01 HYY Rockchip RK3588 Datasheet
01 HYY Rockchip RK3588 Datasheet
Rockchip
RK3588
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Datasheet
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Revision 1.1
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Jan. 2022
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Revision History
Date Revision Description
2022-1-24 1.1 Update the description
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Table of Content
Table of Content ...................................................................................................... 3
Figure Index ........................................................................................................... 4
Table Index............................................................................................................. 5
Warranty Disclaimer ................................................................................................. 6
Chapter 1 Introduction ..................................................................................... 7
1.1 Overview ............................................................................................... 7
1.2 Features ................................................................................................ 7
1.3 Block Diagram ...................................................................................... 17
Chapter 2 Package Information.........................................................................19
2.1 Order Information ................................................................................. 19
2.2 Top Marking ......................................................................................... 19
2.3 Package Dimension ............................................................................... 19
2.4 Pin Number List .................................................................................... 22
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Chapter 3 Electrical Specification ......................................................................30
3.1 Absolute Ratings ................................................................................... 30
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3.2 Recommended Operating Condition ......................................................... 31
3.3 DC Characteristics ................................................................................. 33
3.4 Electrical Characteristics for General IO .................................................... 33
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3.5 Electrical Characteristics for PLL .............................................................. 34
3.6 Electrical Characteristics for PCIe2/SATA Interface ..................................... 34
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3.7 Electrical Characteristics for MIPI CDPHY interface ..................................... 35
3.8 Electrical Characteristics for MIPI CSI DPHY interface ................................. 35
3.9 Electrical Characteristics for SARADC ....................................................... 35
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3.10 Electrical Characteristics for TSADC ........................................................ 35
Chapter 4 Thermal Management .......................................................................36
4.1 Overview ............................................................................................. 36
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4.2 Package Thermal Characteristics ............................................................. 36
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Figure Index
Fig.1-1 Block Diagram ....................................................................................... 18
Fig.2-1 Package definition .................................................................................. 19
Fig.2-2 Package Top View .................................................................................. 19
Fig.2-3 Package Bottom View ............................................................................. 20
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Table Index
Table 2-1 Pin Number Order Information .............................................................. 22
Table 3-1 Absolute ratings.................................................................................. 30
Table 3-2 Recommended operating condition ........................................................ 31
Table 3-3 DC Characteristics............................................................................... 33
Table 3-4 Electrical Characteristics for Digital General IO ........................................ 33
Table 3-5 Electrical Characteristics for INT PLL ...................................................... 34
Table 3-6 Electrical Characteristics for FRAC PLL .................................................... 34
Table 3-7 Electrical Characteristics for DDR PLL ..................................................... 34
Table 3-8 Electrical Characteristics for PCIe2/SATA Interface ................................... 34
Table 3-9 Electrical Characteristics for MIPI CDPHY interface ................................... 35
Table 3-101 Electrical Characteristics for SARADC.................................................. 35
Table 4-1 Thermal Resistance Characteristics ........................................................ 36
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Warranty Disclaimer
Rockchip Electronics Co., Ltd makes no warranty, representation or guarantee (expressed, implied, statutory, or otherwise)
by or with respect to anything in this document, and shall not be liable for any implied warranties of non-infringement,
merchantability or fitness for a particular purpose or for any indirect, special or consequential damages.
Information furnished is believed to be accurate and reliable. However, Rockchip Electronics Co., Ltd assumes no
responsibility for the consequences of use of such information or for any infringement of patents or other rights of third
parties that may result from its use.
Rockchip Electronics Co., Ltd’s products are not designed, intended, or authorized for using as components in systems
intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other
application in which the failure of the Rockchip Electronics Co., Ltd’s product could create a situation where personal injury or
death may occur, should buyer purchase or use Rockchip Electronics Co., Ltd’s products for any such unintended or
unauthorized application, buyers shall indemnify and hold Rockchip Electronics Co., Ltd and its officers, employees,
subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, expenses, and reasonable attorney fees
arising out of, either directly or indirectly, any claim of personal injury or death that may be associated with such unintended
or unauthorized use, even if such claim alleges that Rockchip Electronics Co., Ltd was negligent regarding the design or
manufacture of the part.
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Ltd ’s products. There are no expressed or implied copyright licenses granted hereunder to design or fabricate any integrated
circuits or integrated circuits based on the information in this document.
Rockchip Electronics Co., Ltd does not convey any license under its patent rights nor the
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rights of others.
All copyright and patent rights referenced in this document belong to their respective owners
and shall be subject to corresponding copyright and patent licensing requirements.
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Trademarks
Rockchip and RockchipTM logo and the name of Rockchip Electronics Co., Ltd’s products are trademarks of Rockchip
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Electronics Co., Ltd. and are exclusively owned by Rockchip Electronics Co., Ltd. References to other companies and their
products use trademarks owned by the respective companies and are for reference purpose only.
Confidentiality
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The information contained herein (including any attachments) is confidential. The recipient hereby acknowledges the
confidentiality of this document, and except for the specific purpose, this document shall not be disclosed to any third party.
Chapter 1 Introduction
1.1 Overview
RK3588 is a low power, high performance processor for ARM-based PC and Edge Computing
device, personal mobile internet device and other digital multimedia applications, and
integrates quad-core Cortex-A76 and quad-core Cortex-A55 with separately NEON
coprocessor.
Many embedded powerful hardware engines provide optimized performance for high-end
application. RK3588 supports H.265 and VP9 decoder by 8K@60fps, H.264 decoder by
8K@30fps, and AV1 decoder by 4K@60fps, also support H.264 and H.265 encoder by
8K@30fps, high-quality JPEG encoder/decoder, specialized image preprocessor and
postprocessor.
Embedded 3D GPU makes RK3588 completely compatible with OpenGLES 1.1, 2.0, and 3.2,
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OpenCL up to 2.2 and Vulkan1.2. Special 2D hardware engine with MMU will maximize
display performance and provide very smoothly operation.
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RK3588 introduces a new generation totally hardware-based maximum 48-Megapixel ISP
(image signal processor). It implements a lot of algorithm accelerators, such as HDR, 3A,
LSC, 3DNR, 2DNR, sharpening, dehaze, fisheye correction, gamma correction and so on.
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The build-in NPU supports INT4/INT8/INT16/FP16 hybrid operation and computing power is
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up to 6TOPs. In addition, with its strong compatibility, network models based on a series of
frameworks such as TensorFlow/MXNet/PyTorch/Caffe can be easily converted.
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RK3588 has high-performance quad channel external memory interface
(LPDDR4/LPDDR4X/LPDDR5) capable of sustaining demanding memory bandwidths, also
provides a complete set of peripheral interface to support very flexible applications.
