LM99

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LM99 ±1°C Accurate, High Temperature, Remote Diode Temperature Sensor with Two-
Wire Interface
Check for Samples: LM99

1FEATURES DESCRIPTION
2• Accurately Senses the Temperature of Remote The LM99 is an 11-bit remote diode temperature
Diodes sensor with a 2-wire System Management Bus
(SMBus) serial interface. The LM99 accurately
• Offset Register Allows Use of a Variety of measures: (1) its own temperature and (2) the
Thermal Diodes temperature of a remote diode-connected transistor
• On-board Local Temperature Sensing such as the 2N3904 or a thermal diode commonly
• 10 Bit Plus Sign Remote Diode Temperature found on Graphics Processor Units (GPU), Computer
Processor Units (CPU or other ASICs. The LM99
Data Format, 0.125 °C Resolution
remote diode temperature sensor shifts the
• T_CRIT_A Output Useful for System Shutdown temperature from the remote sensor down 16°C and
• ALERT Output Supports SMBus 2.0 Protocol operates on that shifted temperature:
• SMBus 2.0 Compatible Interface, Supports TACTUAL DIODE JUNCTION = TLM99 + 16°C
TIMEOUT
The local temperature reading requires no offset.
• 8-Pin VSSOP Package
The LM99 has an Offset Register which provides a
APPLICATIONS means for precise matching to various thermal
diodes.
• Graphics Processor Thermal Management
The LM99 and LM99-1 have the same functions but
• Computer Processor Thermal Management different SMBus slave addresses. This allows for one
• Electronic Test Equipment of each to be on the same bus at the same time.
• Office Electronics Activation of the ALERT output occurs when any
temperature goes outside a preprogrammed window
KEY SPECIFICATIONS set by the HIGH and LOW temperature limit registers
• Supply Voltage 3.0 V to 3.6 V or exceeds the T_CRIT temperature limit. Activation
of the T_CRIT_A occurs when any temperature
• Supply Current 0.8 mA (typ) exceeds the T_CRIT programmed limit.
• Local Temp Accuracy
(Includes Quantization error)
– TA = 25°C to 125°C ±3.0°C (Max)
• Remote Diode Temp Accuracy
(Includes Quantization Error)
– TA = 30°C to 50°C, TD = 120°C to 140°C
±1.0°C (Max)
– TA = 0°C to 85°C, TD = 25°C to 140°C ±3.0°C
(Max)

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2 All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2003–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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Simplified Block Diagram

3.0V-3.6V

S ALERT
Fault Q
Queue
Temperature 10-Bit Plus Sign Programable
Sensor '-6 Level R
Circuitry Converter Filter
Fault
Queue
D+ Local/Remote
D- Diode Selector
Fault T_Crit_A
Queue

Control Logic Local/Remote HIGH LOW T_CRIT Limit Configuration Conversion

One Shot Temperature Limit Limit & Hysteresis and Status Rate
Register Registers Registers Registers Registers Registers Registers
Remote Offset Two-Wire Serial SMBData
Registers Interface SMBClock

Connection Diagram

Figure 1. VSSOP-8
TOP VIEW

PIN DESCRIPTIONS
Label Pin # Function Typical Connection
DC Voltage from 3.0 V to 3.6 V. VDD should be bypassed with
a 0.1 µF capacitor in parallel with 100 pF to ground. The 100
VDD 1 Positive Supply Voltage Input pF capacitor should be placed as close as possible to the
power supply pin. A bulk capacitance of approximately 10 µF
needs to be in the vicinity of the LM99 VDD.
To Diode Anode. Connected to the collector and base of the
D+ 2 Diode Current Source remote discrete diode-connected transistor. Connect a 2.2 nF
capacitor between pins 2 and 3.
To Diode Cathode. Connects to the emitter of the remote
D− 3 Diode Return Current Sink diode-connected transistor. Connect a 2.2 nF capacitor
between pins 2 and 3.
T_CRIT Alarm Output, Open- Pull-Up Resistor, Controller Interrupt or Power Supply
T_CRIT_A 4
Drain, Active-Low Shutdown Control
GND 5 Power Supply Ground Ground
Interrupt Output, Open-Drain,
ALERT 6 Pull-Up Resistor, Controller Interrupt or Alert Line
Active-Low
SMBus Bi-Directional Data Line,
SMBData 7 From and to Controller, Pull-Up Resistor
Open-Drain Output
SMBCLK 8 SMBus Input From Controller, Pull-Up Resistor

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Typical Application

Graphics Card Power Supply

VDD Shutdown Control

+3.3 VDC

10 uF

0.1 uF +3.3 VDC

5.1 k
Pull-ups
1 100 pF

VDD
Graphics Processor 4
T_CRIT_A
2 6
D+ ALERT
+3.3 VDC
2.2 nF
LM99 SMBus Master
3 and
D- Control Circuitry
1.5 k
Pull-ups

8
SMBCLK
7
SMBData
GND
5
Thermal Diode-Connected Transistor

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.

