信昌電子陶瓷股份有限公司

Prosperity Dielectrics Co., Ltd.

No.566-1, Kaoshi Rd., Yangmei, Taoyuan 32668, Taiwan (R.O.C.)
Tel : 886-3-4753355 Fax : 886-3-4854959

Messrs. : 一般共用
Date : 2022/07/06

APPROVAL SHEET
Product Name : Stacked Capacitors

Part No. : FE Series

Description : Size 1210~2225, C0G/X7R, 50~630Vdc

PREPARED BY APPROVED BY

信昌電子陶瓷股份有限公司

PROSPERITY DIELECTRICS CO., LTD.

桃園市楊梅區高獅路 566-1 號 http://www.pdc.com.tw

Tel : 03-4753355 ext : Fax : 03-4854959

Contactor : Mobile :

DCM-003-8.1 Rev 2
 信昌電子陶瓷股份有限公司
Prosperity Dielectrics Co., Ltd.
No.566-1, Kaoshi Rd., Yangmei, Taoyuan 32668, Taiwan (R.O.C.)
Tel : 886-3-4753355 Fax : 886-3-4854959

SPECIFICATION
FOR

Product Name : Stacked Capacitors

Part No. : FE Series

Description : Size 1210~2225, C0G/X7R, 50~630Vdc

SPEC. No. : FE-000-001-13

DATE : 2022/07/06

DRAWN BY CHECEKED BY APPROVED BY

Jane Hsiao Yvens Chou Jason Lin

DCM-003-8.2 Rev 2
 信昌電子陶瓷股份有限公司
Prosperity Dielectrics Co., Ltd.
1. INTRODUCTION
FE Series green type capacitors are manufactured by using green materials without lead and cadmium.
These capacitors to achieve a unique structure of high reliability. The use of metal lead frame, can absorb the
heat and mechanical stress. ESR (equivalent series resistance), ESL (equivalent series inductance) is small,
the most suitable for high frequency operation of the rectifier power supply.

2. FEATURES 3. APPLICATIONS
a. High reliability and stability. a. DC to DC converter.
b. Higher mechanical endurance. b. High voltage coupling/DC blocking.
c. Anti thermal stress and mechanical stress. c. Back-lighting inverters.
d. Improved vibration performance. d. Snubbers in high frequency power converters.
e. More capacitance without changing footprint. e. Power supplies.
f. RoHS & HALOGEN Compliant. f. Surge protection.
g. Filtering, smoothing, and decoupling application.
4. HOW TO ORDER
FE 2H X 106 K 500 L G L M
PDC Rated Control Special
Size Dielectric Capacitance Tolerance Packaging Thickness
Family Voltage Code Code
Table 1 Table 2 Table 3 Table 4 Table 5 Table 6 Table 7 Table 8 Table 9 Table 10

Table 1 PDC Family Table 6 Rated Voltage

Code Description Code Description Code Description Code Description

FE Stacked Capacitors Series 500 50Vdc 251 250Vdc

101 100Vdc 501 500Vdc
Table 2 Stack chip quantity and chip size 201 200Vdc 631 630Vdc
The first digit : # of chips in stack
Second digit code : chip size (below) Table 7 Packaging Type
Code Description Code Description Code Description Code Description Code Description

A 1210 (3225) G 1825 (4563) I 2225 (5763) B Bulk T Tray package

C 1812 (4532) H 2220 (5750) L Tape and 13” Reel, Embossed Tape

Table 3 Dielectric Material Characteristics Table 8 Thickness Description

Code Description Code Description Code Description Code Description Code Description
N C0G X X7R A 3.00±0.35 mm J 7.80±0.35 mm S 12.60±0.35 mm
B 3.60±0.35 mm K 8.40±0.35 mm T 13.20±0.35 mm
C 4.20±0.35 mm L 9.00±0.35 mm U 1.70±0.25 mm
D 4.80±0.35 mm M 9.60±0.35 mm V 2.10±0.25 mm
Table 4 Capacitance Rule Code E 5.40±0.35 mm N 10.20±0.35 mm W 2.50±0.25 mm
Code Description Code Description F 6.00±0.35 mm P 10.80±0.35 mm
R47 0.47pF 102 102=10x102=1000pF G 6.60±0.35 mm Q 11.40±0.35 mm
0R5 0.5pF 104 104=10x104=100nF H 7.20±0.35 mm R 12.00±0.35 mm
0 6
100 100=10x10 =10pF 106 106=10x10 =10µF