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1.2 Features
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The features listed below which may or may not be present in actual product, may be
subject to the third party licensing requirements. Please contact Rockchip for actual product
feature configurations and licensing requirements.
1.2.1 Microprocessor
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Quad-core ARM Cortex-A76 MPCore processor and quad-core ARM Cortex-A55 MPCore
processor, both are high-performance, low-power and cached application processor
DSU (DynamIQ Shared Unit) comprises the L3 memory system, control logic, and
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each Cortex-A55
Quad-core Cortex-A76 and Quad-core Cortex-A55 share 3MB L3 cache
Eight separate power domains for CPU core system to support internal power switch
and externally turn on/off based on different application scenario
PD_CPU_0: 1st Cortex-A55 + Neon + FPU + L1/L2 I/D Cache
PD_CPU_1: 2nd Cortex-A55 + Neon + FPU + L1/L2 I/D Cache
PD_CPU_2: 3rd Cortex-A55 + Neon + FPU + L1/L2 I/D Cache
PD_CPU_3: 4th Cortex-A55 + Neon + FPU + L1/L2 I/D Cache
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External off-chip memory
Dynamic Memory Interface
Compatible with JEDEC standards LPDDR4/LPDDR4X/LPDDR5
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Support four channels, each channel 16bits data widths
Support up to 2 ranks (chip selects) for each channel
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Totally up to 32GB address space
Low power modes, such as power-down and self-refresh for SDRAM
eMMC Interface
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Fully compliant with JEDEC eMMC 5.1 and eMMC 5.0 specification
Backward compliant with eMMC 4.51 and earlier versions specification.
Support HS400, HS200, DDR50 and legacy operating modes
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Support three data bus width: 1bit, 4bits or 8bits
SD/MMC Interface
Compatible with SD3.0, MMC ver4.51
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Data bus width is 4bits
Flexible Serial Flash Interface(FSPI)
Support transfer data from/to serial flash device
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MCU
Three Cortex-M0 MCUs inside RK3588
MCU in VD_PMU integrate 16KB Cache and 16KB TCM
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Support global soft-reset control for whole chip, also individual soft-reset for each
component
PMU(power management unit)
Multiple configurable work modes to save power by different frequency or
automatic clock gating control or power domain on/off control
Lots of wakeup sources in different mode
Support 10 separate voltage domains
Support 45 separate power domains, which can be power up/down by software
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timeout
WDT can perform two types of operations when timeout occurs:
Generate a system reset
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First generate an interrupt and if this is not cleared by the service routine by
the time a second timeout occurs then generate a system reset
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Totally five Watchdog for CPU and MCU
Interrupt Controller
Support 12 PPI interrupt source and 480 SPI interrupt sources input from different
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components inside RK3588
Support 16 software-triggered interrupts
Input interrupt level is fixed, high-level sensitive for SPI and low-level sensitive for
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PPI
Support different interrupt priority for each interrupt source, and they are always
software-programmable
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DMAC
Micro-code programming based DMA
Linked list DMA function is supported to complete scatter-gather transfer
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Support TrustZone technology and programmable secure state for each DMA
channel
Secure System
Embedded two cipher engine
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Provide 32 lock registers for software to use to indicate whether mailbox is
occupied
Decompression
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Support for decompressing GZIP files
Support for decompressing LZ4 files, including the General Structure of LZ4 Frame
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format and the Legacy Frame format.
Support for decompressing data in DEFLATE format
Support for decompressing data in ZLIB format
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Support Hash32 check in LZ4 decompression process
Support the limit size function of the decompressed data to prevent the memory
from being maliciously destroyed during the decompression process
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1.2.4 Video CODEC
Video Decoder
Real-time video decoder of MPEG-1, MPEG-2, MPEG-4, H.263, H.264, H.265, VC-1,
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VP9, VP8, MVC, AV1
MMU Embedded
Multi-channel decoder in parallel for less resolution
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Support up to 8K@30fps
Multi-channel encoder in parallel for less resolution
1.2.5 JPEG CODEC
JPEG Encoder
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Provide MMU and L2 Cache with 4x 256KB size
The latest Valhall architecture
ARM Frame Buffer Compression(AFBC) 1.3
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Support Serial Wire debug for embedded MCU
