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com Table of Contents

User’s Guide
BQ76922EVM Evaluation Module

ABSTRACT
The BQ76922EVM evaluation module (EVM) is a complete evaluation system for the BQ76922, a 3-cell to 5-cell
Li-Ion battery monitor integrated circuit. The EVM consists of a BQ76922 circuit module which is used for simple
evaluation of the BQ76922 monitor function. The circuit module includes one BQ76922 integrated circuit (IC),
sense resistor, power FETs, and all other onboard components necessary to protect the cells from overcharge,
over discharge, short circuit, and overcurrent discharge in a 5-series cell Li-Ion or Li-Polymer battery pack. The
circuit module connects directly across the cells in a battery, or can be connected with a power supply and
the included cell simulator resistors. With the on-board interface or compatible external interface board and
Microsoft® Windows® based PC graphical user interface (GUI) software, the user can view the device registers,
adjust protection limits and enable FET control outputs.

Table of Contents
1 Features...................................................................................................................................................................................3
1.1 Kit Contents........................................................................................................................................................................3
1.2 Ordering Information.......................................................................................................................................................... 3
1.3 BQ76922EVM Circuit Module Performance Specification Summary.................................................................................3
1.4 Required Equipment.......................................................................................................................................................... 3
2 BQ76922EVM Quick Start Guide........................................................................................................................................... 4
2.1 Before You Begin............................................................................................................................................................... 4
2.2 Quick Start..........................................................................................................................................................................4
3 Interface Adapter.................................................................................................................................................................... 6
4 Battery Management Studio Software.................................................................................................................................. 7
4.1 System Requirements........................................................................................................................................................7
4.2 Installing BQStudio.............................................................................................................................................................7
4.3 BQ76922 bqz File Installation............................................................................................................................................ 7
4.4 BQStudio Operation and Registers View........................................................................................................................... 7
4.5 Commands.........................................................................................................................................................................9
4.6 Data Memory......................................................................................................................................................................9
4.7 Calibration........................................................................................................................................................................ 11
4.8 Command Sequences......................................................................................................................................................12
5 BQ76922EVM Circuit Module Use....................................................................................................................................... 14
5.1 Cell Simulator...................................................................................................................................................................14
5.2 Evaluating with Load Current........................................................................................................................................... 14
5.3 Evaluating Charge and Discharge Currents.....................................................................................................................14
5.4 Evaluating with Simulated Current................................................................................................................................... 15
5.5 Reducing the Cell Count.................................................................................................................................................. 15
5.6 Connecting Cells.............................................................................................................................................................. 16
5.7 Connecting to a Host........................................................................................................................................................17
5.8 Hardware Configuration................................................................................................................................................... 18
5.9 Configuration Register Programming...............................................................................................................................18
6 BQ76922EVM Circuit Module Physical Construction........................................................................................................20
6.1 Board Layout....................................................................................................................................................................20
6.2 Bill of Materials.................................................................................................................................................................25
6.3 REACH Compliance.........................................................................................................................................................28
6.4 Schematic........................................................................................................................................................................ 29
7 Related Documents from Texas Instruments.....................................................................................................................32
8 Revision History................................................................................................................................................................... 32

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List of Figures
Figure 2-1. EVM Connection for Basic Operation........................................................................................................................5
Figure 3-1. EVM Connection with External EV2400.................................................................................................................... 6
Figure 4-1. Target Selection Wizard............................................................................................................................................ 8
Figure 4-2. BQStudio Window without Device.............................................................................................................................8
Figure 4-3. Register View with Device......................................................................................................................................... 9
Figure 4-4. Tool Selections.......................................................................................................................................................... 9
Figure 4-5. Data Memory View.................................................................................................................................................. 10
Figure 4-6. Data Memory Bit Field Change............................................................................................................................... 10
Figure 4-7. Program OTP Pane with Success Display.............................................................................................................. 11
Figure 4-8. Calibration View.......................................................................................................................................................12
Figure 4-9. Example Voltage Calibration Success.....................................................................................................................12
Figure 4-10. Example Current Calibration Failure..................................................................................................................... 12
Figure 4-11. Command Sequence View.................................................................................................................................... 13
Figure 5-1. Evaluating with Load Current.................................................................................................................................. 14
Figure 5-2. Evaluating with Charge or Discharge Current......................................................................................................... 15
Figure 5-3. Simulating Current Setup........................................................................................................................................ 15
Figure 5-4. Example 3-Cell Simple Evaluation Configuration....................................................................................................16
Figure 5-5. Example Connection with 4 Cells............................................................................................................................17
Figure 5-6. Host Connection Concept....................................................................................................................................... 18
Figure 6-1. Top Silk Screen....................................................................................................................................................... 20
Figure 6-2. Top Assembly.......................................................................................................................................................... 21
Figure 6-3. Top Layer.................................................................................................................................................................21
Figure 6-4. Layer 2.................................................................................................................................................................... 22
Figure 6-5. Layer 3.................................................................................................................................................................... 22
Figure 6-6. Bottom Layer........................................................................................................................................................... 23
Figure 6-7. Bottom Silk Screen..................................................................................................................................................23
Figure 6-8. Bottom Assembly.................................................................................................................................................... 24
Figure 6-9. Schematic Diagram Monitor.................................................................................................................................... 29
Figure 6-10. Schematic Diagram FETs......................................................................................................................................30
Figure 6-11. Schematic Diagram Interface Adapter...................................................................................................................31

List of Tables
Table 1-1. Ordering Information................................................................................................................................................... 3
Table 1-2. Performance Specification Summary..........................................................................................................................3
Table 5-1. Reducing Cell Count................................................................................................................................................. 16
Table 6-1. BQ76922 Circuit Module Bill of Materials................................................................................................................. 25
Table 6-2. REACH Components................................................................................................................................................ 28

Trademarks
Microsoft® and Windows® are registered trademarks of Microsoft Corporation.
All trademarks are the property of their respective owners.

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www.ti.com Features

1 Features
• Complete evaluation system for the BQ76922 3-cell to 5-cell Li-Ion and Phosphate battery monitor
• Populated circuit module for 5-cell configuration for quick setup
• Power connections available on test points
• Communication available with included USB interface adapter or available on 4-pin connector
• Resistor cell simulator for quick setup with only a power supply
• PC software available for configuration
1.1 Kit Contents
• BQ76922 circuit module
• USB cable
1.2 Ordering Information
For complete ordering information, refer to the product folder at www.ti.com.
Table 1-1. Ordering Information
EVM Part Number Chemistry Configuration Capacity
BQ76922EVM Li-Ion 5 cells Any

Note
Although capacity is shown as Any, practical limits of the physical construction of the module typically
limits the operation of the EVM to a 1P or 2P battery construction. Refer to the physical construction
section for board details.

1.3 BQ76922EVM Circuit Module Performance Specification Summary

This section summarizes the performance specifications of the BQ76922 circuit module in its default 5-cell series
FET configuration.
Typical voltage depends on the number of cells configured. Typical current depends on the application. Board
cooling may be required for continuous operation at or below maximum current.
Table 1-2. Performance Specification Summary
Specification Min Typ Max Unit
Input voltage BATT+ with respect to BATT– 6 – 22 V
Continuous charge or discharge current 0 – 10 A
Operating temperature range 20 25 30 °C

1.4 Required Equipment

The following equipment is required to operate the BQ76922 EVM in a simple demonstration:
• DC power supply, 0 – 25 V at 2.5 A
• DC voltmeter
• Computer with USB port and compatible Windows operating system and access to the internet
• Test leads to connect equipment
• Electronic load or assorted resistors
Additional equipment may be desired to operate the BQ76922 with a more extensive demonstration.

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2 BQ76922EVM Quick Start Guide

2.1 Before You Begin
The following warnings and cautions are noted for the safety of anyone using or working close to the BQ76922
EVM. Observe all safety precautions.