Table 5 Tolerance Table 9 Control Code

Code Description Code Description Code Description Code Description Code Description
A ±0.05 pF I -10% ~ 0% Q ±0.03 pF L L type lead K K type lead
B ±0.10 pF J ±5 % Z -20% ~ +80% J J type lead B B type lead
C ±0.25 pF K ±10 % X +10% ~ +20% S Straight type lead F Straight type lead
D ±0.50 pF L 0% ~ +10%
F ±1 % M ±20 %
G ±2 % N -5% ~ +10% Table 10 Special Code
H ±3 % P ±0.02 pF Blank General purpose M Automotive

Specification No. : FE-000-001-13 ~1~

DCM-003-8.3 Rev 2
 信昌電子陶瓷股份有限公司
Prosperity Dielectrics Co., Ltd.
5. EXTERNAL DIMENSIONS
Size Inch
L (mm) W (mm) Code / T (mm) E (mm)
(mm)

1210 (3225) 3.50±0.40 2.50±0.40 1.10±0.15

1812 (4532) 4.80±0.40 3.20±0.40 1.40±0.15

1825 (4563) 4.80±0.40 6.30±0.50 Reference 1.70±0.15

Table 8

2220 (5750) 6.00±0.50 5.00±0.50 1.70±0.15

Fig. 5.1 The outline of Stacked

2225 (5763) 6.00±0.50 6.30±0.50 1.70±0.15
Capacitors

6. GENERAL ELECTRICAL DATA

Dielectric C0G X7R

Size 1210, 1812, 1825, 2220, 2225 1210, 1812, 1825, 2220, 2225
Rated voltage
50V, 100V, 200V, 250V, 500V, 630V 50V, 100V, 200V, 250V, 500V, 630V
(WVDC)

Capacitance range 220nF Max. 47µF Max.

Capacitance
Reference to Table 5 Reference to Table 5
tolerance
Cap. Range Q Spec. Cap. Range D.F. Spec.
Cap.<30pF Q≥400+20C 1210≥2.2μF ≤5.0%
Tan δ Cap.≥30pF Q≥1000 1812~2225≥4.7μF ≤5.0%
Other ≤2.5%

Measured at the condition of 30~70% related humidity Measured at the condition of 30~70% related humidity
Preconditioning for Class II MLCC : Perform a heat
treatment at 150±10°C for 1 hour, then leave in
For 25°C at ambient temperature
Capacitance & Tan δ ambient condition (25°C) for 24±2 hours before
Test condition measurement
Cap. Range Test Condition Cap. Range Test Condition
Cap.<1000pF 1.0±0.2Vrms, 1.0MHz±10% Cap.≤10μF 1.0±0.2Vrms, 1.0KHz±10%
Cap.≥1000pF 1.0±0.2Vrms, 1.0KHz±10% Cap.>10μF 0.5±0.2Vrms, 120Hz±20%

Insulation ≥10GΩ or RxC≥500Ω-F, ≥10GΩ or RxC≥100Ω-F,

resistance at Ur whichever is smaller whichever is smaller
Operating
-55 to +125°C -55 to +125°C
temperature
Capacitance
±30ppm / °C ±15%
characteristic
Termination L / J / Straight type lead L / J / Straight type lead

Specification No. : FE-000-001-13 ~2~

DCM-003-8.3 Rev 2
 信昌電子陶瓷股份有限公司
Prosperity Dielectrics Co., Ltd.
7. CAPACITANCE RANGE (Max.)
7-1. C0G
Rated Voltage
Dimension Code
50V 100V 200V 250V 500V 630V
1210 1A 393 223 103 103 103 103
1C 104 473 273 273 223 223
1812
2C 224(M) 104 563 563 473(M) 473(M)
1G 104 104 683 683 473 223
1825
2G 224(M) 224(M) 134 134 104 473(M)
1H 104 104 683 683 473 223
2220
2H 224(M) 224(M) 134 134 104 473(M)
1I 104 104 104 104 823 683
2225
2I 224(M) 224(M) 224(M) 224(M) 184(M) 134

7-2. X7R
Rated Voltage
Dimension Code
50V 100V 200V 250V 500V 630V
1210 1A 475 335 684 684 104 104
1C 106 475 105 105 474 224
1812
2C 226(M) 106 225(M) 225(M) 105 474(M)
1G 106 106 105 105 564 564
1825
2G 226(M) 226(M) 225(M) 225(M) 125(M) 125(M)
1H 226 106 225 225 474 474
2220
2H 476(M) 226(M) 475(M) 475(M) 105 105
1I 106 106 275 275 564 564
2225
2I 226(M) 226(M) 565 565 125(M) 125(M)
(M) means M tolerance only.
7-3. Customizable, Please contact the liaison.

