A DIVISION OF AVX CORPORATION
DATA PACKAGE
0402 NTC THERMISTORS
TPC
Avenue du Colonel Prat
21850 Saint-Apollinaire
FRANCE
DATA PACKAGE
0402 NTC THERMISTORS
a division of AVX corporation
CONTENTS
Pages
1 DATA SHEET 3
2 RECOMMENDED SOLDERING CONDITIONS 4
3 PACKAGING FOR AUTOMATIC INSERTION 5
3-1 TAPE & REEL QUANTITIES 5
3-2 REEL DIMENSIONS 5
3-3 PAPER CARRIER CONFIGURATION 6
4 QUALIFICATION TESTS 7
4-1 TESTS AND CONDITIONS 7
4-2 RESULTS 8
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DATA PACKAGE
0402 NTC THERMISTORS
a division of AVX corporation
1 - DATA SHEET
FEATURES
Inner electrode
Base layer - silver
Barrier metallization - nickel
Outer layer - tin (90%) / lead (10%)
DIMENSIONS
mm inches
r
L 1 +/- 0.1 0.04 +/- 0.004
e
r
l 0.5 +/- 0.1 0.02 +/- 0.004
L e 0.5 +/- 0.1 0.02 +/- 0.004
l r 0.25+/-0.1 0.01 +/- 0.004
ELECTRICAL CHARACTERISTICS
TYPE RESISTANCE at 25°C (± 5%, ± 10%) SENSIBILITY INDEX B25/85 (± 3%)
NB23NC0103 10KΩ 4080
NB23RC0103 10KΩ 4400
NB23NC0153 15KΩ 4080
NB23NC0223 22KΩ 4080
NB23RC0223 22KΩ 4400
NB23RC0333 33KΩ 4400
NB23RC0473 47KΩ 4400
NB23RC0683 68KΩ 4400
NB23RC0104 100KΩ 4400
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DATA PACKAGE
0402 NTC THERMISTORS
a division of AVX corporation
2 - RECOMMENDED SOLDERING CONDITIONS
The NTC chip thermistor is designed for reflow and flow soldering.
Following soldering conditions are recommended :
Flow Soldering Conditions
Soldering
zone
Preheat zone AB :
C D
time = 1 minute minimum
temperature (B) = 130 – 150°C
E
Soldering zone CD :
Cooling zone time = 4s maximum
B temperature (C/D) = 230 - 250°C
Cool down zone >E :
A 1 minute minimum to reach room temperature
Preheat zone
Time
Reflow Soldering Conditions
Soldering
zone
Preheat zone AB :
C D time = 1 minute minimum
temperature (B) = 130 – 150°C
E
Soldering zone CD :
Cooling zone time = 15s maximum
B temperature (C/D) = 220 – 230°C
Cool down zone >E :
A 1 minute minimum to reach room temperature
Preheat zone
Time
4/8
DATA PACKAGE
0402 NTC THERMISTORS
a division of AVX corporation
3 - PACKAGING FOR AUTOMATIC INSERTION
3.1 Tape and reel quantities
Paper only Tape size : 8 mm
10,000
Qty. per Reel / 7” Reel
Contact factory for exact quantity
3.2 Reel dimensions
W2
A max. B* min. C D* min. N min. W1 W3
max.
7.90 min.
180 1.5 13.0 +0.50 / -0.20
20.2 50.0 8.40 +1.5 / -0.0
14.4 (0.311)
(7.09) (0.059) (0.512 +0.020 / -0.008) (0.795) (1.969) (0.331 +0.059 / -0.0
) (0.567) 10.9 max.
(0.429)
Metric dimensions will govern.
English measurements rounded and for reference only.
5/8
DATA PACKAGE
0402 NTC THERMISTORS
a division of AVX corporation
3.3 Paper Carrier Configuration
D0 E P0 P2 T1 max. G min. R min.
25.0
1.50 +0.10 / -0.0
1.75 +/-0.10 4.00 +/-0.10 2.00 +/-0.05 0.10 0.75
+0.004 / -0.0 +/-0.004 +/-0.004 +/-0.002 (0.984)
(0.059 ) (0.069 ) (0.157 ) (0.079 ) (0.004) (0.030)
see Note 2
Tape
P1 See note 4 E2min F W A0B0 T max.
Size
8 mm 2.00 +/-0.05 6.25 3.50 +/-0.05 8.00 +0.30 / -0.10
see Note 1.10
+/-0.002 +/-0.002 +0.012 / -0.004
½ pitch (0.079 ) (0.246) (0.138 ) (0.315 ) 1 (0.043)
6/8
DATA PACKAGE
0402 NTC THERMISTORS
a division of AVX corporation
4 - QUALIFICATION TESTS
4-1 TESTS AND CONDITIONS
Test Test conditions Performance requirements
Solderability - 60Sn/40Pb solder bath 95% of the termination surface
- 215°C / 3" covered
Resistance to dissolution of - 60Sn/40Pb solder bath < 5% of the termination surface
termination - 260°C / 10’’ leached away
- No tombstoning effect
Reflow soldering test Parts mounted by reflow soldering - Position deviation < 0.15mm in
on FR4 epoxy board any direction
Resistance measurement on
parts
mounted on a board with board in
bent position R(25°C) variation :
Bending test ∆R/R < 3%
at 2 mm
200 cycles -55°C/+125°C R(25°C) variation :
Temperature cycling test 30 min at each temperature ∆R/R < 3%
Parts mounted by reflow soldering at 100 cycles
on FR4 epoxy board
Life test 1000h at 125°C R(25°C) variation :
Parts mounted by reflow soldering ∆R/R < 3%
on FR4 epoxy board
Damp heat, steady-state 56 days at 40°C / 95% RH R(25°C) variation :
Parts mounted by reflow soldering ∆R/R < 3%
on FR4 epoxy board
7/8
DATA PACKAGE
0402 NTC THERMISTORS
a division of AVX corporation
4-2 RESULTS
TESTS Results
Solderability 0 failure
Resistance to dissolution
0 failure
of termination
Reflow soldering test 0 failure
BENDING TEST TEMPERATURE CYCLING TEST
10 10
8 8
∆R/R en %
∆R/R en %
6 6
4 4
maximum
2 2
maximum
0 minimum
0
0 1 2 3 0 100 200
Bending (mm) Cycles
LIFE TEST DAMP HEAT TEST
10 10
8 8
∆R/R en %
∆R/R en %
6 6
4 4
maximum
2 2 maximum
minimum
0 0
minimum
0 168 500 1000 0 21 56
Time (hours) Time (days)
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