One isolated voltage domain to support DVFS
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2D Graphics Engine
Source format: ARGB/RGB888/RGB565/YUV420/YUV422/BPP
Destination formats: ARGB/RGB888/RGB565/YUV420/YUV422
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Max resolution: 8192x8192 source, 4096x4096 destination
Block transfer and Transparency mode
Color fill with gradient fill, and pattern fill
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Alpha blending modes including global alpha, per pixel alpha (color/alpha channel
separately) and fading
Arbitrary non-integer scaling ratio, from 1/8 to 8
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0, 90, 180, 270 degree rotation, x-mirror, y-mirror & rotation operation
ROP2, ROP3, ROP4
Support 4k/64k page size MMU
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De-interlace
1.2.8 Video Input Interface
MIPI interface
Two MIPI DC(DPHY/CPHY) combo PHY
Support to use DPHY or CPHY
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Support HDCP2.3 and HDCP1.4
1.2.9 Image Signal Processor
Video Capture(VICAP)
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Support BT601, BT656, BT1120
Support receiving six interfaces of MIPI CSI/DSI, up to four IDs for each interface
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Support five CSI data formats: RAW8/10/12/14, YUV422
Support three modes of HDR: virtual channel mode, identification code mode, line
counter mode
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Support RAW data through to ISP0/1
Maximum input
48M:8064x6048@15 dual ISP
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32M:6528x4898@30 dual ISP
16M:4672x3504@30 single ISP
3A: include AE/Histogram, AF, AWB statistics output
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FPN: Fixed Pattern Noise removal
BLC: Black Level Correction
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Support DSC 1.2a for HDMI TX
Support HDCP2.3 for HDMI TX, and HDCP1.3 for eDP
DP TX interface
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Support 2 DP TX 1.4a interface which combo with USB3.1 Gen1
Support 1/2/4lanes for each interface
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Support 1.62Gbps, 2.7Gbps, 5.4Gbps and 8.1Gbps Serializer
Support up to 7680x4320@30Hz
Support RGB/YUV(up to 10bit) format
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Support Single Stream Transport(SST)
Support DP Alt mode on USB Type-C
Support HDCP2.3, HDCP 1.3
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MIPI DSI interface
Support 2 MIPI DPHY 2.0 or CPHY 1.1 interface
Support 4 data lanes and 4.5Gbps maximum data rate per lane for DPHY
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Support 3 data trios and 2.0Gsps maximum data rate per trio for CPHY
Support max resolution 4K@60Hz
Support dual MIPI display: left-right mode
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Support up to 1920x1080@60Hz
Support RGB(up to 8bit) format
Up to 150MHz data rate
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Support 3 I2S formats (normal, left-justified, right-justified)
Support 4 PCM formats (early, late1, late2, late3)
Support TDM normal, 1/2 cycle left shift, 1 cycle left shift, 2 cycle left shift, right
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shift mode serial audio data transfer
I2S, PCM and TDM mode cannot be used at the same time
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I2S2/I2S3 with 2 channels
Up to 2 channels for TX and 2 channels RX path
Audio resolution from 16bits to 32bits
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Sample rate up to 192KHz
Provides master and slave work mode, software configurable
Support 3 I2S formats (normal, left-justified, right-justified)
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Support 4 PCM formats (early, late1, late2, late3)
I2S and PCM cannot be used at the same time
SPDIF0/SPDIF1
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Support two 16-bit audio data store together in one 32-bit wide location
Support biphase format stereo audio data output
Support 16 to 31 bit audio data left or right justified in 32-bit wide sample data
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buffer
Support 16, 20, 24 bits audio data transfer in linear PCM mode
Support non-linear PCM transfer
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PDM0/PDM1
Up to 8 channels
Audio resolution from 16bits to 24bits
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Simultaneous IN and OUT transfer for USB3.1 Gen1
Descriptor caching and data pre-fetching used to improve system performance in
high-latency systems
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LPM protocol in USB 2.0 (exclude USB3OTG_2) and U0, U1, U2, and U3 states for
USB3.1 Gen1
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USB3.1 Gen1 Device Features
Up to 10 IN endpoints, including control endpoint 0
Up to 6 OUT endpoints, including control endpoint 0
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Up to 16 endpoint transfer resources, each one for each endpoint
Flexible endpoint configuration for multiple applications/USB set-configuration
modes
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Hardware handles ERDY and burst
Stream-based bulk endpoints with controller automatically initiating data
movement
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Isochronous endpoints with isochronous data in data buffers
