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MEMS: Design and Applications

The document outlines the syllabus for the elective course MEC 2019: Micro Electro Mechanical Systems, covering topics such as MEMS fabrication processes, actuators and sensors, materials and techniques, switches and micro relays, inductors and capacitors, packaging, and RF applications. It includes detailed descriptions of each unit and references for further reading. The course is structured for a total of 3 credits with a focus on both theoretical and practical aspects of MEMS technology.

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mohamed dahmane
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38 views2 pages

MEMS: Design and Applications

The document outlines the syllabus for the elective course MEC 2019: Micro Electro Mechanical Systems, covering topics such as MEMS fabrication processes, actuators and sensors, materials and techniques, switches and micro relays, inductors and capacitors, packaging, and RF applications. It includes detailed descriptions of each unit and references for further reading. The course is structured for a total of 3 credits with a focus on both theoretical and practical aspects of MEMS technology.

Uploaded by

mohamed dahmane
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Download as PDF, TXT or read online on Scribd
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Elective

MEC 2019: Micro Electro Mechanical Systems L/T/P: 3/0/0 3Cr

Unit-1: MEMS Fabrication processes: Introduction, MEMS Overview, Microfabrication of


MEMS: Surface Micromachining, Bulk Micromachining, LIGA, micromachining of polymeric
MEMS devices, Three-dimensional micofabrications.

Unit-2: MEMS Actuators and Sensor: Electromechanical transducers: Piezoelectric


transducers, Electrostrictive transducers, Magnetostrictive transducers, Electrostatic actuators,
Electromagnetic transducers, Electrodynamic transducers, Electrothermal actuators, comparison
of electrothermal actuation process, Microsensing for MEMS: Piezoresistive sensing, Capacitive
sensing, Piezoelectric sensing, Resonant sensing, Surface Acoustic Wave sensors.
Unit- 3: MEMS Materials and Fabrication techniques: Metals, semiconductors, thin films for
MEMS and their deposition techniques, materials for polymer MEMS, Bulk micromachining for
silicon based MEMS, Silicon surface micromachining, Microstereolithography for polymer
MEMS.
Unit-4: MEMS Switches and Micro relays: Switch parameters, basics of switching, Switches
for RF and microwave applications, actuation mechanisms for MEMS devices, bistable micro
relays and microactuators, dynamics of switch operation, MEMS switch design considerations,
modeling and evaluation.
Unit- 5: MEMS Inductors and Capacitors: MEMS Micromachined passive elements: pros and
cons, MEMS Inductors: self and mutual inductance, micromachined inductors, reduction of stray
capacitance, improvement of quality factor, folded inductors, modeling and design issues of
planar inductors, variable inductor and polymer based inductor. MEMS Capacitors: MEMS gap
tuning capacitor, MEMS area tuning capacitor, Dielectric Tunable capacitors.
Unit- 6: MEMS packaging: MEMS packaging: Role of MEMS packaging, Types of MEMS
packaging, flip-chip and multichip Unit packaging, RF MEMS packaging issues.
Unit-7: MEMS RF applications: Micromachined transmission line and components,
micromachined RF Filters, Micromachined Phase shifters, and Micromachined antenna, Gyros
and Bio-MEMS.
References:
1. RF MEMS: Theory, Design, and Technology, Gabriel M. Rebeiz, John Wiley & Sons,
2003.
2. RF MEMS & Their Applications by Vijay K. Varadan, K. J. Vinoy and K. A. Jose
John Wiley & Sons, 2003.
3. RF MEMS: Theory, Design, and Technology, Gabriel M. Rebeiz, John Wiley & Sons,
New Jersey, 2003. ISBN 0-471-20169 - 3
4. RF MEMS & Their Applications by Vijay K. Varadan, K. J. Vinoy and K. A. Jose
John Wiley & Sons, Chichester, 2003. ISBN 0-470-84308 - X
5. Tai-Ran Hsu, “MEMS and Microsystems: Design and Manufacture,” McGraw- Hill,
1st edition, ISBN: 0072393912.

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Breadth Paper of PG level of other Department

* Should not have been taken earlier by the student in any other programme

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