Subject Process Technician Interview Question Paper

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1. What is process engineering & what are the roles of a process engineer?

A Process Engineer plays a critical role in ensuring the efficient, safe, and cost-effective production
of high-quality products. Their expertise in designing, optimizing, and controlling processes directly
impacts the productivity and profitability of manufacturing operations.

2. What is PCB & Types of PCB?

PCB stands for Printed Circuit Board.

Single-Sided PCB
Double-Sided PCB
Multilayer PCB
Rigid PCB
Flexible PCB (Flex PCB
Rigid-Flex PCB
High-Frequency PCB
Aluminum-Backed PCB

3. What is the purpose of stencils & what are the types of stencils?

PCB stencils are essential tools used in the surface-mount technology (SMT) process of assembling printed
circuit boards. Their primary purpose is to apply solder paste to specific areas on the PCB where surface-
mount components (SMDs) will be placed. The stencil ensures that the solder paste is applied in the correct
locations, with precise amounts, and in a uniform manner.

1.Laser-Cut Stencils
2.Chemical-Etched Stencils
3.Electroformed Stencils
4.Frameless Stencils
5.Framed Stencils
6.Prototype Stencils

4. What is the purpose of squeegees & Type of squeegees?

Squeegees are essential tools used in the PCB manufacturing process, particularly during the solder paste
printing stage in surface-mount technology (SMT) assembly. Their purpose is to push and spread solder
paste across the stencil, filling the stencil apertures with the paste and leaving it precisely on the copper
pads of the PCB. This ensures that the correct amount of solder paste is applied, which is critical for
creating reliable electrical connections between surface-mount components and the PCB.
1. Metal Squeegees
2. Plastic or Polyurethane Squeegees
3. Dual Durometer Squeegees
4. Rotary Squeegees
5. Rotary Squeegees
6. Nano-Coated Squeegees
 5. What is the solder paste powder ball size of type 4 & Type 5?

Solder Paste Powder Sizes for Type 4 and Type 5:

1. Type 4 Solder Paste:
o Powder Particle Size: 20 to 38 microns (µm) in diameter.
o Use: Type 4 solder paste is commonly used for standard surface-mount components,
including fine-pitch components with moderate spacing between pads. It is suitable for most
PCB assemblies, especially for components like 0.5 mm to 0.4 mm pitch QFPs, BGAs, and
CSPs.
2. Type 5 Solder Paste:
o Powder Particle Size: 15 to 25 microns (µm) in diameter.
o Use: Type 5 solder paste is used for more advanced PCB designs with very fine-pitch
components, such as 0.4 mm to 0.3 mm pitch BGAs and CSPs. It is often required in high-
density interconnect (HDI) PCBs, where the spacing between pads is minimal, and the solder
paste must be very finely deposited.
Key Differences:
 Type 4 is more commonly used in typical PCB manufacturing, while Type 5 is chosen for finer-pitch,
high-density designs that require a more precise solder paste application.
 Smaller solder balls in Type 5 allow for better paste release from finer stencil apertures but can be
more expensive and prone to oxidation due to the increased surface area of the smaller particles.

6. Difference between SMT and PTH?

7. What is the purpose of a PFC in manufacturing & explain the different symbols?

PFC in manufacturing typically refers to a Process Flow Chart (sometimes called Process Flow
Diagram or PFD), which visually represents the steps involved in the production process. It is a critical
tool used to document, analyze, and improve manufacturing processes, ensuring efficiency, consistency,
 and quality control. A PFC helps teams understand how raw materials, components, and processes flow
through a manufacturing system to become a finished product.

 Symbol: ◯ (Rectangle or Oval)

Process (Operation) Symbol:

 Meaning: Represents a process, task, or operation. It is used for any step in the process where work
is performed.
Decision Symbol:
 Symbol: ◇ (Diamond)
 Meaning: A point in the process where a decision is made, typically with two or more possible
outcomes (e.g., Yes/No).

 Symbol: ◯ (Oval)
Start/End Symbol:

 Meaning: Denotes the beginning or end of the process. It is used to define where the process flow
starts and stops.

8. What is the Solder paste thawing hours & Storage conditions?

Solder paste thawing and storage conditions are critical to maintaining the quality and
performance of the paste during the PCB assembly process. Solder paste contains a mixture of flux and
solder powder, and it must be handled carefully to prevent degradation, separation, or moisture
absorption, which can lead to defects in solder joints.

