Dell PowerEdge R860

Technical Guide

Regulatory Model: E85S Series

Regulatory Type: E85S001
December 2023
Rev. A03
Notes, cautions, and warnings

NOTE: A NOTE indicates important information that helps you make better use of your product.

CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid
the problem.

WARNING: A WARNING indicates a potential for property damage, personal injury, or death.

© 2023 Dell Inc. or its subsidiaries. All rights reserved. Dell Technologies, Dell, and other trademarks are trademarks of Dell Inc. or its
subsidiaries. Other trademarks may be trademarks of their respective owners.
 Contents

Chapter 1: Dell PowerEdge R860 system overview........................................................................ 5

Key workloads...................................................................................................................................................................... 5
New technologies................................................................................................................................................................ 5

Chapter 2: System features and generational comparison............................................................. 7

Chapter 3: Chassis views and features.........................................................................................10

Front view of the system.................................................................................................................................................10
Rear view of the system................................................................................................................................................... 11
Inside the system............................................................................................................................................................... 12
Quick Resource Locator................................................................................................................................................... 18

Chapter 4: Processor.................................................................................................................. 20
Processor features .......................................................................................................................................................... 20
Supported processors................................................................................................................................................ 20

Chapter 5: Memory subsystem.....................................................................................................21

Supported memory............................................................................................................................................................ 21

Chapter 6: Storage...................................................................................................................... 22
Storage controllers........................................................................................................................................................... 22
Supported Drives...............................................................................................................................................................22
Internal storage configuration........................................................................................................................................ 23
External Storage................................................................................................................................................................ 23

Chapter 7: Networking................................................................................................................ 24
Overview............................................................................................................................................................................. 24
OCP 3.0 support................................................................................................................................................................24
Supported OCP cards................................................................................................................................................ 24
OCP NIC 3.0 vs. rack Network Daughter Card comparisons........................................................................... 25

Chapter 8: PCIe subsystem......................................................................................................... 26

PCIe risers...........................................................................................................................................................................26

Chapter 9: Power, thermal, and acoustics................................................................................... 32

Power................................................................................................................................................................................... 32
Power Supply Units.....................................................................................................................................................33
Thermal................................................................................................................................................................................ 34
Thermal design............................................................................................................................................................. 34
Acoustics............................................................................................................................................................................. 35
Acoustical performance............................................................................................................................................. 35
PowerEdge acoustical specifications..................................................................................................................... 36

Contents 3
 Chapter 10: Rack, rails, and cable management........................................................................... 44
Rails and cable management information....................................................................................................................44

Chapter 11: Operating Systems and Virtualization....................................................................... 53

Supported operating systems........................................................................................................................................ 53

Chapter 12: Dell OpenManage Systems Management................................................................... 54

Integrated Dell Remote Access Controller (iDRAC)................................................................................................. 54
Systems Management software support matrix....................................................................................................... 55

Chapter 13: Appendix D: Service and support.............................................................................. 57

Default support levels.......................................................................................................................................................57
Default deployment levels......................................................................................................................................... 57
Other services and support information...................................................................................................................... 57
Dell deployment services........................................................................................................................................... 57
Dell custom deployment Services............................................................................................................................ 61
Dell Residency Services.............................................................................................................................................. 61
Dell Data Migration Services..................................................................................................................................... 61
Dell Enterprise Support Services.............................................................................................................................62
Enterprise connectivity.............................................................................................................................................. 64
Dell TechDirect............................................................................................................................................................ 65
Dell Technologies Consulting Services...................................................................................................................65

Chapter 14: Appendix A: Additional specifications....................................................................... 67

Chassis dimensions .......................................................................................................................................................... 67
Chassis weight................................................................................................................................................................... 68
NIC port specifications.................................................................................................................................................... 68
Video specifications.......................................................................................................................................................... 68
USB Ports........................................................................................................................................................................... 69
PSU rating........................................................................................................................................................................... 70
Environmental specifications...........................................................................................................................................71
Thermal restriction matrix......................................................................................................................................... 73
Thermal air restrictions.............................................................................................................................................. 76

Chapter 15: Appendix B. Standards compliance........................................................................... 78

Chapter 16: Appendix C Additional resources...............................................................................79

4 Contents
 1
Dell PowerEdge R860 system overview
The PowerEdge R860 system is a 2U server that supports:
● Up to 4 x 4 th Gen Intel® Xeon® Scalable Processors with up to 60 cores
● 64 DDR5 DIMM slots, supports maximum 16 TB
● Two AC or DC power supply units with 1+1 redundancy
● Up to 8 x 2.5-inch SAS/SATA (HDD/SSD) drives
● Up to 8 x EDSFF E3.S NVMe Gen5 (SSD) drives
● Up to 16 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) drives
● Up to 24 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) drives
● Up to 16 x 2.5-inch SAS/SATA (HDD/SSD) + 8 x 2.5-inch NVMe (SSD) drives
● Up to 24 x 2.5-inch SAS/SATA (HDD/SSD) + 2 x 2.5-inch (rear) SAS/SATA/NVMe (HDD/SSD) or 4 x EDSFF E3.S (rear)
NVMe Gen5 (SSD) drives
● PCI Express® (PCIe) 5.0 enabled expansion slots
● Network interface technologies to cover Network Interface Card (NIC)
NOTE: For more information about how to hot swap NVMe PCIe SSD U.2 device, see the Dell Express Flash NVMe
PCIe SSD User's Guide at [Link] > Browse all products > Infrastructure > Data Center
Infrastructure > Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Select This
Product > Documentation > Manuals and Documents.

NOTE: All instances of SAS, SATA, NVMe drives are referred to as drives in this document, unless specified otherwise.

CAUTION: Do not install GPUs, network cards, or other PCIe devices on your system that are not validated
and tested by Dell. Damage caused by unauthorized and invalidated hardware installation will null and void the
system warranty.

Topics:
• Key workloads
• New technologies

Key workloads
Customers looking for accelerated compute to maximize performance in a dense, scalable server architecture to address the
following applications:
● SAP/HANA, Oracle, SQL
● Database, ERP, CRM, batch
● Data warehouse, business intelligence
● Virtualization/VM and VDI
● AI, HPC and ML/DL

New technologies
Table 1. New technologies
Technology Detailed Description
4 th Generation Intel® Xeon® Scalable Processors Core count: Up to 60 core processor
UPI speed: Up to 4 links per CPU, speed: 12.8 GT/s, 14.4 GT/s,
16 GT/s

Dell PowerEdge R860 system overview 5

Table 1. New technologies (continued)
Technology Detailed Description
Maximum number of PCIe lanes per CPU: Integrated 80 PCIe
5.0 lanes @ 32 GT/s PCIe Gen5
Maximum TDP: 350 W
4800 MT/s DDR5 Memory Max 16 DIMM per processor and 64 DIMMs per system
Supports DDR5 ECC RDIMM
PCIe Gen Gen5 @32 GT/s
PCIe Slot Up to eight Gen5 (x16) slots
Flex I/O LOM board, 2 x1Gb with BCM5720 LAN controller (optional)
Rear I/O with:
● 1 x Dedicated iDRAC Ethernet port
● 1 x USB 3.0
● 1 x USB 2.0
● 1 x VGA port (optional for Direct Liquid Cooling
configuration)
Serial Port (option) with STD RIO board
OCP Mezz 3.0 (supported by x168 PCIe lanes) (optional)
Front I/O with:
● 1 x USB 2.0
● 1 x iDRAC Direct (Micro-AB USB) port
● 1 x VGA port
CPLD 1-wire Support payload data of Front PERC, Riser, BP, and Rear I/O
to BOSS N1 and iDRAC.
Dedicated PERC PERC 11
● H355, H755
PERC 12
● H965i, H965e
Software RAID OS RAID/S160
Power Supplies 60 mm dimension is the new PSU form factor on a 15G design.

Titanium 1100 W AC/HVDC

Platinum 1400 W AC/HVDC

Titanium 1800 W AC/HVDC

86 mm dimension PSU

Platinum 2400 W AC/HVDC

Titanium 2800 W AC/HVDC

6 Dell PowerEdge R860 system overview

 2
System features and generational
comparison
The following table shows the comparison between the PowerEdge R860 with the PowerEdge R840.

Table 2. Features comparison

Features PowerEdge R860 PowerEdge R840
Processors 4x 4 th
Gen Intel® Xeon® Scalable 4 x 2 nd Generation Intel® Xeon® Scalable Processor
Processors
Processor Intel Ultra Path Interconnect (UPI) Intel Ultra Path Interconnect (UPI)
interconnect
Memory ● 64 x DDR5 RDIMM ● 48 x DDR4 DIMM RDIMM /LRDIMM
● Up to 4800 MT/s (1 DPC) / 4400 MT/s ● 24 x PMem ( Intel Optane Persistent Memory)
(2 DPC) ● 12 x NVDIMM
Storage Controllers ● PERC 11G: H755, H355 ● PERC 9G: H330, H730p
● PERC 12G: H965i, H965e ● PERC 10G: H740p, H840
● HBA 11: HBA355i, HBA355e ● HBA 9: HBA330, 12 Gbps SAS HBA
● BOSS-N1 ● BOSS adapter
● Software RAID: S160 ● Software RAID: S140
● Internal Dual SD Module
Drive Bays Front bays: Front bays:
● 2.5 inches - 24 Gb SAS, 6 Gb SATA ● 2.5 inches - 24 Gb SAS, 6 Gb SATA
● 2.5 inches - Gen3/4 NVMe ● 2.5 inches - Gen3/4 NVMe
● EDSFF E3.S - NVMe Gen5
Rear bay:
Rear bay:
● 2.5 inches - 12 Gb SAS, 6 Gb SATA
● 2.5 inches - 24 Gb SAS, 6 Gb SATA,
Gen3/4 NVMe
● EDSFF E3.S - NVMe Gen5
Power Supplies ● AC (Platinum): 1400 W, 2400 W ● AC (Platinum): 750 W, 1100 W, 1600 W, 2000 W,
● AC (Titanium): 1100 W, 1800 W, 2800 W 2400 W
● AC (Titanium): 1600 W, 2600 W
● LVDC @-48 VDC Input: 1100 W
Cooling Options ● Air Cooling ● Air Cooling
● Optional Direct Liquid Cooling (DLC)
NOTE: DLC is a rack solution and requires
rack manifolds and a cooling distribution
unit (CDU) to operate.

Fans Standard (STD) fans Standard (STD) fans

Up to 6 sets (dual fan module) hot plug fans Up to six hot plug fans
Dimension Height: 86.8 mm (3.41 inches) Height: 86.8 mm (3.4 inches)
Width: 482 mm (18.97 inches) Width: 434.0 mm (17.08 inches)
Depth: 883.2 mm (34.77 inches) with bezel Depth: 879.8 mm (34.63 inches) with bezel

System features and generational comparison 7

Table 2. Features comparison (continued)
Features PowerEdge R860 PowerEdge R840
Depth: 869.2 mm (34.22 inches) without Depth: 865.9 mm (34.09 inches) without bezel
bezel
Form Factor 2U rack server 2U rack server
Embedded ● iDRAC9 ● iDRAC9
Management ● iDRAC Direct ● iDRAC Direct
● iDRAC RESTful API with Redfish ● Quick Sync 2 BLE/wireless module
● iDRAC Service Manual
● Quick Sync 2 wireless module
Bezel Optional LCD bezel or security bezel Optional LCD bezel or security bezel
OpenManage ● CloudIQ for PowerEdge plug-in ● OpenManage Enterprise
Software ● OpenManage Enterprise ● OpenManage Power Center
● OpenManage Enterprise Integration for
VMware vCenter
● OpenManage Integration for Microsoft
System Center
● OpenManage Integration with Windows
Admin Center
● OpenManage Power Manager plug-in
● OpenManage Services plug-in
● OpenManage Update Manager plug-in
Mobility OpenManage Mobile OpenManage Mobile
Integrations and OpenManage Integrations OpenManage OpenManage Connections
Connections ● BMC Truesight Integrations ● IBM Tivoli Netcool/
● Microsoft System Center ● BMC Truesight ® OMNIbus
● OpenManage Integration with ServiceNow ● Microsoft System ● Micro Focus Operations
● Red Hat Ansible Modules Center Manager
● Terraform Providers ● Red Hat Ansible ● Nagios® Core and
Modules Nagios® XI
● VMware vCenter and vRealize Operations
Manager ● VMware vCenter

Security ● Cryptographically signed firmware ● Cryptographically signed firmware

● Data at Rest Encryption (SEDs with local ● Secure Boot
or external key mgmt) ● Secure Erase
● Secure Boot ● Silicon Root of Trust
● Secured Component Verification ● System Lockdown (requires iDRAC9 Enterprise or
(Hardware integrity check) Datacenter)
● Secure Erase ● TPM 1.2/2.0, TCM 2.0 optional
● Silicon Root of Trust
● System Lockdown (requires iDRAC9
Enterprise or Datacenter)
● TPM 2.0 FIPS, CC-TCG certified, TPM 2.0
China NationZ
Embedded NIC 2 x 1GbE LOM card (optional) 4 x 1GbE Network Daughter Card (optional)
Networking Options OCP x16 (optional) Mezz 3.0 N/A
NOTE: The system allows either LOM
card or OCP card or both to be installed
in the system.

