AP5725

WHITE LED STEP-UP CONVERTER

Description Pin Assignments

The AP5725 is a step-up DC/DC converter specifically (Top View)

designed to drive white LEDs with a constant current. The
device can drive 2 ~ 6 LEDs in series from a Li-Ion cell. SW 1 6 VIN (Top View)
Series connection of the LEDs provides identical LED
SW 1 6 GND
currents resulting in uniform brightness and eliminates the GND 2 5 OVP
need for ballast resistors. For driving higher number of LEDs, VIN 2 5 FB
AP5725 also supports a single feedback of parallel FB 3 74 EN OVP 3 4 EN
connected multiple strings of equal number of LEDs.
SOT26 / TSOT23-6 DFN2020C-6
The AP5725 switches at 1.2MHz that allows the use of tiny
external components. A low 0.25V feedback voltage
minimizes power loss in the current setting resistor for better
efficiency.

Features Applications

• High efficiency: 84% typical • Cellular Phones

• Fast 1.2MHz switching frequency • PDAs, Hand held Computers
• Current limit and UVLO protections • Digital Cameras
• Internal thermal shutdown • MP3 Players
• Internal Over Voltage Protection • GPS Receivers
• Integrated soft-start function
• SOT26, TSOT23-6 and DFN2020C-6: Available in
“Green” Molding Compound (No Br, Sb)
• Lead Free Finish/ RoHS Compliant (Note 1)

Notes: 1. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied. Please visit our website at
http://www.diodes.com/products/lead_free.html.

Typical Application Circuit

L1
D1
22uH
VIN
COUT
C IN 1uF
1uF
V IN SW 2~6 LEDs

ON OFF AP5725 OVP

EN FB
PWM Dimming
RSET
GND 12

Figure 1. Typical Application Circuit

AP5725 1 of 17 July 2010

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Pin Descriptions

Pin Name Description

SW Switch Pin. Connect inductor/diode here. Minimize trace area at this pin to reduce EMI.
GND GND pin.
Feedback Pin. Reference voltage is 0.25V. Connect cathode of lowest LED and a sense
FB
resister here. Calculate resistor value according to the formula: RSET = 0.25V / ILED
Converter On/Off Control Input. A high input at EN turns the converter On, and a low input
EN turns it off. If On/Off control is not needed, connect EN to the input source for automatic
startup. The EN pin cannot be left floating.
OVP Output Voltage detect pin for over voltage protection.
VIN Input Supply Pin. Must be locally bypassed with 1μF or 2.2μF to reduce input noise.

Functional Block Diagram

OVP
5

1 SW
Comparator
Driver
-

A2 Q1
CONTROL
+

Rc LOGIC
A1 OTP
- + Cc
FB 3

VREF
+

VIN 6
0.25V Σ
-

RAMP
Generator
2 GND
EN 4 Enable

1.2MHz
Oscillator

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Absolute Maximum Ratings

Symbol Parameter Rating Unit

VIN VIN Pin Voltage -0.3~7 V
VSW SW Voltage -0.3~34 V
VOVP OVP Pin Voltage -0.3~35 V
VFB Feedback Pin Voltage -0.3~7 V
EN EN -0.3~7 V
o
TJ(MAX) Maximum Junction Temperature 150 C
o
TLEAD Lead Temperature 300 C
o
TST Storage Temperature Range -65 to +150 C
Caution: Operation above the absolute maximum ratings can cause device failure. These values, therefore, must not be exceeded under
any condition. Operation at the absolute maximum rating for extended periods, may reduce device reliability.

Recommended Operating Conditions

Symbol Parameter Min Max Unit

VIN Input Voltage 2.7 5.5 V
o
TJ Operating Junction Temperature -40 125 C
o
TA Operating Ambient Temperature -40 85 C

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Electrical Characteristics (VIN = 3.6V, TA = 25°C, unless otherwise specified.)

