Mechatronics Systems:
A Semiconductor Perspective
These slides are from a presentation given by: Simon Thomas (Motorola)
September 7, 2000
Mechatronics 2000 S.T
Outline
Introduction Automotive Opportunities
- Business - Motor Control - Smart Connector - MEMS integration - Emerging Systems
In the Home Opportunities System Needs of Semiconductors
- System on Chip - System in Package - Design Methodology
Conclusion
Mechatronics 2000 S.T
Mechatronics: Technology Integration
The synergistic combination of mechanical, electrical, and computer engineering - emphasis on integrated design for products - optimal combination of appropriate technologies
Mechatronics 2000 S.T
Mechatronics
Micro to Macro Applications
Mechatronics 2000 S.T
Dynamic Growth in Automobile Electronics
Automotive Semiconductor TAM World-Wide [$B]
40.0 35.0 30.0 25.0 20.0 15.0 10.0 5.0 0.0 1975 Uncertainty 5fth Wave 5fth Wave (EPAS, X-by-Wire, 42V...) ITS (w/o Radio) Body (Comfort, Light) Safety (ABS, Airbag...) Engine Control
Mechatronics
Feature/Cost Driven
Multiplex Networking
Feature/Cost Driven
1980
1985
1990
1995
2000
2005
2010
Mechatronics 2000 S.T
5th Wave
(Conversion of Mechanical to Electronic Systems)
Typical Applications Brake-By-Wire system Steer-By-Wire Integrated vehicle dynamics Camless engines Integrated starter alternator
Direct Fuel Injection Continuously Variable Transmission Electric AC Compressor
Electric Valve Control
Active Suspension
OEM Driven Reliability Reduced weight Fuel economy Manufacturing flexibility Design freedom Advanced safety features Cost
Electric Water Pump
Crankshaft Starter Generator
Electric Brake (Brake-by-Wire)
42 Volt Electric Converter Mechatronics 2000 S.T Assist Power Steering
Steer-by-Wire
Automotive Semiconductor Market
$300
Vehicle Production
60
Rising Semiconductor Content Per Vehicle
$250 $200 $ Per Car $150 $100 $50 $0 1999 2000
50 40 30 20 10 0 Vehicles (In Millions)
2001
2002
2003
2004
Source: Strategy Analytics, 1999
Mechatronics 2000 S.T
Motors Are Everywhere:
From Simple to Sophisticated
Hand-held power tools to Precision-control robots Panel-based settings to intelligent spin control Window lifts to brake-by-wire Single speed to variable speed fans and blowers
*Motion Tech Trends February 1999
Industrial picture
automotive
Mechatronics 2000 S.T
ELEC TR IC M OT OR USA GE : M o to rs per v ehicle
250 200 150 100 50 0
60 90 19 85 30 45 00 15 19 19 75 19 18 19 19 19 20 05
Q uantity
1/27/99
MIT/Industry Consortium
Mechatronics 2000 S.T
Motors in Cars
Solenoid Stepper DC Stepper DC DC AC
Climate Light Level. Mirror Dashboard Dashboar d Gauges Hydraulics
Centr. Locking
R-Wiper Seat Mover
F-Wiper Window Lift Sun Roof
Climate Fan Engine Fan P-Steering
0.01 0.1
1 10
2.5 30
5 60
15 120
50 ITYP [A] 600 Power [W]
Mechatronics 2000 S.T
Mechatronic Systems
Example : Stepper Motor Driver for Climate Control
Stepper Motor
Existing Control Circuit/Connector Assembly
Final Motor Assembly
Solution : A Smart Connector
IC
Motorola MUX 3
HC05 Systemchip (S3)+ Chip Capacitor in Single Plastic Semiconductor Package With Lead Frame Formed to Meet Connector Requirements. Integration of Components and Connector Function Eliminates An Entire Assembly Level.