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Absolute Maximum Ratings (1)

Supply Voltage −0.3 V to 6.0 V
Voltage at SMBData, SMBCLK, ALERT, T_CRIT_A −0.5 V to 6.0 V
Voltage at Other Pins −0.3 V to (VDD
+ 0.3 V)
D− Input Current ±1 mA
Input Current at All Other Pins (2) ±5 mA
Package Input Current (2) 30 mA
SMBData, ALERT, T_CRIT_A Output Sink Current 10 mA
Storage Temperature −65°C to
+150°C
Soldering Information, Lead VSSOP-8 Packages (3) Vapor Phase (60 seconds) 215°C
Temperature
Infrared (15 seconds) 220°C
ESD Susceptibility (4) Human Body Model 2000 V
Machine Model 200 V

(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not
apply when operating the device beyond its rated operating conditions.
(2) When the input voltage (VI) at any pin exceeds the power supplies (VI < GND or VI > VDD), the current at that pin should be limited to 5
mA. Parasitic components and or ESD protection circuitry are shown in the figure below for the LM99's pins. The nominal breakdown
voltage of D3 is 6.5 V. Care should be taken not to forward bias the parasitic diode, D1, present on pins: D+, D−. Doing so by more than
50 mV may corrupt a temperature measurement.
(3) See http://www.ti.com/packaging for other recommendations and methods of soldering surface mount devices.
(4) Human body model, 100 pF discharged through a 1.5 kΩ resistor. Machine model, 200 pF discharged directly into each pin.

Operating Ratings
Operating Temperature Range 0°C to +125°C
(1)
Electrical Characteristics Temperature Range TMIN ≤ TA ≤ TMAX
LM99 0°C ≤ TA≤ +85°C
Supply Voltage Range (VDD) +3.0 V to +3.6 V

(1) Thermal resistance junction-to-ambient when attached to a printed circuit board with 2 oz. foil:
— VSSOP-8 = 210°C/W

Temperature-to-Digital Converter Characteristics

Unless otherwise noted, these specifications apply for VDD = +3.0 Vdc to +3.6 Vdc. Boldface limits apply for TA = TJ = TMIN
≤ TA ≤ TMAX; all other limits TA = TJ = +25°C, unless otherwise noted.
Typical (1) Limits (2) Units
Parameter Conditions
(Limit)
Temperature Error Using Local Diode TA = +25°C to +125°C (3) ±1 ±3 °C (max)
Temperature Error Using Remote Diode Connected TA = +30°C to +50°C and TD =
±1 °C (max)
Transistor (TD is the Remote Diode Junction +120°C to +140°C
Temperature)
TA = +0°C to +85°C and TD = +25°C °C (max)
TD = TLM99 + 16°C ±3
to +140°C
Remote Diode Measurement Resolution 11 Bits
0.125 °C
Local Diode Measurement Resolution 8 Bits
1 °C
Conversion Time of All Temperatures at the Fastest See (4) 31.25 34.4 ms (max)
Setting

(1) Typicals are at TA = 25°C and represent most likely parametric normal.
(2) Limits are ensured to AOQL (Average Outgoing Quality Level).
(3) Local temperature accuracy does not include the effects of self-heating. The rise in temperature due to self-heating is the product of the
internal power dissipation of the LM99 and the thermal resistance. See Note 1 of the Operating Ratings table for the thermal resistance
to be used in the self-heating calculation.
(4) This specification is provided only to indicate how often temperature data is updated. The LM99 can be read at any time without regard
to conversion state (and will yield last conversion result).
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Temperature-to-Digital Converter Characteristics (continued)

