MBRA340T3

Surface Mount
Schottky Power Rectifier
SMA Power Surface Mount Package
Employing the Schottky Barrier principle in a large area
metal−to−silicon power diode. State of the art geometry features
epitaxial construction with oxide passivation and metal overlay [Link]
contact. Ideally suited for low voltage, high frequency rectification, or
as free wheeling and polarity diodes in surface mount applications SCHOTTKY BARRIER
where compact size and weight are critical to the system. RECTIFIER
Features 3.0 AMPERES
• Small Compact Surface Mountable Package with J−Bent Leads 40 VOLTS
• Rectangular Package for Automated Handling
• Highly Stable Oxide Passivated Junction 1 2
Cathode Anode
• Very Low Forward Voltage Drop
• Guardring for Stress Protection
1
• Pb−Free Package is Available
Mechanical Characteristics:
• Case: Epoxy, Molded 2
• Weight: 70 mg (approximately) SMA
CASE 403D
• Finish: All External Surfaces Corrosion Resistant and Terminal PLASTIC
Leads are Readily Solderable
• Lead and Mounting Surface Temperature for Soldering Purposes: MARKING DIAGRAM
260°C Max. for 10 Seconds
• Shipped in 12 mm tape, 5000 units per 13 inch reel A34
• Polarity: Cathode Lead Indicated by Polarity Band AYWWG

• ESD Ratings: Machine Model = C

ESD Ratings: Human Body Model = 3B A34 = Device Code
• Device Meets MSL 1 Requirements
A
Y
= Assembly Location
= Year
WW = Work Week
MAXIMUM RATINGS
G = Pb−Free Package
Rating Symbol Value Unit
Peak Repetitive Reverse Voltage VRRM 40 V
Working Peak Reverse Voltage VRWM ORDERING INFORMATION
DC Blocking Voltage VR
Device Package Shipping †
Average Rectified Forward Current IO 3.0 A
(At Rated VR, TL = 100°C) MBRA340T3 SMA 5000/Tape & Reel
Non−Repetitive Peak Surge Current IFSM 100 A SMA
(Surge Applied at Rated Load Conditions MBRA340T3G 5000/Tape & Reel
(Pb−Free)
Halfwave, Single Phase, 60 Hz)
†For information on tape and reel specifications,
Storage/Operating Case Temperature Tstg, TC −55 to +150 °C
including part orientation and tape sizes, please
Operating Junction Temperature (Note 1) TJ −55 to +150 °C refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Voltage Rate of Change dv/dt 10,000 V/ms
(Rated VR, TJ = 25°C)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. The heat generated must be less than the thermal conductivity from
Junction−to−Ambient: dPD/dTJ < 1/RqJA.

© Semiconductor Components Industries, LLC, 2006 1 Publication Order Number:

October, 2006 − Rev. 4 MBRA340T3/D
 MBRA340T3

THERMAL CHARACTERISTICS
Characteristic Symbol Value Unit

Thermal Resistance − Junction−to−Lead (Note 2) RθJL 15 °C/W

Thermal Resistance − Junction−to−Ambient (Note 2) RθJA 81

ELECTRICAL CHARACTERISTICS
VF TJ = 25°C TJ = 100°C Volts
Maximum Instantaneous Forward Voltage (Note 3)
(IF = 3.0 A) 0.450 0.390
IR TJ = 25°C TJ = 100°C mA
Maximum Instantaneous Reverse Current
(VR = 40 V) 0.3 15
2. Mounted on 2″ Square PC Board with 1″ Square Total Pad Size, PC Board FR4.
3. Pulse Test: Pulse Width ≤ 250 μs, Duty Cycle ≤ 2.0%.