GPU Options N/A Up to 2 double width GPUs or up to 2 full height

FPGAs
Ports Front Ports Rear Ports Front Ports Rear Ports

8 System features and generational comparison

Table 2. Features comparison (continued)
Features PowerEdge R860 PowerEdge R840
● 1 x USB 2.0 ● 1 x USB 2.0 ● 2 x USB 2.0 ● 2 x USB 3.0
● 1 x VGA ● 1 x iDRAC Direct/ ● 1 x USB 3.0 ● 1 x iDRAC Direct/
● 1 x Dedicated Ethernet port (optional) Ethernet port
iDRAC micro-USB ● 1 x USB 3.0 ● 1 x VGA ● 1 x Serial port (optional)
● 1 x Serial port ● 1 x Dedicated ● 1 x VGA
(optional) iDRAC micro-USB
● 1 x VGA (optional
for liquid cooling
configuration)
Internal Port: 1 x USB 3.0 Internal Port: 1 x USB 3.0
PCIe Up to 8 x PCIe slots Up to 6 x PCIe Gen3 slots
● 8 x PCIe Gen5 slots
● 4 x PCIe Gen4 slots
Operating System and ● Canonical Ubuntu Server LTS ● Canonical Ubuntu Server LTS
Hypervisors ● Microsoft Windows Server with Hyper-V ● Citrix Hypervisor
● Red Hat Enterprise Linux ● Microsoft Windows Server LTSC with Hyper-V
● SUSE Linux Enterprise Server ● Red Hat Enterprise Linux
● VMware ESXi ● VMware ESXi
For specifications and interoperability details, For specifications and interoperability details, see Dell
see Dell Enterprise Operating Systems on Enterprise Operating Systems on Servers, Storage,
Servers, Storage, and Networking page at and Networking page at [Link]/OSsupport.
[Link]/OSsupport.

System features and generational comparison 9

 3
Chassis views and features
Topics:
• Front view of the system
• Rear view of the system
• Inside the system
• Quick Resource Locator

Front view of the system

Figure 1. Front view of 24 x 2.5-inch drive system

Figure 2. Front view of 16 x 2.5-inch drive system

Figure 3. Front view of 8 x 2.5-inch drive system

Figure 4. Front view of 8 x EDSFF E3.S drive system

10 Chassis views and features

Rear view of the system

Figure 5. Rear view of the system

Figure 6. Rear view of the system with 2 x 2.5-inch drive system

Figure 7. Rear view of the system with 4 x EDSFF E3.S drive system

Figure 8. Rear view of the system with Direct Liquid Cooling

Chassis views and features 11

Inside the system

Figure 9. Inside the system without risers

12 Chassis views and features

Figure 10. Inside the system without risers (PEM board installed)

Chassis views and features 13

Figure 11. Inside the system with risers

14 Chassis views and features

Figure 12. Inside the system with risers + rear 2 x 2.5-inch module

Chassis views and features 15

Figure 13. Inside the system with risers + rear 4 x EDSFF E3.S drive module

16 Chassis views and features

Figure 14. Inside the system with Direct Liquid Cooling module

Chassis views and features 17

Figure 15. Inside the system with Direct Liquid Cooling module (PEM board installed)

Quick Resource Locator

The QRL on everything (SILs, GSG, Installation and Service Manual except on the EST) is a generic QRL for R860 that leads to
a webpage for that product. That webpage has links for things like setup and service videos, iDRAC manual, and other things
that apply to the platform. The QRL on the EST is unique and specific to that service tag and will contain the Service Tag
number and the iDRAC password. The label and the QRL code within it are printed on demand at the L10 factories. This QRL
links to a webpage that shows the exact configuration as built for that customer, and the specific warranty purchased. It is one
click away from the same content of generic information that applies to R860 that is available in the other QRLs.

18 Chassis views and features

Figure 16. R860 Quick Resource Locator

Chassis views and features 19

 4
Processor
Topics:
• Processor features

Processor features
The 4 th Generation Intel ® Xeon ® Processors stack is the next generation data center processor offering with significant
performance increases, integrated acceleration, and next generation memory and I/O. Sapphire Rapids accelerate customer
usages with unique workload optimizations.
The following lists the features and functions that are in the 4 th Generation Intel ® Xeon ® Scalable Processor offering:
● Faster UPI with up to four Intel Ultra Path Interconnect (Intel UPI) at up to 16 GT/s, increasing multisocket bandwidth
● More, faster I/O with PCI Express 5 and up to 80 lanes (per socket)
● Enhanced Memory Performance with DDR5 support and memory speed up to 4800 MT/s in one DIMM per channel (1DPC)
and 4400 MT/s in two DIMM per channel (2DPC)
● New built-in accelerators for data analytics, networking, storage, crypto, and data compression

Supported processors
The following table shows the Intel Sapphire Rapids SKUs that are supported on the R8960.

Table 3. Supported Processors for R860

Processor Clock Cache UPI Cores Threads Turbo Memory Memory TDP
Speed (M) (GT/s) Speed Capacity
(GHz) (MT/s)
8490H 1 1.9 113 16 60 120 Turbo 4800 4 TB 350 W
8468H 1 2.1 105 16 48 96 Turbo 4800 4 TB 330 W
8460H 1 2.2 105 16 40 80 Turbo 4800 4 TB 330 W
8454H 1 2.1 83 16 32 64 Turbo 4800 4 TB 270 W
8450H 1 2 75 16 28 56 Turbo 4800 4 TB 250 W
8444H 1 2.9 45 16 16 32 Turbo 4800 4 TB 270 W
6448H 2.4 60 16 32 64 Turbo 4800 4 TB 250 W
6434H 3.7 23 16 8 16 Turbo 4800 4 TB 195 W
6418H 2.1 60 16 24 48 Turbo 4800 4 TB 185 W
6416H 2.2 45 16 18 36 Turbo 4800 4 TB 165 W

NOTE: Mixing of the processors in a 4S configurations is not recommended.

NOTE: 1 Only the processors that are listed above can support 96 GB RDIMM.

20 Processor
 5
Memory subsystem
Topics:
• Supported memory

Supported memory
Table 4. Memory technology comparison
Feature PowerEdge R860 (DDR5)
DIMM type RDIMM
Transfer speed 4800 MT/s (1DPC), 4400 MT/s ( 2DPC)
Voltage 1.1 V

Table 5. Supported memory matrix

DIMM type Rank Capacity DIMM rated Operating Speed
voltage and
speed 1 DIMM per 2 DIMMs per
channel (DPC) channel (DPC)
RDIMM 1R 16 GB DDR5 (1.1 V), 4800 4800 MT/s 4400 MT/s
MT/s
2R 32 GB, 64 GB DDR5 (1.1 V), 4800 4800 MT/s 4400 MT/s
MT/s
2R 96 GB DDR5 (1.1 V), 5600 4800 MT/s 4400 MT/s
MT/s
4R 128 GB DDR5 (1.1 V), 4800 4800 MT/s 4400 MT/s
MT/s
8R 256 GB DDR5 (1.1 V), 4800 4800 MT/s 4400 MT/s
MT/s

NOTE: The processor may reduce the performance of the rated DIMM speed.

NOTE: Only 8 or 16 DIMMs per processor are compatible with 96 GB RDIMMs.

NOTE: Few processors that are listed in the supported processors section support 96 GB RDIMM.

Memory subsystem 21
 6
Storage
Topics:
• Storage controllers
• Supported Drives
• Internal storage configuration
• External Storage

Storage controllers
Dell’s RAID controller options offer performance improvements, including the fPERC solution. fPERC provides a base RAID HW
controller without consuming a PCIe slot by using a small form factor and high-density connector to the base planar. 16G PERC
Controller offerings will be a heavy leverage of 15G PERC family. The Value and Value Performance levels will carry over to
16G from 15G. New to 16G, is the Harpoon-based Premium Performance tier offering. This high-end offering will drive IOPs
performance and enhanced SSD performance.

Table 6. PERC Series controller offerings

Performance Level Controller and Description
Entry S160
Value H355, HBA355 (internal/external)
Value Performance H755
Premium Performance H965 (internal/external)

NOTE: For more information on the features of the Dell PowerEdge RAID controllers (PERC), Software RAID
controllers, or BOSS card, and on deploying the cards, see the storage controller documentation at [Link]/
storagecontrollermanuals.

NOTE: From December 2021, H355 replaces H345 as the entry raid controller. H345 is deprecated in January 2022.

Supported Drives
The table that is shown below lists the internal drives that are supported by the R860.

Table 7. Supported drives

Form Factor Type Speed Rotational Capacities
Speed
2.5 inches vSAS 12 Gb SSD 1.92 TB, 3.84 TB, 960 GB, 7.62 TB
2.5 inches SAS 24 Gb SSD 1.92 TB, 1.6 TB, 800 GB, 3.84 TB, 960 GB, 7.68 TB
2.5 inches SATA 6 Gb SSD 1.92 TB, 480 GB, 960 GB, 3.84 TB
2.5 inches NVMe Gen4 SSD 1.6 TB, 3.2 TB, 6.4 TB, 1.92 TB, 3.84 TB, 15.63 TB, 7.68 TB, 800
GB, 400 GB
2.5 inches DC NVMe Gen4 SSD 3.84 TB, 960 GB
2.5 inches SAS 12 Gb 10 K 600 GB, 1.2 TB, 2.4 TB

22 Storage
Table 7. Supported drives (continued)
Form Factor Type Speed Rotational Capacities
Speed
EDSFF E3.S NVMe Gen5 SSD 3.84 TB, 7.68 TB

Internal storage configuration

R860 available internal storage configurations:
● 8 x 2.5-inch (SAS/SATA)
● 16 x 2.5-inch (SAS4/SATA)
● 16 x 2.5-inch (SAS4/SATA) + 8 x 2.5-inch NVMe
● 24 x 2.5-inch (SAS4/SATA)
● 24 x 2.5-inch (SAS4/SATA) + 2 x 2.5-inch (NVMe)
● 24 x 2.5-inch (SAS4/SATA) + 2 x 2.5-inch (SAS/SATA)
● 24 x 2.5-inch (SAS4/SATA) - Dual Controller
● 24 x 2.5-inch + 2 x 2.5-inch (SAS4/SATA) - Dual Controller
● 24 x 2.5-inch + 2 x 2.5-inch (SAS/SATA) - Dual Controller
● 24 x 2.5-inch (SAS4/SATA) + 4 x EDSFF E3.S NVMe Gen5
● 24 x 2.5-inch (NVMe) passive
● 16 x 2.5-inch (NVMe RAID)
● 8 x EDSFF E3.S (NVMe) Gen5

External Storage
The R860 support the external storage device types listed in the table below.

Table 8. Support external storage devices

Device Type Description
External Tape Supports connection to external USB tape products
NAS/IDM appliance software Supports NAS software stack
JBOD Supports connection to 12 Gb MD-series JBODs

Storage 23
 7
Networking
Topics:
• Overview
• OCP 3.0 support

Overview
PowerEdge offers a wide variety of options to get information moving to and from our servers. Industry best technologies are
chosen, and systems management features are added by our partners to firmware to tie in with iDRAC. These adapters are
rigorously validated for worry-free, fully supported use in Dell servers.

OCP 3.0 support

Table 9. OCP 3.0 feature list
Feature OCP 3.0
Form factor SFF
PCIe Gen Gen4
Max PCIe width x16
Max number of ports 4
Port type BT/SFP/SFP+/SFP28/SFP56/QSFP56
Max port speed 100 GbE
NC-SI Yes
SNAPI Yes
WoL Yes
Power consumption 15 W ~ 35 W

Supported OCP cards

Table 10. Supported OCP cards

Form factor Vendor Port type Port speed Port count
OCP 3.0 Broadcom SFP28 25 GbE 4
Broadcom SFP28 25 GbE 2
Intel SFP28 25 GbE 4
Intel SFP28 25 GbE 2
Broadcom BT 10 GbE 4
Broadcom SFP+ 10 GbE 2

24 Networking
Table 10. Supported OCP cards (continued)
Form factor Vendor Port type Port speed Port count
Broadcom BT 1 GbE 4
Intel SFP+ 1 GbE 4
Broadcom QSFP56 100 GbE 2
Mellanox QSFP56 100 GbE 2
Mellanox SFP28 25 GbE 2
Intel SFP+ 1 GbE 4
Intel SFP+ 10 GbE 4
Intel SFP+ 10 GbE 2

OCP NIC 3.0 vs. rack Network Daughter Card comparisons

Table 11. OCP 3.0, 2.0, and rNDC NIC comparison
Form Factor Dell rNDC OCP 2.0 (LOM Mezz) OCP 3.0 Notes
PCIe Gen Gen 3 Gen 3 Gen 4 Supported OCP3 are
SFF (small form factor)
Max PCIe Lanes x8 Up to x16 Up to x8 See server slot priority
matrix
Shared LOM Yes Yes Yes This is iDRAC port
redirect
Aux Power Yes Yes Yes Used for Shared LOM

Networking 25
 8
PCIe subsystem
Topics:
• PCIe risers

PCIe risers
Shown below are the riser offerings for the platform.

Figure 17. Riser connector location on system board and PEM board
1. Riser 4 slot 2. Riser 1 slot
3. Riser 2 cable slot 4. Riser 2 cable slot
5. Riser 4 cable slot 6. Riser 3 cable slot
7. Riser 3 cable slot 8. Riser 1 cable slot

NOTE: A riser can be connected to the riser slot or riser cable slot or both depending on the type of riser used.