9. What is the purpose of a soldering profile? Explain the types of profiles.?

Purpose of a Soldering Profile:
1. Controlled Heating:
o The profile ensures that the PCB and components are heated uniformly and gradually,
preventing thermal stress, warping, or damage to sensitive components.
2. Proper Solder Paste Activation:
o Different phases of the profile allow the solder paste flux to activate, clean the component
leads and PCB pads, and enable proper solder wetting.
3. Avoiding Defects:
o A controlled temperature ramp prevents issues like solder balling, bridging, or tombstoning,
and ensures complete reflow of the solder paste.
4. Component Protection:
o The profile ensures that temperature-sensitive components are not exposed to excessive
heat, which could lead to failures or reduced reliability.
5. Uniform Solder Joints:
o By following the appropriate reflow profile, you ensure consistent solder joint quality across
the entire board.

Types of Soldering Profiles:

There are two main types of soldering profiles used in reflow soldering:
1. Ramp-to-Peak Profile
2. Soak (Ramp-Soak-Spike) Profile

1. Ramp-to-Peak Profile:
This is the simpler of the two profiles and involves steadily increasing the temperature of the PCB until
it reaches the peak temperature, followed by cooling. This type of profile is used for many standard
components and applications.
Phases of Ramp-to-Peak Profile:
1. Preheat Phase:
o The temperature ramps steadily from room temperature to the solder paste activation
temperature (typically between 120°C to 180°C). This is done at a rate of 1–3°C per second.
o Purpose: To preheat the entire assembly uniformly, avoiding thermal shock to the
components.
2. Soak Phase:
o There is typically no soak phase in a true ramp-to-peak profile; the temperature continues to
increase towards the peak without a plateau. This allows the flux in the solder paste to
activate and clean the surfaces.
3. Reflow Phase (Peak):
o The temperature reaches the peak reflow temperature, typically between 230°C to 260°C,
 depending on the solder paste used (e.g., leaded or lead-free solder).
o During this phase, the solder melts, wets the surfaces, and forms solder joints.
4. Cooling Phase:
o After the peak temperature is reached, the temperature is rapidly reduced (typically 3–6°C
per second) to solidify the solder and form strong joints. Proper cooling ensures good joint
strength and avoids defects like micro-cracks.

2. Soak (Ramp-Soak-Spike) Profile

This is a more complex profile and is typically used for PCBs with more complex assemblies, mixed
technology, or temperature-sensitive components. It includes a soak phase, which allows the entire
assembly to reach a uniform temperature before the solder is reflowed.
Phases of Soak Profile:
1. Preheat Phase:
o The temperature gradually ramps from room temperature to around 120°C to 150°C at a rate
of 1–3°C per second.
o Purpose: To bring the board and components to a temperature that avoids thermal shock.
2. Soak Phase:
o The temperature is held at a soak temperature (usually 150°C to 180°C) for a specified
period (typically 60–120 seconds).
o Purpose: To ensure that the board and components reach a uniform temperature before
entering the reflow phase. This allows any differences in thermal mass to equalize, ensuring
consistent reflow.
o During the soak, flux activation occurs, which removes oxides and prepares the surfaces for
soldering.
3. Reflow Phase (Spike):
o The temperature is rapidly increased to the peak reflow temperature (usually 230°C to
260°C), where the solder paste melts and wets the component leads and PCB pads.
o Peak temperature should be carefully controlled to prevent overheating.
4. Cooling Phase:
o After the peak, the temperature is reduced at a controlled rate of 3–6°C per second.
o Purpose: To solidify the solder joints and prevent defects like thermal shock, warping, or
micro-cracks.

10. What is MSD&MSL? Types of MSL levels & their floor life?
MSD and MSL are key terms related to moisture-sensitive components in electronics manufacturing.
Understanding these concepts is important for ensuring the reliability of surface-mount devices (SMDs)
during the soldering process.

Types of MSL Levels and Their Floor Life:

MSL levels range from 1 (least sensitive to moisture) to 6 (most sensitive to moisture). Each MSL level
specifies how long the component can remain exposed to ambient conditions before moisture becomes a
concern and the component needs re-baking.
 11. What are the most common types of PCBA finishes used in the industry?

1. HASL (Hot Air Solder Leveling)

2. ENIG (Electroless Nickel Immersion Gold)
3. OSP (Organic Solderability Preservative)
4. Immersion Silver (ImAg)
5. Immersion Tin (ImSn)
6. ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold)
7. Hard Gold (Electrolytic Gold)

12. What is ESD? What is the purpose of ESD?

ESD (Electrostatic Discharge) refers to the sudden flow of electricity between two electrically charged
objects, typically caused by a difference in voltage potential. This discharge can occur when two objects
with different electrical potentials come into contact or are brought close together, resulting in a transfer of
charge.
ESD is particularly relevant in the electronics industry because many electronic components are sensitive to
even small amounts of static electricity. The discharge of electrostatic energy can potentially damage or
destroy these components, affecting the performance, reliability, and lifespan of the product.

