Scribd
Upload
30 views1 page

Assignment 2 2023 24 CECD

Assignment-2- Components for electronic circuit design of III Semester- EC- Priyadarshini Bhagwati College of Engineering

Uploaded by

Pramod Bokde
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
30 views1 page

Assignment 2 2023 24 CECD

Assignment-2- Components for electronic circuit design of III Semester- EC- Priyadarshini Bhagwati College of Engineering

Uploaded by

Pramod Bokde
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
You are on page 1/ 1

PRIYADARSHINI BHAGWATI COLLEGE OF ENGINEERING

Session 2023-24
Department of Electronics & Communication Engineering

Semester : III - Sem Subject : Components for Electronic Circuit Design


Assignment : 2 Topic : Unit 3, 4 & 5
Date of Display : 15/10/2023 Date of Submission : 26/10/2023

Q.No. Question CO BL
1 What is Base width modulation? Explain with the help of neat diagram 3 2
2 What is biasing of transistor? What are different types of biasing of 3 2
BJT. Explain any one.
3 Describe thermal runaway in BJT. 3 2
4 Derive an expression for stability factor S for fixed bias circuit. 3 3
5 What are the advantages of FET over BJT? 4 2
6 Differentiate between BJT and FET. 4 2
7 Draw and explain drain and transfer characteristics of JFET. 4 2
8 Explain the working of n-channel enhancement type MOSFET. 4 2
9 List the different steps for the fabrication of transistor on monilithic IC. 5 2
10 Explain the process of ‘Photolithgraphy’ and ‘Ionization’. 5 2
11 Write a short note on ‘Diffusion process’ used in fabrication of IC. 5 2
12 Explain the process of fabrication of resistor on IC. 5 2

Dr. P. R. Bokde Dr. D. M. Kate


Subject Teacher HoD

You might also like