Flexible Descriptor with rich set of features to support buffer interrupt
moderation, multiple transfers, isochronous, control, and scattered buffering
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support
USB3.1 Gen1 xHCI Host Features
Support up to 64 devices
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Support 1 interrupter
Support 1 USB2.0 port (exclude USB3OTG_2) and 1 Super-Speed port
Support standard or open-source xHCI and class driver
USB3.1 Gen1 Dual-Role Device (DRD) Features
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SATA Interface
Compatible with Serial ATA 3.1 and AHCI revision 1.3.1
Support eSATA
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Support 1 port for each SATA interface
Support 6Gbps data rate
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PCIe3.0 Interface
Compatible with PCI Express Base Specification Revision 3.0
Support dual operation mode: Root Complex(RC) and End Point(EP)
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Support data rates: 2.5Gbps(PCIe1.1), 5Gbps(PCIe2.1), 8Gps(PCIe3.0)
Support aggregation and bifurcation with 1x 4lanes, 2x 2lanes, 4x 1lanes and 1x
2lanes + 2x 1lanes
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SPI interface
Support 5 SPI Controllers(SPI0-SPI4)
Support two chip-select output
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Support serial-master and serial-slave mode, software-configurable
I2C Master controller
Support 9 I2C Master(I2C0-I2C8)
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CAN Bus
Support 3 CAN buses
Support CAN 2.0B protocol
Support transmit or receive CAN standard frame
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OTP
Support 32Kbit space and higher 4k address space is non-secure part.
Support read and program word mask in secure model
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Support maximum 32 bit OTP program operation
Support maximum 16 word OTP read operation
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Program and Read state can be read
Program fail address record
Package Type
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FCBGA1088L (body: 23mm x 23mm; ball size: 0.36mm; ball pitch: 0.65mm)
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3x Mailbox 9x I2C
Image Enhancement Dual pipe ISP
Processor (Support camera HDR input)
Multi-Media Interface 2x Giga-Ethernet
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2x MIPI-CSI DPHY 4L/CPHY 3L 8K Video Encoder 8K 10-bits Video Decoder
(H265/H264 ) (H265/H264/VP9 ) SDIO 3.0
4x MIPI-CSI DPHY 2L
GPIO
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2x MIPI-DSI DPHY 4 Lane JPEG Encoder/Decoder
2x HDMI2.1 TX/eDP1.3 4 Lane
Embedded Memory
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2x DP1.4 4 Lane with HDCP2.3 External Memory Interface
(Combo with USB3) SRAM
HDMI RX 2.0 eMMC5.1 SD3.0/MMC4.5
ROM
Display Controller LPDDR4/LPDDR4X/LPDDR5
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(Support video HDR output) Quad-channel x16bit OTP
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RKXXXX : Chip Name
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ABC : Subcontractor Code
XXXXXX : Die Lot NO #
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DEFG : Date Code
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The first pin OSAT gy
Fig.2-1 Package definition
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Fig.2-3 Package Bottom View
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Fig.2-5 Package Dimension
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DDR_CH1_DQ8_D A22 DDR_CH1_DM1_D D22
DDR_CH1_DQ10_D A23 VSS_35 D23
PCIE30X1_1_CLKREQN_M2/DP0_HPDIN_M2/I2C2_SDA_M4/UA A24 VSS_36 D24
RT6_RX_M1/SPI4_MISO_M2/GPIO1_A0_d
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PCIE30X1_1_WAKEN_M2/DP1_HPDIN_M2/SATA1_ACT_LED_M A25 PDM1_SDI2_M1/PCIE30X4_WAKEN_M3/SPI0_MISO_M2/ D25
1/I2C2_SCL_M4/UART6_TX_M1/SPI4_MOSI_M2/GPIO1_A1_d GPIO1_B1_d
VOP_POST_EMPTY/I2C4_SDA_M3/UART6_RTSN_M1/PWM0_M2 A26 PDM1_SDI3_M1/PCIE30X4_PERSTN_M3/UART4_RX_M2/ D26
/SPI4_CLK_M2/GPIO1_A2_d SPI0_MOSI_M2/GPIO1_B2_d
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HDMI_TX1_SDA_M2/I2C4_SCL_M3/UART6_CTSN_M1/PWM1_M A27 PDM1_CLK1_M1/PCIE30X1_0_WAKEN_M2/SATA0_ACT_L D27
2/SPI4_CS0_M2/GPIO1_A3_d ED_M1/UART4_TX_M2/SPI0_CLK_M2/GPIO1_B3_d
PCIE30_PORT1_REF_CLKP A28 I2S0_SDI0/GPIO1_D4_d D28
PCIE30_PORT1_TX0N A30 PDM0_CLK0_M0/I2C4_SDA_M4/PWM15_IR_M2/GPIO1_ D29
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C6_d
PCIE30_PORT1_RX0N A32 I2S0_LRCK/I2C2_SCL_M3/UART4_RTSN/GPIO1_C5_d D30
PCIE30_PORT1_RESREF A33 VSS_37 D31
VSS_4 A34 PCIE30_PORT0_TX0P D32
DDR_CH0_DQ14_A AA1 PCIE30_PORT0_TX0N D33
DDR_CH0_DQ15_A AA2
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DDR_CH0_DQ13_B E1
VSS_248 AA3 DDR_CH0_DQ14_B E2
DDR_CH0_DQS1N_A AA4 VSS_38 E3
DDR_CH0_DQS1P_A AA5 DDR_CH0_DM1_B E4
VSS_249 AA6 DDR_CH1_DQS1P_C E5
lo
VCCIO2_1V8 AA7 VSS_39 E6
AVSS_15 AA8 DDR_CH1_WCK1N_C E7
HDMI/eDP_TX0_VDD_0V75 AA9 VSS_40 E8
AVSS_16 AA10 DDR_CH1_DQS0P_C E9
no
1_MOSI_M1/GPIO3_B7_d M0/PWM1_M1/SPI1_CS0_M2/GPIO1_D3_d
GMAC1_TXD2/SDIO_D0_M1/I2S3_MCLK/FSPI_D0_M2/I2C6_S AA29 I2S0_SDO0/I2C4_SCL_M4/UART4_CTSN/GPIO1_C7_d E29
DA_M4/PWM10_M0/SPI4_MISO_M1/GPIO3_A0_u
GMAC1_TXD3/SDIO_D1_M1/I2S3_SCLK/AUDDSM_LN/FSPI_D1 AA30 PDM0_CLK1_M0/I2C2_SDA_M3/PWM11_IR_M2/SPI4_CS E30
_M2/I2C6_SCL_M4/PWM11_IR_M0/SPI4_MOSI_M1/GPIO3_A1 1_M0/GPIO1_C4_d
_u
VSS_260 AA31 I2S0_SCLK/I2C6_SCL_M1/UART3_CTSN/PWM7_IR_M2/S E31
PI4_CS0_M0/GPIO1_C3_d
