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Answers To Electrical Engineering Question Bank

The document provides a comprehensive overview of electrical engineering concepts, covering basic circuit analysis, network theorems, capacitors, inductors, AC circuit analysis, semiconductor devices, diodes, transistors, operational amplifiers, oscillators, power electronic devices, transformers, motors, power factor improvement, and more. It also discusses protection mechanisms for power lines, modulation techniques, transmission media, and digital communication principles. Each section includes key definitions, principles, and applications relevant to the field of electrical engineering.

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0% found this document useful (0 votes)
40 views8 pages

Answers To Electrical Engineering Question Bank

The document provides a comprehensive overview of electrical engineering concepts, covering basic circuit analysis, network theorems, capacitors, inductors, AC circuit analysis, semiconductor devices, diodes, transistors, operational amplifiers, oscillators, power electronic devices, transformers, motors, power factor improvement, and more. It also discusses protection mechanisms for power lines, modulation techniques, transmission media, and digital communication principles. Each section includes key definitions, principles, and applications relevant to the field of electrical engineering.

Uploaded by

221901026
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Download as PDF, TXT or read online on Scribd
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Answers to Electrical Engineering Question

Bank
1.1 Basic Circuit Analysis
1. AC vs. DC circuits: AC circuits use alternating current with components like
transformers; DC circuits use direct current with components like batteries.
2. Kirchhoff's Laws: KCL states total current entering a junction equals total current
leaving; KVL states total voltage around a loop equals zero.
3. Nodal vs. Mesh Analysis: Nodal analysis uses node voltages; mesh analysis uses loop
currents.
4. Ohm's Law: Voltage (V) equals current (I) times resistance (R), used to calculate circuit
parameters.
5. Resistance, Capacitance, Inductance: Resistance opposes current, capacitance stores
charge, inductance stores energy in magnetic fields.
6. Conductance: Conductance is the inverse of resistance, measured in siemens.
7. Ideal Sources: Ideal voltage source maintains constant voltage; ideal current source
maintains constant current.
8. Linear vs. Nonlinear Resistors: Linear resistors follow Ohm’s Law; nonlinear resistors
have varying resistance.
9. Active vs. Passive Components: Active components supply energy (e.g., batteries);
passive components consume energy (e.g., resistors).

1.2 Network Theorems


1. Superposition Theorem: Total response in a linear circuit is the sum of responses from
each independent source.
2. Norton’s vs. Thevenin’s Theorem: Norton’s uses a current source with parallel
resistance; Thevenin’s uses a voltage source with series resistance.
3. Maximum Power Transfer Theorem: Maximum power is transferred when load resistance
equals source resistance.
4. Source Transformation: Converts a voltage source with series resistance to a current
source with parallel resistance, or vice versa.
5. Dependent vs. Independent Sources: Independent sources have fixed values;
dependent sources vary based on circuit parameters.

1.3 Capacitors and Inductors


1. Capacitance in RC Circuit: Capacitance stores charge; in RC circuits, it charges via
resistor and discharges exponentially.
2. Energy in Capacitor: Energy is ½CV², where C is capacitance and V is voltage.
3. Inductance: Inductance (henry) opposes current change, creating magnetic fields.
4. Mutual Inductance: Energy transfer between inductors due to shared magnetic fields,
used in transformers.
1.4 AC Circuit Analysis
1. Phasors: Phasors represent AC signals as rotating vectors for easier analysis.
2. Series and Parallel Resonance: Resonance occurs when inductive and capacitive
reactances cancel, maximizing or minimizing impedance.
3. AC Circuits with Loads: Capacitive loads lead voltage; inductive loads lag voltage.
4. Three-Phase AC Systems: Analyzed using phasors, balanced loads, and Y or Delta
configurations.

2.1 Basic Conceptual


1. Semiconductor Device: Semiconductors control current; n-type has extra electrons, p-
type has holes.
2. Electrical vs. Electronics Devices: Electrical devices handle power; electronics devices
process signals.
3. Heat Sink Purpose: Heat sinks dissipate heat from components to prevent overheating.

2.2 Diode
1. Diode vs. Zener Diode: Diodes allow one-way current; Zener diodes regulate voltage in
reverse bias.
2. Forward Biasing: Forward biasing allows current flow in a pn junction by reducing the
barrier.
3. Diode Applications: Diodes are used in rectification, signal modulation, and protection
circuits.
4. Avalanche Breakdown: High reverse voltage causes a sudden increase in current in
diodes.
5. Depletion Region: A barrier region in diodes that prevents current flow until bias is
applied.