Unless otherwise noted, these specifications apply for VDD = +3.0 Vdc to +3.6 Vdc. Boldface limits apply for TA = TJ = TMIN
≤ TA ≤ TMAX; all other limits TA = TJ = +25°C, unless otherwise noted.
Typical (1) Limits (2) Units
Parameter Conditions
(Limit)
Quiescent Current (5) SMBus Inactive, 16 Hz conversion 0.8 1.7 mA (max)
rate
Shutdown 315 µA
D− Source Voltage 0.7 V
Diode Source Current (VD+ − VD−) = + 0.65 V; high level 160 315 µA (max)
110 µA (min)
Low level 13 20 µA (max)
7 µA (min)
ALERT and T_CRIT_A Output Saturation Voltage IOUT = 6.0 mA 0.4 V (max)
Power-On-Reset (POR) Threshold Measure on VDD input, falling edge 2.4 V (max)
1.8 V (min)
Local and Remote HIGH Default Temperature See (6) Add 16°C for true Remote +70 °C
settings Temperature.
Local and Remote LOW Default Temperature See (6) Add 16°C for true Remote 0 °C
settings Temperature.
Local T_CRIT Default Temperature Setting See (6) +85 °C
Remote T_CRIT Default Temperature Setting See (6) Add 16°C for 126°C true +110 °C
Remote T_CRIT Setting

(5) Quiescent current will not increase substantially with an SMBus.

(6) Default values set at power up.

Logic Electrical Characteristics

DIGITAL DC CHARACTERISTICS
Unless otherwise noted, these specifications apply for VDD = +3.0 to 3.6 Vdc. Boldface limits apply for TA = TJ = TMIN to
TMAX; all other limits TA = TJ = +25°C, unless otherwise noted.
Symbol Parameter Conditions Typical (1) Limits (2) Units
(Limit)
SMBData, SMBCLK INPUTS
VIN(1) Logical “1” Input Voltage 2.1 V (min)
VIN(0) Logical “0”Input Voltage 0.8 V (max)
VIN(HYST) SMBData and SMBCLK Digital Input 400 mV
Hysteresis
IIN(1) Logical “1” Input Current VIN = VDD 0.005 ±10 µA (max)
IIN(0) Logical “0” Input Current VIN = 0 V −0.005 ±10 µA (max)
CIN Input Capacitance 5 pF
ALL DIGITAL OUTPUTS
IOH High Level Output Current VOH = VDD 10 µA (max)
VOL SMBus Low Level Output Voltage IOL = 4 mA 0.4 V (max)
IOL = 6 mA 0.6

(1) Typicals are at TA = 25°C and represent most likely parametric normal.
(2) Limits are ensured to AOQL (Average Outgoing Quality Level).

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SMBus Digital Switching Characteristics

Unless otherwise noted, these specifications apply for VDD = +3.0 Vdc to +3.6 Vdc, CL (load capacitance) on output lines = 80
pF. Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = +25°C, unless otherwise noted.
The switching characteristics of the LM99 fully meet or exceed the published specifications of the SMBus version 2.0. The
following parameters are the timing relationships between SMBCLK and SMBData signals related to the LM99. They adhere
to but are not necessarily the SMBus bus specifications.
Typical (1) Limits (2) Units
Symbol Parameter Conditions
(Limit)
fSMB SMBus Clock Frequency 100 kHz (max)
10 kHz (min)
tLOW SMBus Clock Low Time from VIN(0)max to VIN(0)max 4.7 µs (min)
25 ms (max)
tHIGH SMBus Clock High Time from VIN(1)min to VIN(1)min 4.0 µs (min)
tR,SMB SMBus Rise Time See (3) 1 µs (max)
tF,SMB SMBus Fall Time See (4) 0.3 µs (max)
tOF Output Fall Time CL = 400 pF, 250 ns (max)
IO = 3 mA (4)
tTIMEOUT SMBData and SMBCLK Time Low for Reset of 25 ms (min)
Serial Interface (5) 35 ms (max)
tSU;DAT Data In Setup Time to SMBCLK High 250 ns (min)
tHD;DAT Data Out Stable after SMBCLK Low 300 ns (min)
900 ns (max)
tHD;STA Start Condition SMBData Low to SMBCLK Low 100 ns (min)
(Start condition hold before the first clock falling
edge)
tSU;STO Stop Condition SMBCLK High to SMBData Low 100 ns (min)
(Stop Condition Setup)
tSU;STA SMBus Repeated Start-Condition Setup Time, 0.6 µs (min)
SMBCLK High to SMBData Low
tBUF SMBus Free Time Between Stop and Start 1.3 µs (min)
Conditions

(1) Typicals are at TA = 25°C and represent most likely parametric normal.
(2) Limits are ensured to AOQL (Average Outgoing Quality Level).
(3) The output rise time is measured from (VIN(0)max + 0.15 V) to (VIN(1)min − 0.15 V).
(4) The output fall time is measured from (VIN(1)min - 0.15 V) to (VIN(1)min + 0.15 V).
(5) Holding the SMBData and/or SMBCLK lines Low for a time interval greater than tTIMEOUT will reset the LM99's SMBus state machine,
therefore setting SMBData and SMBCLK pins to a high impedance state.
tLOW
tR tF
VIH
SMBCLK
VIL
tHD;STA tHIGH tSU;STA
tBUF tSU;DAT tSU;STO
tHD;DAT
VIH
SMBDAT VIL