EMMC_D5/I2C1_SDA_M3/UART5_TX_M2/GPIO2_D5_u AA32 VSS_46 E32
EMMC_D3/FSPI_D3_M0/GPIO2_D3_u AA33 PCIE30_PORT0_REF_CLKP E33
EMMC_RSTN/I2C2_SCL_M2/UART5_RTSN_M1/GPIO2_A3_d AA34 PCIE30_PORT0_REF_CLKN E34
DDR_CH0_DQ9_A AB1 DDR_CH0_DQ4_B F1
DDR_CH0_DQ8_A AB2 DDR_CH0_DQ12_B F2
VSS_261 AB3 VSS_47 F3
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MIPI_CSI0_AVCC0V75 AB25 I2S0_SDO2/I2S0_SDI3/PDM0_SDI1_M0/I2C7_SDA_M0/ F27
UART6_RX_M2/SPI1_MOSI_M2/GPIO1_D1_d
MIPI_CSI0_AVCC1V8 AB26 I2S0_SDO3/I2S0_SDI2/PDM0_SDI2_M0/I2C1_SCL_M4/ F28
UART4_TX_M0/PWM0_M1/SPI1_CLK_M2/GPIO1_D2_d
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VSS_270 AB27 I2S0_MCLK/I2C6_SDA_M1/UART3_RTSN/PWM3_IR_M2/ F30
SPI4_CLK_M0/GPIO1_C2__d
PCIE30X4_BUTTON_RSTN/DP1_HPDIN_M0/MCU_JTAG_TMS_M AB28 VSS_61 F31
1/UART9_TX_M2/PWM11_IR_M3/SPI0_CS1_M3/GPIO3_D5_d
o.
VSS_271 AB29 PCIE30_PORT0_RX1P F32
GMAC0_PPSTRING/FSPI_CS1N_M1/HDMI_TX1_SCL_M0/I2C4_ AB30 PCIE30_PORT0_RX1N F33
SCL_M1/UART7_TX_M0/GPIO2_B5_u
GMAC0_PTP_REFCLK/FSPI_CS0N_M1/HDMI_TX1_SDA_M0/I2C AB31 DDR_CH0_DQ6_B G1
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4_SDA_M1/UART7_RX_M0/GPIO2_B4_u
VSS_272 AB32 DDR_CH0_DQ5_B G2
GMAC0_MDIO/I2C0_SCL_M1/UART9_CTSN_M0/PWM6_M2/SPI AB33 VSS_62 G3
3_MOSI_M0/GPIO4_C5_d
GMAC0_MDC/I2C7_SDA_M1/UART9_RTSN_M0/PWM5_M2/SPI3 AB34 DDR_CH0_DM0_B G4
_MISO_M0/GPIO4_C4_d
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DDR_CH0_DQ10_A AC1 VSS_63 G6
DDR_CH0_DQ11_A AC2 DDR_CH1_ZQ_C G8
VSS_273 AC3 DDR_CH1_WCK0P_C G9
VSS_274 AC4 VSS_64 G10
lo
AVSS_21 AC5 DDR_CH1_LP4/4X_CS0_C G11
HDMI/eDP_TX0_VDD_CMN_1V8 AC6 DDR_CH1_A0_C G12
HDMI/eDP_TX0_VDD_IO_1V8 AC7 DDR_CH1_A2_D G13
AVSS_22 AC8 DDR_CH1_A1_D G14
no
td
_RTSN_M1/SPI4_CS1_M1/GPIO3_A4_d
GMAC1_TXEN/I2S2_SCLK_M1/CAN1_RX_M0/UART3_TX_M1/P AD29 DDR_CH0_DQS0N_B J7
WM12_M0/GPIO3_B5_u
ETH0_REFCLKO_25M/I2S2_SDI_M0/I2C6_SCL_M2/SPI1_CS0_ AD30 DDR_CH0_DQS0P_B J8
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M0/GPIO2_C3_d
GMAC0_RXD1/I2C6_SDA_M2/UART9_TX_M0/SPI1_MOSI_M0/ AD31 VSS_84 J10
GPIO2_C2_d
GMAC0_RXD0/I2C2_SCL_M1/UART1_CTSN_M0/SPI1_MISO_M AD32 VSS_85 J11
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0/GPIO2_C1_d
GMAC0_TXD0/I2S2_MCLK_M0/I2C5_SCL_M4/UART1_RX_M0/G AD33 VSS_86 J12
PIO2_B6_d
GMAC0_TXD1/I2S2_SCLK_M0/I2C5_SDA_M4/UART1_TX_M0/G AD34 VSS_87 J13
C
PIO2_B7_d
SDMMC_CLK/PDM1_CLK0_M0/TEST_CLKOUT_M0/MCU_JTAG_T AE1 VSS_88 J14
MS_M0/CAN0_RX_M1/UART5_TX_M0/GPIO4_D5_d
SDMMC_CMD/PDM1_CLK1_M0/MCU_JTAG_TCK_M0/CAN0_TX_ AE2 VSS_89 J15
M1/UART5_RX_M0/PWM7_IR_M1/GPIO4_D4_u
VSS_290 AE3 VSS_90
gy J16
HDMI_RX_VPH3V3 AE4 VSS_91 J18
HDMI_RX_DVDD3V3 AE5 VSS_92 J19
AVSS_27 AE6 VSS_93 J20
AVSS_28 AE7 VSS_94 J21
lo
HDMI_RX_AVDD0V75 AE8 VSS_95 J22
AVSS_29 AE9 VSS_96 J23
VSS_291 AE11 VSS_97 J24
VSS_292 AE12 VSS_98 J25
no
_M1/PWM13_M0/GPIO3_B6_d
CLK32K_OUT1/GPIO2_C5_d AE30 VSS_101 K8
GMAC0_RXDV_CRS/UART7_RTSN_M0/PWM2_M2/SPI3_CS0_M AE31 VSS_102 K9
0/GPIO4_C2_d
GMAC0_RXCLK/SDIO_D2_M0/FSPI_D2_M1/I2C8_SCL_M1/UAR AE32 DDR_CH1_VDDQ_0 K11
T6_RTSN_M0/GPIO2_B0_u
H
td
HDMI_TX0_SBDP/eDP_TX0_AUXP AG2 DDR_CH1_VDD_1 L12
AVSS_40 AG3 DDR_CH1_VDD_2 L13
HDMI_RX_D0N AG4 DDR_CH1_VDD_3 L14
HDMI_RX_D0P AG5 DDR_CH1_PLL_DVDD L15
,L
AVSS_41 AG6 DDR_CH1_PLL_AVSS L16
AVSS_42 AG7 DDR_CH1_VDD_MIF_0 L17
USB20_HOST0_REXT AG9 DDR_CH1_VDD_MIF_1 L18
AVSS_43 AG10 VSS_110 L19
o.
USB20_AVDD_1V8 AG11 VSS_111 L20
AVSS_44 AG12 VSS_112 L21
TYPEC1_DP1_VDDH_1V8 AG13 VSS_113 L22
TYPEC0_DP0_VDDH_1V8 AG14 VDD_CPU_BIG1_8 L23
C
AVSS_45 AG15 VDD_CPU_BIG1_1 L24
TYPEC1_DP1_REXT AG16 VSS_114 L25
AVSS_46 AG18 AVSS_10 L26
MIPI_D/C_PHY1_VDD AG19 PCIE20_SATA30_1_AVDD_1V8 L27
MIPI_D/C_PHY0_VDD AG20 PCIE20_SATA30_1_AVDD_0V85 L28
gy
AVSS_47 AG21 SPI2_MISO_M2/I2C0_SCL_M0/GPIO0_B3_z L29
AVSS_48 AG22 SPI2_CS1_M2/I2C1_SCL_M1/UART0_RX_M1/GPIO0_B0_ L30
z
CIF_D13/PCIE20X1_2_PERSTN_M0/HDMI_RX_CEC_M1/UART4 AG23 AVSS_11 L31
_TX_M1/PWM9_M2/SPI0_MISO_M3/GPIO3_D1_d
lo
CIF_D15/PCIE30X2_WAKEN_M2/HDMI_RX_SDA_M1/I2C7_SDA AG24 PCIE20_0_REFCLKP L32
_M2/UART9_CTSN_M2/PWM10_M2/SPI0_CLK_M3/GPIO3_D3_
d
no
td
TYPEC1_DP1_VDDA_0V85 AJ13 VDD_CPU_BIG0_8 N17
TYPEC0_DP0_VDD_0V85 AJ14 VSS_130 N18
AVSS_63 AJ15 VDD_CPU_BIG0_MEM_1 N19
AVSS_64 AJ16 VSS_131 N20
,L
AVSS_65 AJ18 VDD_CPU_BIG1_MEM_1 N21
MIPI_D/C_PHY1_VDD_1V8 AJ19 VSS_132 N22
MIPI_D/C_PHY0_VDD_1V8 AJ20 VDD_CPU_BIG1_6 N23
AVSS_66 AJ21 VDD_CPU_BIG1_3 N24
o.
AVSS_67 AJ22 VSS_133 N25
AVSS_68 AJ23 VSS_134 N26
CIF_D11/PCIE20X1_2_CLKREQN_M0/HDMI_TX0_SCL_M2/I2C5 AJ24 OSC_1V8 N27
_SCL_M0/SPI3_MOSI_M3/GPIO3_C7_u
C
BT1120_D14/PCIE20X1_2_WAKEN_M1/HDMI_TX0_SDA_M0/I2 AJ25 PMUIO1_1V8 N28
C8_SCL_M3/SPI3_CS0_M1/GPIO4_C0_u
BT1120_D11/PCIE30X4_WAKEN_M1/HDMI_RX_CEC_M0/SATA1 AJ26 VSS_135 N29
_ACT_LED_M0/UART9_RX_M1/PWM12_M1/SPI3_MISO_M1/GPI
O4_B5_d
BT1120_D12/PCIE30X4_PERSTN_M1/HDMI_RX_HPDIN_M0/SA AJ27
gy
SPI2_MOSI_M2/I2C0_SDA_M0/GPIO0_A6_z N30
TA0_ACT_LED_M0/I2C5_SCL_M1/PWM13_M1/SPI3_MOSI_M1/
GPIO4_B6_d
BT1120_D13/PCIE20X1_2_CLKREQN_M1/HDMI_TX0_SCL_M0/I AJ28 SPI2_CLK_M2/SDMMC_PWREN/PMU_DEBUG/GPIO0_A5_ N31
2C5_SDA_M1/SPI3_CLK_M1/GPIO4_B7_u d
lo
VSS_313 AJ30 AVSS_14 N32
MIPI_CSI1_CLK0P AJ31 PCIE20_0_RXP/SATA30_0_RXP N33
MIPI_CSI1_CLK0N AJ32 PCIE20_0_RXN/SATA30_0_RXN N34
MIPI_CSI0_CLK0P AJ33 VSS_136 P1
no
td
MIPI_DPHY1_RX_D1N/MIPI_CPHY1_RX_TRIO0_C AL19 VSS_162 R21
MIPI_DPHY1_RX_CLKN/MIPI_CPHY1_RX_TRIO1_B AL20 VSS_163 R22
MIPI_DPHY1_RX_D2N/MIPI_CPHY1_RX_TRIO2_A AL21 VSS_164 R23
MIPI_DPHY1_RX_D3N/MIPI_CPHY1_RX_TRIO2_C AL22 VSS_165 R24
,L
AVSS_83 AL23 VSS_166 R25
MIPI_CAMERA0_CLK_M0/SPDIF1_TX_M1/I2S1_SDO0_M0/PCIE AL24 VSS_167 R26
30X1_0_BUTTON_RSTN/SATA2_ACT_LED_M0/I2C6_SCL_M3/U
ART8_RX_M0/SPI0_CS1_M1/GPIO4_B1_u
o.
