Type 5 SAC305 Lead Free

Solder Paste
4900P5

Description
The 4900P5 Type 5 SAC305 Lead Free Solder Paste is an electronic grade solder paste that is lead free
and halogen free, and which offers a robust flux activity. It meets and exceeds requirements for both the
RoHS and J-STD-006 impurity level limits.

Applications & Usages

The solder paste is designed to accommodate high speed printing. It can yield brick-like prints even when
using an ultra-fine pitch stencils down to 0.3 mm.

Benefits and Features

 Excellent wettability with uncoated copper or with
copper coated with organic solderability preservatives COMPLIANCE
 Dobb-Frank (DRC conflict free)
 Suitable for air or nitrogen atmosphere  REACH (compliant)
 Long tack-time  RoHS (compliant)

 Medium soft, non-cracking resides

Solder Allow Composition

Properties Value Properties Value
a)
MAIN INGREDIENTS IMPURITIES
Sn 96.8 to 95.7% Pb ≤0.05% Max
Ag 02.8 to 3.2% Sb ≤0.05% Max
Cu 00.4 to 0.6% Bi ≤0.05% Max
In ≤0.05% Max
As ≤0.01% Max
Fe ≤0.01% Max
Ni ≤0.005% Max
Au ≤0.002% Max
Al ≤0.001% Max
Cd ≤0.001% Max
Zn ≤0.001% Max

a) Exceeds impurity requirements of J-STD-006

Particle Size
The powder distribution complies with the J-STD-005 Type 5 (25-15 µm) particle sizes. Solder powder
distribution is measured utilizing laser diffraction, optical analysis and sieve analysis. Careful control of
solder powder manufacturing processes ensures the particles’ shape are 95% spherical minimum (aspect
ratio < 1.5) and that the alloy contains a typical maximum oxide level of 80 ppm.

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Properties of Type 5 SAC305 Lead Free Solder Paste

Flux Properties Method Value
Flux Classification J-STD-004 ROL0
Flux Type Rosin
Flux Activity Low
Halides %(wt) <0.05%
Acid Number (mgKOH/g sample) IPC-TM-650 2.3.13 117
Copper Mirror IPC-TM-650 2.3.32 No removal of copper film
Corrosion Test IPC-TM-650 2.6.15 Pass
Surface Insulation Resistance (SIR) IPC-TM-650 2.6.3.3 2.01 x 1010 Ω
Bellcore (Telecordia) Bellcore GR-78-CORE 13.1.3 5.25 x 1011 Ω
Electromigration Bellcore GR-78-CORE 13.1.4 Pass
Post Reflow Flux Residue TGA Analysis 5.5%

Paste Properties Method Value

Metal Loading IPC-TM-650 2.2.20 88.5%
Viscosity
Malcom(2), poise IPC-TM-650 2.4.34.3 modified 1600-1900
Thixotropic Index 0.50-0.60
Slump Test
25 °C, 0.63 vertical/horizontal IPC-TM-650 2.4.35 No bridges all spacings
150 °C, 0.63 vertical/horizontal " "
25 °C, 0.33 vertical/horizontal " "
150 °C, 0.33 vertical/horizontal " "
Solder Ball Test IPC-TM-650 2.4.43 Pass
Tack
Initial JIS Z 3284 124 gf
Tack retention @ 24 h " 111 gf
Tack retention @ 72 h " 98 gf
Stencil Life QIT 3.44.5 >8 h
Abandon Time QIT 3.44.6 60 min

Note: The force in grams is denoted with the units gf.

Pressure
The pressure applied in the syringe should be kept at a minimum, and the proper head pressure kept in
the range of 0.6-1.5 lb/in (107–270 g/cm) according to the length of the blade. The external air pressure
supply should be maintained constant.

Solder Paste Application

Solder paste should be taken out of the refrigerator at least 3 to 6 hours prior to use. This will give the
paste enough time to come to thermal equilibrium with the environment. The flow rate of paste in a
dispensing application depends on viscosity, which can be altered by temperature change. If solder paste
is purchased in syringes pre-mixing is not necessary due to the shear action produced from the
dispensing.
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Reflow
Best results have been achieved when DSP 825HF is reflowed in a forced air convection oven with a
minimum of 7 zones (top and bottom).
The following is a recommended profile for a forced air convection reflow process. The melting
temperature of the solder, the heat resistance of the components, and the characteristics of the PCB (i.e.
density, thickness, etc.) determine the actual reflow profile.