P S P

Figure 2. SMBus Communication

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Pin PIN # D1 D2 D3 D4 D5 D6 D7 R1 SNP ESD

Name CLAMP
VDD 1 x
D+ 2 x (1) x x x x x
D− 3 x x x x x x
T_CRIT_ 4 x x x
A
ALERT 6 x x x
SMBData 7 x x x
SMBCLK 8 x

(1) Note: An “x” indicates that the diode exists.

V+

D1
D3
D4 D6
I/O
D2 ESD R1
SNP Clamp D5 D7

GND

Figure 3. ESD Protection Input Structure

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FUNCTIONAL DESCRIPTION
The LM99 temperature sensor incorporates a delta VBE based temperature sensor using a Local or Remote
diode and a 10-bit plus sign ΔΣ ADC (Delta-Sigma Analog-to-Digital Converter). The LM99 is compatible with the
serial SMBus version 2.0 two-wire interface. Digital comparators compare the measured Local Temperature (LT)
to the Local High (LHS), Local Low (LLS) and Local T_CRIT (LCS) user-programmable temperature limit
registers. The measured Remote Temperature (RT) is digitally compared to the Remote High (RHS), Remote
Low (RLS) and Remote T_CRIT (RCS) user-programmable temperature limit registers. Activation of the ALERT
output indicates that a comparison is greater than the limit preset in a T_CRIT or HIGH limit register or less than
the limit preset in a LOW limit register. The T_CRIT_A output responds as a true comparator with built in
hysteresis. The hysteresis is set by the value placed in the Hysteresis register (TH). Activation of T_CRIT_A
occurs when the temperature is above the T_CRIT setpoint. T_CRIT_A remains activated until the temperature
goes below the setpoint calculated by T_CRIT − TH. The hysteresis register impacts both the remote
temperature and local temperature readings.
The LM99 may be placed in a low power consumption (Shutdown) mode by setting the RUN/STOP bit found in
the Configuration register. In the Shutdown mode, the LM99's SMBus interface remains while all circuitry not
required is turned off.
The Local temperature reading and setpoint data registers are 8-bits wide. The format of the 11-bit remote
temperature data is a 16-bit left justified word. Two 8-bit registers, high and low bytes, are provided for each
setpoint as well as the temperature reading. Two offset registers (RTOLB and RTOHB) can be used to
compensate for non–ideality error, discussed further in DIODE NON-IDEALITY. The remote temperature reading
reported is adjusted by subtracting from, or adding to, the actual temperature reading the value placed in the
offset register.

CONVERSION SEQUENCE
The LM99 takes approximately 31.25 ms to convert the Local Temperature (LT), Remote Temperature (RT), and
to update all of its registers. Only during the conversion process the busy bit (D7) in the Status register (02h) is
high. These conversions are addressed in a round–robin sequence. The conversion rate may be modified by the
Conversion Rate Register (04h). When the conversion rate is modified a delay is inserted between conversions;
however, the actual conversion time remains at 31.25 ms. Different conversion rates will cause the LM99 to draw
different amounts of supply current as shown in Figure 4.
2000

1800
SUPPLY CURRENT (PA

1600
140
0
1200

1000

800

600

400
0.01 0.1 1.0 10 100

CONVERSION RATE (Hz)

Figure 4. Conversion Rate Effect on Power Supply Current

THE ALERT OUTPUT

The LM99's ALERT pin is an active-low open-drain output that is triggered by a temperature conversion that is
outside the limits defined by the temperature setpoint registers. Reset of the ALERT output is dependent upon
the selected method of use. The LM99's ALERT pin is versatile and will accommodate three different methods of
use to best serve the system designer: as a temperature comparator, as a temperature–based interrupt flag, and
as part of an SMBus ALERT system. The three methods of use are further described below. The ALERT and
interrupt methods are different only in how the user interacts with the LM99.