2.3 Bipolar Junction Transistor (BJT)


1. BJT Operation: BJT uses base current to control larger collector-emitter current.
2. NPN vs. PNP Transistor: NPN uses electrons; PNP uses holes for current flow.
3. BJT Signal Amplification: Small base current controls large collector current for
amplification.
4. Current Controlled Device: BJT’s output is controlled by base current.
5. Biasing Need: Biasing sets operating point for stable transistor amplification.

2.4 Operational Amplifier (Op-Amp)


1. Operational Amplifier: Op-amp amplifies voltage differences with high gain.
2. Ideal Op-Amp Characteristics: Infinite gain, infinite input impedance, zero output
impedance.
3. Integrator Circuit: Op-amp integrator converts input voltage to output integral over
time.
4. CMRR Significance: Common-mode rejection ratio measures op-amp’s ability to reject
common signals.
5. Slew Rate: Slew rate is the maximum rate of output voltage change in op-amps.

2.5 Field Effect Transistors


1. FET and MOSFET: FET (Field Effect Transistor) and MOSFET (Metal-Oxide-
Semiconductor FET) control current via electric fields.
2. BJT vs. FET: BJT is current-controlled; FET is voltage-controlled with higher input
impedance.
3. MOSFET Operation: MOSFET controls current with gate voltage, used in switching and
amplification.
4. MOSFET vs. BJT: MOSFETs have higher input impedance but slower switching than BJTs.
5. CMOS Applications: CMOS (Complementary MOSFET) is used in low-power logic
circuits.

2.6 Oscillators and 555 Timer


1. Oscillator Principle: Oscillators generate periodic signals using feedback loops.
2. Oscillator Applications: Used in signal generation, clocks, and communication systems.
3. 555 IC Applications: 555 IC is used for timers, oscillators, and pulse generation.

2.7 Power Electronic Devices


1. GTO vs. SCR: GTO can be turned off by gate signal; SCR cannot.
2. BJT vs. MOSFET Efficiency: MOSFETs are more efficient for high-frequency switching
than BJTs.
3. IGBT vs. MOSFET: IGBTs handle higher voltages; MOSFETs are faster for low-power
applications.

2.8 Power Converters


1. DC-DC Converter: Buck lowers voltage, boost raises voltage, buck-boost adjusts both.
2. PWM Control: PWM adjusts duty cycle to control output voltage in converters and
inverters.
3. MPPT in Solar: MPPT maximizes power extraction from solar panels by adjusting load.

3.1 Transformers
1. Transformer KVA Rating: Rated in KVA because losses depend on voltage and current.
2. No DC in Transformer: DC doesn’t induce changing magnetic flux for transformer
operation.
3. Parallel Operation Conditions: Same voltage ratio, polarity, and phase sequence.
4. Single-Phase Autotransformer: A transformer with a single winding for voltage step-
up/down.
5. Transformer Tests: Open circuit test measures core losses; short circuit test measures
copper losses.
6. Transformer Losses: Core (hysteresis, eddy current) and copper (I²R) losses.
7. Faraday’s and Lenz’s Laws: Faraday’s law links voltage to magnetic flux change; Lenz’s
law states induced current opposes flux change.

3.2 Motors and Generators


1. Capacitor in Induction Motor: Capacitor improves starting torque in single-phase
induction motors.
2. Star Delta Starter: Reduces starting current in induction motors by switching
connections.
3. Tap Changing: Adjusts transformer voltage ratio, used in power systems.
4. Synchronous vs. Induction Motor: Synchronous motors run at fixed speed; induction
motors slip.
5. Induction Motor Speed Control: V/f control, pole changing, or rotor resistance
adjustment.
6. Prime Mover: Device (e.g., turbine) that drives a generator.
7. High Starting Torque Motor: Series DC motor, used for heavy loads like cranes.
8. Voltage Regulation: Measures output voltage change; negative in capacitive loads due to
leading current.
9. Back EMF in DC Motor: Opposes applied voltage, regulating motor speed.
10. Alternator vs. Generator: Alternators produce AC; generators can produce AC or DC.
11. Induction Motor Tests: No-load and blocked rotor tests determine equivalent circuit
parameters.
12. Commutation: Process of current reversal in DC motor brushes to maintain torque.
13. Universal Motor: Runs on AC or DC, used in appliances like drills.
14. Torque Angle: Angle between rotor and stator fields, affecting motor torque.