TYPICAL CHARACTERISTICS

10 10
IF, INSTANTANEOUS FORWARD

IF, INSTANTANEOUS FORWARD

CURRENT (AMPS)

CURRENT (AMPS)

1 T = 125°C 1
J
TJ = 125°C

TJ = 100°C

TJ = 100°C TJ = 25°C TJ = −55°C TJ = 25°C TJ = −55°C

0.1 0.1
0.10 0.20 0.30 0.40 0.50 0.60 0.10 0.20 0.30 0.40 0.50 0.60
VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) VF, MAXIMUM INSTANTANEOUS FORWARD
VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage
IR, MAXIMUM REVERSE CURRENT (AMPS)

100E−3 100E−3
TJ = 125°C TJ = 125°C
IR, REVERSE CURRENT (AMPS)

10E−3
1E−3 10E−3
TJ = 100°C
TJ = 100°C
100E−6
1E−3
10E−6
TJ = 25°C
1E−6 TJ = 25°C
100E−6
100E−9 TJ = −55°C TJ = −55°C
10E−9 10E−6
1E−9
100E−12 1E−6
0 10 20 30 40 0 10 20 30 40
VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS)

Figure 3. Typical Reverse Current Figure 4. Maximum Reverse Current

[Link]
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 MBRA340T3

TYPICAL CHARACTERISTICS
IO, AVERAGE FORWARD CURRENT (AMPS)

PFO, AVERAGE POWER DISSIPATION (WATTS)

5 1.8
freq = 20 kHz
4.5 dc 1.6
SQUARE
4 1.4 WAVE
3.5 SQUARE WAVE dc
1.2
3
Ipk/IO = p 1.0
2.5
Ipk/IO = 5 0.8 Ipk/IO = p
2
0.6 Ipk/IO = 5
1.5 Ipk/IO = 10
1 0.4
Ipk/IO = 20 Ipk/IO = 10
0.5 0.2
Ipk/IO = 20
0 0
25 45 65 85 105 125 145 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
TL, LEAD TEMPERATURE (°C) IO, AVERAGE FORWARD CURRENT (AMPS)

Figure 5. Current Derating Figure 6. Forward Power Dissipation

TJ, DERATED OPERATING TEMPERATURE (°C)

1000 125
TJ = 25 °C
RqJA = 22 °C/W
115
C, CAPACITANCE (pF)

105 RqJA = 43 °C/W

95 RqJA = 63 °C/W

85
RqJA = 81 °C/W
75
RqJA = 96 °C/W
65

100 55
0 5 10 15 20 25 30 35 40 0 5 10 15 20 25 30 35 40
VR, REVERSE VOLTAGE (VOLTS) VR, DC REVERSE VOLTAGE (VOLTS)

Figure 7. Capacitance Figure 8. Typical Operating Temperature

Derating

[Link]
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 MBRA340T3

R(t), TRANSIENT THERMAL RESISTANCE (°C/W)

100
D = 0.5
0.2
0.1
10 0.05

0.02
0.01
1

SINGLE PULSE
0.1
0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000
t, TIME (S)
Figure 9. Thermal Response, Junction−to−Ambient (min pad)
R(t), TRANSIENT THERMAL RESISTANCE (°C/W)

100

D = 0.5

0.2
10 0.1
0.05
0.02
1 0.01

SINGLE PULSE
0.1
0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000
t, TIME (S)
Figure 10. Thermal Response, Junction to Ambient (1 inch pad)

[Link]
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 MBRA340T3

PACKAGE DIMENSIONS

SMA
CASE 403D−02
ISSUE C

HE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
E Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 403D−01 OBSOLETE, NEW STANDARD IS 403D−02.

MILLIMETERS INCHES
DIM MIN NOM MAX MIN NOM MAX
b D A 1.91 2.16 2.41 0.075 0.085 0.095
A1 0.05 0.10 0.15 0.002 0.004 0.006
b 1.27 1.45 1.63 0.050 0.057 0.064
c 0.15 0.28 0.41 0.006 0.011 0.016
D 2.29 2.60 2.92 0.090 0.103 0.115
POLARITY INDICATOR
OPTIONAL AS NEEDED E 4.06 4.32 4.57 0.160 0.170 0.180
(SEE STYLES) HE 4.83 5.21 5.59 0.190 0.205 0.220
L 0.76 1.14 1.52 0.030 0.045 0.060

A1
L c

SOLDERING FOOTPRINT*

4.0
0.157

2.0
0.0787

2.0
0.0787

SCALE 8:1 ǒinches

mm Ǔ

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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PUBLICATION ORDERING INFORMATION

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Email: orderlit@[Link] Phone: 81−3−5773−3850 Sales Representative

[Link] MBRA340T3/D
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