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Each temperature reading (LT and RT) is associated with a T_CRIT setpoint register (LCS, RCS), a HIGH
setpoint register (LHS and RHS) and a LOW setpoint register (LLS and RLS). At the end of every temperature
reading, a digital comparison determines whether that reading is above its HIGH or T_CRIT setpoint or below its
LOW setpoint. If so, the corresponding bit in the STATUS REGISTER is set. If the ALERT mask bit is not high,
any bit set in the STATUS REGISTER, with the exception of Busy (D7) and OPEN (D2), will cause the ALERT
output to be pulled low. Any temperature conversion that is out of the limits defined by the temperature setpoint
registers will trigger an ALERT. Additionally, the ALERT mask bit in the Configuration register must be cleared to
trigger an ALERT in all modes.

ALERT Output as a Temperature Comparator

When the LM99 is implemented in a system in which it is not serviced by an interrupt routine, the ALERT output
could be used as a temperature comparator. Under this method of use, once the condition that triggered the
ALERT to go low is no longer present, the ALERT is de-asserted (Figure 5). For example, if the ALERT output
was activated by the comparison of LT > LHS, when this condition is no longer true the ALERT will return HIGH.
This mode allows operation without software intervention, once all registers are configured during set-up. In order
for the ALERT to be used as a temperature comparator, bit D0 (the ALERT configure bit) in the FILTER and
ALERT CONFIGURE REGISTER (xBF) must be set high. This is not the power on default default state.
Remote High Limit
TEMPERATURE

RDTS Measurement

LM99 ALERT Pin

Status Register: RTDS High

TIME

Figure 5. ALERT Comparator Temperature Response Diagram

ALERT Output as an Interrupt

The LM99's ALERT output can be implemented as a simple interrupt signal when it is used to trigger an interrupt
service routine. In such systems it is undesirable for the interrupt flag to repeatedly trigger during or before the
interrupt service routine has been completed. Under this method of operation, during a read of the STATUS
REGISTER the LM99 will set the ALERT mask bit (D7 of the Configuration register) if any bit in the STATUS
REGISTER is set, with the exception of Busy (D7) and OPEN (D2). This prevents further ALERT triggering until
the master has reset the ALERT mask bit, at the end of the interrupt service routine. The STATUS REGISTER
bits are cleared only upon a read command from the master (see Figure 6) and will be re-asserted at the end of
the next conversion if the triggering condition(s) persist(s). In order for the ALERT to be used as a dedicated
interrupt signal, bit D0 (the ALERT configure bit) in the FILTER and ALERT CONFIGURE REGISTER (xBF) must
be set low. This is the power–on default state.
The following sequence describes the response of a system that uses the ALERT output pin as a interrupt flag:
1. Master Senses ALERT low
2. Master reads the LM99 STATUS REGISTER to determine what caused the ALERT
3. LM99 clears STATUS REGISTER, resets the ALERT HIGH and sets the ALERT mask bit (D7 in the
Configuration register).
4. Master attends to conditions that caused the ALERT to be triggered. The fan is started, setpoint limits are
adjusted, etc.
5. Master resets the ALERT mask (D7 in the Configuration register).

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RDTS Measurement
Remote High Limit

TEMPERATURE
LM99 ALERT pin
ALERT mask set in
response to reading of
status register by
master

End of Temperature
conversion
Status Register: RTDS High
TIME

Figure 6. ALERT Output as an Interrupt Temperature Response Diagram

ALERT Output as an SMBus ALERT

When the ALERT output is connected to one or more ALERT outputs of other SMBus compatible devices and to
a master, an SMBus alert line is created. Under this implementation, the LM99's ALERT should be operated
using the ARA (Alert Response Address) protocol. The SMBus 2.0 ARA protocol, defined in the SMBus
specification 2.0, is a procedure designed to assist the master in resolving which part generated an interrupt and
service that interrupt while impeding system operation as little as possible.
The SMBus alert line is connected to the open-drain ports of all devices on the bus thereby AND'ing them
together. The ARA is a method by which with one command the SMBus master may identify which part is pulling
the SMBus alert line LOW and prevent it from pulling it LOW again for the same triggering condition. When an
ARA command is received by all devices on the bus, the devices pulling the SMBus alert line LOW, first, send
their address to the master and second, release the SMBus alert line after recognizing a successful transmission
of their address.
The SMBus 1.1 and 2.0 specification state that in response to an ARA (Alert Response Address) “after
acknowledging the slave address the device must disengage its SMBALERT pulldown”. Furthermore, “if the host
still sees SMBALERT low when the message transfer is complete, it knows to read the ARA again”. This SMBus
“disengaging of SMBALERT” requirement prevents locking up the SMBus alert line. Competitive parts may
address this “disengaging of SMBALERT” requirement differently than the LM99 or not at all. SMBus systems
that implement the ARA protocol as suggested for the LM99 will be fully compatible with all competitive parts.
The LM99 fulfills “disengaging of SMBALERT” by setting the ALERT mask bit (bit D7 in the Configuration
register, at address 09h) after successfully sending out its address in response to an ARA and releasing the
ALERT output pin. Once the ALERT mask bit is activated, the ALERT output pin will be disabled until enabled by
software. In order to enable the ALERT the master must read the STATUS REGISTER, at address 02h, during
the interrupt service routine and then reset the ALERT mask bit in the Configuration register to 0 at the end of
the interrupt service routine.
The following sequence describes the ARA response protocol.
1. Master Senses SMBus alert line low
2. Master sends a START followed by the Alert Response Address (ARA) with a Read Command.
3. Alerting Device(s) send ACK.
4. Alerting Device(s) send their Address. While transmitting their address, alerting devices sense whether their
address has been transmitted correctly. (The LM99 will reset its ALERT output and set the ALERT mask bit
once its complete address has been transmitted successfully.)
5. Master/slave NoACK
6. Master sends STOP
7. Master attends to conditions that caused the ALERT to be triggered. The STATUS REGISTER is read and
fan started, setpoint limits adjusted, etc.
8. Master resets the ALERT mask (D7 in the Configuration register).
The ARA, 000 1100, is a general call address. No device should ever be assigned this address.