VSS_316 AL25 PMUIO2_1V8 R27
CIF_CLKOUT/BT1120_D10/I2S1_SDO3_M0/PCIE30X4_CLKREQ AL26 VSS_168 R28
N_M1/DP0_HPDIN_M0/SPDIF0_TX_M1/UART9_TX_M1/PWM11
_IR_M1/GPIO4_B4_u
C
CIF_D6/BT1120_D6/I2S1_SDI1_M0/PCIE30X2_CLKREQN_M1/I AL27 I2S1_SCLK_M1/JTAG_TMS_M2/I2C1_SDA_M0/UART2_R R29
2C5_SCL_M2/UART3_RX_M2/SPI2_CLK_M1/GPIO4_A6_d X_M0/PCIE30X1_1_WAKEN_M0/GPIO0_B6_d
CIF_D4/BT1120_D4/PCIE30X1_0_WAKEN_M1/I2C3_SCL_M2/U AL28 PDM0_CLK1_M1/PWM2_M0/UART0_RX_M0/I2C4_SDA_M R30
ART0_RX_M2/SPI2_MISO_M1/GPIO4_A4_d 2/DP0_HPDIN_M1/PCIE30X1_0_WAKEN_M0/GPIO0_C4_
d
CIF_D3/BT1120_D3/PCIE30X1_0_CLKREQN_M1/UART0_TX_M AL29
gy
PMIC_SLEEP2/GPIO0_A3_d R31
2/GPIO4_A3_d
CIF_D1/BT1120_D1/I2S1_SCLK_M0/PCIE30X1_1_WAKEN_M1/ AL30 PMIC_SLEEP1/GPIO0_A2_d R32
UART9_CTSN_M1/SPI0_MOSI_M1/GPIO4_A1_d
MIPI_CSI1_D3P AL31 VSS_169 R33
lo
MIPI_CSI1_D3N AL32 XIN_24M R34
MIPI_CSI0_D3P AL33 DDR_CH0_DQ2_A T1
MIPI_CSI0_D3N AL34 DDR_CH0_DQ1_A T2
HDMI/eDP_TX0_REXT AM2 VSS_170 T3
no
td
MIPI_DPHY0_TX_D3P/NO_USE AN28 LITCPU_AVS/SPI3_CLK_M2/GPIO0_D3_u U33
MIPI_DPHY0_RX_D0P/MIPI_CPHY0_RX_TRIO0_B AN29 VSS_196 U34
HDMI_TX1_D3N/eDP_TX1_D3N AN3 DDR_CH0_DQ6_A V1
MIPI_DPHY0_RX_D1P/MIPI_CPHY0_RX_TRIO1_A AN30 DDR_CH0_DQ5_A V2
,L
AVSS_97 AN31 VSS_197 V3
MIPI_DPHY0_RX_CLKP/MIPI_CPHY0_RX_TRIO1_C AN32 VSS_198 V4
MIPI_DPHY0_RX_D2P/MIPI_CPHY0_RX_TRIO2_B AN33 VSS_199 V5
MIPI_DPHY0_RX_D3P/NO_USE AN34 DDR_CH0_WCK0N_A V6
o.
AVSS_98 AP1 DDR_CH0_WCK0P_A V7
HDMI_TX1_D0N/eDP_TX1_D0N AP4 VSS_200 V8
HDMI_TX1_D2N/eDP_TX1_D2N AP6 VSS_201 V9
TYPEC1_USB20_OTG1_REXT AP7 VSS_202 V10
C
TYPEC1_SSRX1N/DP1_TX0N AP8 VSS_203 V11
TYPEC1_SSTX1P/DP1_TX1P AP9 VDD_VDENC_MEM_0 V12
TYPEC1_SSRX2N/DP1_TX2N AP10 VDD_VDENC_MEM_1 V13
TYPEC1_SSTX2P/DP1_TX3P AP11 VDD_VDENC_3 V14
TYPEC0_USB20_OTG0_REXT AP12 VSS_204
gy V15
TYPEC0_SSRX1N/DP0_TX0N AP13 VDD_LOGIC_6 V16
TYPEC0_SSTX1P/DP0_TX1P AP14 VDD_LOGIC_7 V17
TYPEC0_SSRX2N/DP0_TX2N AP15 VSS_205 V18
TYPEC0_SSTX2P/DP0_TX3P AP16 VSS_206 V19
lo
AVSS_99 AP17 PLL_DVDD0V75 V20
MIPI_DPHY1_TX_D0N/MIPI_CPHY1_TX_TRIO0_A AP18 VDD_CPU_LIT_6 V21
MIPI_DPHY1_TX_D1N/MIPI_CPHY1_TX_TRIO0_C AP19 VDD_CPU_LIT_1 V22
HDMI_TX1_SBDN/eDP_TX1_AUXN AP2 VSS_207 V23
no
X_M1/HDMI_TX0_SCL_M1/SPI3_CS1_M2/SATA_MP_SWI
TCH/GPIO0_D5_u
MIPI_DPHY0_TX_D1N/MIPI_CPHY0_TX_TRIO0_C AP25 I2S1_SDO2_M1/PDM0_SDI2_M1/PWM3_IR_M0/I2C1_SC V29
L_M2/CAN2_RX_M1/HDMI_TX0_SDA_M1/SPI3_CS0_M2/
PCIE30X2_PERSTN_M0/SATA_CPDET/GPIO0_D4_u
Te
DDR_CH1_DQ15_C B4 DDR_CH0_ZQ_A W8
DDR_CH1_DQ13_C B5 VSS_216 W9
VSS_5 B6 VSS_217 W10
DDR_CH1_DQ5_C B7 VSS_218 W11
DDR_CH1_DQ7_C B8 VSS_219 W12
DDR_CH1_DQ1_C B9 VDD_VDENC_5 W13
DDR_CH1_DQ3_C B10 VDD_VDENC_4 W14
DDR_CH1_A5_C B11 VSS_220 W15
DDR_CH1_CK_C B12 VSS_221 W16
DDR_CH1_CK_D B13 VSS_222 W17
DDR_CH1_A5_D B14 VSS_223 W18
DDR_CH1_DQ3_D B15 VSS_224 W19
DDR_CH1_DQ1_D B16 VSS_225 W20
DDR_CH1_DQ7_D B17 VDD_CPU_LIT_5 W21
td
DDR_CH0_DQ10_B C2 VSS_231 Y6
VSS_10 C3 VCCIO2 Y7
VSS_11 C4 VSS_232 Y8
VSS_17 C10 VSS_233 Y9
,L
VSS_18 C11 VSS_234 Y10
VSS_19 C12 VSS_235 Y11
VSS_20 C13 VSS_236 Y12
VSS_21 C14 VSS_237 Y13
o.