CAUTION
The default settings of the BQ76922 do not limit performance to the ratings of the EVM. Set all
protections appropriately and limit current for safe operation.

CAUTION
The circuit module has signal traces, components, and component leads on the top and bottom of
the board. This may result in exposed voltages, hot surfaces or sharp edges. Do not reach under the
board during operation. Do not leave the EVM powered when unattended.

CAUTION
The circuit module may be damaged by over temperature. To avoid damage, monitor the
temperature during evaluation and provide cooling, as needed, for your system environment.

CAUTION
Some power supplies can be damaged by application of external voltages. If using more than
1 power supply, check your equipment requirements and use blocking diodes or other isolation
techniques, as needed, to prevent damage to your equipment.

CAUTION
The communication interface is not isolated on the EVM. Be sure no ground potential exists between
the computer and the EVM. Also be aware that the computer is referenced to the PACK- potential of
the EVM.

CAUTION
Connections for rated current must be made at the terminal block. Test points are not rated for the
board current.

2.2 Quick Start

The BQ76922 registers must be configured to enable most protections, select the monitored cells, and enable
the protection FETs on the EVM. This quick start section does not describe current protection settings. Once
registers are configured, the values may be written to One Time Programmable memory (OTP) for use on
the next reset of the device, but since that is a permanent change it is not part of this quick start procedure.
Preproduction sample configuration may differ from the production data sheet, check the documents provided
with the samples. This quick start assumes a new EVM without OTP configuration settings. If your board has a
part with configuration stored in OTP refer to the Section 4 and Section 5.
These steps describe quick connection of the BQ76922 EVM to demonstrate operation of the AFE portion of the
EVM. For more detailed descriptions, refer to other sections of the user guide.
Refer to Figure 2-1 for the following steps.
1. Download the BQSTUDIO Software from the tool folder link www.ti.com/tool/BQSTUDIO or search from
www.ti.com.
2. Install the BQStudio software (see Section 4.2).

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3. Install the cell simulator shunts.

4. Install the interface shunts to the INT positions.
5. Attach the on board communication adapter USB connector to the PC using USB cable.
6. Connect a 0-V DC power supply capable of 250 mA minimum between the BAT- and CELL5 terminals and
adjust to approximately 18 V.
7. Press and release the WAKE switch.
8. Start the BQStudio software. The GUI should open with a register display. Click on the Scan button to enable
repeated update of the display. The power supply may be adjusted within range of the part to observe
voltage changes in the GUI register display.
9. Select the Data memory button in the BQStudio window.
10. Select the Settings button and set the Enabled Protections A CUV bit. Writing to the data memory after
setting the bit.
11. In the Commands panel click on the FET_EN button.
12. In the Registers view, click on the Scan icon so that the registers update periodically. Observe that the
DSG_FET and CHG_FET bits in the FET Status register of the BIT Registers section are on and that
the Stack voltage and the Pack pin voltage registers in the Registers section are approximately equal.
The SLEEPCHG bit is enabled by default, if the SLEEP status is set CHG_FET will be off. Click the
SLEEP_DISABLE command button. Measure the PACK voltage on the board if desired.
13. Adjust the supply voltage to approximately 22 V. In the registers view observe that the COV bit turns on, the
CHG_FET bit goes off, and the Pack pin voltage drops to approximately 0.3 V below the Stack voltage.
14. Adjust the supply voltage to approximately 12 V. In the registers view observe that the CUV bit turns on, the
DSG_FET bit goes off, and the Pack pin voltage drops to approximately 0 V.
15. Make other adjustments as desired, for evaluation. See other sections of this user guide for details of
operation.
16. When complete with this quick start demonstration, exit BQStudio software and turn off the power supply.
Refer to other sections of this user guide for additional details.

DC Power Supply
+ -

Install cell
simulator shunts

Position shunts
to “INT”

Figure 2-1. EVM Connection for Basic Operation

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3 Interface Adapter
The BQStudio software uses either the on-board USB interface adapter or separate EV2400 interface board to
provide communication with the EVM board from the computer. The on-board interface identifies as an EV2400.
The EV2400 uses operating system drivers and no separate installation is required.
When connecting an external EV2400 change the J7 jumpers on the board from the INT to the EXT position.
Since the external EV2400 provides pull ups, do not install shunts at the PU positions. Figure 3-1 shows an
example of the EVM connected with an external EV2400.

EV2400
I2C

DC Power Supply
Install cell
+ - simulator shunts

Position shunts to “EXT”

Figure 3-1. EVM Connection with External EV2400

EV2400 versions 0.28 and newer are compatible with the on-board interface. The latest version is
recommended. If updates are available for the on-board interface adapter, they are available from the EV2400
tool folder on the web, www.ti.com/tool/EV2400. Do not install the EV2400 firmware version 0.18 in the on-board
adapter.
The BQ76922 devices are not supported with the older EV2300 interface.

CAUTION
Do not program the on-board adapter with version 0.18 or earlier firmware.

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4 Battery Management Studio Software

The Battery Management Studio software is used for evaluation of the BQ76922 monitor. It is also identified as
BQStudio for a compact name. If an earlier version of the BQStudio software is already installed from another
product evaluation, it should still be installed again to load the configuration files and tools specific to the current
version of the BQ76922.
4.1 System Requirements
The BQStudio software requires a Windows 7, or later, operating system. Additional items are required and are
described in the installation windows. The examples in this document are from Windows 7 or 10.
4.2 Installing BQStudio
Find the latest software version in the software section of the product folder http://www.ti.com/tool/BQSTUDIO or
search from power.ti.com. Check periodically for software updates. Alternatively use the BQStudio installation file
provided. Use the following steps to install the BQStudio software:
1. Uninstall older versions of BQStudio software. After uninstalling, delete the BatteryManagmentStudio
program directory.
2. Copy the archive file to a directory of your choice, extract all files and run the Battery Management Studio-
xxxxxx-Setup.exe application.
3. Follow the instructions and make selections as required on the setup windows selecting Next, as required.
TI recommends installing the software in the default location.
4. On the last window select option checkboxes desired and Finish to complete the BQStudio software
installation.
4.3 BQ76922 bqz File Installation
The BQStudio software uses a bqz file to configure the displays for the BQ76922 device or family devices. This
is normally provided in the BQStudio installation. If provided separately, copy the .bqz file to the config directory
in the installation, typically C:\ti\BatteryManagementStudio\config.
4.4 BQStudio Operation and Registers View
BQStudio is used to communicate to the BQ76922 for evaluation. It includes several tools to aid in configuration,
calibration and data display of the BQ76922 during evaluation.
Although the software runs without connection to an interface board or powered device, it is recommended
to have both connected and the device on when starting the software. Follow the directions in the quick start
section. Figure 2-1 shows typical connections for operation with the BQStudio software.
Start the software from the desktop shortcut Battery Management Studio or the Start menu.
When started, the software looks for the communication interface and the device. If the device is not found, it
opens a Target Selection Wizard. On the first window select the Monitor or All class and click the Next button.
On the second window select the newest or appropriate BQ76922 version in the list and click the Finish button.
This selection is remembered until the software is re-stared. If the device is not found, the user is presented
with a Proceed? window which must be acknowledged. If the software still can not find the device, a Battery
Management Studio popup window appears indicating communication status. Acknowledge the message to
proceed.

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Figure 4-1. Target Selection Wizard

If the software was started without a communication interface adapter, a Battery Management Studio popup
window indicates a free adapter is not available. Acknowledge the message to proceed. Errors appear in the left
bottom border of the Battery Management Studio screen. Correct the problem with the adapter and restart the
software.
BQStudio contains a user guide for general operation of the software. Refer to the menu selection Help | Help
Contents for information.
The BQStudio window appears as shown in Figure 4-2. The register area is blank since the device is not
attached.
The center pane of BQStudio displays tool tips when the cursor is held over an item name. The tool tip provides
some description of the item. The tool tip closes after approximately 30 seconds. To avoid the tool tip display
move the cursor to the value or units column, or to the Dashboard pane.