Specification No. : FE-000-001-13 ~3~

DCM-003-8.3 Rev 2
 信昌電子陶瓷股份有限公司
Prosperity Dielectrics Co., Ltd.
8. RELIABILITY TEST CONDITIONS AND REQUIREMENTS
No. Item Test Condition Requirements
Visual and * No remarkable defect.
1. ---
Dimensions * Dimensions to confirm to individual specification sheet.
2. Capacitance * Shall not exceed the limits given in the detailed spec.
* Class I :
Cap.≤1000pF, 1.0±0.2Vrms, 1MHz±10%. Dielectric Cap. Range Q/D.F.
Cap.>1000pF, 1.0±0.2Vrms, 1KHz±10%. Cap.≥30pF Q≥1000
Q/D.F.
Class I (C0G)
3. (Dissipation Cap.<30pF Q≥400+20C
* Class II :
Factor) 1210≥2.2μF & 1812~2220≥4.7μF D.F.≤5.0%
Cap.≤10µF, 1.0±0.2Vrms, 1KHz±10%.
Class II (X7R)
Cap.>10µF, 0.5±0.2Vrms, 120Hz±20%. Other D.F.≤2.5%

* With no electrical load.

T.C. Capacitance Change
Temperature T.C. Operating Temp.
4. C0G Within ±30ppm/°C
Coefficient C0G -55~125°C at 25°C
X7R Within ±15%
X7R -55~125°C at 25°C

Rated Vol. (V) Apply Voltage Test Time

Dielectric Requirements
Insulation ≤100 1 times of UR Max. 120 sec.
5. Class I ≥10GΩ or RxC≥500Ω-F, whichever is smaller
Resistance 100<V≤500 1 times of UR 60 sec.
Class II ≥10GΩ or RxC≥100Ω-F, whichever is smaller
>500 500Vdc 60 sec.

Rated Voltage Condition

≤100 2.5 times of UR
100<V≤250 2.0 times of UR
Dielectric
6. 250<V≤500 1.5 times of UR * No evidence of damage or flash over during test.
Strength
=630 1.2 times of UR
* Duration : 1 to 5 sec.
* Charge and discharge current less than 50mA.

* Conduct the 100 cycles according to the

temperatures and time.
Step Temp.(°C) Time(min.)
* No remarkable damage.
1 Min. operating temp. +0/-3 30±3 * Cap. change :
2 Room temp. 2~3 C0G Within ±2.5% or ±0.25pF, whichever is larger.
Temperature 3 Max. operating temp. +3/-0 30±3 X7R Within ±7.5%.
7.
Cycle * Q/D.F. :
4 Room temp. 2~3
C0G : Q≥100% of initial requirement.
* Before initial measurement (Class II only) : To apply
X7R : D.F.≤150% of initial requirement.
de-aging at 150°C for 1hr then set for 24±2 hrs at
* I.R. : To meet the initial requirement.
room temp.
* Measurement to be made after keeping at room temp.
for 24±2 hrs (Class I) or 48±4 hrs (Class II).

* No remarkable damage.
* Test temp. : 40±2°C.
* Cap. change :
* Humidity : 90~95%RH.
C0G Within ±5.0% or ±0.5pF, whichever is larger.
* Test time : 500 +24/-0hrs.
Humidity X7R Within ±12.5%.
* Before initial measurement (Class II only) : To apply
8. (Damp Heat) * Q/D.F. :
de-aging at 150°C for 1hr then set for 24±2 hrs at
Steady State C0G : Q≥350.
room temp.
X7R : D.F.≤200% of initial requirement.
* Measurement to be made after keeping at room
* I.R. (Class I):. : ≥1GΩ or RxC≥50Ω-F, whichever is smaller.
temp. for 24±2 hrs (Class I) or 48±4 hrs (Class II).
* I.R. (Class II): ≥1GΩ or RxC≥10Ω-F, whichever is smaller.

Specification No. : FE-000-001-13 ~4~

DCM-003-8.3 Rev 2
 信昌電子陶瓷股份有限公司
Prosperity Dielectrics Co., Ltd.
8. RELIABILITY TEST CONDITIONS AND REQUIREMENTS
No. Item Test Condition Requirements

* Test temp. : 40±2°C.