VSS_22 C15 VSS_238 Y14
VSS_23 C16 VSS_239 Y15
VSS_24 C17 VSS_240 Y16
VSS_25 C18 VSS_241 Y17
C
DDR_CH1_RESET_D C19 VSS_242 Y18
VSS_26 C20 VSS_243 Y19
VSS_27 C21 VSS_244 Y20
VSS_28 C22 VDD_CPU_LIT_4 Y21
VSS_29 C23 VDD_CPU_LIT_3 Y22
HDMI_TX1_HPD_M0/SPI2_CLK_M0/GPIO1_A6_d C24 VSS_245
gy Y23
PDM1_SDI0_M1/PCIE30X1_1_PERSTN_M2/PWM3_IR_M3/SPI2 C25 VSS_246 Y24
_CS0_M0/GPIO1_A7_u
VSS_30 C26 VCCIO3_1V8 Y26
PDM1_SDI1_M1/PCIE30X4_CLKREQN_M3/SPI2_CS1_M0/GPIO C27 GMAC1_PPSCLK/PCIE30X2_BUTTON_RSTN/UART7_RX_ Y27
lo
1_B0_u M1/SPI1_CLK_M1/GPIO3_C1_d
VSS_31 C28 VSS_247 Y28
PCIE30_PORT1_TX1P C29 GMAC1_PPSTRIG/I2C3_SDA_M1/UART7_TX_M1/SPI1_M Y29
ISO_M1/GPIO3_C0_d
no
td
Supply voltage for NPU VDD_NPU -0.3 1.1 V
Supply voltage for NPU memory VDD_NPU_MEM -0.3 1.1 V
Supply voltage for VCODEC VDD_VDENC -0.3 0.95 V
,L
Supply voltage for VCODEC memory VDD_VDENC_MEM -0.3 0.95 V
Supply voltage for core logic VDD_LOGIC -0.3 0.95 V
o.
PMU_0V75
PLL_DVDD0V75
USB20_DVDD_0V75
C
HDMI/eDP_TX0_VDD_0V75
HDMI/eDP_TX0_AVDD_0V75
HDMI/eDP_TX1_VDD_0V75
0.75V supply voltage HDMI/eDP_TX1_AVDD_0V75 -0.3 0.95 V
gy
HDMI_RX_AVDD0V75
MIPI_CSI0_AVCC0V75
MIPI_CSI1_AVCC0V75
PCIE30_PORT0_AVDD0V75
lo
PCIE30_PORT1_AVDD0V75
OTP_VDDOTP_0V75
DDR_CH0_VDD
DDR_CH0_VDD_MIF
no
DDR_CH0_PLL_DVDD
DDR_CH1_VDD
DDR_CH1_VDD_MIF
DDR_CH1_PLL_DVDD
ch
TYPEC0_DP0_VDD_0V85
0.85V supply voltage TYPEC0_DP0_VDDA_0V85 -0.3 1.00 V
TYPEC1_DP1_VDD_0V85
TYPEC1_DP1_VDDA_0V85
Te
MIPI_D/C_PHY0_VDD
MIPI_D/C_PHY1_VDD
PCIE20_SATA30_0_AVDD_0V85
PCIE20_SATA30_1_AVDD_0V85
PCIE20_SATA30_USB30_2_AVDD_0V85
MIPI_D/C_PHY0_VDD_1V2
1.2V supply voltage -0.3 1.35 V
YY
MIPI_D/C_PHY1_VDD_1V2
DDR_CH0_PLL_AVDD1V8
DDR_CH1_PLL_AVDD1V8
PLL_AVDD1V8
USB20_AVDD_1V8
H
TYPEC0_DP0_VDDH_1V8
TYPEC1_DP1_VDDH_1V8
HDMI/eDP_TX0_VDD_CMN_1V8
HDMI/eDP_TX0_VDD_IO_1V8
1.8V supply voltage -0.5 1.98 V
HDMI/eDP_TX1_VDD_CMN_1V8
HDMI/eDP_TX1_VDD_IO_1V8
MIPI_CSI0_AVCC1V8
MIPI_CSI1_AVCC1V8
MIPI_D/C_PHY0_VDD_1V8
MIPI_D/C_PHY1_VDD_1V8
PCIE20_SATA30_0_AVDD_1V8
PCIE20_SATA30_1_AVDD_1V8
td
DDR_CH1_VDDQ_CK
Supply voltage for DDR IO DDR_CH0_VDDQ_CKE
-0.3 1.25 V
(LPDDR4/4X 1.1V; LPDDR5 1.05V) DDR_CH1_VDDQ_CKE
℃
,L
Storage Temperature Tstg -40 125
Max Conjunction Temperature Tj NA 125 ℃
o.
3.2 Recommended Operating Condition
C
Following table describes the recommended operating condition.
Table 3-2 Recommended operating condition
Parameters Symbol Min Typ Max Unit
gy
Voltage for CPU BigCore 0 VDD_CPU_BIG0 0.55 0.75 1.05 V
Voltage for CPU BigCore 0
VDD_CPU_BIG0_MEM 0.675 0.75 1.05 V
Memory
lo
Voltage for CPU BigCore 1 VDD_CPU_BIG1 0.55 0.75 1.05 V
Voltage for CPU BigCore 1
VDD_CPU_BIG1_MEM 0.675 0.75 1.05 V
Memory
no
only) VCCIO3_1V8
PMUIO2_1V8, VCCIO2_1V8,
Digital GPIO Power 2.7 3.3 3.6
VCCIO4_1V8, VCCIO5_1V8, V
(3.3V/1.8V) 1.65 1.8 1.95
VCCIO6_1V8
eMMC IO Power (1.8V) EMMCIO_1V8 1.65 1.8 1.95 V
DDR_CH0_VDD, DDR_CH0_VDD_MIF,
DDR CH0 Logic power(0.85V) 0.675 0.85 0.935 V
DDR_CH1_VDD, DDR_CH1_VDD_MIF,
DDR_CH0_PLL_DVDD,
DDR CH0_PLL power(0.85V) 0.675 0.85 0.8925 V
DDR_CH1_PLL_DVDD
DDR_CH0_PLL_AVDD1V8,
DDR CH0_PLL power(1.8V) 1.62 1.8 1.98 V
DDR_CH1_PLL_AVDD1V8
td
TYPEC1_DP1_VDDA_0V85
USB & DP Analog Power TYPEC0_DP0_VDDH_1V8,
1.71 1.8 1.89 V
(1.8V) TYPEC1_DP1_VDDH_1V8
,L
PCIE20_SATA30_0_AVDD_0V85,
Combo PIPE PHY Analog
PCIE20_SATA30_1_AVDD_0V85, 0.8 0.85 0.935 V
Power(0.85V)
PCIE20_SATA30_USB30_2_AVDD_0V85
PCIE20_SATA30_0_AVDD_1V8,
o.