4.1 Power Factor Improvement


1. Power Factor Component: Capacitors improve power factor, connected in parallel.
2. Power Factor Impact: Higher power factor improves transmission efficiency, reduces
costs.
3. Power Factor Calculation: At unity PF, apparent power equals real power (2000 W).
4. Capacitor Bank Type: Delta capacitor banks are preferred for 3-phase systems.
5. Synchronous Condenser: Synchronous motor used to adjust power factor; phase
advancer improves PF in motors.

4.2 Variable Loads and Load Flow


1. Base vs. Peak Load: Base load is constant; peak load is temporary, handled by gas
turbines.
2. Load Definitions: Average Load (total energy/time), Load Factor (average/max demand),
etc., with respective formulas.
3. Load-Flow Study: Analyzes power flow and voltage in a system.
4. Bus Types: Slack, voltage-controlled, and load buses.
5. Bus Quantities: Slack bus (V, δ known), voltage-controlled (V, P known), load bus (P, Q
known).
4.3 Faults of Power Line
1. Symmetrical Fault: Equal fault currents in all phases, e.g., three-phase short circuit.
2. Fault Current Limiters: Reactors or resistors limit short circuit currents.
3. Unsymmetrical Faults: Single line-to-ground, line-to-line, or double line-to-ground
faults.
4. Power System Faults: Symmetrical (3-phase) and unsymmetrical (LG, LL, LLG) faults.

4.4 Transmission and Distribution


1. Overhead Transmission Components: Conductors, insulators, towers, and ground wires.
2. Insulators Purpose: Prevent unwanted current flow in transmission lines.
3. String Efficiency: Ratio of actual to ideal voltage distribution in insulators; improved by
guard rings.
4. Corona: Ionization of air around conductors; reduced by larger conductors or bundles.
5. Sag: Conductor droop; zero sag is impossible due to weight and tension.
6. Skin Effect: Current flows near conductor surface, increasing resistance and costs.
7. Ferranti Effect: Voltage rise at receiving end in lightly loaded lines.
8. Transposition: Rotating conductor positions to balance impedances; voltage regulation
measures output stability.
9. Reactive Compensation: Adjusts reactive power; SCADA monitors, FACTS/STATCOM
control voltage.
10. HVDC vs. HVAC: HVDC is efficient for long distances, lower losses.
11. Veramara HVDC: Back-to-back HVDC link for interconnecting AC systems.
12. AC vs. DC Distribution: AC is standard; DC is used for specific applications like
microgrids.
13. Overhead vs. Underground: Overhead is cheaper; underground is more reliable.
14. Bangladesh Renewable Energy: Growing solar and wind energy, targeting 10% renewable
by 2030.

5.1 Circuit Breaker and Relay


1. Relay, Fuse, Circuit Breaker: Relay detects faults, fuse melts to break circuit, circuit
breaker interrupts current.
2. Protection Relay Types: Overcurrent, distance, and differential relays.
3. Grounding vs. Earthing: Grounding protects circuits; earthing connects to ground for
safety.
4. Pickup Value: Minimum current for relay activation.
5. Busbar Protection: Protects busbars using differential or high-impedance relays.
6. Circuit Breaker Terms: Arc Voltage (across contacts), Restriking Voltage (transient),
Recovery Voltage (after arc extinction).
7. Relay Terms: Pickup Value (activation threshold), Current Setting (relay sensitivity),
Plug/Time Setting Multiplier (adjust relay response).

5.2 Earthing
1. Earthing Types: Plate, pipe, and rod earthing.
2. Lightning Mechanism: Charge separation in clouds causes high-voltage discharge.
3. Surge Absorber: Absorbs voltage spikes; Ferranti surge absorber uses capacitors.

5.3 Protection of Power Line


1. Transmission vs. Distribution: Transmission uses high voltages (e.g., 132 kV in
Bangladesh); distribution uses lower voltages.
2. Skin Effect: Current concentrates on conductor surface, reducing efficiency.
3. Fault Limiting Devices: Reactors, fuses, and circuit breakers.
4. Overcurrent vs. Differential Relay: Overcurrent detects high current; differential detects
current imbalance.
5. CT and PT: Current Transformer (CT) measures current, Potential Transformer (PT)
measures voltage; CT secondary is shorted to prevent high voltage.
6. Current Limiting Reactor: Limits fault current in power systems.
7. Overvoltage Causes: Lightning, switching, or faults.
8. Busbar Maintenance: De-energize, inspect, and clean busbars.