Figure 4-2. BQStudio Window without Device

Without a device, BQStudio operates with reduced functions. Tools can be browsed and data fields inspected,
but data can not be entered.
On the left side of the window is the dashboard which shows the adapter, device and simple voltage and current
displays. The dashboard updates periodically unless Auto Refresh is stopped by clicking on the banner. The
right side of the window has the commands pane.

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The center panel of the window initially shows the register tab. The register display shows device status registers
and is read once when the device is detected. To update the register values select the Refresh button at the
top of the Registers tab. To repeatedly read the registers select the Scan button. To repeatedly read and log
the register values to a file select the Start Log button and follow the prompts to save a log file. When a log is
running, select Stop Log to end the log and close the file. The Parameter View selection allows the choice of
basic parameters which shows commonly used registers, or all parameters which shows more registers.
If a device is connected and powered after BQStudio is powered, dashboard may auto detect the device and
update the device and register display. Figure 4-3 shows a register display with a connected device.

Figure 4-3. Register View with Device

The available tools for the device are shown at the top of the window and may be selected by clicking on the tool
icon. Tools may also be selected from the View menu as shown in Figure 4-4. Opening a new tool may change
the center tab of the window. These tools are described in following sections. Not all devices have all the tools
described. Multiple tools can be active at one time, tools which use the center pane for display are shown as a
tabs at the top of the center section. These tabs can be closed with the X as desired, but closing the tab may
terminate the operation running in the tab.

Figure 4-4. Tool Selections

4.5 Commands
The Commands tab is displayed on the right side of the BQStudio window. Buttons allow reading various
information about the device and certain operations. Commands and returned data are shown in the Log Panel
of the tab. The seal function is unusual in general evaluation and is not recommended during initial evaluation.

CAUTION
Sealing the device without remembering the key reduces the function of the EVM.

4.6 Data Memory

The data memory tool is used to configure the device. The device has both volatile registers and One Time
Programmable (OTP) memory. Most evaluation can be performed without writing OTP. Configuration files may
be saved and loaded later to resume evaluation. At power up, the device is configured from the OTP. On a new
EVM, the OTP has only the REG0 and REG1 settings of the BQ76922, other locations are not programmed.

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Configuration can be entered in the volatile registers using the Data Memory tool. The Data Memory tool
displays as a tab in the center pane of the BQStudio window. Figure 4-5 shows the initial data memory view
with a device connected. Configuration settings are grouped into different functions accessed with buttons on the
left side of the pane. The Calibration section is displayed on initial selection. Other functional sections can be
displayed by clicking on the named button.

Figure 4-5. Data Memory View

4.6.1 Entering, Saving, and Loading Configuration

Most of the configuration of the BQ76922 is accomplished through setting values in data memory. The data
memory locations are accessed using the buttons in the Data Memory view. The Parameter View selection
at the top of the pane allows the choice of basic parameters which shows commonly used parameters, or all
parameters which shows more configuration parameters. Data values may be changed by selecting and entering
a value. Parameter registers which are bit fields may be changed by selecting the bit in the pop up when the
register or its value is selected. Data Memory must be written after bit changes, a button is provided under the
bit field. Figure 4-6 shows the bit field for the Enabled Protections A which is one of the most basic settings that
must typically be changed with the EVM.

Figure 4-6. Data Memory Bit Field Change

Changes to configuration by memory changes take place immediately, however the FETs are enabled using the
Enable_FETs command. Enabling a protection and enabling the protection action on a FET are not sufficient,
the FETs must be enabled with the command. BQStudio will enter and exit configuration update mode of the
part automatically when data memory is edited. If FETs were on when config update mode was entered they will
be turned off during the write and turned on after exit. Exiting config will clear some command settings such as
SLEEP_DISABLE, check settings after configuration changes.
Calibration data is also located in data memory. Calibration values may be loaded manually or calculated by a
tool.
The data is read from the part when the Data Memory view is opened, but the window does not know when
the power may have been cycled so that the data is not current. Data may be read using the Read All tool
at the top of the pane. The Export tool in the Data Memory view allows saving the configuration data to a
comma-separated-value file format which can be accessed by a spreadsheet program. Reading data before
export with the Read All button loads the data from the part rather than values which may be only in the view.
Export also has an option to export a Flash Stream format file which can be written to another part by the
Command Sequence tool. The FS file can be saved with OTP programming command included. The Import tool
allows loading a saved file into the view so that it can be written to the device. The Write All tool writes all values

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in the view into registers in the device. The gg.csv files should not be edited with a spreadsheet program since
those may add characters causing the import to fail.
4.6.2 OTP Programming

CAUTION
OTP programming is a permanent change to the device. Be sure all configuration and calibration
are set before programming settings into the device. Casual programming may leave the board
inoperable. Writes to OTP are not incremental, all OTP is written at the same time.

Once the configuration and calibration has been determined and loaded in the registers, it may be programmed
to the BQ76922 OTP memory using the Program OTP button at the top of the pane. Note that this is a
permanent programming and is not reversible. There are 2 writes possible, if the device has been programmed
once, a second memory is available. Additional memories are not available. OTP memory is programmed using
the OTP memory view. Programming typically takes about 40 s. To program the OTP memory:
1. OTP write requires 12V at the board stack and room temperature. Calibrate the device if needed.
2. Be sure the desired settings are written to the data memory.
3. Select the Program OTP tool at the top of the Data Memory window. This opens a Program OTP pane.
4. Adjust the board voltage to 12.0 +/- 0.1 V for programming.
5. Select the Check OTP Programming Possible button. If not successful make the recommended adjustments
if possible. If successful, the display is similar to Figure 4-7.
6. Select the Program Data Memory to OTP Memory button. If successful, the display is similar to the check.
7. Adjust the board voltage back to normal operating conditions, cycle power, and test as desired.

Figure 4-7. Program OTP Pane with Success Display

4.7 Calibration
The calibration tool may not be available for all versions of devices. When the calibration tool is not available
calibration of the device can be performed by entering values in the calibration section of the data memory.
The calibration writes to the volatile registers in the device which are available in the Data Memory view. When
calibration values are complete they can be written to the OTP with other configuration settings. Calibration
cannot be written to OTP separately from configuration settings.
The EVM and all new boards should be calibrated before operation. The calibration view is shown in Figure 4-8.
Temperature is typically calibrated first. Board Offset should be calibrated with no current flow and should be
calibrated before Current Gain. The EVM uses a 1-mΩ sense resistor and calibration at low current results in
some granularity from the current resolution. This may result in an apparent error at higher currents. Calibration
at higher currents reduces this effect and should be done where it is important.
Voltages and temperatures may be calibrated individually or as a group. All values entered are calibrated. If
individual values are to be calibrated, leave all the other entries blank. As an example, measure the battery
voltage, calculate the average cell value and enter the value in the box. Clicking the Calibrate Voltage button
runs the calibration. Values left blank or entered as '0' are not calibrated. When successful, a green check
appears next to the button as shown in Figure 4-9. If there is an error, a red X appears instead as shown in
Figure 4-10 with a message in the bottom border.

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When calibrating the EVM voltage, remember the EVM uses 1% values for the cell simulator resistors.
Measuring each cell voltage value is recommended rather than using a common value if individual cell voltage
calibration is desired.