Combo PIPE PHY Analog
PCIE20_SATA30_1_AVDD_1V8, 1.62 1.8 1.98 V
Power(1.8V)
PCIE20_SATA30_USB30_2_AVDD_1V8
PCIE30_PORT0_AVDD0V75,
PCIe30 Analog Power(0.75V) 0.7125 0.75 0.8925 V
C
PCIE30_PORT1_AVDD0V75
PCIE30_PORT0_AVDD1V8,
PCIe30 Analog Power(1.8V) 1.71 1.8 1.89 V
PCIE30_PORT1_AVDD1V8
MIPI CSI DPHY Analog MIPI_CSI0_AVCC0V75,
0.675 0.75 0.825 V
Power(0.75V) MIPI_CSI1_AVCC0V75
gy
MIPI CSI DPHY Analog MIPI_CSI0_AVCC1V8,
1.62 1.8 1.98 V
Power(1.8V) MIPI_CSI1_AVCC1V8
MIPI DCPHY Analog Power MIPI_D/C_PHY0_VDD,
0.7125 0.85 0.8925 V
lo
(0.85V) MIPI_D/C_PHY1_VDD
MIPI DCPHY Analog Power MIPI_D/C_PHY0_VDD_1V2,
1.14 1.2 1.26 V
(1.2V) MIPI_D/C_PHY1_VDD_1V2
no
3.3 DC Characteristics
Table 3-3 DC Characteristics
Parameters Symbol Min Typ Max Unit
Input Low Voltage VIL VSS NA 0.3*VDDO V
Input High Voltage VIH 0.7*VDDO NA VDDO V
Digital Output Low Voltage VOL VSS NA 0.25*DVDD V
3.3V/1.8V GPIO
@3.3V Output High Voltage VOH 0.75*DVDD NA DVDD V
Pullup Resistor RRPU 10 NA 100 Kohm
Pulldown Resistor RRPD 10 NA 100 Kohm
Input Low Voltage VIL VSS NA 0.3*VDDO V
Input High Voltage VIH 0.7*VDDO NA VDDO V
Digital Output Low Voltage VOL VSS NA 0.25*DVDD V
3.3V/1.8V GPIO
@1.8V Output High Voltage VOH 0.75*DVDD NA DVDD V
Pullup Resistor RRPU 10 NA 50 Kohm
Pulldown Resistor RRPD 10 NA 50 Kohm
Input Low Voltage VIL VSS NA 0.3*VDDO
td
V
Input High Voltage VIH 0.7*VDDO NA VDDO V
Digital 1.8V only Output Low Voltage VOL VSS NA 0.25*DVDD V
,L
GPIO
@1.8V Output High Voltage VOH 0.75*DVDD NA DVDD V
Pullup Resistor RRPU 10 NA 50 Kohm
o.
Pulldown Resistor RRPD 10 NA 50 Kohm
Input Low Voltage VIL VSS NA 0.35*DVDD V
Input High Voltage VIH 0.65*DVDD NA DVDD V
C
eMMC IO Output Low Voltage VOL VSS NA 0.45 V
@1.8V Output High Voltage VOH DVDD-0.45 NA DVDD V
Pullup Resistor RRPU
gy 10 NA 50 Kohm
Pulldown Resistor RRPD 10 NA 50 Kohm
Input Low Voltage VIL NA NA Vref-0.14 V
lo
Input High Voltage VIH Vref+0.14 NA NA V
Output Log Voltage VOL NA NA 0.2 V
DDR IO Output High Voltage VOH 0.25 NA NA V
no
Room/Hot
Input Low Current IIL -100/-500 NA 100/500
uA
Room/Hot
Input High Current IIH -100/-500 NA 100/500
uA
ch
td
Parameters Symbol Test condition Min Typ Max Unit
Input clock frequency FFIN 4.5 - 300 MHz
Reference frequency(FFIN/p) FFREE 4.5 7 12 MHz
,L
Frequency of PLL’s output FFOUT 35.2 - 4500 MHz
Frequency of VCO’s output FFVCO 2250 - 4500 MHz
Measured at all FFIN and FFOUT range.
o.
Lock time TLT - - 150 Cycles
RESETB=High
C
Parameters Symbol Test condition Min Typ Max Unit
Input clock frequency FFIN 6 - 300 MHz
Reference frequency(FFIN/p) FFREE 6 20 30 MHz
gy
Frequency of PLL’s output FFOUT 35.2 - 4500 MHz
Frequency of VCO’s output FFVCO 2250 - 4500 MHz
Measured at all FFIN and FFOUT range.
Lock time TLT - - 500 Cycles
lo
RESETB=High
Notes:
① p is the input divider value
td
Logic0 input voltage, not in
VIL All conditions NA NA 550 mV
ULPS state
Duration for which the NA NA 100 us
Tskewcal transmitter drives the skew-
,L
>1.5Gbps
(initial) calibration pattern in the initial 2^15 NA NA UI
Skew skew calibration mode
Calibration Duration for which the NA NA 10 us
o.
Tskewcal transmitter drives the skew- >1.5Gbps
(periodic) calibration pattern in the (optional) 2^13 NA NA UI
periodic skew calibration mode
C
3.8 Electrical Characteristics for MIPI CSI DPHY interface
Table 3-10 Electrical Characteristics for MIPI CSI DPHY interface
gy
Parameters Symbol Min Typ Max Units
NA NA 100 mV
Common-mode interference beyond 450 MHz ΔVCMRX(HF)
NA NA 50 mV
lo
-50 NA 50 mV
Common-mode interference 50MHz-450MHz ΔVCMRX(LF)
-25 NA 25 mV
Common-mode termination CCM NA NA 60 pF
no
td
,L
o.
C
gy
lo
no
ch
Te
YY
H