Preheat Zone—The preheat zone, is also referred to as the ramp zone, and is used to elevate the
temperature of the PCB to the desired soak temperature. In the preheat zone the temperature of the PCB
is constantly rising, at a rate that should not exceed 2.5 C/sec. The oven’s preheat zone should normally
occupy 25-33% of the total heated tunnel length.
The Soak Zone—normally occupies 33-50% of the total heated tunnel length exposes the PCB to a
relatively steady temperature that will allow the components of different mass to be uniform in
temperature. The soak zone also allows the flux to concentrate and the volatiles to escape from the
paste.

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The Reflow Zone—or spike zone is to elevate the temperature of the PCB assembly from the activation
temperature to the recommended peak temperature. The activation temperature is always somewhat
below the melting point of the alloy, while the peak temperature is always above the melting point.

Cleaning
The 4900P5 is a no clean formulation therefore the residues do not need to be removed for typical
applications. If residue removal is desired, use MG 8241-T or 8241-W Isopropyl Alcohol Wipes.

Storage and Shelf Life

Store refrigerated between 2-10°C [35-50°F] to minimize solvent evaporation, flux separation, and
chemical activity. Storage of syringes is preferred in an upright position with tip down to prevent flux
separation and air entrapment. Use at room temperature, warm up can be achieved by removing from
refrigerator 3 hours before use, faster warm up can also be achieved by placing in a sealed container in a
water bath at near ambient temperature for 30 minutes.
Unopened Container (35-50 °F/2-10 °C) 12 months (from DOM)
Unopened Container (68-77 °F/20-25 °C) 6 months (from DOM)

Reusing Solder Paste

This is not normally recommended, because it typically generates more problems than it is worth. If you
do decide to reuse solder paste, these pointers may be helpful. This paste should be tightly sealed and
refrigerated. Then, the paste may be reused at a later date, provided that the paste has not separated or
thickened significantly compared to its original properties. Storage of syringes is preferred in an upright
position with tip down to prevent flux separation and air entrapment.

Working Environment
Solder paste performs best when used in a controlled environment. Maintaining ambient temperature of
between 68-77 °F (20-25 °C) at a relative humidity of 40-65% will ensure consistent performance and
maximum life of paste.

Cleaning Misprint Boards

If you should have a misprinted board, the paste may be cleaned off manually with MG 8241 Alcohol
Wipes.

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Stencil Cleaning
Periodic cleaning of the stencil during production is recommended to prevent any paste from being
deposited in unwanted areas of the board. Without stencil cleaning, solder balling will increase. We
recommend a periodic dry wipe (every 5 to 10 boards) with an occasional MG 8241-T or 8241-W Alcohol
Wipe (every 15 to 25 boards). When running fine pitch boards, the cleaning may need to become more
frequent.

Disposal
The 4900P5 should be stored in a sealed container and disposed of in accordance with state & local
authority requirements.

Health and Safety

Please see the 4900P5 Type 5 SAC305 Lead Free Solder Paste Safety Data Sheet (SDS) for more details
on transportation, storage, handling and other security guidelines.
Environmental Impact: This product doesn’t have any known environmental toxicity.
This product meets the European Directive
2011/65/EU Annex II (ROHS);
recasting 2002/95/EC.
Health and Safety: This product is not considered to be hazardous for human health under normal use.
It is widely used in the packing and food industry.
HMIS® RATING NFPA® 704 CODES

HEALTH: * 1
0
FLAMMABILITY: 0
1 0
PHYSICAL HAZARD: 0
PERSONAL PROTECTION:

Approximate HMIS and NFPA Risk Ratings Legend:

0 (Low or none); 1 (Slight); 2 (Moderate); 3 (Serious); 4 (Severe)

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Technical Support
Contact us regarding any questions, improvement suggestions, or problems with this product. Application
notes, instructions, and FAQs are located at www.mgchemicals.com.
Email: [email protected]
Phone: +1-800-340-0772 (Canada, Mexico & USA)
+1-905-331-1396 (International)
Fax: +1-905-331-2862 or +1-800-340-0773

Mailing address: Manufacturing & Support Head Office

1210 Corporate Drive 9347–193rd Street
Burlington, Ontario, Canada Surrey, British Columbia, Canada
L7L 5R6 V4N 4E7

Warranty
M.G. Chemicals Ltd. warranties this product for 12 months from the date of purchase by the end user.
M.G. Chemicals Ltd. makes no claims as to shelf life of this product for the warranty. The liability of M.G.
Chemicals Ltd. whether based on its warranty, contracts, or otherwise shall in no case include incidental or
consequential damage.

Disclaimer
This information is believed to be accurate. It is intended for professional end users having the skills to
evaluate and use the data properly. M.G. Chemicals Ltd. does not guarantee the accuracy of the data and
assumes no liability in connection with damages incurred while using it.

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