Figure 4-8. Calibration View

Figure 4-9. Example Voltage Calibration Success

Figure 4-10. Example Current Calibration Failure

4.8 Command Sequences

Features are controlled by commands as described in the BQ76922 technical reference manual (SLUUCG7).
Data is available from registers, and the registers view shows data, but a user may want to send specific
commands to the device. The Command sequences tool allows this operation and is shown in Figure 4-11.
The Device Send and Receive section allows read or write to a single or consecutive locations. The Command
Sequence section allows reads and writes to be intermixed in a sequence. Sequences may be stored to files or
called from files. Files may be assigned to buttons in the Command Sequence File Assignment Buttons section.
Results can be viewed in the Transaction Log and saved to a file if desired.

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Figure 4-11. Command Sequence View

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5 BQ76922EVM Circuit Module Use

The BQ76922 circuit module contains the BQ76922 IC and related circuitry to demonstrate the features of the
IC. Surface mount FETs are provided for the high current path. A thermistor provides temperature sensing on the
board. Other components provide support for the IC and connections to the board. Basic operation is described
in the quick start guide. For details of the circuit, refer to the physical construction section.
5.1 Cell Simulator
The EVM includes a resistive cell simulator made up of 200-Ω series resistors. The taps of the resistor network
are connected to the cell inputs using shunts on the J16 header. BAT- is always connected to the resistor divider
network. Installing a shunt on the top cell location connects the top cell input to the resistor divider to provide
simulated voltages for the other cell inputs. If the shunt is not installed on the top cell position of the header all
lower inputs are pulled to VSS. Installing shunts for the lower cell positions connects the input to the simulated
voltage. There is no indication of the cell simulator connection, the user must be aware of the shunt installation.
5.2 Evaluating with Load Current
With the BQ76922 configured and the FETs enabled discharge current can be demonstrated by attaching
suitable resistors or a DC load at the PACK terminals as shown in Figure 5-1.
DC Load
+ -

DC Power Supply
+ -

Install cell
simulator shunts

Position shunts
to “INT”

Figure 5-1. Evaluating with Load Current

5.3 Evaluating Charge and Discharge Currents

Bipolar power supplies source or sink currents to maintain the set voltage. When bipolar supplies are available,
they may be used for both the battery and pack side of the board to allow charge and discharge currents without
re-connecting the equipment. Be sure to set the supplies appropriately to prevent exceeding the ratings of the
EVM.

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Bipolar DC Power Supply

(source/sink)

+ -

Bipolar DC Power Supply

(source/sink)

+ -

Install cell
simulator shunts

Position shunts
to “INT”

Figure 5-2. Evaluating with Charge or Discharge Current

5.4 Evaluating with Simulated Current

The quick start guide describes connection for basic operation. Providing more than recognizable current in that
configuration can require a power supply with a significant power rating. Applying a charge current can damage
some power supplies. Figure 5-3 shows a method to force current through the sense path without a high wattage
power supply or special equipment. The load power supply should be set at a low voltage in a constant current
mode. Polarity can be reversed on the load supply to simulate a charge current. The battery simulation supply
must never be reversed.

DC Power Supply
(Simulated load) + -

DC Power Supply
+ -

Install cell
simulator shunts

Position shunts
to “INT”

Figure 5-3. Simulating Current Setup

5.5 Reducing the Cell Count

The BQ76922 must have the top and bottom cells used for proper operation. Cell count can be reduced by
shorting the unused cell inputs from the next-to-top down. Cell count can be reduced for basic evaluation by

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shorting unused cells at the input terminal block. Follow the recommendations in the datasheet for which cells
to short. This works for both operation with the cell simulator and cells, but can have some side effects in
transient tests because it parallels the shorted resistors to the cell IC where the capacitor provides a signal path
to the used input. See Figure 5-4 for an example of simple reduced cell configuration for 3 cells. For the best
evaluation with reduced cells in a transient environment, short the VCx pins at the capacitor and remove the
unused input resistor. When using the cell simulator, shorting the unused cell at the terminal block is still required
to eliminate the simulated cell voltage. Shorting the cell inputs at the terminal block screw terminals is suggested
since it should be apparent if the board is re-used for a different cell count. Table 5-1 shows configuration
recommendations for reduced cell count.
Table 5-1. Reducing Cell Count
Unused Cell
Short Cell Input Input Resistor To Replace Capacitor
(Numbered from Bottom IC Inputs Shorted
Terminals Remove With 0 Ω
Cell 1)
Cell 4 CELL4 to CELL3 R4 C5 VC4 to VC3
Cell 3 CELL3 to CELL2 R5 C7 VC3 to VC2

DC Power Supply
Short
+ - CELL4 to CELL3
and
CELL3 to CELL2

Install cell
simulator shunts

Figure 5-4. Example 3-Cell Simple Evaluation Configuration

When reducing the cell count with the top cell used, the resulting configuration of the BQ7718 secondary
protector does not match its data sheet configuration. While the circuit typicaly function on the EVM, when
implementing a design the configuration of the data sheet is recommended.
After changing the physical connection the Vcell Mode must be changed in Data Memory Settings for proper
operation. The default setting of 0x0000 selects all cells and will be the same as 0x001F. For 3 cells as shown
above set the Vcell Mode to 0x0013.
5.6 Connecting Cells
The EVM is constructed with a single connection to the top and bottom of the cell stack. Cell voltage for these
cells is sensed on the board.
While the EVM has a place to mount an activated fuse, the pattern is shorted to allow easy evaluation without
the concern of activating the fuse. When connecting cells use a fuse in the current path and any other signal
path appropriate for your application.
The cell simulator provides resistors between the cell inputs. When the cell simulator shunts are installed, these
resistors load the cells, and divide the voltage to any unconnected inputs as cells are connected. If desired,
the cell simulator shunts can be installed during cell connection and removed after cell connection. The shunts
must be removed after connection of cells, or the cells are discharged by the constant drain of the cell simulator
resistors.
BAT- is the reference voltage for the IC and should be connected first. After BAT- cells may be connected in any
order. Cell connection from the bottom up minimizes the voltage step size applied to the board. Recommended
connection sequence for the EVM when connecting cells is bottom up:
1. Connect BAT–
2. Connect cells bottom up; CELL1, CELL2, CELL3 ...

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3. Be sure the cell simulator shunts are removed

Figure 5-5 shows an example connecting cells with an EVM configuration reduced to 4 cells. Be sure the Vcell
mode is configured for the cells used. In this example 0x0017.
If connec
ng cells conrm opera on before connecng.
Use all appropriate fusing, insulaon, isolaon and
shielding necessary for safe operaon. Board has exposed
contacts. Do not leave una ended

For 4 cells, connect 3rd

cell to both CELL3 and
CELL4 inputs

Remove cell
simulator shunts
to avoid draining
cells

Figure 5-5. Example Connection with 4 Cells

5.7 Connecting to a Host

After initial operation of the monitor with the BQStudio software, it may be desirable to operate the board
connected to and controlled by a microcontroller board. J5 could be used to connect I2C signals to the
microcontroller board with GND and REG1 for a power supply from J2. The user should note that the J2 GND is
connected to the BQ76922 VSS and BAT- while the J5 reference is PACK-. With the connection shown in Figure
5-6 the MCU runs from the battery voltage inside the protection FETs. The shunts on J7 must be positioned to
connect the BQ76922 I2C lines to the external connector. If the MCU board provides pull ups for the I2C lines,
remove any PU shunts from J7. If 10kohm pull ups are desired to REG1 for the SCL and SDA install shunts on
the PU pins of J7. The microcontroller board GND could alternately be referenced to the PACK- at J5. In this
case the REG1 power supply would be modulated by the battery current. Since the sense resistor is small, this is
not normally a concern, but the user should be aware of the difference. Do not connect the same GND reference
to both the J2 GND and the J5 PACK- since this shorts the sense resistor through the external equipment and
may lead to damage or unexpected results.

CAUTION
Do not connect the MCU board to both the J2 GND and J5 PACK- terminals, this shorts the sense
resistor and could result in damage to equipment or unexpected results.