* No remarkable damage.
* Humidity : 90~95%RH.
* Cap. change :
* Test time : 500 +24/-0hrs.
C0G Within ±7.5% or ±0.75pF, whichever is larger.
Humidity * To apply voltage : Rated voltage (500V max.).
X7R Within ±12.5%.
9. (Damp Heat) * Before initial measurement (Class II only) : To apply
* Q/D.F. :
Load de-aging at 150°C for 1hr then set for 24±2 hrs at
C0G : Q≥200.
room temp.
X7R : D.F.≤200% of initial requirement.
* Measurement to be made after keeping at room
* I.R. : ≥500MΩ or RxC≥25Ω-F, whichever is smaller.
temp. for 24±2 hrs (Class I) or 48±4 hrs (Class II).

* Test temp. : 125±3°C.

* To apply voltage :
Dielectric Rated Vol.(V) Apply Voltage
≤100 2.0 times of UR
C0G/X7R 200≤V≤ 500 1.5 times of UR
=630 1.2 times of UR
* Exception items (X7R only) :
(1) 150% of rated voltage for below range :
Rated Vol.(V) Size Cap. Range
ALL ALL Cap.≥106
1210 * No remarkable damage.
1812 * Cap. change :
50V & 100V 1825 Cap.≥105 C0G Within ±3.0% or ±0.3pF, whichever is larger.
High
2220 X7R Within ±12.5%.
Temperature
10. 2225 * Q/D.F. :
Load
C0G : Q≥350.
(Endurance) (2) 120% of rated voltage for below range :
X7R : D.F.≤200% of initial requirement.
Size Dielectric Rated Voltage Capacitance
* I.R. (Class I). : ≥1GΩ or RxC≥50Ω-F, whichever is smaller.
2220 X7R ≥100V Cap.≥15µF
*I.R. (Class II) : ≥1GΩ or RxC≥10Ω-F, whichever is smaller.
(3) 100% of rated voltage for below range :
Size Dielectric Rated Voltage Capacitance
1206 X7R ≥100V Cap.≥2.2µF
1210 X7R ≥100V Cap.≥3.3µF
2220 X7R ≥100V Cap.≥22µF
* Test time : 1000 +24/-0 hrs.
* Before initial measurement (Class II only) : To apply
de-aging at 150°C for 1hr then set for 24±2 hrs at room
temp.
* Measurement to be made after keeping at room temp.
for 24±2 hrs (Class I) or 48±4 hrs (Class II).

Specification No. : FE-000-001-13 ~5~

DCM-003-8.3 Rev 2
 信昌電子陶瓷股份有限公司
Prosperity Dielectrics Co., Ltd.
8. RELIABILITY TEST CONDITIONS AND REQUIREMENTS
No. Item Test Condition Requirements

* Capacitors mounted on a substrate. A force of 10N

applied perpendicular to the place of substrate and
parallel the line joining the center of terminations for
10±1 second.
Adhesive
11. Strength of * No remarkable damage or removal of the terminations.
Termination

* The middle part of substrate shall be pressurized by

means of the pressurizing rod at a rate of about 1mm
per second until the deflection becomes 5mm.

* No remarkable damage.
Dielectric Cap. Change
C0G Within ±3.0% or ±2.0pF, whichever is larger
12. Bending Test X7R Within ±12.5%
(This capacitance change means the change of capacitance under
specified flexure of substrate from the capacitance measured before the
test)

Unit : mm

* Vibration frequency : 10~55 Hz/min.

* Total amplitude : 1.5mm.
* Test time : 6 hrs. (Two hrs each in three mutually
perpendicular directions)
Vibration * No remarkable damage.
13. * Before initial measurement (Class II only) : To apply
Resistance * Cap. change and D.F. : To meet initial spec.
de-aging at 150°C for 1hr then set for 24±2 hrs at
room temp.
* Measurement to be made after keeping at room
temp. for 24±2 hrs (Class I) or 48±4 hrs (Class II).

Specification No. : FE-000-001-13 ~6~

DCM-003-8.3 Rev 2
 信昌電子陶瓷股份有限公司
Prosperity Dielectrics Co., Ltd.
9. PACKAGE DIMENSION AND QUANTITY
9.1. PACKAGE QUANTITY
Plastic tape
PDC Family & Size Thickness (mm)
13” reel
FE1A ALL 1.5k
FE1C ALL 1.5k
FE2C ALL 0.5k
FE1H ALL 1k
FE2H ALL 0.5k
For other chip size, please contact the liaison