Symbol Parameter Conditions Min Typ. Max Unit

System Supply Input
VIN Operating Input Voltage 2.7 - 5.5 V
UVLO Under Voltage Lockout - 2.2 2.4 V
Under Voltage Lockout Hysteretic - 85 - mV
IQ Quiescent Current FB=0.35V, No Switching - 500 - μA
ISD Shutdown Current VEN < 0.4V - 0.1 1 μA
Oscillator
FOSC Operation Frequency 1 1.2 1.4 MHz
Dmax Maximum Duty Cycle 86 90 - %
Reference Voltage
VFB Feedback Voltage 0.225 0.25 0.275 V
IFB FB Pin Bias Current 10 45 100 nA
MOSFET
Rds(on) On Resistance of MOSFET - 0.95 1.2 Ω
IOCP Switching Current Limit Normal Operation - 750 - mA
Control and Protection
EN Voltage High ON 1.5 - - V
EN Voltage Low OFF - - 0.4 V
IEN EN Pin Pull Low Current - 4 6 μA
OVP OVP Threshold 26 30 34 V
SOT26 (Note 2) 162
Thermal Resistance Junction-to- o
θJA TSOT23-6 (Note 2) 152 C/W
Ambient
DFN2020C-6 (Note2) 200
SOT26 (Note 2) 36
Thermal Resistance Junction-to- o
θJC TSOT23-6 (Note 2) 32 C/W
Case
DFN2020C-6 (Note 2) 30
Notes: 2. Test condition for SOT26, TSOT23-6 and DFN2020C-6: Device mounted on FR-4 substrate, single-layer PC board, 2oz copper,
with minimum recommended pad layout

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Typical Performance Characteristics (6 LEDs ; VIN = 3.6V ; IOUT = 25mA)

VIN vs. Shutdown Current VIN vs. Quiescent Current

1 700
Shutdown Current(uA)

Quiescent Current(uA)
600
0.8
500
0.6
400
0.4 300
200
0.2
100
0
0
2.5 3 3.5 4 4.5 5 5.5
VIN (V) 2.5 3 3.5 4 4.5 5 5.5
VIN (V)

VIN vs. Frequency VIN vs. Max Duty

1.25 100

1.2
Frequency(MHz)

95
Max Duty(%)

1.15
90
1.1

85
1.05

1 80
2.5 3 3.5 4 4.5 5 5.5 2.5 3 3.5 4 4.5 5 5.5
VIN (V) VIN(V)

VIN vs. Feedback Voltage IOUT vs. Feedback Voltage

0.3 0.3
Feedback Voltage(V)

0.28
Feedback Voltage(V)

0.28

0.26 0.26

0.24 0.24

0.22 0.22

0.2 0.2
2.5 3 3.5 4 4.5 5 5.5 0 10 20 30 40 50
VIN (V) I OUT (mA)

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Typical Performance Characteristics (Continued)

V IN vs. OVP Threshold Temperature vs. Shutdown Current

35 1

Shutdown Current(uA)
33
OVP Threshold(V)

0.8

31 0.6

29 0.4

27 0.2

25 0
2.5 3 3.5 4 4.5 5 5.5 -50 -25 0 25 50 75 100 125
V IN (V) Temperature (℃)

Temperature vs. OVP Threshold Tem perature vs. Frequency

35 1.7
V IN = 4.2V
30 1.4
OVP Threshold(V)

Frequency (MHZ)

25 1.1 V IN = 3.6V

20 0.8

15 0.5

10 0.2
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125
Temperature (℃) Tem perature (℃)

Temperature vs. Feedback Voltage

0.28

0.27
Feedback Voltage(V)

VIN = 4.2V
0.26

0.25 VIN = 3.6V

0.24

0.23
-50 -25 0 25 50 75 100 125
Temperature(℃ )

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Typical Performance Characteristics (Continued)

IOUT vs. Efficiency IOUT vs. Efficiency

90 90

85 V IN = 4.2V 85
VIN = 4.2V
Efficiency(%)

80

Efficiency(%)
80

75 V IN = 3.6V 75
VIN = 3.6V
70 70

65 65
4 LEDs ; L = 22uH
6 LEDs ; L = 22uH
60 60
0 5 10 15 20 25 30 0 5 10 15 20 25 30
IOUT (m A) IOUT (mA)

VIN vs. Efficiency

100

90 3 LEDs 4 LEDs
Efficiency(%)

80
6 LEDs
70

60

50

40
2.5 3 3.5 4 4.5 5
VIN (V)

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Typical Performance Characteristics (Continued)

VOUT Ripple VOUT Ripple

VIN = 3.6V; 4 LEDs ; IOUT = 30mA VIN = 3.6V; 6 LEDs ; IOUT = 30mA

SW SW

VOUT VOUT

POWER ON POWER OFF

VIN = 3.6V; 6 LEDs ; IOUT = 30mA VIN = 3.6V; 6 LEDs ; IOUT = 30mA

VEN VEN

VOUT VOUT

Irushi Irushin
g

AP5725 8 of 17 July 2010

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Applications Information

Inductor Selection
A 10μH~22μH inductor is recommended for most AP5725 applications. For high efficiency the inductor should
have low core losses at 1.2MHz and low DCR (copper wire resistance). The inductor saturation current rating
should also exceed the peak input current, especially for high load current applications (like 3S8P).