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MCU
Evalua
on Board

SDA
SCL

DC Power Supply
+ -

Install cell
simulator shunts

Position shunts to “EXT”,

omit “PU” if pull-up
provided on MCU

Figure 5-6. Host Connection Concept

5.8 Hardware Configuration

5.8.1 Configuration Jumpers
Certain features on the BQ76922EVM may be configured by jumpers or shunts on headers. See Section 6.4 for
details of the header pins. Not all configurations are compatible with all register settings, the user should set pins
appropriately for the register settings planned. For example pins must not be pulled above REG18 when used as
thermistor inputs. Pull up to REG1 is not acceptable when registers configure a pin as a thermistor input.

CAUTION
Multi-function pins must be connected to compatible signal levels before programming registers to
avoid device damage.

The J16 cell simulator header and J7 I2C configuration are discussed with board connection diagrams.
J4 selects the connection of the DFETOFF and CFETOFF pins. Pins may be pulled low, high to REG1 or
brought to a terminal block for external connection.
J3 selects the connection of TS2. It may be taken to a terminal block for connection of an external wake or
thermistor. It may also be pulled to VSS. The 10k R22 simulates a nominal temperature.
J6 selects the connection of ALERT. It may be connected to a terminal block for external connection, to the
on-board interface for HDQ, or pulled up to REG1 or down to VSS.
5.8.2 Unused Components
The EVM contains a number of component patterns which may be useful for evaluation. Unpopulated headers
at the MCU may provide future signal access. Parallel FET configuration is possible by changing the component
population in the FET area. See the FET schematic page Figure 6-10.
5.9 Configuration Register Programming
Configuration register programming should be done once hardware configuration is set with jumpers.
Configuration registers are set in the Data Memory screen and are different from the status registers displayed

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in the Registers screen. See the BQ76922 data sheet and supporting documentation for register information.
When a configuration file is available it may be imported to set all operational selections at once. However,
a configuration file loaded with Data Memory Import can load as little as 1 parameter, so the user should be
familiar with the contents of imported files. With a new device or after loading a configuration file, individual
register changes may be made. Configuration register programming typically involves the following general
principles selected in various register names:
1. Selection of the function for multi-function pins
2. Selection of the protection features to be enabled
3. Selection of the protection thresholds for the enabled features
4. Setting the FET control options
5. Exporting (saving) the configuration register file for future use
When no additional changes are anticipated to the configuration and extended validation is planned, the user
may write the configuration to OTP. OTP is written using the Program OTP button on the Data memory window
of BQStudio. Once programmed the device loads the register values from OTP after reset. Additional register
changes may be made, but the user should realize the part features have been permanently changed. OTP
settings may be incompatible with additional hardware configuration changes and could result in damage. The
user should check settings or replace the IC or EVM as required.

CAUTION
Hardware changes after OTP programming may result in damage to the IC or board after reset if
incompatible configuration is selected.

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6 BQ76922EVM Circuit Module Physical Construction

This section contains the PCB layout, bill of materials, and schematic of the BQ76922EVM circuit module.
The BQ76922EVM consists of one circuit module assembly, BMS022.
6.1 Board Layout
The BQ76922EVM circuit module is a 3.0-inch × 4.9-inch 4-layer circuit card assembly. It is designed for
easy assembly with cell connections on the left edge to a terminal block. Pack terminals are on the top edge
using a terminal block. Wide trace areas are used reducing voltage drops on the high current paths. Optional
connections for hardware feature pins are on a separate terminal block on the top edge of the board. An
on-board interface adapter with USB connector is located in the right lower corner. Configuration headers are
toward the right side of the board. Pushbutton switches for wake up and reset of the BQ76922 are located near
the bottom edge of the board. The EVM layout and construction allows easy understanding of the connections
and access to the test points for evaluation, but the connector area and programming features result in a large
board.
The board layout includes spark gaps with the reference designator prefix E. These spark gaps are fabricated
with the board and no component is installed.
See additional information in the configuration and operation sections of this document. Figure 6-1 to Figure 6-8
show the board layout.

Figure 6-1. Top Silk Screen

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Figure 6-2. Top Assembly

Figure 6-3. Top Layer

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Figure 6-4. Layer 2

Figure 6-5. Layer 3

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Figure 6-6. Bottom Layer

Figure 6-7. Bottom Silk Screen

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Figure 6-8. Bottom Assembly

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6.2 Bill of Materials

The bill of materials for the circuit module is shown in Table 6-1. Substitute parts may be used in the manufacturing of the assembly.
Table 6-1. BQ76922 Circuit Module Bill of Materials
Alternate Alternate
Designator Qty Value Description Package Reference Part Number MFG
Part Number MFG
!PCB1 1 Printed Circuit Board BMS022 Any
C1 1 0.47uF CAP, CERM, 0.47 uF, 25 V, +/- 10%, X7R, AEC-Q200 Grade 0805 GCM219R71E474KA55D MuRata
1, 0805
C2, C13 2 100pF CAP, CERM, 100 pF, 50 V, +/- 5%, C0G/NP0, 0603 0603 C0603C101J5GACTU Kemet
C3, C6 1 1uF CAP, CERM, 1 uF, 50 V, +/- 10%, X7R, AEC-Q200 Grade 1, 1206 CGA5L3X7R1H105K160A TDK
1206 B
C4, C5, C7, C8, C9, 6 0.22uF CAP, CERM, 0.22 uF, 50 V, +/- 10%, X7R, 0603 0603 C1608X7R1H224K080AB TDK
C10

C19, C24, C25, C26, C27, C28, C29, 12 0.1uF CAP, CERM, 0.1 uF, 50 V, +/- 10%, X7R, 0603 0603 885012206095 Wurth Elektronik
C30, C31, C32, C33, C34

C11 1 0.022uF CAP, CERM, 0.022 uF, 16 V, +/- 10%, X7R, 0603 0603 C0603C223K4RACTU Kemet

C12 1 0.01uF CAP, CERM, 0.01 uF, 16 V, +/- 10%, X7R, 0603 0603 885012206040 Wurth Elektronik

C16 1 1uF CAP, CERM, 1 uF, 16 V, +/- 10%, X7R, 0805 0805 EMK212B7105KG-T Taiyo Yuden
C18 1 2.2uF CAP, CERM, 2.2 uF, 16 V, +/- 10%, X7R, 0805 0805 EMK212B7225KG-T Taiyo Yuden
C35, C37, C40, C41, C43 5 0.1uF CAP, CERM, 0.1 uF, 16 V, +/- 10%, X7R, 0402 0402 885012205037 Wurth Elektronik
C36, C42, C44 3 0.47uF CAP, CERM, 0.47 uF, 6.3 V, +/- 10%, X5R, 0402 0402 04026D474KAT2A AVX
C38, C39 2 10uF CAP, CERM, 10 µF, 16 V,+/- 10%, X5R, 0805 0805 CL21A106KOQNNNG Samsung Electro-Mechanics
C45 1 2200pF CAP, CERM, 2200 pF, 10 V, +/- 10%, X7R, 0402 0402 885012205008 Wurth Elektronik
D1, D2, D7 3 40V Diode, Schottky, 40 V, 0.2 A, SOT-323 SOT-323 BAS40W-7-F Diodes Inc.
D3 1 Red LED, Red, SMD LED_0603 150060RS75000 Wurth Elektronik
D4, D5, D6 3 16V Diode, Zener, 16 V, 500 mW, SOD-123 SOD-123 MMSZ5246B-7-F Diodes Inc.
D8 1 100V Diode, Ultrafast, 100 V, 0.15 A, SOD-123 SOD-123 1N4148W-7-F Diodes Inc.
D9 1 100V Diode, Schottky, 100 V, 0.15 A, SOD-123 SOD-123 BAT46W-7-F Diodes Inc.
D13, D14, D15 3 Green LED, Green, SMD LED_0603 150060VS75000 Wurth Elektronik
H1, H2, H3, H4 4 Bumpon, Hemisphere, 0.44 X 0.20, Clear Transparent Bumpon SJ-5303 (CLEAR) 3M
J1 1 TERM BLOCK 3.5MM VERT 6POS PCB HDR6 OSTTE060161 On Shore Technology
J2 1 Terminal Block, 3.5mm, 8-Pos, TH Terminal Block, 3.5mm, 8-Pos, ED555/8DS On-Shore Technology
TH
J4 1 Header, 100mil, 6x2, Tin, TH Header, 6x2, 100mil, Tin PEC06DAAN Sullins Connector Solutions
J3 1 Header, 2.54mm, 3x1, Gold, SMT Header, 2.54mm, 3x1, SMT 87898-0304 Molex
J5 1 Header (friction lock), 100mil, 4x1, R/A, TH 4x1 R/A Header 22/05/3041 Molex
J7, J16 2 Header, 100mil, 5x2, Tin, TH Header, 5x2, 100mil, Tin PEC05DAAN Sullins Connector Solutions
J6 1 Header, 100mil, 4x2, Tin, TH Header, 4x2, 100mil, Tin PEC04DAAN Sullins Connector Solutions
J9 1 TERM BLOCK 3.5MM VERT 4POS PCB HDR4 OSTTE040161 On Shore Technology
J12 1 Receptacle, Micro-USB Type B, 0.65 mm, 5x1, R/A, Bottom Receptacle, 0.65mm, 5x1, 47346-1001 Molex
Mount SMT R/A, SMT
J13 1 Header, 2.54 mm, 2x1, Gold, TH Header, 2.54mm, 2x1, TH 61300211121 Wurth Elektronik
J15 1 Header, 2.54mm, 4x1, Tin, TH Header, 2.54mm, 4x1, TH 22284043 Molex