26 PCIe subsystem
Figure 18. Riser 1B

Figure 19. Riser 1C

PCIe subsystem 27
Figure 20. Riser 2

Figure 21. Riser 3

28 PCIe subsystem
Figure 22. Riser 4B

Figure 23. Riser 4C

Table 12. PCIe Riser Configs

Config No. RSR Configuration # of CPUs PERC type supported Rear Storage
Possible
0 R1B+R4B 2 or 4 Front PERC / PERC No
Adaptor
1 R1C+R4C 4 Front PERC / PERC No
Adaptor
2 R1C+R2+R3+R4C 4 Front PERC / PERC No
Adaptor
3 R1C+R2+R4C 4 Front PERC / PERC Yes
Adaptor

PCIe subsystem 29
Table 13. Riser Config 0: R1B+R4B
Processor CPU1 CPU2
Configuration PCIe slot Width Length Height R1B R4B
location
PCIe Slot-1 SW HL FH Gen4 x8 -
PCIe Slot-2 SW HL FH Gen4 x8 -
0: R1B+R4B
PCIe Slot-7 SW HL FH - Gen4 x8
PCIe Slot-8 SW HL FH - Gen4 x8

Table 14. Riser Config 1: R1C+R4C

Processor CPU1 CPU3 CPU2 CPU4
Configurat PCIe slot Width Length Height R1C R4C
ion location
PCIe Slot-1 SW HL FH - Gen5 x16 - -
PCIe Slot-2 SW HL FH Gen5 x16 - - -
1: R1C+R4C
PCIe Slot-7 SW HL FH - - Gen5 x16 -
PCIe Slot-8 SW HL FH - - - Gen5 x16

Table 15. Riser Config 2: R1C+R2+R3+R4C

Processor CPU1 CPU3 CPU1 CPU2 CPU3 CPU4 CPU2 CPU4
Config PCIe Width Length Height R1C R2 R3 R4c
uratio slot
n locatio
n
PCIe SW HL FH - Gen5
- - - - - -
Slot-1 x16
PCIe SW HL FH Gen5
- - - - - - -
Slot-2 x16
PCIe SW HL LP Gen5
- - - - - - -
Slot-3 x16

2: PCIe SW HL FH Gen5
- - - - - - -
R1C+R Slot-4 x16
2+R3+ PCIe SW HL FH Gen5
R4C - - - - - - -
Slot-5 x16
PCIe SW HL LP Gen5
- - - - - - -
Slot-6 x16
PCIe SW HL FH Gen5
- - - - - - -
Slot-7 x16
PCIe SW HL FH Gen5
- - - - - - -
Slot-8 x16

Table 16. Riser Config 3: R1C+R2+R4C

Processor CPU1 CPU3 CPU1 CPU2 CPU2 CPU4
Configu PCIe Width Length Height
ration slot R1C R2 R4C
location
3: PCIe SW HL FH
R1C+R2+ Slot-1 - Gen5 x16 - - - -
R4C

30 PCIe subsystem
Table 16. Riser Config 3: R1C+R2+R4C (continued)
Processor CPU1 CPU3 CPU1 CPU2 CPU2 CPU4
Configu PCIe Width Length Height
ration slot R1C R2 R4C
location
PCIe SW HL FH
Gen5 x16 - - - - -
Slot-2
PCIe SW HL LP
- - Gen5 x16 - - -
Slot-3
PCIe SW HL LP
- - - Gen5 x16 - -
Slot-6
PCIe SW HL FH
- - - - Gen5 x16 -
Slot-7
PCIe SW HL FH
- - - - - Gen5 x16
Slot-8

PCIe subsystem 31
 9
Power, thermal, and acoustics
PowerEdge servers have an extensive collection of sensors that automatically track thermal activity, which helps regulate
temperature thereby reducing server noise and power consumption. The table below lists the tools and technologies Dell offers
to lower power consumption and increase energy efficiency.
Topics:
• Power
• Thermal
• Acoustics

Power
Table 17. Power tools and technologies
Feature Description
Power Supply Units(PSU) Dell's PSU portfolio includes intelligent features such as dynamically optimizing efficiency while
portfolio maintaining availability and redundancy. Find additional information in the Power supply units
section.
Tools for right sizing Enterprise Infrastructure Planning Tool (EIPT) is a tool that can help you determine the most
efficient configuration possible. With Dell's EIPT, you can calculate the power consumption
of your hardware, power infrastructure, and storage at a given workload. Learn more at
[Link]/calc.
Industry Compliance Dell's servers are compliant with all relevant industry certifications and guide lines, including 80
PLUS, Climate Savers and ENERGY STAR.
Power monitoring accuracy PSU power monitoring improvements include:

● Dell's power monitoring accuracy is currently 1%, whereas the industry standard is 5%
● More accurate reporting of power
● Better performance under a power cap
Power capping Use Dell's systems management to set the power cap limit for your systems to limit the output
of a PSU and reduce system power consumption. Dell is the first hardware vendor to leverage
Intel Node Manager for circuit-breaker fast capping.
Systems Management iDRAC Enterprise and Datacenter provides server-level management that monitors, reports and
controls power consumption at the processor, memory and system level.

Dell OpenManage Power Center delivers group power management at the rack, row, and data
center level for servers, power distribution units, and uninterruptible power supplies.

Active power management Intel Node Manager is an embedded technology that provides individual server-level power
reporting and power limiting functionality. Dell offers a complete power management solution
comprised of Intel Node Manager accessed through Dell iDRAC9 Datacenter and OpenManage
Power Center that allows policy-based management of power and thermal at the individual
server, rack, and data center level. Hot spare reduces power consumption of redundant power
supplies. Thermal control off a speed optimizes the thermal settings for your environment to
reduce fan consumption and lower system power consumption.

Idle power enables Dell servers to run as efficiently when idle as when at full workload.

Fresh Air cooling Refer to ASHRAE A3/A4 Thermal Restriction.

32 Power, thermal, and acoustics

Table 17. Power tools and technologies (continued)
Feature Description
Rack infrastructure Dell offers some of the industry's highest-efficiency power infrastructure solutions, including:
● Power distribution units (PDUs)
● Uninterruptible power supplies (UPSs)
● Energy Smart containment rack enclosures
Find additional information at: [Link]
[Link].

Power Supply Units

Energy Smart power supplies have intelligent features, such as the ability to dynamically optimize efficiency while maintaining
availability and redundancy. Also featured are enhanced power-consumption reduction technologies, such as high-efficiency
power conversion and advanced thermal-management techniques, and embedded power-management features, including high-
accuracy power monitoring. The table below shows the power supply unit options that are available for the R860.

Table 18. Power Supply Unit Options

Wattage Frequency Voltage/Current Class Heat
dissipation
1100 W mixed 50/60 Hz 100–240 Vac/12—3.6 A Titanium 4100 BTU/hr
mode
N/A 240 Vdc/5.2 A N/A 4100 BTU/hr
1400 W mixed 50/60 Hz 100–240 Vac/12—8 A Platinum 5250 BTU/hr
mode
N/A 240 Vdc/6.6 A N/A 5250 BTU/hr
1800 W mixed 50/60 Hz 200–240 Vac/10 A Titanium 6750 BTU/hr
mode
N/A 240 Vdc/8.2 A N/A 6750 BTU/hr
2400 W mixed 50/60 Hz 100–240 Vac/ 16—13.5 A Platinum 9000 BTU/hr
mode
N/A 240 Vdc/11.2 A N/A 9000 BTU/hr
2800 W mixed 50/60 Hz 200–240 Vac/15.6 A Titanium 10,500 BTU/hr
mode
N/A 240 Vdc/13.6 A N/A 10,500 BTU/hr

NOTE: If a system with AC 2400 W PSUs operates at low line 100-120 Vac, and then the power rating per PSU is degraded
to 1400 W.

NOTE: If a system with AC 1400 W or 1100 W PSUs operates at low line 100-120 Vac, and then the power rating per PSU is
degraded to 1050 W.

Figure 24. PSU power cords

Table 19. PSU power cords

Form factor Output Power cord
Redundant 60 mm 1100 W AC C13
1400 W AC C13
1800 W AC C15

Power, thermal, and acoustics 33

Table 19. PSU power cords (continued)
Form factor Output Power cord
Redundant 86 mm 2400 W AC C19
2800 W AC C21

NOTE: C19 power cord combined with C20 to C21 jumper power cord can be used to adapt 2800 W PSU.

NOTE: C13 power cord combined with C14 to C15 jumper power cord can be used to adapt 1800 W PSU.

Thermal
PowerEdge servers have an extensive collection of sensors that automatically track thermal activity, which helps regulate
temperature thereby reducing server noise and power consumption.

Thermal design
Thermal management of the platform helps deliver high performance with the right amount of cooling to components, while
maintaining the lowest fan speeds possible. This is done across a wide range of ambient temperatures from 10°C to 35°C (50°F
to 95°F) and to extended ambient temperature ranges.

Figure 25. Thermal design characteristics

The thermal design of the PowerEdge R860 reflects the following:

● Optimized thermal design: The system layout is architected for optimum thermal design.
● System component placement and layout are designed to provide maximum airflow coverage to critical components with
minimum expense of fan power.
● Comprehensive thermal management: The thermal control system regulates the fan speed based on several different
responses from all system-component temperature sensors, as well as inventory for system configurations. Temperature
monitoring includes components such as processors, DIMMs, chipset, the inlet air ambient, hard disk drives, and OCP.
● Open and closed loop thermal fan speed control: Open loop thermal control uses system configuration to determine
fan speed based on inlet air ambient temperature. Closed loop thermal control method uses feedback temperatures to
dynamically determine proper fan speeds.
● User-configurable settings: With the understanding and realization that every customer has unique set of circumstances or
expectations from the system, in this generation of servers, we have introduced limited user- configurable settings residing
in the iDRAC BIOS setup screen. For more information, see the Dell PowerEdge R860 Installation and Service Manual at

34 Power, thermal, and acoustics

 [Link]/poweredgemanuals and “Advanced Thermal Control: Optimizing across Environments and Power Goals” on
[Link].
● Cooling redundancy: The R860 allows N+1 fan redundancy, allowing continuous operation with one fan failure in the system.
● Environmental Specifications: The optimized thermal management makes the R860 reliable under a wide range of operating
environments.

Acoustics
Acoustical performance
Dell PowerEdge R860 is a rack-mount server appropriate for an office to that of data center environment. Although the R860
is designed for use in data centers, some users may prefer to use it in a quieter setting. However in most cases, the idle air
mover speed of the system cannot be lowered without changing the configuration of the system, and in some cases, even a
configuration change may not reduce idle air mover speeds.

Table 20. Acoustical Configurations of R860

Configuration Quietest HCI Data Management Machine
Learning
CPU TDP 195 W 250 W 250 W 350 W
CPU Quantity 4 4 4 4
RDIMM 16 GB DDR5 64 GB DDR5 64 GB DDR5 64 GB DDR5
Memory
Memory 4 24 48 64
Quantity
Backplane 2.5-inch x 24 BP 2.5-inch x 24 BP 2.5-inch x 8 BP 2.5-inch x 24
Type BP
HDD Type SATA 2.5-inch 600 GB SATA 2.5-inch 600 GB SATA 2.5-inch 1.2 TB SATA 2.5-inch
1.8 TB
HDD Quantity 24 24 24 24
M.2 Drives NVMe 480 GB NVMe 480 GB NVMe 480 GB NVMe 480 GB
M.2 Quantity 1 1 1 1
PSU Type 2400 W 2800 W 2400 W 2800 W
PSU Quantity 2 2 2 2
OCP X OCP3 10 GB 2-port OCP3 10 GB 2-port OCP3 10 GB 2-
port
PCI 1 X X X X
PCI 2 X X X X
PCI 3 X X X X
PCI 4 X X X X
PCI 5 X X X X
PCI 6 X X X X
PCI 7 X X X X
PCI 8 X X X X
PCI 9 X X X X
PERC Front HBA355i Front HBA355i Front HBA355i Front HBA355i

Power, thermal, and acoustics 35

Table 21. Acoustical experience of R860 configurations
Configuration Quietest HCI Data Machine Learning
Management
Acoustical Performance: Idle/ Operating @ 25°C Ambient
L wA,m (B) Idle (4) 5.4 5.7 5.6 5.8
Operating/Customer 5.8 7.0 6.6 7.1
usage operating (5)(6)
K (B) Idle (4) 0.4 0.4 0.4 0.4
v

Operating/Customer 0.4 0.4 0.4 0.4

usage operating (5)(6)
L pA,m (dB) Idle (4) 38 42 40 43
Operating/Customer 45 55 50 54
usage operating (5)(6)
Prominent discrete tones (3) Prominence ratio < 15 dB
Acoustical Performance: Idle @ 28°C Ambient
L (1) (B) 5.7 6.2 6.3 6.2
wA,m

K v (B) 0.4 0.4 0.4 0.4

L (2) (dB) 41 46 46 45
pA,m

Acoustical Performance: Max. loading @ 35°C Ambient Mx. Loading @

30°C Ambient
L (1) (B) 7.6 8.7 8.6 8.7
wA,m

K v (B) 0,4 0.4 0.4 0.4

L (2) (dB) 61 71 69 71
pA,m

(1) LwA,m:The declared mean A-weighted sound power level (LwA) is calculated per section 5.2 of ISO 9296 (2017) with data
collected using the methods that are described in ISO 7779 (2010). Engineering data presented here may not be fully compliant
with ISO 7779 declaration requirement.
(2) LpA,m:The declared mean A-weighted emission sound pressure level is at the bystander position per section 5.3 of ISO 9296
(2017) and measured using methods that are described in ISO 7779 (2010). The system is placed in a 24U rack enclosure, 75 cm
above a reflective floor. Engineering data presented here may not be fully compliant with ISO 7779 declaration requirement.
(3) Prominenttones: Criteria of Annex D of ECMA-74 and Prominence Ratio method of ECMA-418 are followed to determine if
discrete tones are prominent and to report them, if so.
(4) Idle mode: The steady-state condition in which the server is energized but not operating any intended function.
(5) Operatingmode: The maximum of the steady state acoustical output at 50% of CPU TDP or active storage drives for the
respective sections of Annex C of ECMA-74.
(6)Customer Usage Operating mode: The operating mode is represented by the maximum of the steady state acoustical output
at 10 - 50% of CPU TDP, 40% of Memory, and 10% IOPs load as the components showed in the above configurations.