5.4 Transformer, Alternator Protection


1. Alternator Faults: Stator faults, rotor faults, and unbalanced loading.
2. Unbalanced Loading: Unequal phase currents in alternators.
3. Buchholz Relay: Detects gas or oil flow in transformers due to faults.
4. Blackout: Complete loss of power in a transmission system.
5. Circulating Current: Unwanted current due to parallel alternator mismatch.
6. Isolator, Transformers: Isolator disconnects circuits; unit/auxiliary transformers step
down voltage.
7. Substation Protection: Relays, circuit breakers, and surge arresters.

6.1 Basic Conceptual


1. Modulation/Demodulation: Modulation encodes signals for transmission; demodulation
decodes them.
2. AM System: Amplitude modulation varies carrier amplitude with signal.
3. Baud vs. Bit Rate: Baud rate is symbols per second; bit rate is bits per second.
4. Analog vs. Digital Transmission: Analog is continuous; digital is discrete, less noise-
prone.
5. Attenuation and Interference: Attenuation is signal loss; interference is noise; reduced
by amplifiers and shielding.

6.2 Transmission Media/Channel


1. Guided vs. Unguided Media: Guided (e.g., cables) is wired; unguided (e.g., radio) is
wireless.
2. Higher SNR: Higher signal-to-noise ratio improves signal clarity.
3. Optical Fiber: Transmits light; has higher bandwidth than coaxial or copper.
4. Low-Pass vs. Band-Pass: Low-pass allows low frequencies; band-pass allows a frequency
range.
5. Baseband vs. Broadband: Microphone to recorder is baseband; modulated voice signals
are broadband.

6.3 Analog to Digital Conversion


1. ADC Steps: Sampling, quantization, and encoding.
2. Nyquist Rate: Minimum sampling rate (2x signal frequency) to avoid distortion.
3. Serial vs. Parallel Communication: Serial sends bits sequentially; parallel sends multiple
bits simultaneously.
4. Shannon Capacity, etc.: Capacity (max data rate), propagation delay (signal travel time),
latency (total delay), throughput (actual data rate).
5. Aliasing: Distortion from low sampling rate; avoided by sampling above Nyquist rate.

6.4 Mobile Cellular Communications


1. Duplexing: Duplexing allows two-way communication; TDD uses time slots, FDD uses
frequency bands.
2. Guard Bands: Prevent interference between frequency channels.
3. Handoff and Reuse: Handoff transfers calls; frequency reuse assigns channels to cells.
4. 2G, 3G, 4G Comparison: 4G uses advanced modulation, higher bandwidth, and faster
data rates.
5. Uplink vs. Downlink: Uplink is mobile to base; downlink is base to mobile, with different
frequencies.

7.1 Basic Conceptual


1. Flip-Flop vs. Latch: Flip-flops are edge-triggered; latches are level-triggered.
2. Gates: Basic (AND, OR), special (XOR), universal (NAND, NOR).
3. Register, Multiplexing: Register stores data; multiplexing combines signals,
demultiplexing separates them.
4. Gates with NAND/NOR: Combine NAND/NOR gates to mimic AND, OR, XOR logic.
5. Encoder/Decoder: Encoder converts inputs to coded output; decoder reverses it.
6. CMOS Pull-Up/Down: Pull-up (PMOS) connects to Vdd; pull-down (NMOS) connects to
ground.
7. Flip-Flop Circuits: JK, SR, D flip-flops store bits with specific truth tables.
8. Nibble, Byte, Word: Nibble (4 bits), Byte (8 bits), Word (16/32 bits).

8.1 Basic Conceptual


1. Open vs. Control Loop: Open loop has no feedback; control loop uses feedback for
stability.
2. Transfer Function: Ratio of output to input in a control system.
3. Feedback Components: Sensor, controller, and actuator in a feedback system.
4. Gain Margin: Measure of system stability, indicating distance from instability.
5. Pole/Zero: Poles determine system stability; zeros affect response shape.
6. Routh Hurwitz Criterion: Tests system stability using coefficient array.
7. System Stability: Stable (returns to equilibrium), marginally stable (oscillates), unstable
(diverges).
8. Damping: Reduces oscillations; damping ratio measures oscillation decay.

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