Capacitor Selection
The small size of ceramic capacitors are ideal for AP5725 applications. X5R and X7R types are recommended
because they retain their capacitance over wider voltage and temperature ranges than other types such as Y5V or
Z5U. A 1μF input capacitor and a 1μF output capacitor are sufficient for most AP5725 applications. For high
output current applications like 3S8P, larger output capacitor of 2.2uF ~ 4.7uF is recommended to minimize output
ripple.

Diode Selection
Schottky diodes, with their low forward voltage drop and fast reverse recovery, are the ideal choices for AP5725
applications. The forward voltage drop of a Schottky diode represents the conduction losses in the diode, while
the diode capacitance (CT or CD) represents the switching losses. For diode selection, both forward voltage drop
and diode capacitance need to be considered. Schottky diodes with higher current ratings usually have lower
forward voltage drop and larger diode capacitance, which can cause significant switching losses at the 1.2MHz
switching frequency of the AP5725. Schottky diodes with higher current ratings usually have lower forward voltage
drop and larger diode capacitance. Larger Schottky diode capacitance can cause significant switching losses at
the 1.2MHz switching frequency of the AP5725. A Schottky diode rated at 100mA to 200mA is sufficient for most
AP5725 applications.

LED Current Control

The LED current is controlled by the feedback resistor (RSET in Figure 1). The feedback reference is 0.25V. The
LED current is 0.25V/ RSET. In order to have accurate LED current, precision resistors are preferred (1% is
recommended). The formula and table for RSET selection are shown below.
RSET = 0.25V/ILED (See Table 1)

Table 1. RSET Resistor Value Selection

ILED (mA) RSET (Ω)
5 50
10 25
15 16.6
20 12.5
30 8.3

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Applications Information (Continued)

Open-Circuit Protection
In the cases of output open circuit, when the LEDs are disconnected from the circuit or the LEDs fail, the feedback
voltage will be zero. The AP5725 will then switch at a high duty cycle resulting in a high output voltage, which may
cause the SW and OVP pin voltage to exceed the voltage rating of these pins. The OVP pin monitors the output
voltage. If the output voltage reaches the over voltage protection threshold at the OVP pin (Figure 2), the over
voltage protection is activated and SW pin stops switching.

L1
D1
22uH
VIN
COUT
C IN 1uF
1uF
V IN SW
x
AP5725 OVP x
EN FB
RSET
GND 12

Figure 2. LED Driver with Open-Circuit Protection

Dimming Control
There are four different types of dimming control circuits:

1. Using a PWM Signal to EN Pin

With the PWM signal applied to the EN pin, the AP5725 is turned on or off by the PWM signal. The LEDs operate
at either zero or full current. The average LED current increases proportionally with the duty cycle of the PWM
signal. A 0% duty cycle will turn off the AP5725 and corresponds to zero LED current. A 100% duty cycle
corresponds to full current. The typical frequency range of the PWM signal is below 2kHz.

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Applications Information (Continued)

2. Using a DC Voltage
For some applications, the preferred method of brightness control is a variable DC voltage to adjust the
LED current. The dimming control using a DC voltage is shown in Figure 3. As the DC voltage increases, the
voltage drop on R2 increases and the voltage drop on RSET decreases. Thus, the LED current decreases. The
selection of R2 and R3 will make the current from the variable DC source much smaller than the LED current and
much larger than the FB pin bias current. For VDC range from 0V to 2V, the selection of resistors in Figure 3 gives
dimming control of LED current from 0mA to 20mA.

AP5725

FB
R3 R2
100k 5k
VDC
RSET
12

Figure 3. Dimming Control Using a DC Voltage

3. Using a Filtered PWM Signal

The filtered PWM signal can be considered as an adjustable DC voltage. It can be used to replace the variable
DC voltage source in dimming control.