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Table 6-1. BQ76922 Circuit Module Bill of Materials (continued)

Alternate Alternate
Designator Qty Value Description Package Reference Part Number MFG
Part Number MFG
Q1 1 80 V Transistor, NPN, 80 V, 1 A, SOT-89 SOT-89 BCX5616TA Diodes Inc.
Q4, Q5 2 -60V MOSFET, P-CH, -60 V, -0.9 A, SOT-23 SOT-23 ZXMP6A13FTA Diodes Inc. None
Q7, Q8 2 60V MOSFET, N-CH, 60 V, 172 A, DNK0008A (VSON-CLIP-8) DNK0008A CSD18532Q5B Texas Instruments None
Q9 1 60V MOSFET, N-CH, 60 V, 0.31 A, SOT-323 SOT-323 2N7002KW Fairchild Semiconductor None
Q10 1 60V MOSFET, N-CH, 60 V, 2 A, AEC-Q101, SOT-23 SOT-23 DMN6075S-7 Diodes Inc. None
R1, R14, R15, R21, R23, R28 6 100 RES, 100, 5%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 CRCW0603100RJNEA Vishay-Dale
R2, R4, R5, R6, R7, R8 6 20.0 RES, 20.0, 1%, 0.25 W, AEC-Q200 Grade 0, 1206 1206 CRCW120620R0FKEA Vishay-Dale
R3 1 200 RES, 200, 5%, 1 W, AEC-Q200 Grade 0, 2512 2512 CRCW2512200RJNEG Vishay-Dale
R11, R12, R13, R18, R19, R20, R22, 14 10k RES, 10 k, 5%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 CRCW060310K0JNEA Vishay-Dale
R46, R50, R55, R56, R57, R58, R59
R16, R17, R24 3 100k RES, 100 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 CRCW0603100KFKEA Vishay-Dale
R25 1 0.001 RES, 0.001, 1%, 1 W, 1210 1210 PMR25HZPFV1L00 Rohm
R29, R30 2 1.0k RES, 1.0 k, 5%, 1 W, AEC-Q200 Grade 0, 2512 2512 CRCW25121K00JNEG Vishay-Dale
R10, R31, R32, R38, R39, R40 6 10Meg RES, 10 M, 5%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 CRCW060310M0JNEA Vishay-Dale
R33, R35, R37, R41, R42, R51 6 1.0k RES, 1.0 k, 5%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 CRCW06031K00JNEA Vishay-Dale
R36 1 3.9k RES, 3.9 k, 5%, 0.25 W, AEC-Q200 Grade 0, 1206 1206 CRCW12063K90JNEA Vishay-Dale
R44 1 0 RES, 0, 5%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 CRCW06030000Z0EA Vishay-Dale
R45, R47, R48, R49, R54 5 5.1k RES, 5.1 k, 5%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 CRCW06035K10JNEA Vishay-Dale
R52 1 20k RES, 20 k, 5%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 CRCW060320K0JNEA Vishay-Dale
R60, R61 2 33 RES, 33, 5%, 0.063 W, AEC-Q200 Grade 0, 0402 0402 CRCW040233R0JNED Vishay-Dale
R62 1 2.0k RES, 2.0 k, 5%, 0.063 W, AEC-Q200 Grade 0, 0402 0402 CRCW04022K00JNED Vishay-Dale
R63, R71 2 10k RES, 10 k, 5%, 0.063 W, AEC-Q200 Grade 0, 0402 0402 CRCW040210K0JNED Vishay-Dale
R64, R65 2 1.0Meg RES, 1.0 M, 5%, 0.063 W, AEC-Q200 Grade 0, 0402 0402 CRCW04021M00JNED Vishay-Dale
R66, R67, R68 3 330 RES, 330, 1%, 0.1 W, AEC-Q200 Grade 0, 0402 0402 ERJ-2RKF3300X Panasonic
R69, R70, R72, R73, R74 5 200 RES, 200, 1%, 0.25 W, AEC-Q200 Grade 0, 1206 1206 CRCW1206200RFKEA Vishay-Dale
RT1 1 10k Thermistor NTC, 10.0k ohm, 1%, Disc, 5x8.4 mm Disc, 5x8.4 mm 103AT-2 SEMITEC Corporation
S1, S2 2 Switch, Tactile, SPST-NO, SM Switch, 6.2X5X6.2 mm KST221JLFS C&K Components
S3 1 Switch, SPST-NO, Off-Mom, 0.05A, 12VDC, SMD 3.9x2.9mm PTS820 J20M SMTR LFS C&K Components
SH-J1, SH-J2, SH-J3, SH-J4, SH-J5, 11 1x2 Shunt, 100mil, Gold plated, Black Shunt SNT-100-BK-G Samtec 969102-0000-DA 3M
SH-J6, SH-J7, SH-J8, SH-J9, SH-J10,
SH-J11
TP1 1 Test Point, Multipurpose, Red, TH Red Multipurpose Testpoint 5010 Keystone
TP4 1 Test Point, Multipurpose, Black, TH Black Multipurpose Testpoint 5011 Keystone
TP13, TP14, TP15, TP16 4 Test Point, Compact, Black, TH Black Compact Testpoint 5006 Keystone
U1 1 Multicell Battery Monitor and Protection Family, RSN0032B RSN0032B BQ76922RSNT Texas Instruments BQ76922RSNR Texas
(WQFN-32) Instruments
U2, U3 2 Single-Channel ESD in 0402 Package With 10pF DPY0002A TPD1E10B06DPYR Texas Instruments TPD1E10B06DP Texas
Capacitance and 6V Breakdown, DPY0002A (X1SON-2) YT Instruments
U4 1 Family 2-5S Overvoltage Protector with Internal Delay Timer, DPJ0008A BQ771807DPJR Texas Instruments BQ771807DPJT Texas
DPJ0008A (WSON-8) Instruments
U5 1 25 MHz Mixed Signal Microcontroller with 128 KB Flash, 8192 PN0080A MSP430F5529IPN Texas Instruments
B SRAM and 63 GPIOs, -40 to 85 degC, 80-pin QFP (PN),
Green (RoHS & no Sb/Br)