PowerEdge acoustical specifications

Dell typically categorizes servers in five categories of acoustically acceptable usage:
● Category 1: Table-top in Office Environment
● Category 2: Floor-standing in Office Environment
● Category 3: General Use Space
● Category 4: Attended Data Center
● Category 5: Unattended Data Center

36 Power, thermal, and acoustics

Category 1: Table-top in Office Environment
When Dell determines that a specific Enterprise product is to be used primarily on top of the table, then the acoustical
specification in the table below applies. Noise from the product should not annoy or otherwise interfere with the user’s thoughts
or speech, for example, on the telephone.

Table 22. Dell Enterprise Category 1, "Table-top in Office Environment" acoustical specification category
Measurement Metric, re Test Modes, re AC0159 (note must be in steady Simulate (that is, set fan
Position re AC0159 state, see AC0159, except where noted below) speeds representative) for Idle
AC0158 at 28° C & 35° C Ambient,
Standby in Idle in 23±2° C Operating in and for 100% loading and
23±2° C Ambient 23±2° C maximum configuration, at 35°
Ambient Ambient – if C Ambient
not otherwise
specified in
the program’s
configuration
document,
then processor
and hard drive
operating
modes are
required
Sound Power LWA,m, B ≤ 4.2 ≤ 4.7 ≤ 5.0 Report
Sound Quality Tones, Hz, dB No prominent tones per criteria D.10.6 and D.10.8 of Report tones
(both positions ECMA-74
must meet
limits): Front Tonality, tu ≤ 0.35 ≤ 0.35 ≤ 0.35 Report
Binaural HEAD Dell Modulation, ≤ 35 ≤ 35 ≤ 35 Report
and Rear %
Microphone
Loudness, sones Report Report Report Report
LpA-single Report Report Report Report
point, dBA
Front Binaural Transients ● Oscillation (see AC0159), if observed, during 20- N/A
HEAD minute steady-state observation, must adhere to
the following two criteria:
○ Max. {ΔLpA} < 3.0 dB
○ Event count < 3 for “1.5 dB < ΔLpA < 3.0 dB”
○ Acoustical Jump (see AC0159), during air
mover speed transition from Idle to Operating
Mode must be ≤ 15dB.
● Startup behavior
○ Report Startup behavior re. AC0159
○ Startup must proceed smoothly, i.e., no
sudden or large jumps, and fan speed during
startup must not exceed 50% of its maximum
● Transient inputs: Report time-history sound
pressure levels re AC0159 “Train of Step
Functions on Processor”
Any Other ● No rattles, squeaks, or unexpected noises.
● Sound should be “even” around the EUT (one side should not be dramatically louder
than another).
● Unless otherwise specified, the “default” thermal-related settings shall be selected for
BIOS and iDRAC.
● Specific operating conditions are defined in “Configurations and Configuration
Dependencies” for each platform.
Sound Pressure LpA-reported, Report for all Report for all Report for all Report for all mics
dBA, re AC0158 mics mics mics
and program

Power, thermal, and acoustics 37

Table 22. Dell Enterprise Category 1, "Table-top in Office Environment" acoustical specification
category (continued)
Measurement Metric, re Test Modes, re AC0159 (note must be in steady Simulate (that is, set fan
Position re AC0159 state, see AC0159, except where noted below) speeds representative) for Idle
AC0158 at 28° C & 35° C Ambient,
Standby in Idle in 23±2° C Operating in and for 100% loading and
23±2° C Ambient 23±2° C maximum configuration, at 35°
Ambient Ambient – if C Ambient
not otherwise
specified in
the program’s
configuration
document,
then processor
and hard drive
operating
modes are
required
configuration
document

Category 2: Floor-standing in Office Environment

When Dell determines that a specific Enterprise product is to be used primarily when it is sitting on the floor, that is, next to a
user’s feet, then the acoustical specification in the table below applies. Noise from the product should not annoy or otherwise
interfere with the user’s thoughts or speech, for example, on the telephone.

Table 23. Dell Enterprise Category 2, “Floor-standing in Office Environment” acoustical specification
category
Measurement Metric, re Test Modes, re AC0159 (note must be in steady state, see AC0159, except where
Position re AC0159 noted below)
AC0158
Standby in Idle in 23±2° C Operating in Simulate (that is, set fan
23±2° C Ambient 23±2° C speeds representative) for Idle
Ambient Ambient – if at 28° C & 35° C Ambient,
not otherwise and for 100% loading and
specified in maximum configuration, at 35°
the program’s C Ambient
configuration
document,
then processor
and hard drive
operating
modes are
required
Sound Power LWA,m, B ≤ 4.9 ≤ 5.1 ≤ 5.4 Report
Sound Quality Tones, Hz, dB No prominent tones per criteria D.10.6 and D.10.8 of Report tones
(both positions ECMA-74
must meet
limits): Front Tonality, tu ≤ 0.35 ≤ 0.35 ≤ 0.35 Report
Binaural HEAD Dell Modulation, ≤ 35 ≤ 35 ≤ 35 Report
and Rear %
Microphone
Loudness, sones Report Report Report Report
LpA-single Report Report Report Report
point, dBA
Front Binaural Transients ● Oscillation (see AC0159), if observed, during 20- N/A
HEAD minute steady-state observation, must adhere to
the following two criteria:
○ Max. {ΔLpA} < 3.0 dB
○ Event count < 3 for “1.5 dB < ΔLpA < 3.0 dB”

38 Power, thermal, and acoustics

Table 23. Dell Enterprise Category 2, “Floor-standing in Office Environment” acoustical specification
category (continued)
Measurement Metric, re Test Modes, re AC0159 (note must be in steady state, see AC0159, except where
Position re AC0159 noted below)
AC0158
Standby in Idle in 23±2° C Operating in Simulate (that is, set fan
23±2° C Ambient 23±2° C speeds representative) for Idle
Ambient Ambient – if at 28° C & 35° C Ambient,
not otherwise and for 100% loading and
specified in maximum configuration, at 35°
the program’s C Ambient
configuration
document,
then processor
and hard drive
operating
modes are
required
● Acoustical Jump (see AC0159), during air mover
speed transition from Idle to Operating Mode
must be ≤ 15 dB.
● Startup behavior
○ Report Startup behavior re. AC0159
○ Startup must proceed smoothly, that is, no
sudden or large jumps, and fan speed during
startup must not exceed 50% of its maximum
● Transient inputs: Report time-history sound
pressure levels re AC0159 “Train of Step
Functions on Processor”
Any Other ● No rattles, squeaks, or unexpected noises.
● Sound should be “even” around the EUT (one side should not be dramatically louder
than another).
● Unless otherwise specified, the “default” thermal-related settings shall be selected for
BIOS and iDRAC.
● Specific operating conditions are defined in “Configurations and Configuration
Dependencies” for each platform.
Sound Pressure LpA-reported, Report for all Report for all Report for all Report for all mics
dBA, re AC0158 mics mics mics
and program
configuration
document

Category 3: General Use Space

When Dell determines that a specific Enterprise product is to be predominantly used in a general use space, then the acoustical
specification in the table below applies. These products could be found in laboratories, schools, restaurants, open office space
layouts, small ventilated closets, etc., though not in close proximity to any particular person nor in quantities greater than a few
in any location. People within proximity of a few of these products should not experience any impact to speech intelligibility or
annoyance from the noise of the product. A rack product sitting on a table in a common area is an example.

Power, thermal, and acoustics 39

Table 24. Dell Enterprise Category 3, “General Use Space” acoustical specification category
Measurement Metric, re Test Modes, re AC0159 (note must be in steady Simulate (i.e., set fan speeds
Position re AC0159 state, see AC0159, except where noted below) representative) for Idle at 28
AC0158 & 35° C Ambient, and for
Standby in Idle in 23±2° C Operating in 100% loading and maximum
23±2° C Ambient 23±2° C configuration, at 35° C
Ambient Ambient – if Ambient
not otherwise
specified in
the program’s
configuration
document,
then processor
and hard drive
operating
modes are
required
Sound Power LWA,m, B ≤ 5.2 ≤ 5.5 ≤ 5.8 Report
Sound Quality Tones, Hz, dB No prominent tones per criteria D.10.6 and D.10.8 of Report tones
(both positions ECMA-74
must meet
limits): Front Tonality, tu ≤ 0.35 ≤ 0.35 ≤ 0.35 Report
Binaural HEAD Dell Modulation, ≤ 35 ≤ 35 ≤ 35 Report
and Rear %
Microphone
Loudness, sones Report Report Report Report
LpA-single Report Report Report Report
point, dBA
Front Binaural Transients ● Oscillation (see AC0159), if observed, during 20- N/A
HEAD minute steady-state observation, must adhere to
the following two criteria:
○ Max. {ΔLpA} < 3.0 dB
○ Event count < 3 for “1.5 dB < ΔLpA < 3.0 dB”
○ Acoustical Jump (see AC0159), during air
mover speed transition from Idle to Operating
Mode must be ≤ 15dB.
● Startup behavior
○ Report Startup behavior re. AC0159
○ Startup must proceed smoothly, i.e., no
sudden or large jumps, and fan speed during
startup must not exceed 50% of its maximum
● ∞ Transient inputs: Report time-history sound
pressure levels re AC0159 “Train of Step
Functions on Processor”
Any Other ● No rattles, squeaks, or unexpected noises.
● Sound should be “even” around the EUT (one side should not be dramatically louder
than another).
● Unless otherwise specified, the “default” thermal-related settings shall be selected for
BIOS and iDRAC.
● Specific operating conditions are defined in “Configurations and Configuration
Dependencies” for each platform.
Sound Pressure LpA-reported, Report for all Report for all Report for all Report for all mics
dBA, re AC0158 mics mics mics
and program
configuration
document

40 Power, thermal, and acoustics

Category 4: Attended Data Center
When Dell determines that a specific Enterprise product is to be predominantly used in an attended data center, then the
acoustical specification of the table applies. The phrase “attended data center” is used to mean a space in which many (from
tens to 1000s) of Enterprise products are deployed in proximity (that is, in the same room) to personnel whose speech (perhaps
with raised voices) is expected to be intelligible over the data center noise. Hearing protection or hearing monitoring programs
are not expected in these areas. Examples in this category include monolithic rack products. When Dell determines that a
specific Enterprise product is to be predominantly used in a general use space, then the acoustical specification of the above
table applies. These products could be found in laboratories, schools, restaurants, open office space layouts, small ventilated
closets, etc., though not in close proximity to any particular person nor in quantities greater than a few in any location. People
within proximity of a few of these products should not experience any impact to speech intelligibility or annoyance from the
noise of the product. A rack product sitting on a table in a common area is an example.

Table 25. Dell Enterprise Category 4, “Attended Data Center” acoustical specification category
Measurement Metric, re Test Modes, re AC0159 (note must be in steady state, see Simulate (that
Position re AC0159 AC0159, except where noted below) is, set fan
AC0158 speeds
Standby in Idle in 23±2° C Operating in Simulate (that representative
23±2° C Ambient 23±2° C is, set fan ) for 100%
Ambient Ambient – if speeds loading and
not otherwise representative maximum
specified in ) for Idle at configuration,
the program’s 28° C & 35° C at 35° C
configuration Ambient Ambient
document,
then processor
and hard drive
operating
modes are
required
Sound Power LWA,m, B Report ≤ 6.9 ≤ 7.1 Report ≤ 8.5
Front Binaural Tones, Hz, dB Report < 15 dB < 15 dB Report < 20 dB
HEAD
Tonality, tu Report Report Report Report Report
Dell Modulation, Report Report Report Report Report
%
Loudness, sones Report Report Report Report Report
LpA-single Report Report Report Report Report
point, dBA
Transients ● Oscillation (see AC0159), if observed, during 20- N/A
minute steady-state observation, must adhere to
the following two criteria:
○ Max. {ΔLpA} < 3.0 dB
○ Event count < 3 for “1.5 dB < ΔLpA < 3.0 dB”
○ Acoustical Jump (see AC0159), during air
mover speed transition from Idle to Operating
Mode must be ≤ 15 dB.
○ Startup behavior
￭ Report Startup behavior re. AC0159
￭ Startup must proceed smoothly, that is,
no sudden or large jumps, and fan speed
during startup must not exceed 50% of its
maximum
● ∞ Transient inputs: Report time-history sound
pressure levels re AC0159 “Train of Step
Functions on Processor”
Any Other ● No rattles, squeaks, or unexpected noises.
● Sound should be “even” around the EUT (one side should not be dramatically louder
than another).

Power, thermal, and acoustics 41

Table 25. Dell Enterprise Category 4, “Attended Data Center” acoustical specification
category (continued)
Measurement Metric, re Test Modes, re AC0159 (note must be in steady state, see Simulate (that
Position re AC0159 AC0159, except where noted below) is, set fan
AC0158 speeds
Standby in Idle in 23±2° C Operating in Simulate (that representative
23±2° C Ambient 23±2° C is, set fan ) for 100%
Ambient Ambient – if speeds loading and
not otherwise representative maximum
specified in ) for Idle at configuration,
the program’s 28° C & 35° C at 35° C
configuration Ambient Ambient
document,
then processor
and hard drive
operating
modes are
required
● Unless otherwise specified, the “default” thermal-related settings shall be selected for
BIOS and iDRAC.
● Specific operating conditions are defined in “Configurations and Configuration
Dependencies” for each platform.
Sound Pressure LpA-reported, Report for all Report for all Report for all Report for all Report for all
dBA mics mics mics mics mics

Category 5: Unattended Data Center

When Dell determines that a specific Enterprise product is to be predominantly used in an unattended data center (and not
blades or blade enclosures; these have their own category), then the acoustical specification in the table below applies. The
phrase “unattended data center” is used to mean a space in which many (from tens to 1000s) of Enterprise products are
deployed together, its own heating and cooling systems condition the space, and operators or servicers of equipment enter
generally only to deploy, service, or decommission equipment. Hearing protection or hearing monitoring programs may be
expected (per government or company guidelines) in these areas. Examples in this category include monolithic rack products.