Chip Capacitor
Mechatronics 2000 S.T
Mechatronics: Stepper motor controller
L2 R2
R1 L1
G
BU S
ND
VS UP
HC05 Core 1008 Byte programm ROM or E2PROM On-Chip 4.96 MHz RC Oscillator On-Chip 5V Voltage Regulator ISO9141 Single-wire bus interface transceiver (LIN) Four universal 5 Ohms push-pull outputs
Mechatronics 2000 S.T
Potential Mechatronic Modules in a Car
Mechatronics 2000 S.T
Mechatronics Door Modules
3 wire LIN Bus
Smart Mirror motor-unit pin-header CAN Bus
Smart Doorlock
Smart Window Lift-unit
Switchboard with CAN Bus Gateway
Mechatronics 2000 S.T
Seat Module Solution
Seat Harness Architecture showing various smart connector interconnections solutions
Mechatronics 2000 S.T
Typical Smart Connector
FET
FET
MCU CONTROL
FET
FET
uC + TMOS Substrate Assembly and Test
Assembly into Module Final Test
Stamp Leadframe Overmold Leadframe Mold Housing
Mechatronics 2000 S.T
Technology Integration
System interconnect and packaging technology
System-on-Chip and substrate / chip-interconnect technology
Mechatronics 2000 S.T
Micro Electro Mechanical System (MEMS) Integration
Mechatronics 2000 S.T
General Accelerometer Applications
Acceleration / deceleration Velocity Precision displacement Shock / vibration Detecting premature failure in rotating equipment Detecting & measuring excessive handling/ shock Tilt / Inclinometer
Mechatronics 2000 S.T
Z-Axis Accelerometer Two Chip Packaging Solution
Mechatronics 2000 S.T
Pressure Sensor- Packaging
Pressure Stainless Steel Cap Package
Silicone Gel Die Coat Wire Bond
Die
Lead frame Pressure
RTV Die Bond
Basic chip carrier package gauge or differential die
Mechatronics 2000 S.T
MEMS Sensors
MGS1100 Sensor Package
CO
CO
CO
Metal Si (2.5m) SiO2 Poly Si SnO 2 Sensor Contacts Membrane Heater
Die attach
Sensor Header
Mechatronics 2000 S.T
Emerging Systems: Advanced Braking
Brake By Wire
Advanced silicon and fault tolerant protocol
Provides increased features for Total Stability Control Advanced Vehicle Dynamics through integration of Cruise Control and Braking Systems CPUs, Power and SmartMOSTM Intelligent Sensors Brake By Wire Architecture
Advanced Braking
Front Brake 1
PEDAL
Rear Brake1 BUS1 BUS2
Front Brake2
High Level ECU or gateway Mechatronics 2000 S.T
Rear Brake2
Emerging Systems: Hybrid Engines
Advanced control,liter Car!! power 42V/14V Moving towards the 3 system and Fifth(>10kW)products Increased power Wave
Lowering emissions (-30%) High performance PowerPCTM User friendly stop-starts DSP cores for vector control Integration with other 42V systems (Combined Alternator Starter, Power and SmartMOSTM products for high Electronic Valve Control) power battery control Intelligent Sensors for temperature and position Dependable real-time bus Hybrid Architecture
Starter Generator 4cyl Engine Inverter Nickel/Metal Hydride Battery
Hybrid Engines
Motor ECU Re-Generative Braking Mechatronics 2000 S.T
Total Connectivity
Paging messaging data AM/FM/DAB MP3/DVD/Games XM & Command Audio Mobile Computer navigation www server PIM applications Cellular voice data
Display e-call messages route instructions
PDA Support Palm Organiser
Positioning (GPS)
OEM Bus/IDB Gateway Mechatronics 2000 S.T (with firewall)