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Table 6-1. BQ76922 Circuit Module Bill of Materials (continued)

Alternate Alternate
Designator Qty Value Description Package Reference Part Number MFG
Part Number MFG
U6, U7, U9, U10 4 Single-Channel ESD in 0402 Package With 10pF DPY0002A TPD1E10B06DPYT Texas Instruments TPD1E10B06DP Texas
Capacitance and 6V Breakdown, DPY0002A (X1SON-2) YR Instruments
U8 1 Single Output LDO, 150 mA, Fixed 3.3 V Output, 2.7 to 10 DBV0005A TPS76333DBVR Texas Instruments
V Input, with Low IQ, 5-pin SOT-23 (DBV), -40 to 125 degC,
Green (RoHS & no Sb/Br)
Y1 1 Resonator, 4 MHz, 39 pF, AEC-Q200 Grade 1, SMD 4.5x1.2x2 mm CSTCR4M00G55B-R0 MuRata
C17 0 0.01uF CAP, CERM, 0.01 uF, 16 V, +/- 10%, X7R, 0603 0603 885012206040 Wurth Elektronik
C14, C15, C20, C21 0 0.1uF CAP, CERM, 0.1 uF, 50 V, +/- 10%, X7R, 0603 0603 885012206095 Wurth Elektronik
D10, D11, D12 0 100V Diode, Schottky, 100 V, 0.15 A, SOD-123 SOD-123 BAT46W-7-F Diodes Inc.
F1 0 Fuse, 30 A, 62 VDC, SMD 9.5x2x5mm SFK-3030 Dexerials Corporation
FID1, FID2, FID3, FID4, FID5, FID6 0 Fiducial mark. There is nothing to buy or mount. N/A N/A N/A
J8 0 Terminal Block, 3.5mm Pitch, 2x1, TH 7.0x8.2x6.5mm ED555/2DS On-Shore Technology
J10, J11 0 Header, 2.54 mm, 7x1, Gold, TH Header, 2.54 mm, 7x1, TH PBC07SAAN Sullins Connector Solutions
J14 0 Header, 2.54mm, 5x1, Tin, TH Header, 2.54mm, 5x1, TH PEC05SAAN Sullins Connector Solutions
Q2 0 -60V MOSFET, P-CH, -60 V, -0.9 A, SOT-23 SOT-23 ZXMP6A13FTA Diodes Inc. None
Q3 0 40V MOSFET, N-CH, 40 V, 15 A, DQJ0008A (VSONP-8) DQJ0008A CSD18504Q5A Texas Instruments None
Q6 0 60V MOSFET, N-CH, 60 V, 172 A, DNK0008A (VSON-CLIP-8) DNK0008A CSD18532Q5B Texas Instruments None
R9 0 0 RES, 0, 5%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 CRCW06030000Z0EA Vishay-Dale
R26 0 1.0k RES, 1.0 k, 5%, 1 W, AEC-Q200 Grade 0, 2512 2512 CRCW25121K00JNEG Vishay-Dale
R27 0 10Meg RES, 10 M, 5%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 CRCW060310M0JNEA Vishay-Dale
R34 0 0 RES, 0, 5%, 2 W, 2512 WIDE 2512 WIDE RCL12250000Z0EG Vishay Draloric
R43 0 51 RES, 51, 5%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 CRCW060351R0JNEA Vishay-Dale
R53 0 10k RES, 10 k, 5%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 CRCW060310K0JNEA Vishay-Dale
TP38, TP39 0 Red Test Point, Compact, Red, TH Red Compact Testpoint 5005 Keystone
Note: Unless otherwise noted in the Alternate PartNumber and/or Alternate Manufacturer columns, all parts may be substituted with equivalents.

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6.3 REACH Compliance

In compliance with the Article 33 provision of the EU REACH regulation we are notifying you that this EVM
includes component(s) containing at least one Substance of Very High Concern (SVHC) above 0.1%. These
uses from Texas Instruments do not exceed 1 ton per year. The SVHC’s are:
Table 6-2. REACH Components
Component Manufacturer Component Part Number SVHC Substance SVHC CAS (when available)
Lead Titanium Zirconium Oxide
Murata Resonator CSTCR4M00G55B-R0 12626-81-2
[(Pbx Tiy Zrz) 03]

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6.4 Schematic
Figure 6-9 through Figure 6-11 illustrate the schematics.
Input
22V 10A
TP1
BAT+
1 5P
5P 5P
2 4P
4P
3 3P
3P
4 2P
2P
5 1P
1P
TP2 TP3
6 D1 C1
R1 BAT CP1
CD
100
J1 C2 C3 0.47uF
40V 100pF 1uF U1
TP4
BAT- D2
1 32
BAT CP1
VSS VSS 40V
CHG 31 CHG
R2 CHG
VC5 2 VC5
20.0 VC4 3 VC4A DSG 30 DSG
C4 DSG R3
4 VC4B
R4 0.22uF 5 29 PACK 200
VC3A PACK PACK
20.0 VC3 6 VC3B
C5 VC2 7 28 LD
R5 VC2 LD LD
0.22uF VC1 8 C6
VC1
20.0 VC0 9 27 PCHG 1uF
VC0 PCHG PCHG
C7

2,4
TP5 Q1
R6 0.22uF SRP 11 26 PDSG J2
SRP PDSG PDSG BCX5616TA
20.0 1 VSS EXTTS2 1
C8 TS2
FUSE 25 FUSE EALERT 2
R7 0.22uF FUSE ALERT
SRN 12 SRN
EDFETOFF 3
DFETOFF

3
20.0 BREG 24 BREG TP6 ECFETOFF 4
CFETOFF
TS1 13 TS1
RST_SHUT 5
R8 R9 RST-SHUT
TS2 14 TS2 REGIN 23 REGIN EREGIN 6
REGIN
20.0 0 7
REG1
REG1 8
C9 C10 VSS
ALERT 16 ALERT RST_SHUT 21
0.22uF 0.22uF SRP SRN TS1 TS2
SCL 17 SCL
TP7 SDA 18 SDA DFETOFF 20 DFETOFF VSS
TP8 TP9 TP10 REG1 RESET
VSS 22 19 CFETOFF R10 TP11
REG1 CFETOFF
10M S1 REG1
TP12 15 REG18 1 4
33 2 3
PAD
VSS 10
C11 VSS R11 R12 R13
BQ76922RSNT 10k 10k 10k C12
EXTTS2 0.022uF
C13 REG18 0.01uF
J3
1 VSS J4 VSS VSS
C14 100pF C15 2 C16 C17 C18 1 2
0.1uF C19 0.1uF 3 3 4
NT1 1uF 0.01uF 2.2uF 5 6
BAT-
TP13 TP14 7 8
VSS 0.1uF VSS 9 10
4
3

VSS VSS SDA SCL 11 12

R14 R15
100 100 R16 R17
VSS TP15 TP16 TP17 TP18 S2 100k 100k
1
2

GND GND GND GND REG1

WAKE REG1

VSS VSS VSS VSS VSS

R18 R19
R20 10k 10k
10k J5
RT1 R22 J6 R21 4
t°

10k 1 2 EALERT 3
R23 100 SDA2 SDA
3 4 HDQ 2
HDQ SCL
TP19 5 6 1
100 PACK-

9
7
5
3
1
GND 7 8
J7
TP20 R24
BAT- 100k

1
R25 VSS
E1 E2

10
8
6
4
2
0.001 PGND U2 U3
SCL2
VSS

2
PGND

Figure 6-9. Schematic Diagram Monitor

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TP22 C20 C21
NT2
Q2 0.1uF 0.1uF J8
R26 CPACK+ 1
CPACK+
1.0k 2
CPACK+
R27
F1 10M
Q3 C22
1 3 FBAT 0.1uF E3
5P 1,2,3 7,8
5,6,
TP23
C23