Table 26. Dell Enterprise Category 5, “Unattended Data Center” acoustical specification category
Measuremen Metric, re Test Modes, re AC0159 (note must be in steady state, see AC0159, Simulate (that
t Position re AC0159 except where noted below) is, set air
AC0158 mover speeds
Standby in Idle in 23±2° Operating in Simulate (that is, representative
23±2° C C Ambient 23±2° C set air mover speeds ) for 100%
Ambient Ambient – if representative) for Idle at loading and
not 28° C & 35° C Ambient maximum
otherwise configuration,
specified in at 35° C
the Ambient
program’s
configuratio
n document,
then
processor
and hard
drive
operating
modes are
required
Sound Power LWA,m, B Report ≤ 7.5 ≤ 7.7 Report ≤ 8.7
Front Binaural Tones, Hz, dB Report < 15 dB < 15 dB Report < 20 dB
HEAD
Tonality, tu Report Report Report Report Report
Dell Report Report Report Report Report
Modulation,
%
Loudness, Report Report Report Report Report
sones

42 Power, thermal, and acoustics

Table 26. Dell Enterprise Category 5, “Unattended Data Center” acoustical specification
category (continued)
Measuremen Metric, re Test Modes, re AC0159 (note must be in steady state, see AC0159, Simulate (that
t Position re AC0159 except where noted below) is, set air
AC0158 mover speeds
Standby in Idle in 23±2° Operating in Simulate (that is, representative
23±2° C C Ambient 23±2° C set air mover speeds ) for 100%
Ambient Ambient – if representative) for Idle at loading and
not 28° C & 35° C Ambient maximum
otherwise configuration,
specified in at 35° C
the Ambient
program’s
configuratio
n document,
then
processor
and hard
drive
operating
modes are
required
LpA-single Report Report Report Report Report
point, dBA
Front Binaural Transients ● Oscillation (see AC0159), if N/A
HEAD observed, during 20-minute steady-state
observation, must adhere to the following
two criteria:
○ Max. {ΔLpA} < 3.0 dB
○ Event count < 3 for “1.5 dB < ΔLpA <
3.0 dB”
● Report Acoustical Jump (see AC0159)
during air mover speed transition from
Idle to Operating Mode.
● Startup behavior
○ Report Startup behavior re. AC0159
○ Startup must proceed smoothly, that
is, no sudden or large jumps, and air
mover speed during startup must not
exceed 50% of its maximum
● Transient inputs: Report time-history
sound pressure levels re AC0159 “Train of
Step Functions on Processor”
Any Other ● No rattles, squeaks, or unexpected noises.
● Sound should be “even” around the EUT (one side should not be dramatically louder than
another).
● Unless otherwise specified, the “default” thermal-related settings shall be selected for BIOS
and iDRAC.
● Specific operating conditions are defined in “Configurations and Configuration
Dependencies” for each platform.
Sound LpA-reported, Report for all Report for all Report for all Report for all mics Report for all
Pressure dBA, re mics mics mics mics
AC0158 and
program
configuration
document

Power, thermal, and acoustics 43

 10
Rack, rails, and cable management
Topics:
• Rails and cable management information

Rails and cable management information

The rail offerings for the PowerEdge R860 consist of two general types: sliding and static. The cable management offerings
consist of an optional cable management arm (CMA) and an optional strain relief bar (SRB).
See the Dell Enterprise Systems Rail Sizing and Rack Compatibility Matrix available at [Link]
Business_solutions_engineering-Docs_Documents/en/[Link] for information regarding:
● Specific details about rail types.
● Rail adjustability ranges for various rack mounting flange types
● Rail depth with and without cable management accessories
● Rack types that are supported for various rack mounting flange types
Key factors governing proper rail selection include the following:
● Spacing between the front and rear mounting flanges of the rack
● Type and location of any equipment that is mounted in the back of the rack such as power distribution units (PDUs)
● Overall depth of the rack

Sliding rails features summary

The sliding rails allow the system to be fully extended out of the rack for service. There is one type of sliding rail available:
Stab-in/Drop-in sliding rails. The sliding rails are available with or without the optional cable management arm (CMA) or strain
relief bar (SRB).
B24 Stab-in/Drop-in sliding rails for 4-post racks
● Supports drop-in or stab-in installation of the chassis to the rails.
● Support for tool-less installation in 19" EIA-310-E compliant square, un-threaded round hole racks including all generations of
the Dell racks. Also supports tool-less installation in threaded round hole 4-post racks.
● Support for tool-less installation in Dell Titan or Titan-D racks
● Support full extension of the system out of the rack to allow serviceability of key internal components.
● Support for optional cable management arm (CMA).
● Support for optional strain relief bar (SRB).

44 Rack, rails, and cable management

Figure 26. Sliding rails with optional CMA

Figure 27. Sliding rails with optional SRB

Scan the QRL code for the documentation and trouble-shooting information regarding the installation procedures for Drop-in/
Stab-in rail types.

Rack, rails, and cable management 45

Figure 28. Quick resource locator for combo rails

B19 static rails summary

The static rails offer a greater adjustability range and a smaller overall mounting footprint than the sliding rails because of their
reduced complexity and lack of need for CMA support. The static rails support a wider variety of racks than the sliding rails.
However, they do not support serviceability in the rack and are thus not compatible with the CMA. The static rails are also not
compatible with SRB.

Figure 29. Static rails

Static rails features summary

Static rails for 4-post & 2-post racks:
● Supports stab-in installation of the chassis to the rails.
● Support tool-less installation in 19" EIA-310-E compliant square or un-threaded round hole 4-post racks including all
generations of Dell racks.
● Support tooled installation in 19" EIA-310-E compliant threaded hole 4-post and 2-post racks.
● Support for tooled installation in Dell Titan or Titan-D rack.
NOTE:
● Screws are not included with the static rail kit since racks are offered with various thread types. The screws are
provided for mounting static rails in racks with threaded mounting flanges.
● Screw head diameter should be 10 mm or less.
2-Post racks installation

46 Rack, rails, and cable management

If installing to 2-Post (Telco) racks, the ReadyRails static rails (B19) must be used. Sliding rails support mounting in 4-post racks
only.

Figure 30. Static rails in 2-post center mount configuration

Installation in the Dell Titan or Titan-D racks

For tool-less installation in Titan or Titan-D racks, the Stab-in/Drop-in Sliding rails (B24) must be used. This rail collapses
down sufficiently to fit in the rack with mounting flanges that are spaced about 24 inches apart from front to back. The
Stab-in/Drop-in Sliding rail allows bezels of the servers and storage systems to be aligned when installed in these racks. For
tooled installation, Stab-in Static rails (B19) must be used for bezel alignment with Storage systems.

Cable management arm (CMA)

The optional cable management arm (CMA) organizes and secures the cords and cables exiting the back of the systems. It
unfolds to allow the systems to extend out of the rack without having to detach the cables. Some key features of the CMA
include:
● Large U-shaped baskets to support dense cable loads.
● Open vent pattern for optimal airflow.
● Ability to mount on either side by swinging the spring-loaded brackets from one side to the other.
● Utilizes hook-and-loop straps rather than plastic tie wraps to eliminate the risk of cable damage during cycling.
● Includes a low-profile fixed tray to both support and retain the CMA in its fully closed position.
● Both the CMA and the tray mount without the use of tools by simple and intuitive snap-in designs.
The CMA can be mounted to either side of the sliding rails without the use of tools or the need for conversion. For systems
with one power supply unit (PSU), it is recommended to mount on the side opposite to that of the power supply to allow easier
access to it and the rear drives (if applicable) for service or replacement.

Rack, rails, and cable management 47

Figure 31. Sliding rails with CMA cabling

Strain Relief Bar (SRB)

The optional strain relief bar (SRB) for the PowerEdge R860 organizes and supports cable connections at the rear end of the
server to avoid damage from bending.

Figure 32. Cabled strain relief bar

● Tool-less attachment to the rails

● Two depth positions to accommodate various cable loads and rack depths
● Supports cable loads and controls stresses on server connectors
● Cables can be separated into discrete purpose-specific bundles

Rack Installation
Drop-in design means that the system is installed vertically into the rails by inserting the standoffs on the sides of the system
into the J-slots in the inner rail members with the rails in the fully extended position. The recommended method of installation
is to first insert the rear standoffs on the system into the rear J-slots on the rails to free up a hand and then rotate the system
down into the remaining J-slots while using the free hand to hold the rail against the side of the system.

48 Rack, rails, and cable management

Installing system into the rack (option A: Drop-In)
1. Pull the inner rails out of the rack until they lock into place.

Figure 33. Pull out inner rail

2. Locate the rear rail standoff on each side of the system and lower them into the rear J-slots on the slide assemblies.
3. Rotate the system downward until all the rail standoffs are seated in the J-slots.

Figure 34. Rail standoffs seated in J-slots

4. Push the system inward until the lock levers click into place.
5. Pull the blue side release lock tabs forward or backward on both rails and slide the system into the rack until the system is in
the rack.

Rack, rails, and cable management 49

 Figure 35. Slide system into the rack

Installing the system into the rack (option B: Stab-In)

1. Pull the intermediate rails out of the rack until they lock into place.
2. Release the inner rail lock by pulling forward on the white tabs and sliding the inner rail out of the intermediate rails.

Figure 36. Pull out the intermediate rail

Table 27. Rail component label

Number Component
1 Intermediate rail
2 Inner rail
3. Attach the inner rails to the sides of the system by aligning the J-slots on the rail with the standoffs on the system and
sliding forward on the system until they lock into place.

50 Rack, rails, and cable management

 Figure 37. Attach the inner rails to the system
4. With the intermediate rails extended, install the system into the extended rails.

Figure 38. Install system into the extended rails

5. Pull blue slide release lock tabs forward or backward on both rails, and slide the system into the rack.

Rack, rails, and cable management 51

 Figure 39. Slide system into the rack

52 Rack, rails, and cable management

 11
Operating Systems and Virtualization
Topics:
• Supported operating systems

Supported operating systems

The PowerEdge R860 system supports the following operating systems:
● Canonical Ubuntu Server LTS
● Microsoft Windows Server with Hyper-V
● Red Hat Enterprise Linux
● SUSE Linux Enterprise Server
● VMware ESXi
For more information, go to [Link]/ossupport.

Operating Systems and Virtualization 53

 12
Dell OpenManage Systems Management
Dell delivers management solutions that help IT administrators effectively deploy, update, monitor, and manage IT assets.
OpenManage solutions and tools enable you to quickly respond to problems by helping them to manage Dell servers efficiently;
in physical, virtual, local, and remote environments; all without the need to install an agent in the operating system.
The OpenManage portfolio includes:
● Innovative embedded management tool - integrated Dell Remote Access Controller (iDRAC)
● Consoles - OpenManage Enterprise
● Extensible with plug-ins - OpenManage Power Manager
● Update tools - Repository Manager
Dell has developed comprehensive systems management solutions that are based on open standards and has integrated with
management consoles from partners such as Microsoft and VMware, allowing advanced management of Dell servers. Dell
management capabilities extend to offerings from the industry's top systems management vendors and frameworks such as
Ansible, Splunk, and ServiceNow. OpenManage tools automate the full span of server life cycle management activities along
with powerful RESTful APIs to script or integrate with your choice of frameworks.
For more information about the entire OpenManage portfolio, see:
● The latest Dell Systems Management Overview Guide.
Topics:
• Integrated Dell Remote Access Controller (iDRAC)
• Systems Management software support matrix

Integrated Dell Remote Access Controller (iDRAC)

iDRAC9 delivers advanced, agent-free, local and remote server administration. Embedded in every PowerEdge server, iDRAC9
provides a secure means to automate a multitude of common management tasks. Because iDRAC is embedded within every
PowerEdge server, there is no additional software to install; just plug in power and network cables, and iDRAC is ready to go.
Even before installing an operating system (operating system) or hypervisor, IT administrators have a complete set of server
management features at their fingertips.
With iDRAC9 in-place across the Dell PowerEdge portfolio, the same IT administration techniques and tools can be applied
throughout. This consistent management platform allows easy scaling of PowerEdge servers as an organization's infrastructure
grows. Customers can use the iDRAC RESTful API for the latest in scalable administration methods of PowerEdge servers. With
this API, iDRAC enables support for the Redfish standard and enhances it with Dell extensions to optimize at-scale management
of PowerEdge servers. By having iDRAC at the core, the entire OpenManage portfolio of Systems Management tools allows
every customer to tailor an effective, affordable solution for any size environment.
Zero Touch Provisioning (ZTP) is embedded in iDRAC. ZTP - Zero Touch Provisioning is Intelligent Automation Dell's agent-free
management puts IT administrators in control. Once a PowerEdge server is connected to power and networking, that system
can be monitored and fully managed, whether you're standing in front of the server or remotely over a network. In fact,
with no need for software agents, an IT administrator can: • Monitor • Manage • Update • Troubleshoot and remediate Dell
servers With features like zero-touch deployment and provisioning, iDRAC Group Manager, and System Lockdown, iDRAC9 is
purpose-built to make server administration quick and easy. For those customers whose existing management platform utilizes
in-band management, Dell does provide iDRAC Service Module, a lightweight service that can interact with both iDRAC9 and
the host operating system to support legacy management platforms.
When ordered with DHCP enabled from the factory, PowerEdge servers can be automatically configured when they are
initially powered up and connected to your network. This process uses profile-based configurations that ensure each server is
configured per your specifications. This feature requires an iDRAC Enterprise license.
iDRAC9 offers following license tiers:

54 Dell OpenManage Systems Management

Table 28. iDRAC9 license tiers
License Description
iDRAC9 Basic ● Available only on 100-500 series rack/tower
● Basic instrumentation with iDRAC web UI
● For cost conscious customers that see limited value in management
iDRAC9 ● Default on 600+ series rack/tower, modular, and XR series
Express ● Includes all features of Basic
● Expanded remote management and server life-cycle features
iDRAC9 ● Available as an upsell on all servers
Enterprise ● Includes all features of Basic and Express. Includes key features such as virtual console, AD/LDAP
support, and more
● Remote presence features with advanced, Enterprise-class, management capabilities
iDRAC9 ● Available as an upsell on all servers
Datacenter ● Includes all features of Basic, Express, and Enterprise. Includes key features such as telemetry streaming,
Thermal Manage, automated certificate management, and more
● Extended remote insight into server details, focused on high end server options, granular power, and
thermal management

For a full list of iDRAC features by license tier, see Integrated Dell Remote Access Controller 9 User's Guide at [Link].
For more details on iDRAC9 including white papers and videos, see:
● Support for Integrated Dell Remote Access Controller 9 (iDRAC9) on the Knowledge Base page at [Link]

Systems Management software support matrix

Table 29. Systems Management software support matrix
Categories Features PE mainstream
Embedded Management and In-band iDRAC9 (Express, Enterprise, and Datacenter licenses) Supported
Services
OpenManage Mobile Supported
OM Server Administrator (OMSA) Supported
iDRAC Service Module (iSM) Supported
Driver Pack Supported
Change Management Update Tools (Repository Manager, DSU, Catalogs) Supported
Server Update Utility Supported
Lifecycle Controller Driver Pack Supported
Bootable ISO Supported
Console and Plug-ins OpenManage Enterprise Supported
Power Manager Plug-in Supported
Update Manager Plug-in Supported
SupportAssist Plug-in Supported
CloudIQ Supported
Integrations and connections OM Integration with VMware Vcenter/vROps Supported
OM Integration with Microsoft System Center (OMIMSC) Supported
Integrations with Microsoft System Center and Windows Supported
Admin Center (WAC)

Dell OpenManage Systems Management 55

Table 29. Systems Management software support matrix (continued)
Categories Features PE mainstream
ServiceNow Supported
Ansible Supported
Third-party Connectors (Nagios, Tivoli, Microfocus) Supported
Security Secure Enterprise Key Management Supported
Secure Component Verification Supported
Standard operating system Red Hat Enterprise Linux, SUSE, Windows Server 2021 Supported (Tier-1)
Ubuntu, CentOS

56 Dell OpenManage Systems Management

 13
Appendix D: Service and support
Topics:
• Default support levels
• Other services and support information

Default support levels

This system offers 3 years Dell ProSupport Next Business Day (NBD), including 24x7 phone support and NBD parts and labor
support.

Default deployment levels

This system is defaulted to the ProDeploy Dell Server R860 which includes onsite hardware installation and software
configuration. C-series sleds require a deploy service on each sled purchased. Installation of the enclosure is included at no
additional charges. Optionally, the customer may choose any of the factory or field deployment offers listed below.

Other services and support information

Dell Technologies Services include a wide, customizable range of service options to simplify the assessment, design,
implementation, management and maintenance of IT environments and to help transition from platform to platform.
Depending on the current business requirements and correct level of service for customers, we provide factory, onsite, remote,
modular, and specialized services that fit the customer requirements and budget. We will help with a little or a lot, based on the
customers choice, and provide access to our global resources.

Dell deployment services

Dell ProDeploy Infrastructure Suite

ProDeploy Infrastructure Suite provides a variety of deployment offerings that satisfy a customer's unique needs. It is made
up of 5 offers: ProDeploy Configuration Services, ProDeploy Rack Integration Services, Basic Deployment, ProDeploy, and
ProDeploy Plus.

Appendix D: Service and support 57

Figure 40. ProDeploy Infrastructure Suite for servers

The new Factory Services consist of two tiers of deployment that happen prior to shipping to the customer's site.
Factory Based Services:
● ProDeploy Factory Configuration - Ideal for customers buying servers in volume and seeking pre-configuration prior to
shipping such as: custom image, system settings, and asset tagging so it arrives ready to use out of the box. Furthermore,
servers can be packaged and bundled to meet specific shipping and distribution requirements for each customer location to
facilitate the rollout process. Upsell one of the field based services (below) if a customer needs assistance with the final
server installation.
● ProDeploy Rack Integration - Ideal for customers seeking to build out fully integrated racks prior to shipping. These rack
builds include hardware install, cabling, and full system configuration. You can also add-on a factory stress test and optional
on-site final rack configuration to complete the rack installation.
○ STANDARD SKUs for Rack Integration is available in US only and requires:
￭ 20 or more devices (R and C series servers and all Dell or non-Dell switches). Use Informational SKUs for Dell
switches or 3rd party products
￭ Shipping to contiguous US
○ USE CUSTOM QUOTE for Rack Integration for:
￭ All countries except USA
￭ Racks containing less than 20 servers
￭ Any rack that includes VxRail or Storage
￭ Shipping outside contiguous US
￭ Shipping to multiple locations
Field Based Services:
● Basic Deployment consists of the hardware installation, cabling and firmware update during normal standard business hours.
Basic Deployment is traditionally sold to Competency Enabled Partners. Competency enabled partners often have Dell do the
hardware installation while they complete the software configuration.
● ProDeploy consists of your hardware installation and configuration of the software using offshore resources. ProDeploy is
great for customers who are price sensitive or who are remote from their data centers and don't require an onsite presence.
● ProDeploy Plus will give you in-region or onsite resources to complete the engagement for the customer. It also comes with
additional features such as Post Deployment Configuration Assistance and Training Credits.

58 Appendix D: Service and support

Figure 41. ProDeploy Infrastructure Suite - Factory services

Figure 42. ProDeploy Infrastructure Suite - Field services

Dell ProDeploy Plus for Infrastructure

From beginning to end, ProDeploy Plus provides the skill and scale that is must successfully perform demanding deployments in
today's complex IT environments. Certified Dell experts start with extensive environmental assessments and detailed migration

Appendix D: Service and support 59

planning and recommendations. Software installation includes set up of our enterprise connectivity solution (secure connect
gateway) and OpenManage system management utilities.
Postdeployment configuration assistance, testing, and product orientation services are also available.

Dell ProDeploy for Infrastructure

ProDeploy provides full-service installation and configuration of both server hardware and system software by certified
deployment engineers including set up of leading operating systems and hypervisors as well our enterprise connectivity solution
(secure connect gateway) and OpenManage system management utilities. To prepare for the deployment, we conduct a
site readiness review and implementation planning exercise. System testing, validation, and full project documentation with
knowledge transfer complete the process.

Dell Basic Deployment

Basic Deployment delivers worry-free professional installation by experienced technicians who know Dell servers inside and out.

Additional Deployment Services

You can tailor the ProDeploy Infrastructure Suite offer to meet your customer's unique needs by leveraging "Additional
Deployment Time." ADT will cover additional tasks above the normal scope of the standard offers. ADT can be sold for Project
Management or Technical Resources and is sold as blocks of four hours remote or eight hours on-site.

Dell ProDeploy for HPC (available in US/Canada only. All other regions use custom)
HPC deployments require specialists that understand that cutting edge is yesterday's news. Dell deploys the world 's fastest
systems and understands the nuances that make them perform. ProDeploy for HPC provides:
● Global team of dedicated HPC specialists
● Proven track record, thousands of successful HPC deployments
● Design validation, benchmarking, and product orientation
Learn more at [Link]/HPC-Services.

60 Appendix D: Service and support

Figure 43. ProDeploy Expansion for HPC

Dell custom deployment Services

Dell custom rack integration and other Dell configuration services help customers save time by providing systems that are
racked, cabled, tested, and ready to be integrated into the data center. Dell support preconfigure RAID, BIOS and iDRAC
settings, install system images, and even install third-party hardware and software.
For more information, see Server Configuration Services.

Dell Residency Services

Residency Services help customers transition to new capabilities quickly with the assistance of onsite or remote Dell experts
whose priorities and time they control.
Residency experts can provide post implementation management and knowledge transfer that is related to a new technology
acquisition or day-to-day operational management of the IT infrastructure.

Dell Data Migration Services

Protect business and data of the customer with our single point of contact to manage data migration projects.
A customer project manager works with our experienced team of experts to create a plan using industry-leading tools and
proven processes that are based on global best practices to migrate existing files and data, so business systems are up and
running quickly and smoothly.

Appendix D: Service and support 61

Dell Enterprise Support Services

Dell ProSupport Enterprise Suite

With the ProSupport Enterprise Suite, we help keep IT systems running smoothly, so customers can focus on running their
business. We help maintain peak performance and availability of the most essential workloads. ProSupport Enterprise Suite is a
suite of support services that enable customers to build the solution that is right for their organization. They choose support
models that are based on how they use technology and where they want to allocate resources. From the desktop to the data
center, address everyday IT challenges, such as unplanned downtime, mission-critical needs, data and asset protection, support
planning, resource allocation, software application management and more. Optimize customer IT resources by choosing the right
support model.

Table 30. ProSupport Enterprise Suite

Service Support model Description
ProSupport Enterprise Suite ProSupport Plus for Enterprise Proactive, predictive, and reactive
support for systems that look after
your business-critical applications and
workloads
ProSupport for Enterprise Comprehensive 24 x 7 predictive and
reactive support for hardware and
software
Basic hardware support Reactive hardware support during
normal business hours

Dell ProSupport Plus for Enterprise

When customers purchase PowerEdge server, we recommend ProSupport Plus, our proactive and preventative support service
for business-critical systems. ProSupport Plus provides all the benefits of ProSupport, plus the following:
● An assigned Services Account Manager who knows their business and environment
● Immediate advanced troubleshooting from an engineer
● Personalized, preventive recommendations that are based on analysis of support trends and best practices from across the
Dell Technologies infrastructure solutions customer base to reduce support issues and improve performance
● Predictive analysis for issue prevention and optimization that is enabled by secure connect gateway technology
● Proactive monitoring, issue detection, notification, and automated case creation for accelerated issue resolution enabled by
secure connect gateway
● On-demand reporting and analytics-based recommendations that are enabled by secure connect gateway and TechDirect

Dell ProSupport for Enterprise

ProSupport service offers highly trained experts around the clock and around the globe to address IT needs. We help minimize
disruptions and maximize availability of PowerEdge server workloads with:
● 24x7 support through phone, chat and online
● Predictive, automated tools and innovative technology
● A central point of accountability for all hardware and software issues
● Collaborative third-party support
● Hypervisor, operating system and application support
● Consistent experience regardless of where customers are located or what language they speak
NOTE: Subject to service offer country or region availability.
● Optional onsite parts and labor response options including next business day or four-hour mission critical

62 Appendix D: Service and support

Figure 44. ProSupport Enterprise Suite

Dell ProSupport One for Data Center

ProSupport One for Data Center offers flexible site-wide support for large and distributed data centers with more than 1,000
assets. This offering is built on standard ProSupport components that leverage our global scale but are tailored to a customer's
needs. While not for everyone, this service option offers a truly unique solution for Dell Technologies largest customers with the
most complex environments.
● Team of assigned Services Account Managers with remote, on-site options
● Assigned ProSupport One technical and field engineers who are trained on the customer’s environment and configurations
● On-demand reporting and analytics-based recommendations that are enabled by secure connect gateway and TechDirect
● Flexible on-site support and parts options that fit their operational model
● A tailored support plan and training for their operations staff

Dell ProSupport Add-on for HPC

The ProSupport Add-on for HPC provides solution-aware support including:
● Access to senior HPC experts
● Advanced HPC cluster assistance: performance, interoperability, and configuration
● Enhanced HPC solution level end-to-end support
● Remote presupport engagement with HPC Specialists during ProDeploy implementation
Learn more at [Link]/HPC-Services.

Appendix D: Service and support 63

Figure 45. ProSupport Add-on for HPC is an add-on to PS or PSP

Support Technologies
Powering the support experience with predictive, data-driven technologies.

NOTE: SupportAssist Enterprise capabilities are now part of the secure connect gateway technology.

Enterprise connectivity
The best time to solve a problem is before it happens. The automated proactive and predictive support features enabled by the
secure connect gateway technology helps reduce steps and time to resolution, often detecting issues before they become a
crisis. The gateway technology is available in virtual and application editions. It is also implemented as a direct connect version
for select Dell hardware and a Services plugin within OpenManage Enterprise for PowerEdge servers. The legacy SupportAssist
Enterprise solution has been retired and is now replaced by the secure connect gateway solutions.
Benefits include:
● Value: Our connectivity solutions are available to all customers at no additional charge
● Improve productivity: Replace manual, high-effort routines with automated support
● Accelerate time to resolution: Receive issue alerts, automatic case creation, and proactive contact from Dell experts
● Gain insight and control: Optimize enterprise devices with insights in portals reporting like TechDirect, and get predictive
issue detection before the problem starts
NOTE: Connect devices can access these features. Features vary depending on the service level agreement for the
connected device. ProSupport Plus customers experience the full set of automated support capabilities.

Table 31. Features enabled by connectivity

— Basic hardware ProSupport ProSupport Plus
warranty
Automated issue detection and system Supported Supported Supported
state information collection
Proactive, automated case creation and Not supported Supported Supported
notification

64 Appendix D: Service and support

Table 31. Features enabled by connectivity (continued)
— Basic hardware ProSupport ProSupport Plus
warranty
Predictive issue detection for failure Not supported Not supported Supported
prevention

Get started at [Link]/secureconnectgateway.