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Bit D0 (the ALERT configure bit) in the FILTER and ALERT CONFIGURE REGISTER (xBF) must be set low in
order for the LM99 to respond to the ARA command.
The ALERT output can be disabled by setting the ALERT mask bit, D7, of the Configuration register. The power
on default is to have the ALERT mask bit and the ALERT configure bit low.

Remote High Limit

TEMPERATURE
RDTS Measurement
LM99 ALERT Pin

ALERT mask set in

response to ARA
from master

Status Register: RTDS High

TIME

Figure 7. ALERT Output as an SMBus ALERT Temperature Response Diagram

T_CRIT_A OUTPUT and T_CRIT LIMIT

T_CRIT_A is activated when any temperature reading is greater than the limit preset in the critical temperature
setpoint register (T_CRIT), as shown in Figure 8. The Status Register can be read to determine which event
caused the alarm. A bit in the Status Register is set high to indicate which temperature reading exceeded the
T_CRIT setpoint temperature and caused the alarm, see STATUS REGISTER (SR).
Local and remote temperature diodes are sampled in sequence by the A/D converter. The T_CRIT_A output and
the Status Register flags are updated after every Local and Remote temperature conversion. T_CRIT_A follows
the state of the comparison, it is reset when the temperature falls below the setpoint RCS-TH. The Status
Register flags are reset only after the Status Register is read and if a temperature conversion(s) is/are below the
T_CRIT setpoint, as shown in STATUS REGISTER (SR).

Figure 8. T_CRIT_A Temperature Response Diagram

POWER ON RESET DEFAULT STATES

LM99 always powers up to these known default states. The LM99 remains in these states until after the first
conversion.
1. Command Register set to 00h
2. Local Temperature set to 0°C
3. Remote Diode Temperature set to 0°C until the end of the first conversion.
4. Status Register set to 00h.
5. Configuration register set to 00h; ALERT enabled, Remote T_CRIT alarm enabled and Local T_CRIT alarm
enabled
6. 85°C Local T_CRIT temperature setpoint
7. 110°C Remote T_CRIT temperature setpoint (126°C Remote diode junction temperature)

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8. 70°C Local and Remote HIGH temperature setpoints

9. 0°C Local and Remote LOW temperature setpoints
10. Filter and Alert Configure Register set to 00h; filter disabled, ALERT output set as an SMBus ALERT
11. Conversion Rate Register set to 8h; conversion rate set to 16 conv./sec.

SMBus INTERFACE
The LM99 operates as a slave on the SMBus, so the SMBCLK line is an input and the SMBData line is bi-
directional. The LM99 never drives the SMBCLK line and it does not support clock stretching. According to
SMBus specifications, the LM99 has a 7-bit slave address. All bits A6 through A0 are internally programmed and
can not be changed by software or hardware. The LM99 and LM99-1 have the following slave addresses:

Version A6 A5 A4 A3 A2 A1 A0
LM99 1 0 0 1 1 0 0
LM99-1 1 0 0 1 1 0 1

TEMPERATURE DATA FORMAT

Temperature data can only be read from the Local and Remote Temperature registers; the setpoint registers
(T_CRIT, LOW, HIGH) are read/write.
Remote temperature data is represented by an 11-bit, two's complement word with an LSB (Least Significant Bit)
equal to 0.125°C. The data format is a left justified 16-bit word available in two 8-bit registers:

Table 1. Actual vs. LM99 Remote Temperature Conversion

Actual Remote Diode LM99 Remote Diode Binary Results in LM99 Remote Hex Remote
Temperature,°C Temperature Register, °C Temperature Register Temperature Register
120 +104 0110 1000 0000 0000 6800h
125 +109 0110 1101 0000 0000 6D00h
126 +110 0110 1110 0000 0000 7100h
130 +114 0111 0010 0010 0000 7200h
135 +119 0111 0111 0000 0000 7700h
140 +124 0111 1100 0000 0000 7200h

Table 2. Actual vs. Remote T_Crit Setpoint

Actual Remote Diode T_Crit Factory-Programmed Remote Binary Remote T_CRIT High Hex Remote T_CRIT High
Setpoint,°C T_CRIT High Setpoint, °C Setpoint Value Setpoint Value
126 +110 0110 1110 71h

Local Temperature data is represented by an 8-bit, two's complement byte with an LSB (Least Significant
Bit) equal to 1°C:

Local Temperature Digital Output

Binary Hex
+125°C 0111 1101 7Dh
+25°C 0001 1001 19h
+1°C 0000 0001 01h
0°C 0000 0000 00h
−1°C 1111 1111 FFh
−25°C 1110 0111 E7h
−55°C 1100 1001 C9h

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OPEN-DRAIN OUTPUTS
The SMBData, ALERT and T_CRIT_A outputs are open-drain outputs and do not have internal pull-ups. A “high”
level will not be observed on these pins until pull-up current is provided by some external source, typically a pull-
up resistor. Choice of resistor value depends on many system factors but, in general, the pull-up resistor should
be as large as possible. This will minimize any internal temperature reading errors due to internal heating of the
LM99. The maximum resistance of the pull-up to provide a 2.1V high level, based on LM99 specification for High
Level Output Current with the supply voltage at 3.0V, is 82 kΩ (5%) or 88.7 kΩ (1%).

DIODE FAULT DETECTION

The LM99 is equipped with operational circuitry designed to detect fault conditions concerning the remote diode.
In the event that the D+ pin is detected as shorted to VDD or floating, the Remote Temperature High Byte (RTHB)
register is loaded with +127°C, the Remote Temperature Low Byte (RTLB) register is loaded with 0, and the
OPEN bit (D2) in the status register is set. As a result, if the Remote T_CRIT setpoint register (RCS) is set to a
value less than +127°C the ALERT and T_Crit output pins will be pulled low, if the Alert Mask and T_Crit Mask
are disabled. If the Remote HIGH Setpoint High Byte Register (RHSHB) is set to a value less than +127°C then
ALERT will be pulled low, if the Alert Mask is disabled. The OPEN bit itself will not trigger and ALERT.
In the event that the D+ pin is shorted to ground or D−, the Remote Temperature High Byte (RTHB) register is
loaded with −128°C (1000 0000) and the OPEN bit (D2) in the status register will not be set. Since operating the
LM99 at −128°C is beyond it's operational limits, this temperature reading represents this shorted fault condition.
If the value in the Remote Low Setpoint High Byte Register (RLSHB) is more than −128°C and the Alert Mask is
disabled, ALERT will be pulled low.
Remote diode temperature sensors that have been previously released and are competitive with the LM99 output
a code of 0°C if the external diode is short-circuited. This change is an improvement that allows a reading of 0°C
to be truly interpreted as a genuine 0°C reading and not a fault condition.

COMMUNICATING WITH THE LM99

The data registers in the LM99 are selected by the Command Register. At power-up the Command Register is
set to “00”, the location for the Read Local Temperature Register. The Command Register latches the last
location it was set to. Each data register in the LM99 falls into one of four types of user accessibility:
1. Read only
2. Write only
3. Read/Write same address
4. Read/Write different address
A Write to the LM99 will always include the address byte and the command byte. A write to any register requires
one data byte.
Reading the LM99 can take place either of two ways:
1. If the location latched in the Command Register is correct (most of the time it is expected that the Command
Register will point to one of the Read Temperature Registers because that will be the data most frequently
read from the LM99), then the read can simply consist of an address byte, followed by retrieving the data
byte.
2. If the Command Register needs to be set, then an address byte, command byte, repeat start, and another
address byte will accomplish a read.
The data byte has the most significant bit first. At the end of a read, the LM99 can accept either Acknowledge or
No Acknowledge from the Master (No Acknowledge is typically used as a signal for the slave that the Master has
read its last byte). It takes the LM99 31.25 ms to measure the temperature of the remote diode and internal
diode. When retrieving all 10 bits from a previous remote diode temperature measurement, the master must
insure that all 10 bits are from the same temperature conversion. This may be achieved by using one-shot mode
or by setting the conversion rate and monitoring the busy bit such that no conversion occurs in between reading
the MSB and LSB of the last temperature conversion.