4
SFK-3030 C24 C25 0.1uF

TP24
R28 0.1uF 0.1uF
Q4 Q5 PGND
100 U4 R29 R30
D3 1.0k
1 8 Red R32 R31
VDD OUT
10M 10M
R33 2
FUSE Q6
V5 R34 PDgate
1.0k C26 C27 7,8 1,2,3
3 V4 0
R35 0.1uF 0.1uF 1 5,6,
4P
4 V3 J9
1.0k Q7 Q8

4
C28 R36 TP25
R37 0.1uF 5 7 3.9k PACK+
3P V2 VSS 1,2,3 7,8 7,8 1,2,3 4 PACK+
1.0k C29 6 9 R38 5,6, 5,6, R39 R40 C30
R41 V1 PAD PACK+
0.1uF D4 10M PCgate 10M D5 10M D6 0.1uF 3
2P

4
16V
1.0k C31 16V 16V PACK-
BQ771807DPJR Cgate 2
R42 0.1uF C32
1P R43 Q9 0.1uF 1 PACK-
1.0k R44
C33 R45 51 0 R46
0.1uF 5.1k Output
10k 22V 10A max
TP26 TP27 TP28 TP29
E4
VSS
TP30 Dgate

D7
Q10 R47 R48 R49 R50 R51
5.1k 5.1k 5.1k 10k 1.0k
D8
40V PCHG PDSG 100V
R52 C34 TP31 TP32 TP33 TP34 PGND
20k 0.1uF
PGND
D9 PACK LD
100V TP35 TP36
CHG PCHG CD PDSG

R54 R53
5.1k 10k TP37
1 D3 and R35 are not required in design, but used to simulate fuse blown condition. VSS
R55
PACK
DSG 10k
FUSE
R56 PGND
LD
10k

D10 D11 D12

100V 100V 100V

VSS

Figure 6-10. Schematic Diagram FETs

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3.3V

R57 R58 R59

10k 10k 10k

SCL2
U5
J10
SDA2
1 21
P1.0/TA0CLK/ACLK P2.0/TA1.1
29 HDQ
HDQ
2 22 30
P1.1/TA0.0 P2.1/TA1.2
3 23 31
P1.2/TA0.1 P2.2/TA2CLK/SMCLK
4 24 32
P1.3/TA0.2 P2.3/TA2.0
5 25 P1.4/TA0.3 P2.4/TA2.1 33
6 26 P1.5/TA0.4 P2.5/TA2.2 34
7 27 P1.6/TA1CLK/CBOUT P2.6/RTCCLK/DMAE0 35
28 P1.7/TA1.0 P2.7/UCB0STE/UCA0CLK 36

J11 37 P3.0/UCB0SIMO/UCB0SDA P4.0/PM_UCB1STE/PM_UCA1CLK 45

1 HDQ 38 P3.1/UCB0SOMI/UCB0SCL P4.1/PM_UCB1SIMO/PM_UCB1SDA 46
NT3
2 39 P3.2/UCB0CLK/UCA0STE P4.2/PM_UCB1SOMI/PM_UCB1SCL 47
3 40 P3.3/UCA0TXD/UCA0SIMO P4.3/PM_UCB1CLK/PM_UCA1STE 48
Net-Tie
SCL2 4 SCL2 41 P3.4/UCA0RXD/UCA0SOMI P4.4/PM_UCA1TXD/PM_UCA1SIMO 51 SCL2
SDA2 5 SDA2 42 P3.5/TB0.5 P4.5/PM_UCA1RXD/PM_UCA1SOMI 52 SDA2
SMBC1 6 SMBC1 43 P3.6/TB0.6 P4.6/PM_NONE 53 SMBC1
SMBD1 7 SMBD1 44 P3.7/TB0OUTH/SVMOUT P4.7/PM_NONE 54 SMBD1
NT4
9 P5.0/A8/VREF+/VEREF+ P6.0/CB0/A0 77
10 78
10

P5.1/A9/VREF-/VEREF- P6.1/CB1/A1 Net-Tie

8
6

VBUS TP38 69 P5.2/XT2IN P6.2/CB2/A2 79

J12 70 P5.3/XT2OUT P6.3/CB3/A3 80
VBUS 1 Y1 12 P5.4/XIN P6.4/CB4/A4 1
13 P5.5/XOUT P6.5/CB5/A5 2
2 R60 33 DM 1 3 55 3
D- P5.6/TB0.0 P6.6/CB6/A6
56 P5.7/TB0.1 P6.7/CB7/A7 4
3
R61 33 DP
D+
5 P7.0/CB8/A12 P8.0 15 LED1
4 R62 PUR 6 16 LED2
ID P7.1/CB9/A13 P8.1
1

7 P7.2/CB10/A14 P8.2 17 LED3

2.0k

2
5 U6 U7 J13 J14 8
GND P7.3/CB11/A15
1 1 57 72
P7.4/TB0.2 P7.4/TB0.2 PJ.0/TDO
2 2 58 73
P7.5/TB0.3 P7.5/TB0.3 PJ.1/TDI/TCLK
VUSB QGND 3 59 P7.6/TB0.4 PJ.2/TMS 74
P7.6/TB0.4
11
9
7

4 60 75
P7.7/TB0CLK/MCLK P7.7/TB0CLK/MCLK PJ.3/TCK
2

R63 R64 R65 5

RST/NMI/SBWTDIO 76 RST
10k 1.0M 1.0M 71 TEST
TEST/SBWTCK
QGND QGND
67
V18 PU.0/DP
62 DP
20 VCORE PU.1/DM 64 DM
VBUS VUSB 3.3V
PUR
63 PUR
65 VBUS
VBUS TP39 3.3V 66 VUSB VSSU 61
U8 D13 AVSS1
14
1 5 R66 LED1 11 68
IN OUT AVCC1 AVSS2
Green C35 C36 18 19
330 DVCC1 DVSS1
3 4 D14 0.1uF 0.47uF 50 49
EN NC R67 DVCC2 DVSS2
LED2
C37 C38 GND C39 C40 Green C41 C42 C43 C44
0.1uF 10µF 10µF 0.1uF 330 0.1uF 0.1uF
D15 0.47uF 0.47uF MSP430F5529IPN
2

R68 LED3 QGND

Green
330 R69
QGND QGND QGND 200

R70
3.3V 200
J15 R71
1
2
10k RST J16
3 TEST 1 2 R72
NT5 5P 200
4 3 4
4P
5 6
Net-Tie 3P
1 2 PGND 7 8
2P
QGND 9 10
1P R73
MP1S3 MP2
1

200
MP3 MP4
U9 U10

TP40 C45 R74

GND 2200pF 200
2

BAT-

QGND

Figure 6-11. Schematic Diagram Interface Adapter

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Related Documents from Texas Instruments www.ti.com

7 Related Documents from Texas Instruments

• Texas Instruments, BQ76922 3S-5S Battery Monitor and Protector data sheet
• Texas Instruments, BQ76922 Technical Reference Manual
• Texas Instruments, BQ7718 Overvoltage Protection for 2 to 5-Series Cell Li-Ion Batt w/ Int Delay Timer data
sheet

8 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision * (September 2019) to Revision A (November 2021) Page

• Deleted preproduction note................................................................................................................................ 4
• Changed settings and figure in Quick Start ....................................................................................................... 4
• Changed text and figure in Interface Adapter .................................................................................................... 6
• Instructions and figures updated in Battery Management Studio Software ....................................................... 7
• Changed figures, minor text updates in BQ76922EVM Circuit Module Use ....................................................14
• Changed board layout figures...........................................................................................................................20
• Changed Bill of materials for board revision B..................................................................................................25
• Changed schematics........................................................................................................................................ 29
• Updated data sheet and added technical reference manual in Related Documents from Texas Instruments 32

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