4. Using a Logic Signal

For applications that need to adjust the LED current in discrete steps, a logic signal can be used as shown in
Figure 4. RSET sets the minimum LED current (when the NMOS is off). RSET sets how much the LED current
increases when the NMOS is turned on.

AP5725

FB

RINC

Logic RSET
Signal

Figure 4. Dimming Control Using a Logic Signal

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Applications Information (Continued)

VOUT VIN

L1 22uH
C1 D2 D1 B0540WS C2
1uF 1uF
LED U1
1 6
SW Vin
2 5
D3 GND OVP
R1 3 4
LED 12ohm FB EN
ON OFF
AP5725

D4
LED

D5
LED

D6
LED

D7
LED

Table 2. Suggested Inductors

Inductors Current Rating Dimensions
Vendor Type Series
(uH) (A) (mm)
Wurth Electronics 22 0.51A SMD 3.8X 3.8 X 1.6 744031220
GOTREND 22 0.56A SMD 3.8 X 3.8 X 1.05 GLP3810PH220N
TAIYO YUDRN 22 0.51A SMD 4.0 X 4.0 X 1.25 NR4012

Table 3. Suggested Capacitors for CIN and COUT

Vendor Capacitance Type Series
TAIYO YUDEN 1uF SMD TMK212 B7105MG-T

Table 4. Suggested Diodes

Vendor Rating Type Series
ZETEX 40V/0.5A SOD323 ZLLS400
DIODES 40V/0.5A SOD323 B0540WS
DIODES 40V/0.25A SOD523 SDM20U40

Table 5. Suggested Resistor

Vendor Type Series
YAGEO SMD FR-SK

Table 6. Suggested W-LED

Vendor Type Series
LITEON SMD LTW-C1911UC5

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Ordering Information

AP 5725 XXX G - 7

Package Green Packing

W : SOT26 G : Green 7 : Tape & Reel
WU : TSOT23-6
FDC : DFN2020C-6

Package Packaging 7” Tape and Reel

Device
Code (Note 3) Quantity Part Number Suffix
AP5725WG-7 W SOT26 3000/Tape & Reel -7
AP5725WUG-7 WU TSOT23-6 3000/Tape & Reel -7
AP5725FDCG-7 FDC DFN2020C-6 3000/Tape & Reel -7
Notes: 3. Pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at
http://www.diodes.com/datasheets/ap02001.pdf.

Marking Information

(1) SOT26 and TSOT23-6

( Top View )
6 5 4
7

XX : Identification Code
XX Y W X
Y : Year 0~9
W : Week : A~Z : 1~26 week;
a~z : 27~52 week; z represents
1 2 3
52 and 53 week
X : A~Z : Green

Part Number Package Identification Code

AP5725WG-7 SOT26 FC
AP5725WUG-7 TSOT23-6 GC

(2) DFN2020C-6
( Top View )
XX : Identification Code
XX Y : Year : 0~9
W : Week : A~Z : 1~26 week;
YWX a~z : 27~52 week; z represents
52 and 53 week
X : A~Z : Green

Part Number Package Identification Code

AP5725FDCG-7 DFN2020C-6 GC

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Package Outline Dimensions (All Dimensions in mm)

(1) Package Type: SOT26

(2) Package Type: TSOT23-6

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Package Outline Dimensions (Continued)

(3) Package Type: DFN2020C-6

0.57/0.63

0.43mon.
Marking
0.10 C
(Active area depth)
0.15max.
0.08 C Seating plane
0.25 A
0/0.05

C
Top View
Pin#1 ID 0.37
2x

1.95/2.075 A
B 1.55/1.75
R0.
15

0.9
0.25/0.35
1.95/2.075

0.86/1.06

0.45

1
R0.
0.65
2x- 0.25 B
1.59
0.65nom. 0.25/0.35 0.10 M C A B Land Pattern Recommendation
Bottom View (Unit:mm)

AP5725 15 of 17 July 2010

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Taping Orientation

For DFN2020C-6

Notes: 4. The taping orientation of the other package type can be found on our website at http://www.diodes.com/datasheets/ap02007.pdf.

AP5725 16 of 17 July 2010

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IMPORTANT NOTICE

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Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without
the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:

A. Life support devices or systems are devices or systems which:

1. are intended to implant into the body, or

2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided
in the labeling can be reasonably expected to result in significant injury to the user.

B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected
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Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or
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Copyright © 2010, Diodes Incorporated

www.diodes.com

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