9.2. EMBOSSED TAPE DIMENSIONS

Fig. 9.1 The dimension of plastic tape

Size FE1A FE1C FE2C FE1H FE2H

Chip 6.00±0.35 3.60±0.35 6.00±0.35
3.00±0.35 3.60±0.35
Thickness 6.60±0.35 4.20±0.35 6.60±0.35
W 12.00±0.30 16.00±0.30 16.00±0.30 16.00±0.30 16.00±0.30
E 1.75±0.10 1.75±0.10 1.75±0.10 1.75±0.10 1.75±0.10
F 5.50±0.10 7.50±0.10 7.50±0.10 7.50±0.10 7.50±0.10
P 8.00±0.10 8.00±0.10 12.00±0.10 12.00±0.10 12.00±0.10
P0 4.00±0.10 4.00±0.10 4.00±0.10 4.00±0.10 4.00±0.10
10xP0 40.00±0.20 40.00±0.20 40.00±0.20 40.00±0.20 40.00±0.20
P2 2.00±0.10 2.00±0.10 2.00±0.10 2.00±0.10 2.00±0.10
D0 Ø1.50 +0.10/-0 Ø1.50 +0.10/-0 Ø1.50 +0.10/-0 Ø1.50 +0.10/-0 Ø1.50 +0.10/-0
T 0.40±0.05 0.40±0.05 0.40±0.05 0.40±0.05 0.50±0.05
A0 3.00±0.10 3.52±0.10 5.70±0.10 5.70±0.10 5.60±0.10
B0 3.82±0.10 5.08±0.10 6.60±0.10 6.45±0.10 6.60±0.10
K0 3.40±0.10 3.14±0.10 7.00±0.10 3.75±0.10 7.00±0.10
Unit : mm mm mm mm mm
* For other chip size, please contact the liaison.

Specification No. : FE-000-001-13 ~7~

DCM-003-8.3 Rev 2
 信昌電子陶瓷股份有限公司
Prosperity Dielectrics Co., Ltd.
9. PACKAGE DIMENSION AND QUANTITY
9.3. REEL DIMENSIONS

Reel size 13”

A 330.0±0.50mm

B 2.00±0.50mm

13.00+0.50/-
C
0.20mm

2.00+0.50/-0.20
T Fig. 9.2 The dimension of reel
mm

10. FOOTPRINT DIMENSIONS

Size 1210 1812 1825 2220 2225 Fig. 10.1 Illustration of Footprint

D1 4.90 6.80 6.80 8.40 8.40

D2 1.40 1.60 1.60 2.20 2.20

D3 2.10 3.60 3.60 4.00 4.00

D4 1.40 1.60 1.60 2.20 2.20

D5 2.80 3.80 6.80 5.50 6.80

Specification No. : FE-000-001-13 ~8~

DCM-003-8.3 Rev 2
 信昌電子陶瓷股份有限公司
Prosperity Dielectrics Co., Ltd.
11. APPLICATION NOTES
STORAGE
To prevent the damage of solderability of terminations, the following storage conditions are
recommended :
Indoors under 5 ~ 40°C and 20% ~ 70% RH.
No harmful gases containing sulfuric acid, ammonia, hydrogen sulfide or chlorine.
Packaging should not be opened until the capacitors are required for use. If opened, the pack should be
re-sealed as soon as is practicable. Taped product should be stored out of direct sunlight, which might promote
deterioration in tape or adhesion performance. The product is recommended to be used within 12 months after
shipment and checked the solderability before use.

HANDLING
Chip capacitors are dense, hard, brittle, and abrasive materials. They are liable to suffer mechanical
damage, in the form of cracks or chips. Chip Capacitors should be handled with care to avoid contamination or
damage. To use vacuum or plastic tweezers to pick up or plastic tweezers is recommended for manual
placement. Tape and reeled packages are suitable for automatic pick and placement machine.

PREHEAT
In order to minimize the risk of thermal shock during soldering, a carefully controlled preheat is required.
The rate of preheat should not exceed 3°C per second.

SOLDERING
Use mildly activated rosin fluxes do not use activated flux. The amount of solder in each solder joint
should be controlled to prevent the damage of chip capacitors caused by the stress between solder, chips, and
substrate.
a.) Reflow soldering :
Fig. 11.1 Reflow soldering profile

For Sn/Ag/Cu Series solder paste (Pb-Free)

COOLING
After soldering, cool the chips and the substrate gradually to room temperature. Natural cooling in air is
recommended to minimize stress in the solder joint.

CLEANING
All flux residues must be removed by using suitable electronic-grade vapor-cleaning solvents to eliminate
contamination that could cause electrolytic surface corrosion. Good results can be obtained by using ultrasonic
cleaning of the solvent. The choice of the proper system is depends upon many factors such as component
mix, flux, and solder paste and assembly method. The ability of the cleaning system to remove flux residues
and contamination from under the chips is very important.
Specification No. : FE-000-001-13 ~9~

DCM-003-8.3 Rev 2