions VDD Tamb = -40 °C Tamb = +25 °C Tamb = +85 °C Tamb = +125 °C Unit
Min Max Min Max Min Max Min Max
VIH HIGH-level input |IO| < 1 μA 5V 4 - 4 - 4 - 4 - V
voltage 10 V 8 - 8 - 8 - 8 - V
15 V 12.5 - 12.5 - 12.5 - 12.5 - V
VIL LOW-level input |IO| < 1 μA 5V - 1 - 1 - 1 - 1 V
voltage 10 V - 2 - 2 - 2 - 2 V
15 V - 2.5 - 2.5 - 2.5 - 2.5 V
VOH HIGH-level |IO| < 1 μA 5V 4.95 - 4.95 - 4.95 - 4.95 - V
output voltage 10 V 9.95 - 9.95 - 9.95 - 9.95 - V
15 V 14.95 - 14.95 - 14.95 - 14.95 - V
VOL LOW-level |IO| < 1 μA 5V - 0.05 - 0.05 - 0.05 - 0.05 V
output voltage 10 V - 0.05 - 0.05 - 0.05 - 0.05 V
15 V - 0.05 - 0.05 - 0.05 - 0.05 V
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Symbol Parameter Conditions VDD Tamb = -40 °C Tamb = +25 °C Tamb = +85 °C Tamb = +125 °C Unit
Min Max Min Max Min Max Min Max
IOH HIGH-level VO = 2.5 V 5V - -1.7 - -1.4 - -1.1 - -1.1 mA
output current VO = 4.6 V 5V - -0.64 - -0.5 - -0.36 - -0.36 mA
VO = 9.5 V 10 V - -1.6 - -1.3 - -0.9 - -0.9 mA
VO = 13.5 V 15 V - -4.2 - -3.4 - -2.4 - -2.4 mA
IOL LOW-level VO = 0.4 V 5V 0.64 - 0.5 - 0.36 - 0.36 - mA
output current VO = 0.5 V 10 V 1.6 - 1.3 - 0.9 - 0.9 - mA
VO = 1.5 V 15 V 4.2 - 3.4 - 2.4 - 2.4 - mA
II input leakage 15 V - ±0.1 - ±0.1 - ±1.0 - ±1.0 μA
current
IDD supply current all valid input 5 V - 0.25 - 0.25 - 7.5 - 7.5 μA
combinations; 10 V - 0.5 - 0.5 - 15.0 - 15.0 μA
IO = 0 A
15 V - 1.0 - 1.0 - 30.0 - 30.0 μA
CI input digital inputs - - - 7.5 - - - - pF
capacitance
[1] The typical value of the propagation delay and output transition time can be calculated with the extrapolation formula (CL in pF).
2
CL = output load capacitance in pF;
15 V PD = 22000 × fi + Σ(fo × CL) × VDD (μW) Σ(fo × CL) = sum of the outputs;
VDD = supply voltage in V.
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VDD
VI VO
G DUT
RT CL
001aag182
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VO ID VO ID
(V) (µA) (V) (mA)
2.5 250 5 5
0 0 0 0
0 2.5 5.0 0 5 10
VI (V) VI (V)
a. VDD = 5 V; IO = 0 A b. VDD = 10 V; IO = 0 A
001aag161
20 20
VO ID
(V) (mA)
10 10
0 0
0 10 20
VI (V)
c. VDD = 15 V; IO = 0 A
(1) VO = output voltage.
(2) ID = drain current.
Fig. 6. Typical transfer characteristics
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VDD
VDD
A
1/6 HEF4069UB 1/6 HEF4069UB
0V
D A B
VDD
C2 R2 R1 C1
B
VSS 0V
C
1.5VDD
VDD
C 0.5VDD
0V
- 0.5VDD
VDD
D 0.5VDD
0V
forward voltage
clamping diode 001aag162
Fig. 8 shows a crystal oscillator for frequencies up to 10 MHz using two HEF4069UB inverters.
The second inverter amplifies the oscillator output voltage to a level sufficient to drive other Local
Oxidation CMOS (LOCMOS) circuits.
1 MΩ 22 pF 1 MΩ
2 MHz
2.2 kΩ
100 pF 22 pF
1/6 HEF4069UB 1/6 HEF4069UB
001aag155
The output inverter is used to amplify the oscillator output voltage to a level sufficient to drive other LOCMOS
circuits.
Fig. 8. Crystal oscillator
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Fig. 9 and Fig. 10 show voltage gain and supply current. Fig. 11 shows the test set-up and an
example of an analog amplifier using one HEF4069UB.
001aag156 001aag157
75 20
IDD
gain (mA)
(VO/VI)
15
50
typ
typ
10
25
5
0 0
0 5 10 15 0 5 10 15
VDD (V) VDD (V)
Fig. 9. Typical voltage gain as a function of supply Fig. 10. Typical supply current as a function of supply
voltage voltage
330 kΩ
1/6 HEF4069UB
001aag158
Fig. 12 shows typical forward transconductance. Fig. 13 shows the test set-up.
001aag164
10
gfs
(mA/V)
(1)
7.5
(2)
5.0
2.5 VDD
0
0 5 10 15 Vi A Io
VDD (V)
VSS
(1) Average +2σ;
001aag163
(2) Average;
(3) Average -2σ;
at VO is constant.
where ‘σ’ is the standard deviation.
fi = 1 kHz
Fig. 12. Typical forward transconductance as a function
of supply voltage at Tamb = 25 °C Fig. 13. Test set-up
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D E A
X
c
y HE v M A
14 8
A2
A3 A
A1
pin 1 index
θ
Lp
1 7 L
e w M detail X
bp
0 5 mm
scale
HEF4069UB All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2024. All rights reserved
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1
D E A
X
y HE v M A
14 8
A2 A3
A
A1
pin 1 index
θ
Lp
L
1 7
detail X
w M
e bp
0 5 mm
scale
HEF4069UB All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2024. All rights reserved
13. Abbreviations
Table 9. Abbreviations
Acronym Description
ANSI American National Standards Institute
CDM Charged Device Model
CMOS Complementary Metal-Oxide Semiconductor
DUT Device Under Test
ESD ElectroStatic Discharge
ESDA ElectroStatic Discharge Association
HBM Human Body Model
JEDEC Joint Electron Device Engineering Council
LOCMOS Local Oxidation Complementary Metal-Oxide Semiconductor
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Contents
1. General description...................................................... 1
2. Features and benefits.................................................. 1
3. Applications.................................................................. 1
4. Ordering information....................................................1
5. Functional diagram.......................................................2
6. Pinning information......................................................2
6.1. Pinning.........................................................................2
6.2. Pin description............................................................. 2
7. Limiting values............................................................. 3
8. Recommended operating conditions..........................3
9. Static characteristics....................................................3
10. Dynamic characteristics............................................ 4
10.1. Waveforms and test circuit........................................ 5
10.2. Transfer characteristics..............................................6
11. Application information..............................................7
12. Package outline.......................................................... 9
13. Abbreviations............................................................ 11
14. Revision history........................................................11
15. Legal information......................................................12
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