2STC4467
High power NPN epitaxial planar bipolar transistor
Features
■ High breakdown voltage VCEO = 120 V
■ Complementary to 2STA1694
■ Fast-switching speed
■ Typical ft = 20 MHz
■ Fully characterized at 125 oC
3
2
Applications 1
■ Audio power amplifier TO-3P
Description
Figure 1. Internal schematic diagram
The device is a NPN transistor manufactured
using new BiT-LA (Bipolar transistor for linear
amplifier) technology. The resulting transistor
shows good gain linearity behaviour.
Table 1. Device summary
Order code Marking Package Packaging
2STC4467 2STC4467 TO-3P Tube
April 2008 Rev 2 1/7
www.st.com 7
Electrical ratings 2STC4467
1 Electrical ratings
Table 2. Absolute maximum rating
Symbol Parameter Value Unit
VCBO Collector-base voltage (IE = 0) 120 V
VCEO Collector-emitter voltage (IB = 0) 120 V
VEBO Emitter-base voltage (IC = 0) 6 V
IC Collector current 8 A
ICM Collector peak current (tP < 5 ms) 16 A
PTOT Total dissipation at Tc = 25 °C 80 W
Tstg Storage temperature -65 to 150 °C
TJ Max. operating junction temperature 150 °C
Table 3. Thermal data
Symbol Parameter Value Unit
Rthj-case Thermal resistance junction-case ______________ __max 1.563 °C/W
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2STC4467 Electrical characteristics
2 Electrical characteristics
(Tcase = 25 °C; unless otherwise specified)
Table 4. Electrical characteristics
Symbol Parameter Test conditions Min. Typ. Max. Unit
Collector cut-off current
ICBO VCB = 120 V 10 µA
(IE = 0)
Emitter cut-off current
IEBO VEB = 6 V 10 µA
(IC = 0)
Collector-emitter breakdown
V(BR)CEO(1) voltage (I = 0) IC = 50 mA 120 V
B
Collector-base breakdown
V(BR)CBO IC = 100 µA 120 V
voltage (IE = 0)
Emitter-base breakdown voltage
V(BR)EBO(1) (I = 0) IE = 1 mA 6 V
C
Collector-emitter saturation
VCE(sat) (1) IC = 3 A IB = 300 mA 1.5 V
voltage
hFE DC current gain IC = 3 A V CE = 4 V 70 140
fT Transition frequency IC = 0.5 A V CE = 12 V 20 MHz
1. Pulsed duration = 300 µs, duty cycle ≤ 1.5%
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Package mechanical data 2STC4467
3 Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in compliance
with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also
marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are
available at: www.st.com
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2STC4467 Package mechanical data
TO-3P Mechanical data
mm.
DIM.
MIN. TYP MAX.
A 4.6 5
A1 1.45 1.50 1.65
A2 1.20 1.40 1.60
b 0.80 1 1.20
b1 1.80 2.20
b2 2.80 3.20
c 0.55 0.60 0.75
D 19.70 19.90 20.10
D1 13.90
E 15.40 15.80
E1 13.60
E2 9.60
e 5.15 5.45 5.75
L 19.50 20 20.50
L1 3.50
L2 18.20 18.40 18.60
P 3.10 3.30
Q 5
Q1 3.80
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Revision history 2STC4467
4 Revision history
Table 5. Document revision history
Date Revision Changes
22-Nov-2007 1 Initial release
30-Apr-2008 2 Document status promoted from preliminary data to datasheet.
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2STC4467
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