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Problem 4 Simple Conduction

This document provides instructions for solving a simple 2D steady-state conduction problem using PLANE55 elements in ANSYS. Key steps include: 1) Creating a 1x1 rectangular geometry and meshing with 0.05 size PLANE55 elements. 2) Defining the material property of 10 W/m°C thermal conductivity. 3) Applying fixed temperature boundary conditions of 500°C on top and 100°C on other sides. 4) Solving for the steady-state temperature distribution and contour plotting the results.

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Raghu Kotha
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77 views4 pages

Problem 4 Simple Conduction

This document provides instructions for solving a simple 2D steady-state conduction problem using PLANE55 elements in ANSYS. Key steps include: 1) Creating a 1x1 rectangular geometry and meshing with 0.05 size PLANE55 elements. 2) Defining the material property of 10 W/m°C thermal conductivity. 3) Applying fixed temperature boundary conditions of 500°C on top and 100°C on other sides. 4) Solving for the steady-state temperature distribution and contour plotting the results.

Uploaded by

Raghu Kotha
Copyright
© Attribution Non-Commercial (BY-NC)
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as DOC, PDF, TXT or read online on Scribd

Problem 4 Simple Conduction

Discipline : Thermal

Analysis Type: Steady State Element Types Used : PLANE55 (Thermal Solid, Quad 4node 55) Problem Description Solve a simple conduction problem which is constrained as shown in the following figure. Thermal conductivity (k) of the material is 10 W/m C. The block is assumed to be infinitely long.

Preprocessor

1. Give example a Title 2. Create geometry Preprocessor > Modeling > Create > Areas > Rectangle > By 2 Corners > X=0, Y=0, Width=1, Height=1 3. Define the Type of Element Preprocessor > Element Type > Add/Edit/Delete... > click 'Add' > Select Thermal Solid, Quad 4 Node 55 For this example, we will use PLANE55 (Thermal Solid, Quad 4node 55). This element has 4 nodes and a single DOF (temperature) at each node. PLANE55 can only be used for 2 dimensional steady-state or transient thermal analysis. 4. Element Material Properties Preprocessor > Material Props > Material Models > Thermal > Conductivity > Isotropic > KXX = 10 (Thermal conductivity) 5. Mesh Size Preprocessor > Meshing > Size Controls > Manual Size > Areas > All Areas > 0.05 6. Mesh Preprocessor > Meshing > Mesh > Areas > Free > Pick All

Solution
1. Define Analysis Type Solution > Analysis Type > New Analysis > Steady-State
ANTYPE,0

2. Apply Constraints For thermal problems, constraints can be in the form of Temperature, Heat Flow, Convection, Heat Flux, Heat Generation, or Radiation. In this example, all 4 sides of the block have fixed temperatures. Solution > Define Loads > Apply Note that all of the -Structural- options cannot be selected. This is due to the type of element (PLANE55) selected. Thermal > Temperature > On Nodes

Click the Box option (shown below) and draw a box around the nodes on the top line. A window will appear:

Fill the window to constrain the side to a constant temperature of 500 Using the same method, constrain the remaining 3 sides to a constant value of 100 Orange triangles in the graphics window indicate the temperature contraints. 3. Solve the System Solution > Solve > Current LS

Postprocessor

1. Results Using ANSYS Plot Temperature General Postproc > Plot Results > Contour Plot > Nodal Solu ... > DOF solution, Temperature

Note that due to the manner in which the boundary conditions were applied, the top corners are held at a temperature of 100. Recall that the nodes on the top of the plate were constrained first, followed by the side and bottom constraints. The top corner nodes were therefore first constrained at 500C, then 'overwritten' when the side constraints were applied. Decreasing the mesh size can minimize this effect; however, one must be aware of the limitations in the results at the corners.

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