Purpose of ESD (Electrostatic Discharge) Control:

The purpose of ESD control is to protect sensitive electronic components and devices from damage or
degradation due to static electricity. This is critical in industries such as electronics manufacturing,
semiconductor fabrication, PCB assembly, and in handling devices like computer chips, integrated circuits
(ICs), and other microelectronic components.

13. What is PPE?

PPE stands for Personal Protective Equipment. It refers to any clothing or equipment designed to protect
the wearer from potential hazards, injuries, or illnesses in the workplace or other environments. PPE is
commonly used in various industries, including construction, healthcare, manufacturing, laboratories, and
electronics, to ensure worker safety and minimize exposure to risks.
 14. Describe the 5S+1?

1. Sort
Description: The first step involves identifying and removing anything that is not essential for the
current work process. This can include old tools, unused equipment, outdated paperwork, or materials
that are no longer needed. Sorting helps reduce clutter and frees up valuable space.
2. Set in Order
Description: Once unnecessary items are removed, the next step is to ensure that everything has its
designated place. Tools, materials, and equipment should be arranged in such a way that they are easy
to find, access, and return to their proper location. Labeling, color-coding, and proper storage solutions
are often used.
3. Shine
Description: This step focuses on regular cleaning of the work area, tools, and equipment. It’s not just
about tidying up, but also about inspecting for any issues, such as wear, damage, or dirt buildup that
could cause problems. Regular cleaning can also highlight maintenance needs and help prevent
machinery breakdowns.
4. Standardize
Description: To ensure that the improvements made during the first three steps are sustained, it's
important to develop standardized procedures. This includes creating checklists, schedules, and visual
controls to guide the organization of tools and workspace. Training employees on how to maintain
cleanliness and order is also part of this step.
5. Sustain
Description: Sustain the improvements by embedding 5S principles into the daily routine. It involves
fostering discipline and commitment among workers to continue following the established processes
and standards. It may also include regular audits and reviews to ensure the system is being followed.
+1: Safety
Description: The addition of Safety to the 5S system emphasizes that workplace safety should always be
a priority. Safety involves identifying and eliminating hazards, ensuring proper use of personal
protective equipment (PPE), and maintaining clear pathways to avoid accidents. In the 5S+1
methodology, safety is treated as an integral component of each of the other 5S steps, ensuring that
every action taken also considers safety.

15. What is KAIZEN?

Continuous Improvement:
 Kaizen is based on the idea that improvement is an ongoing process. Small, continuous changes,
over time, lead to significant overall improvements.

16. What is the Difference between Jigs and fixtures?

 17. What is the purpose SOP?

Purpose of SOP:
Consistency
Efficiency and Productivity
Quality Control
Compliance and Regulation
Training and Onboarding
Risk Reduction
Problem Solving and Continuous Improvement
Documentation and Accountability

18. What is yield & Mention the yield formula?

Yield in manufacturing refers to the percentage of good, defect-free products produced in a process,
relative to the total number of products that are started. Yield is a measure of the efficiency of a
manufacturing or production process. Higher yield percentages indicate fewer defects and higher efficiency,
while lower yield percentages suggest that more products are failing to meet the required quality
standards.

First Pass Yield (FPY)=( Number of Good Units/Total Units Produced)×100

Overall Yield=( Good Units after Rework / Total Units Started)×100

19. What is CP and CPK?

Cp and Cpk are statistical measures used in quality control and process capability analysis to evaluate the
ability of a process to produce products that meet specification limits. They are used to determine how well
a process is performing and whether it can consistently produce products within the desired quality limits.

20. What is 4M,5WHY and 8D?

1. 4M (Man, Machine, Material, Method):

The 4M is a framework used to analyze and identify potential causes of a problem in a process or
production environment. It helps in examining all aspects of a process to ensure that nothing is overlooked
when troubleshooting.
2. 5 WHY:
The 5 WHY technique is a simple, iterative problem-solving method used to identify the root cause of an
issue by asking "Why?" repeatedly—typically five times—until the root cause is discovered. The idea is that
by repeatedly asking "Why?" at each step, the questioner can peel away layers of symptoms and uncover
the true source of the problem.