Existing OEM Vehicle Bus
In-the-Home Opportunities
Mechatronics 2000 S.T
Appeal of Smart Kitchens
MORI survey commissioned by Motorola
1/3 of European consumers want technology to make home life easier and more fun Two most desired smart products:
- One-button washing machine - Intelligent oven
Consumers want technology to: - Reduce environmental waste - Save energy costs
Mechatronics 2000 S.T
* *
iFridge
Smart Sensors
Networked Appliances
* * * *
DigitalDNA Technology in the Kitchen
- Networked appliances - Motor controls - Smart sensors Motor Controls
Mechatronics 2000 S.T
Lawn Tool Motor Controls
* * * *
White Goods Motor Controls
* * *
Industrial Motor Controls
DigitalDNA Technology in the Workshop
- Motor controls
Mechatronics 2000 S.T
Exercise Equipment Motor Controls
Power Supply Rectifiers/Regulator
MC7805
Washing Machine System Solution
Pressure Sensor MPX5006/MPX2010
MC68HC08MP16
2E72G SSAC9616-A
User Interface
8-bit MCU
TUB
Motor Driver (IGBT Inverter) MGP4N60ED MGP7N60ED MGP11N60ED
Motorola Daves Control Center
MOTOR/PUMP
Mechatronics 2000 S.T
Smoke Detector System
Smoke
Smoke Test
Smoke IC
LED Driver
Ion Chamber ( or Photo Chamber)
Horn Driver Smoke Signal
Horn To other units, Escape lights, Aux. Alarms, etc.
Mechatronics 2000 S.T
I/O
Motor Controls: Turning White Goods Green
Motorola has created a family of DSPs and
MCUs for all motor types (DSP5680X) These embedded solutions serve as a brain for the motor Motors are now able to determine amount of energy required to get a particular job done Result: cost and energy savings for manufacturers and consumers alike
Mechatronics 2000 S.T
Motor Control Example: Washing Machine
Indirect Drive, 3-Phase, AC Induction Motor
POWER STAGE
ANALOG CONDITIONING
Motor Controls Enable: More economical to build Cleaner clothes Better fabric care Reduced drying time Improved energy management Overall machine control without additional controller
Hot Water Valve Control
Cold Water Valve Control
Motor Control
DSP56F805
Mechatronics 2000 S.T
Motor Temp
Water Temp
Cycle Control Settings
Motor Control Example: Refrigerator
3-Phase, Sensorless BLDC Motor
FAN
Motor Controls Enable: Improved operating economy Lower manufacturing costs Better food preservation
Temperature Reading
Temperature Setting
ANALOG CONDITIONING
POWER STAGE
DSP56F803
Mechatronics 2000 S.T
Local Area Networks
Linking the Entire Home
Mechatronics 2000 S.T
Connected Home
Multiple user interface options Communicating thermostats and sensors
HomeManagerTM software UniversalControllerTM for HVAC, lighting, security
ControlServerTM OSGi using MCore processor
InvensysReadyTM appliances
Peracom Avcast SmartModuleTM technology Mechatronics technology 2000 S.T
System Needs for Semiconductors
Mechatronics 2000 S.T
System Needs for Semiconductors
Today's "glamour chips" such as MPUs, DSPs and DRAMs must be surrounded by a wide array of discretes and passives
PRESSURE PRESSURE CHEMICAL CHEMICAL ACCELERATION ACCELERATION MOTION MOTION POSITION POSITION SIGNAL SIGNAL
ISO ISO COUPLE COUPLE PROTECT PROTECT
MPU MPU MCU MCU DSP DSP MEMORY MEMORY
POWER TRANS POWER TRANS RECTIFIER RECTIFIER THYRISTOR THYRISTOR IGBTS IGBTS RF POWER RF POWER
