Basic Questions
1. What is a PCB, and why is it important?
A Printed Circuit Board (PCB) is a flat board made of insulating material (like FR-4) that
electrically connects and mechanically supports electronic components through
conductive pathways, traces, and pads. PCBs are essential for compact, reliable, and
efficient electronic circuits.
2. Explain the difference between single-layer, double-layer, and multi-layer PCBs.
o Single-layer: Components and traces are on one side of the board. Cost-effective
but limited for simple circuits.
o Double-layer: Traces exist on both sides of the PCB, enabling higher circuit
density.
o Multi-layer: Multiple layers of copper are sandwiched between insulating layers,
suitable for complex and high-speed circuits.
3. What is the role of vias, traces, and pads in PCB design?
o Vias: Conductive holes that connect different layers of the PCB.
o Traces: Pathways that carry electrical signals between components.
o Pads: Exposed copper areas where components are soldered.
4. What are the common materials used in PCB manufacturing?
o FR-4 (Fiberglass epoxy laminate): Most common for rigid PCBs.
o Polyimide: Used for flexible and high-temperature PCBs.
o Copper-clad laminates: Provide conductive pathways.
o Aluminum: Used for power and LED PCBs for heat dissipation.
5. What is solder mask and silkscreen?
o Solder Mask: A protective layer (usually green) applied to prevent solder
bridges.
o Silkscreen: White ink layer for markings like component labels, reference
designators, and logos.
Intermediate Questions
1. Explain the PCB design process step by step.
o Requirement Analysis: Understand circuit needs and constraints.
o Component Selection: Choose components based on function and availability.
o Schematic Design: Create a logical circuit diagram.
o Layout Design: Place components optimally on the board.
o Routing: Connect components with traces manually or automatically.
o Design Review: Validate design for errors and compliance.
o DFM Check: Ensure manufacturability.
o Prototyping and Testing: Build and test the board for functionality.
2. How do you decide trace width and spacing in a design?
o Based on current-carrying capacity, signal integrity, and safety standards.
o Use IPC-2221 standards or online calculators. Wider traces are used for power
lines.
3. What are the factors to consider while placing components on a PCB?
o Component orientation for manufacturability.
o Grouping related components together.
o Placement of power components to optimize thermal management.
o Minimizing trace lengths for high-speed signals.
4. What is ground looping, and how do you prevent it?
Ground loops occur when multiple ground paths create unwanted current flow, causing
noise. To prevent:
o Use a single-point ground.
o Design ground planes.
o Minimize ground trace resistance.
5. How do you ensure signal integrity in high-speed PCB designs?
o Use proper trace impedance matching.
o Avoid sharp angles in traces; use 45° bends.
o Route differential pairs together for signals like USB or Ethernet.
o Use ground planes and shielded traces.
6. What’s the difference between through-hole and surface-mount technologies
(SMD)?
o Through-hole: Components have pins soldered through holes, suitable for high-
mechanical-strength applications.
o SMD: Components are soldered on PCB surfaces, allowing higher component
density and automation.
Advanced Questions
1. How do you minimize Electromagnetic Interference (EMI)?
o Use proper grounding techniques and ground planes.
o Avoid long, parallel traces.
o Shield high-frequency components.
o Use decoupling capacitors near power pins.
2. Explain Thermal Management and how to handle heat dissipation.
o Place heat sinks and thermal vias on power components.
o Use wider traces for high current.
o Design copper pours for heat dissipation.
o Use thermal relief pads and proper ventilation.
3. How do you perform DFM checks?
o Check trace spacing, width, and clearances.
o Verify pad and via sizes meet manufacturer tolerances.
o Ensure components have enough clearance for soldering.
o Inspect for overlapping traces or improper placements.
4. What are Differential Pairs and when are they used?
Differential pairs are two traces carrying equal but opposite signals to reduce noise and
EMI. Used in high-speed communication like USB, HDMI, and Ethernet.
5. How do you design multi-layer PCBs for high-frequency signals?
o Use proper stack-up design with ground/power planes.
o Route high-frequency signals on internal layers to reduce noise.
o Match trace impedance.
o Keep traces short and avoid vias where possible.
Practical/Software Questions
1. Which PCB design software are you comfortable with?
"I have hands-on experience with Altium Designer, Eagle, and KiCAD. I can create
schematics, layout PCBs, perform routing, and generate Gerber files."
2. How do you design schematics and route traces?
o Use the software's library for components.
o Place components logically on the schematic.
o Use net names and labels for connections.
o Route traces on the layout, ensuring design rules for clearances and widths are
met.
3. What is auto-routing, and when would you prefer manual routing?
o Auto-routing: Automatically connects traces but may not optimize critical paths.
o Manual routing: Used for high-speed signals, power lines, and fine-tuning
performance.