3. 8D (Eight Disciplines of Problem Solving):

The 8D is a structured problem-solving methodology widely used to address complex issues, especially in
automotive, manufacturing, and service industries. It helps teams identify the root cause, implement
corrective actions, and prevent recurrence. The 8D process is more comprehensive than 5 WHY and
includes a series of steps designed to ensure that all aspects of the problem are addressed.

21. Solder Bar -SAC 0207 - Composition?

The Solder Bar SAC 0207 refers to a specific type of lead-free solder alloy used in electronics, particularly in
Surface Mount Technology (SMT) and wave soldering processes. SAC stands for Tin (Sn), Silver (Ag), and
Copper (Cu), which are the primary elements in the alloy.

SAC refers to a solder composition that consists of the following elements:

 Sn (Tin): 96.5%
 Ag (Silver): 3.0%
 Cu (Copper): 0.7%

22. Solder Paste -SAC 305 - Composition?

SAC 305 is a commonly used lead-free solder paste alloy, especially in electronics manufacturing. It
is composed of Tin (Sn), Silver (Ag), and Copper (Cu), and is widely used in Surface Mount
Technology (SMT) for soldering components to printed circuit boards (PCBs).
SAC 305 Composition:
 Sn (Tin): 96.5%
 Ag (Silver): 3.0%
 Cu (Copper): 0.5%

23. Difference between ROHS and non-ROHS? Examples?

RoHS (Restriction of Hazardous Substances) and Non-RoHS refer to different sets of regulations and
standards regarding the use of hazardous materials in electronics and electrical equipment.
 24. Which IPC standard is used for acceptance criteria?

The IPC standard used for acceptance criteria in the electronics industry is IPC-A-610.

25. How to calculate cycle time and UPH?

Cycle Time = Total Time / Number of Units Produced

UPH = Total Number of Units Produced / Total Time in Hours

26. What is DPMO & Mention the DPMO Formula?

DPMO (Defects Per Million Opportunities) is a quality metric used in Six Sigma and other quality
management frameworks to measure the number of defects in a process per one million opportunities. It
helps quantify the level of quality and defect frequency in a process, allowing organizations to understand
how often defects occur and where improvements are needed.
DPMO Formula:
DPMO=(Number of Defects / (Number of Opportunities × Number of Units) )×1,000,000

27. What is OCV/OCR?

1. OCV (Optical Character Verification):

OCV is a process or technology used to verify the accuracy of printed text or symbols on electronic
components, PCBs, and other devices. It ensures that all alphanumeric markings (such as part numbers,
logos, serial numbers, etc.) on the surface of a component or assembly are correctly printed and match the
specified design or documentation.
2. OCR (Optical Character Recognition):
OCR is a technology used to digitally recognize and convert printed or handwritten text into machine-
readable data. In manufacturing, OCR is commonly used in automated inspection systems to read and
process text from PCBs, packaging, or other product-related items.

28. What is the purpose of nitrogen in an oven?

1.Prevent Oxidation
2.Improves Soldering Quality
3.Minimizes the Formation of Dross
4.Enhanced Control of Soldering Temperature
5.Improved Reliability

29. What is the purpose of Flux in wave soldering?

The purpose of flux in wave soldering is to ensure the proper formation of solder joints by improving the
wetting action between the solder and the components, as well as preventing defects during the soldering
process.

30. What type of flux is used in wave soldering machine?

31. What is the purpose of a check sheet?

Purpose of a Check Sheet:
1. Data Collection
2. Error Detection
3. Process Improvement
4. Standardization
5. Real-Time Monitoring
6. Easy Analysis
7. Documentation and Reporting
 8. Cost Reduction

32. What is BOM? Types of BoM?

A Bill of Materials (BOM) is a comprehensive list that includes all the raw materials, components, sub-
assemblies, and parts required to manufacture a product, along with the quantities needed and other
necessary details. The BOM serves as a blueprint for the manufacturing process, providing the instructions
on how the final product is assembled.

Types of BOM (Bill of Materials):

1. Engineering BOM (EBOM)
2. Manufacturing BOM (MBOM)
3. Sales BOM (SBOM)
4. Service BOM
5. Production BOM
6. Indented BOM
7. Single-Level BOM

33. What is the general criteria to qualify the fixture?

 34. What is FACA? Explain with one example!

FACA (Failure Analysis and Corrective Action) is a process used in manufacturing, engineering, and quality
management to identify, analyze, and correct failures or defects in a product or process. The FACA process
helps organizations to not only resolve existing problems but also prevent them from recurring by
implementing corrective actions and continually improving the process.