ISO ISO COUPLE COUPLE PROTECT PROTECT
SENSING SENSING INPUT INPUT
DECISION DECISION MAKING MAKING
WORK WORK OUTPUT OUTPUT
POWER POWER
RECTIFIERS RECTIFIERS POWER TRANSISTORS POWER TRANSISTORS
Mechatronics 2000 S.T
Semiconductor Technology Spectrum
0.13 0.18 0.25 0.25 0.5 0.65 0.65 0.65 1.4 0.15mcm2 2 0.3mcm 0.6mcm2
CMOS
High-End Computing 64/128-bit CPU 6-layer metal, 2.5/1.8V
CMOS + Flash
SMARTMOS
Robust I/O, Mid-Power 40/65/80V Bip + CMOS digital/analog/NVM-trim
TMOS
High-Power 40/65/80V Low-RDSON FET protection and I/T-sensing
Embedded Control 8/16/32-bit micro NVM 512Kbyte limited analog, 40V I/O Code Synthesis
C Assembler
Flip-Chip SMT, BGA
1.2kW / 30A / 42V / 150Camb 200W / 15A / 14V / 85Camb
Software
Hardware Driver Operating System (OSEK, Time Triggered OS) Networking (LIN, CAN, TTx, MOST)
IC. Packaging
SoC MCM System in Package
Mechatronics 2000 S.T
CMOS Technology Platform
Copper & Low k Dielectric
Copper
High k & Metal Gates
Silicide Poly Si Cap TiN
TFSOI
Buried Oxide Low k Dielectric High k Gate Silicon Substrate
Process Performance
gh Hi
r rfo Pe
S ce n ma
s te m ys
1.8 GHz SOI 1.5 GHz SOI 1.0 GHz SOI .03ma/MIPS .05ma/MIPS .10ma/MIPS
600 MHz
350 MHz
.12ma/MIPS .40ma/MIPS
120 MHz
.55ma/MIPS
P gh Hi
r rfo e
m Co ce an m
s ion t ica n mu
1994
1995
1996
1997
1998
1999
Mechatronics 2000 S.T
2000
2001
2002
2003
2004
Production Dates
Integrated Packaging for System Solutions
PCB
Packages on PC Board IC R L C PCB Multi-Chip-Package IC IC
MCP
Modules on Chip
Increased Density Increased Performance Improved Reliability
SoC
Selected Modules & MCP Technology
Application Specific System Partitioning
Cost-Performance Tradeoff Latitude: _ Technology Mix & Match _ Performance Adaptability
Mechatronics 2000 S.T
DRIVING FORCES FOR PACKAGE LEVEL INTEGRATION
INTEGRATION OF MIXED TECHNOLOGIES. PERFORMANCE IMPROVEMENTS. SIZE / WEIGHT REDUCTION. SYSTEM COST REDUCTION. MANUFACTURABILITY. SERVICING ENHANCEMENTS. ERGONOMICS. DESIGN FLEXIBILITY.
Mechatronics 2000 S.T
Mechatronics Packaging Challenges
System Partitioning (function, technology, cost etc) System Cost Multichip Issues (KGD, Test) Diverse packaging /interconnect technologies Thermo-mechanical Performance and Design Guidelines Thermal management Micro vs. Macro electronics Reliability
Mechatronics 2000 S.T
Design Approach Today
System Requirements Partitioning Logic Memory Power Incomplete requirements
IC design
IC design
IC design
Debugging
PKG design
PKG design
PKG design
Substrate/Interconnect Design
Mechatronics 2000 S.T
Mechatronics System Design
System Requirements
Functional Partitioning Partitioning Digital Analog SW
System cost/performance trade-off
Tech choice IC Substrate design kits design kits
IC design
Package design
CMOS TMOS SubMEMS system PBGA Substrate LTCC design PASSIVES
Schematic Verification System Simulation Test Generation Cost Design Infrastructure
Mechatronics Design Framework
Package library
Mechatronics 2000 S.T
Mechatronics--- Confluence of diverse fields of Science and Technology - Semiconductors key enabler - Integration of mixed technology components for system performance - IC Design methodology for System needs - Business opportunities unlimited
Mechatronics 2000 S.T