Dell TechDirect
TechDirect helps boost IT team productivity when supporting Dell systems.
Boost your productivity with online servoce for Dell products from TechDirect. From deployment to technical support,
TechDirect lets you do more with less effort and faster resolution. You can:
● OPen and manage support requests or in-warranty systems
● Execute online self-service for parts dispatch
● Collaborate on ProDeploy infrastructure deployment projects online
● Manage proactive and preditive alerts from secure connect gateway technology that help maximize uptime
● Integrate services functionality into your help desk with TechDirect APIs
● Join over 10,000 companies that choose TechDirect
Register at [Link].

Dell Technologies Consulting Services

Our expert consultants help customers transform faster, and quickly achieve business outcomes for the high value
workloads Dell PowerEdge systems can handle. From strategy to full-scale implementation, Dell Technologies Consulting can
help determine how to perform IT, workforce, or application transformation. We use prescriptive approaches and proven
methodologies that are combined with portfolio and partner ecosystem of Dell Technologies to help achieve real business
outcomes. From multi cloud, applications, DevOps, and infrastructure transformations, to business resiliency, data center
modernization, analytics, workforce collaboration, and user experiences-we are here to help.

Dell Managed Services

Some customers prefer Dell to manage the complexity and risk of daily IT operations, Dell Managed Services utilizes proactive,
AI enabled delivery operations and modern automation to help customers realize desired business outcomes from their
infrastructure investments. With these technologies, our experts run, update and fine-tune customer environments aligned
with service levels, while providing environment-wide and down-to-the-device visibility. There are two types of managed service
offers. First the outsourcing model or CAPEX model where Dell manages the customer owned assets using our people and
tools. The second is the as-a-Service model or OPEX model called APEX. In this service, Dell owns all technology and all the
management of it. Many customers will have a blend of the two management types depending on the goals of the organization.

Appendix D: Service and support 65

Figure 46. Dell Managed Services

Dell Technologies Education Services

Build the IT skills required to influence the transformational outcomes of the business. Enable talent and empower teams with
the right skills to lead and perform transformational strategy that drives competitive advantage. Leverage the training and
certification required for real transformation.
Dell Technologies Education Services offers PowerEdge server training and certifications that are designed to help customers
achieve more from their hardware investment. The curriculum delivers the information and the practical, firsthand skills that
their team must confidently install, configure, manage, and troubleshoot Dell servers.
To learn more or register for a class today, see [Link].

66 Appendix D: Service and support

 14
Appendix A: Additional specifications
Topics:
• Chassis dimensions
• Chassis weight
• NIC port specifications
• Video specifications
• USB Ports
• PSU rating
• Environmental specifications

Chassis dimensions
The R860 has the following dimensions:

Figure 47. Chassis dimensions

Appendix A: Additional specifications 67

Table 32. Chassis dimensions
Model Xa Xb Y Za with Za without Zb Zc Mx system Chassis
number bezel bezel Wgt.
R860 482.0 mm 444.0 86.8 mm 36.0 mm 22.0 mm 817.23 848.3 42.97 kg 2U
(18.97 inches) mm (3.41 (1.41 (0.86 mm (32.17 mm (94.73 lbs)
(17.48 inches) inches) inches) inches) (33.39
inches) Ear to inches)
rear wall Ear to
PSU
handle

NOTE: Zb is the nominal rear wall external surface where the system board I/O connectors reside.

Chassis weight
Table 33. Chassis weight
System configuration Maximum weight (with all drives/SSDs)
A server with fully populated drives 42.97 kg (94.73 lbs)
A server without drives and PSU installed 13.09 kg (28.85 lbs)

NIC port specifications

The PowerEdge R860 system supports up to two 10/100/1000 Mbps Network Interface Controller (NIC) ports embedded on
the LAN on Motherboard (LOM) and integrated on the optional Open Compute Project (OCP) cards.

Table 34. NIC port specification for the system

Feature Specifications
LOM card (optional) 1 GbE x 2
OCP card (OCP 3.0) (optional) 1 GbE x 4, 10 GbE x 2, 10 GbE x 4, 25 GbE x 2, 25 GbE x 4,
100 GbE x 2

NOTE: The system allows either LOM card or an OCP card or both to be installed in the system.

Video specifications
The PowerEdge R860 system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.

Table 35. Supported video resolution options

Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60 8, 16, 32
1280 x 800 60 8, 16, 32
1280 x 1024 60 8, 16, 32
1360 x 768 60 8, 16, 32
1440 x 900 60 8, 16, 32
1600 x 900 60 8, 16, 32
1600 x 1200 60 8, 16, 32

68 Appendix A: Additional specifications

Table 35. Supported video resolution options (continued)
Resolution Refresh rate (Hz) Color depth (bits)
1680 x 1050 60 8, 16, 32
1920 x 1080 60 8, 16, 32
1920 x 1200 60 8, 16, 32

USB Ports

Figure 48. Front USB Port

Figure 49. Rear USB Port

Appendix A: Additional specifications 69

Figure 50. Internal USB Port

Table 36. System USB Specifications

Front Rear Internal
USB port type No. of ports USB port type No. of ports USB port type No. of ports
USB x.2.0 – 1 USB x.2.0 – compliant 1 USB x.3.0 – compliant 1
compliant port port
port
USB x.3.0 – compliant 1
port

PSU rating
Below table lists the power capacity the PSUs in high/low line operation mode.

Table 37. PSUs highline and lowline ratings

Features 1100 W 1400 W Platinum 1800 W Titanium 2400 W Platinum 2800 W Titanium
Titanium
Peak Power 1870 W 2380 W 3060 W 4080 W 4760 W
(Highline/-72
VDC)
Highline/-72 1100 W 1400 W 1800 W 2400 W 2800 W
VDC
Peak Power 1785 W 1785 W N/A 2380 W N/A
(Lowline/-40
VDC)
Lowline/-40 1050 W 1050 W N/A 1400 W N/A
VDC

70 Appendix A: Additional specifications

Table 37. PSUs highline and lowline ratings (continued)
Features 1100 W 1400 W Platinum 1800 W Titanium 2400 W Platinum 2800 W Titanium
Titanium
Highline 240 1100 W 1400 W 1800 W 2400 W 2800 W
VDC

The PowerEdge R860 supports up to two AC power supplies with 1+1 redundancy, autosensing, and auto switching capability.
If two PSUs are present during POST, a comparison is made between the wattage capacities of the PSUs. In case the PSU
wattages do not match, the larger of the two PSUs is enabled. Also, there is a PSU mismatch warning that is displayed in BIOS,
iDRAC, or on the system LCD.
If a second PSU is added at run-time, in order for that particular PSU to be enabled, the wattage capacity of the first PSU must
equal the second PSU. Otherwise, the PSU is flagged as unmatched in iDRAC and the second PSU is not enabled.
Dell PSUs have achieved Platinum efficiency levels as shown in the table below.

Table 38. PSU efficiency level

Efficiency Targets by Load
Form factor Output Class 10% 20% 50% 100%
Redundant 60 mm 1100 W AC Titanium 90.00% 94.00% 96.00% 91.50%
1400 W AC Platinum 89.00% 93.00% 94.00% 91.50%
1800 W AC Titanium 90.00% 94.00% 96.00% 94.00%
Redundant 86 mm 2400 W AC Platinum 89.00% 93.00% 94.00% 91.50%
2800 W AC Titanium 90.00% 94.00% 96.00% 94%

Environmental specifications
NOTE: For additional information about environmental certifications, refer to the Product Environmental Datasheet located
with the Documentation on [Link]/support/home.

Table 39. Continuous Operation Specifications for ASHRAE A2

Temperature Specifications
Allowable continuous operations
Temperature range for 10–35°C (50–95°F) with no direct sunlight on the equipment
altitudes <= 900 m (<=
2953 ft)
Humidity percent range 8% RH with -12°C (10.4°F) minimum dew point to 80% RH with 21°C (69.8°F) maximum dew
(non-condensing at all point
times)
Operational altitude de- Maximum temperature is reduced by 1°C/300 m (1.8°F/984 Ft) above 900 m (2953 Ft)
rating

Table 40. Continuous Operation Specifications for ASHRAE A3

Temperature Specifications
Allowable continuous operations
Temperature range for 5–40°C (41–104°F) with no direct sunlight on the equipment
altitudes <= 900 m (<=
2953 ft)
Humidity percent range 8% RH with -12°C (10.4°F) minimum dew point to 85% RH with 24°C (75.2°F) maximum dew
(non-condensing at all point
times)

Appendix A: Additional specifications 71

Table 40. Continuous Operation Specifications for ASHRAE A3 (continued)
Temperature Specifications
Operational altitude de- Maximum temperature is reduced by 1°C/175 m (1.8°F/574 Ft) above 900 m (2953 Ft)
rating

Table 41. Continuous Operation Specifications for ASHRAE A4

Temperature Specifications
Allowable continuous operations
Temperature range for 5–45°C (41–113°F) with no direct sunlight on the equipment
altitudes <= 900 m (<=
2953 ft)
Humidity percent range 8% RH with -12°C (10.4°F) minimum dew point to 90% RH with 24°C (75.2°F) maximum dew
(non-condensing at all point
times)
Operational altitude de- Maximum temperature is reduced by 1°C/125 m (1.8°F/410 Ft) above 900 m (2953 Ft)
rating

Table 42. Common Environmental Specifications for ASHRAE A2, A3 and A4

Temperature Specifications
Allowable continuous operations
Maximum temperature gradient (applies to both 20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in 15
operation and non-operation) minutes), 5°C in an hour* (9°F in an hour) for tape hardware
NOTE: *Per ASHRAE thermal guidelines for tape hardware, these are
not instantaneous rates of temperature change.

Non-operational temperature limits -40 to 65°C (-40 to 149°F)

Non-operational humidity limits 5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude 12,000 meters (39,370 feet)
Maximum operational altitude 3,050 meters (10,006 feet)

Table 43. Maximum vibration specifications

Maximum vibration Specifications
Operating 0.21 G rms at 5 Hz to 500 Hz for 10 minutes (all operation orientations)
Storage 1.88 G rms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)

Table 44. Maximum shock pulse specifications

Maximum shock pulse Specifications
Operating Six consecutively executed shock pulses in the positive and negative x, y,
and z axis of 6 G for up to 11 ms
Storage Six consecutively executed shock pulses in the positive and negative x, y,
and z axis (one pulse on each side of the system) of 71 G for up to 2 ms

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous
contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage
or failure, you may need to rectify the environmental conditions. Remediation of environmental conditions is the responsibility of
the customer.

72 Appendix A: Additional specifications

Table 45. Particulate contamination specifications
Particulate contamination Specifications
Air filtration Data center air filtration as defined by ISO Class 8 per ISO 14644-1
with a 95% upper confidence limit
NOTE: This condition applies to data center environments only. Air
filtration requirements do not apply to IT equipment designed to be
used outside a data center, in environments such as an office or
factory floor.

NOTE: Air entering the data center must have MERV11 or MERV13
filtration.

Conductive dust Air must be free of conductive dust, zinc whiskers, or other
conductive particles
NOTE: This condition applies to data center and non-data center
environments.

Corrosive dust ● Air must be free of corrosive dust

● Residual dust present in the air must have a deliquescent point less
than 60% relative humidity
NOTE: This condition applies to data center and non-data center
environments.

Walk-Up Edge Data Center or Cabinet (sealed, closed Filtration is not required for cabinets that are anticipated to be opened
loop environment) 6 times or less per year. Class 8 per ISO 1466-1 filtration as defined
above is required otherwise
NOTE: In environments commonly above ISA-71 Class G1 or that
may have known challenges, special filters may be required.

Table 46. Gaseous contamination specifications

Gaseous contamination Specifications
Copper coupon corrosion rate <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Silver coupon corrosion rate <200 Å/month as defined by ANSI/ISA71.04-2013

Thermal restriction matrix

Table 47. Processor and heat sink matrix
Heat sink Processor TDP
STD HSK ≤ 185 W
L-type HPR HSK 195 W–250 W
L-type VHPR HSK ≥ 270 W

Table 48. Label reference

Label Description
HPR High performance
VHPR Very High Performance
HSK Heat sink
LP Low Profile
FH Full Height

Appendix A: Additional specifications 73

 NOTE: The ambient temperature of the configuration is determined by the critical component in that configuration. For
example, if the processor's supported ambient temperature is 35°C (95°F), the DIMM is 35°C (95°F), and the GPU is
30°C (86°F), the combined configuration can only support 30°C (86°F).

Table 49. Thermal restriction matrix for air cooled configurations

16 x
24 x 2.5-inch 16 x 8x
16 x 2.5- 8x
2.5- SAS + 8 2.5- 2.5-
Configuration inch x 2.5- 24 x 2.5-inch SAS inch inch inch EDSFF
NVMe E3.S
NVMe inch SAS SAS
NVMe
2x Rear 4
No 2.5- No No
No Rear No Rear Rear x No Rear No Rear
Rear storage Drives Drives Drives inch EDSFF Drives Rear Rear Drives
SAS/ Drives Drives
E3.S
NVMe
CPU T-Case max Ambient temperature
TDP
SKUs center (°C)
35°C 35°C 45°C 35°C 35°C 35°C 45°C 45°C 35°C
6416H 165 W 82 (95°F) (95°F) (113°F (95°F (95°F) (95°F) (113°F) (113°F) (95°F)
) )
35°C 35°C 40°C 35°C 35°C 35°C 40°C 40°C 35°C
6418H 185 W 81 (95°F) (95°F) (104°F (95°F (95°F) (95°F) (104°F) (104°F) (95°F)
) )
35°C 35°C 40°C 35°C 35°C 35°C 40°C 40°C 35°C
6434H 195 W 64 (95°F) (95°F) (104°F (95°F (95°F) (95°F) (104°F) (104°F) (95°F)
) )
35°C 35°C 35°C 35°C 35°C 35°C
35°C 35°C 35°C
6448H 250 W 83 (95°F) (95°F) (95°F (95°F) (95°F) (95°F)
(95°F) (95°F) (95°F)
)
35°C 35°C 35°C 35°C 35°C 35°C
35°C 35°C 35°C
8450H 1 250 W 76 (95°F) (95°F) (95°F (95°F) (95°F) (95°F)
(95°F) (95°F) (95°F)
)
35°C 35°C 35°C 35°C 35°C 35°C
35°C 35°C 35°C
8444H 1 270 W 72 (95°F) (95°F) (95°F (95°F) (95°F) (95°F)
(95°F) (95°F) (95°F)
)
35°C 35°C 35°C 35°C 35°C 35°C
35°C 35°C 35°C
8454H 1 270 W 71 (95°F) (95°F) (95°F (95°F) (95°F) (95°F)
(95°F) (95°F) (95°F)
)
30°C 30°C 30°C 30°C 30°C 35°C 35°C 35°C 35°C
8460H 1 330 W 76 (86° F) (86° F) (86° (86° (86° F) (95°F) (95°F) (95°F) (95°F)
F) F)
30°C 30°C 30°C 30°C 30°C 35°C 35°C 35°C 35°C
8468H 1 330 W 77 (86° F) (86° F) (86° (86° (86° F) (95°F) (95°F) (95°F) (95°F)
F) F)
30°C 30°C 30°C 30°C 30°C 35°C 35°C 35°C 35°C
8490H 1 350 W 79 (86° F) (86° F) (86° (86° (86° F) (95°F) (95°F) (95°F) (95°F)
F) F)
Memory Ambient temperature
35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
256 GB RDIMM (95°F) (95°F) (95°F) (95°F (95°F) (95°F) (95°F) (95°F) (95°F)
)
35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
128 GB RDIMM (95°F) (95°F) (95°F) (95°F (95°F) (95°F) (95°F) (95°F) (95°F)
)

74 Appendix A: Additional specifications

Table 49. Thermal restriction matrix for air cooled configurations (continued)
16 x
24 x 2.5-inch 16 x 8x
16 x 2.5- 8x
2.5- SAS + 8 2.5- 2.5-
Configuration inch x 2.5- 24 x 2.5-inch SAS inch inch inch EDSFF
NVMe E3.S
NVMe inch SAS SAS
NVMe
2x Rear 4
No 2.5- No No
No Rear No Rear Rear x No Rear No Rear
Rear storage Drives Drives Drives inch EDSFF Drives Rear Rear Drives
SAS/ Drives Drives
E3.S
NVMe
96 GB RDIMM 1 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
(95°F) (95°F) (95°F) (95°F (95°F) (95°F) (95°F) (95°F) (95°F)
)
64 GB RDIMM N/A*
32 GB RDIMM N/A*
16 GB RDIMM N/A*

NOTE: DIMM blanks must be installed in empty DIMM slots.

NOTE: *Memory has the same thermal restrictions of the processor used.

NOTE: 1 Only the processors that are listed above can support 96 GB RDIMM.

Table 50. Thermal restriction matrix for Direct Liquid Cooled configurations
16 x 2.5-
24 x inch 16 x 8x
16 x 2.5- 8x
2.5- SAS + 8 2.5- 2.5-
Configuration 24 x 2.5-inch SAS inch EDSFF
inch x 2.5- inch inch
NVMe E3.S
NVMe inch SAS SAS
NVMe
2x Rear 4
No No 2.5- No No
No Rear x No Rear No Rear
Rear storage Rear Rear inch Rear Rear
Drives EDSFF Drives Drives
Drives Drives SAS/ Drives Drives
E3.S
NVMe
CPU T-Case max Ambient temperature
TDP
SKUs center (°C)
35°C 35°C 45°C 35°C 35°C 35°C 45°C 45°C 35°C
6416H 165 W 82 (95°F) (95°F) (113°F (95°F) (95°F) (95°F) (113°F) (113°F) (95°F)
)
35°C 35°C 45°C 35°C 35°C 35°C 45°C 45°C 35°C
6418H 185 W 81 (95°F) (95°F) (113°F (95°F) (95°F) (95°F) (113°F) (113°F) (95°F)
)
35°C 35°C 45°C 35°C 35°C 35°C 45°C 45°C 35°C
6434H 195 W 64 (95°F) (95°F) (113°F (95°F) (95°F) (95°F) (113°F) (113°F) (95°F)
)
45°C 35°C 45°C 45°C
35°C 35°C 35°C 35°C 35°C
6448H 250 W 83 (113°F (95°F) (113°F) (113°F)
(95°F) (95°F) (95°F) (95°F) (95°F)
)
45°C 35°C 45°C 45°C
35°C 35°C 35°C 35°C 35°C
8450H 1 250 W 76 (113°F (95°F) (113°F) (113°F)
(95°F) (95°F) (95°F) (95°F) (95°F)
)
45°C 35°C 45°C 45°C
35°C 35°C 35°C 35°C 35°C
8444H 1 270 W 72 (113°F (95°F) (113°F) (113°F)
(95°F) (95°F) (95°F) (95°F) (95°F)
)

Appendix A: Additional specifications 75

Table 50. Thermal restriction matrix for Direct Liquid Cooled configurations (continued)
16 x 2.5-
24 x inch 16 x 8x
16 x 2.5- 8x
2.5- SAS + 8 2.5- 2.5-
Configuration inch x 2.5- 24 x 2.5-inch SAS inch inch inch EDSFF
NVMe E3.S
NVMe inch SAS SAS
NVMe
2x Rear 4
No No 2.5- No No
No Rear x No Rear No Rear
Rear storage Rear Drives Rear inch EDSFF Drives Rear Rear Drives
Drives Drives SAS/ Drives Drives
E3.S
NVMe
45°C 35°C 45°C 45°C
35°C 35°C 35°C 35°C 35°C
8454H 1 270 W 71 (113°F (95°F) (113°F) (113°F)
(95°F) (95°F) (95°F) (95°F) (95°F)
)
35°C 35°C 45°C 35°C 35°C 35°C 45°C 45°C 35°C
8460H 1 330 W 76 (95°F) (95°F) (113°F (95°F) (95°F) (95°F) (113°F) (113°F) (95°F)
)
35°C 35°C 45°C 35°C 35°C 35°C 45°C 45°C 35°C
8468H 1 330 W 77 (95°F) (95°F) (113°F (95°F) (95°F) (95°F) (113°F) (113°F) (95°F)
)
35°C 35°C 45°C 35°C 35°C 35°C 45°C 45°C 35°C
8490H 1 350 W 79 (95°F) (95°F) (113°F (95°F) (95°F) (95°F) (113°F) (113°F) (95°F)
)
Memory Ambient temperature
35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
256 GB RDIMM
(95°F) (95°F) (95°F) (95°F) (95°F) (95°F) (95°F) (95°F) (95°F)
35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
128 GB RDIMM
(95°F) (95°F) (95°F) (95°F) (95°F) (95°F) (95°F) (95°F) (95°F)
35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
96 GB RDIMM 1
(95°F) (95°F) (95°F) (95°F) (95°F) (95°F) (95°F) (95°F) (95°F)
64 GB RDIMM N/A*
32 GB RDIMM N/A*
16 GB RDIMM N/A*

NOTE: DIMM blanks must be installed in empty DIMM slots.

NOTE: *Memory has the same thermal restrictions of the processor used.

NOTE: 1 Only the processors that are listed above can support 96 GB RDIMM.

Thermal air restrictions

Table 51. Air cooling thermal restriction for 24 x 2.5-inch NVMe/16 x 2.5-inch + 8 x NVMe/16 x NVMe
Storage Configurations
ASHRAE A2/35°C (95°F) A3/40°C (104°F) A4/45°C (113°F)
Processor CPUs ≥ 330 W are not supported. CPUs ≤ 195 W are supported. Only 165 W is supported

Maximum 30°C for CPU ≥ 330 W

PSU Two PSUs are required in redundant mode. If there is a PSU failure, system performance may be reduced.
PCIe card Non-Dell qualified peripheral cards and peripheral cards greater than 25 W are not supported.

76 Appendix A: Additional specifications

Table 51. Air cooling thermal restriction for 24 x 2.5-inch NVMe/16 x 2.5-inch + 8 x NVMe/16 x NVMe
Storage Configurations (continued)
ASHRAE A2/35°C (95°F) A3/40°C (104°F) A4/45°C (113°F)
GPU/FPGA Not supported
DIMM 256 GB RDIMMs only support 1DPC 128 GB, or greater capacity DIMMs are not supported.

Maximum 35°C for 128 GB RDIMM or

greater capacity RDIMMs

NVMe 2.5-inch NVMe storage is supported. 2.5-inch NVMe storage is not supported.
storage
OCP OCP cooling tier >5 is supported OCP cooling tier >5 is not supported

85°C active optics cable is required

BOSS BOSS-N1 is supported. BOSS-N1 is not supported.

Table 52. Air cooling configurations thermal restriction for 8 x 2.5-inch/16 x 2.5-inch Storage
Configuration
ASHRAE A2/35°C (95°F) A3/40°C (104°F) A4/45°C (113°F)
Processor CPUs ≥ 330 W are not supported. CPUs ≤ 195 W are supported. Only 165 W is supported

Maximum 30°C for CPU ≥ 330 W

PSU Two PSUs are required in redundant mode. If there is a PSU failure, system performance may be reduced.
PCIe card Non-Dell qualified peripheral cards and peripheral cards greater than 25 W are not supported.
GPU/FPGA Not supported
DIMM 256 GB RDIMMs only support 1DPC 128 GB, or greater capacity DIMMs are not supported.

Maximum 35°C for 128 GB RDIMM or

greater capacity RDIMMs

NVMe 2.5-inch NVMe storage is not supported.

storage
OCP OCP cooling tier >5 is supported OCP cooling tier >5 is not supported

85°C active optics cable is required

BOSS BOSS-N1 is supported. BOSS-N1 is not supported.

Appendix A: Additional specifications 77

 15
Appendix B. Standards compliance
The system conforms to the following industry standards.

Table 53. Industry standard documents

Standard URL for information and specifications
ACPIAdvance Configuration and Power Interface [Link]
Specification, v6.4
Ethernet IEEE Std 802.3-2022 [Link]
MSFT WHQL Microsoft Windows Hardware Quality Labs [Link]/whdc/system/platform/pcdesign/desguide/
[Link]
IPMI Intelligent Platform Management Interface, v2.0 [Link]/design/servers/ipmi
DDR5 Memory DDR5 SDRAM Specification [Link]/standards-documents/docs/[Link]
PCI Express PCI Express Base Specification, v5.0 [Link]/specifications/pciexpress
PMBus Power System Management Protocol Specification, [Link]
v1.2 PMBus_Specification_Part_I_Rev_1-1_20070205.pdf
SAS Serial Attached SCSI, 3 (SAS-3) (T10/INCITS 519) [Link]
SATA Serial ATA Rev. 3.3 [Link]
SMBIOS System Management BIOS Reference Specification, DMTF SMBIOS
v3.3.0
TPM Trusted Platform Module Specification, v1.2 and v2.0 [Link]
UEFI Unified Extensible Firmware Interface Specification, v2.7 [Link]/specifications
PI Platform Initialization Specification, v1.7
USB Universal Serial Bus v2.0 and SuperSpeed v3.0 (USB 3.1 USB Implementers Forum, Inc. [Link]
Gen1)
NVMe Express Base Specification. Revision 2.0c [Link]
NVMe Command Set Specifications
1. NVM Express NVM Command Set Specification. Revision
1.1c
2. NVM Express Zoned Namespaces Command Set. Revision
1.0c
3. NVM Express® Key Value Command Set. Revision 1.0c
NVMe Transport Specifications
1. NVM Express over PCIe Transport. Revision 1.0c
2. NVM Express RDMA Transport Revision. 1.0b
3. NVM Express TCP Transport. Revision 1.0c
NVMe NVM Express Management Interface. Revision 1.2c
NVMe NVMe Boot Specification. Revision 1.0

78 Appendix B. Standards compliance

 16
Appendix C Additional resources
Table 54. Additional resources
Resource Description of contents Location
Installation and Service Manual This manual, available in PDF format, [Link]/Support/Manuals
provides the following information:

● Chassis features
● System Setup program
● System indicator codes
● System BIOS
● Remove and replace procedures
● Diagnostics
● Jumpers and connectors
Getting Started Guide This guide ships with the system, and is [Link]/Support/Manuals
also available in PDF format. This guide
provides the following information:

● Initial setup steps

Rack Installation Guide This document ships with the rack kits, [Link]/Support/Manuals
and provides instructions for installing a
server in a rack.
System Information Label The system information label documents Inside the system chassis cover
the system board layout and system
jumper settings. Text is minimized due
to space limitations and translation
considerations. The label size is
standardized across platforms.
Quick Resource Locator (QRL) This code on the chassis can be scanned Inside the system chassis cover
by a phone application to access
additional information and resources for
the server, including videos, reference
materials, service tag information, and
Dell contact information.
Enterprise Infrastructure Planning Tool The Dell online EIPT enables easier [Link]/calc
(EIPT) and more meaningful estimates to
help you determine the most efficient
configuration possible. Use EIPT to
calculate the power consumption of
your hardware, power infrastructure, and
storage.

Appendix C Additional resources 79