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SMBus Timing Diagrams

LM99 Timing Diagram

Figure 9. Serial Bus Write to the internal Command Register followed by a the Data Byte

Figure 10. Serial Bus Write to the Internal Command Register

Figure 11. Serial Bus Read from a Register with the Internal Command Register preset to desired value.

SERIAL INTERFACE RESET

In the event that the SMBus Master is RESET while the LM99 is transmitting on the SMBData line, the LM99
must be returned to a known state in the communication protocol. This may be done in one of two ways:
1. When SMBData is LOW, the LM99 SMBus state machine resets to the SMBus idle state if either SMBData
or SMBCLK are held low for more than 35 ms (tTIMEOUT). Note that according to SMBus specification 2.0 all
devices are to timeout when either the SMBCLK or SMBData lines are held low for 25-35 ms. Therefore, to
insure a timeout of all devices on the bus the SMBCLK or SMBData lines must be held low for at least 35
ms.
2. When SMBData is HIGH, have the master initiate an SMBus start. The LM99 will respond properly to an
SMBus start condition at any point during the communication. After the start the LM99 will expect an SMBus
Address address byte.

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DIGITAL FILTER
D2 D1 Filter
0 0 No Filter
0 1 Level 1
1 0 Level 1
1 1 Level 2

In order to suppress erroneous remote temperature readings due to noise, the LM99 incorporates a user-
configured digital filter. The filter is accessed in the FILTER and ALERT CONFIGURE REGISTER at BFh. The
filter can be set according to the table shown.
Level 2 sets maximum filtering.
Filter Output Response to a Step Input depict the filter output to in response to a step input and an impulse input.
Figure 14 depicts the digital filter in use in a Pentium 4 processor system. Note that the two curves, with filter and
without, have been purposely offset so that both responses can be clearly seen. Inserting the filter does not
induce an offset as shown.

Filter Output Response to a Step Input

Figure 12. Step Response Figure 13. Impulse Response

45
LM99
43 with
Filter Off
41
TEMPERATURE (oC)

39
37
35 LM99
with
33
Filter On
31
29
27
25
0 50 100 150 200
SAMPLE NUMBER

The filter on and off curves were purposely offset to better show noise performance.

Figure 14. Digital Filter Response in a Pentium 4 processor System

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FAULT QUEUE
In order to suppress erroneous ALERT or T_CRIT triggering the LM99 incorporates a Fault Queue. The Fault
Queue acts to insure a remote temperature measurement is genuinely beyond a HIGH, LOW or T_CRIT setpoint
by not triggering until three consecutive out of limit measurements have been made, see Figure 15. The fault
queue defaults off upon power-on and may be activated by setting bit D0 in the Configuration register (09h) to
“1”.

ONE-SHOT REGISTER
The One-Shot register is used to initiate a single conversion and comparison cycle when the device is in standby
mode, after which the device returns to standby. This is not a data register and it is the write operation that
causes the one-shot conversion. The data written to this address is irrelevant and is not stored. A zero will
always be read from this register.

TEMPERATURE

RDTS Measurement

Status Register: RTDS High

n n+1 n+2 n+3 n+4 n+5

SAMPLE NUMBER

Figure 15. Fault Queue Temperature Response Diagram

LM99 Registers

COMMAND REGISTER
Selects which registers will be read from or written to. Data for this register should be transmitted during the
Command Byte of the SMBus write communication.

P7 P6 P5 P4 P3 P2 P1 P0
Command Select

P0-P7: Command Select

Command Select Address Power On Default State Register Register Function

Name
Read Address Write Address <D7:D0> binary <D7:D0>
<P7:P0> hex <P7:P0> hex decimal
00h NA 0000 0000 0 LT Local Temperature
01h NA 0000 0000 0 RTHB Remote Temperature High Byte
02h NA 0000 0000 0 SR Status Register
03h 09h 0000 0000 0 C Configuration
04h 0Ah 0000 1000 8 (16 CR Conversion Rate
conv./sec)
05h 0Bh 0100 0110 70 LHS Local HIGH Setpoint
06h 0Ch 0000 0000 0 LLS Local LOW Setpoint
07h 0Dh 0100 0110 70 RHSHB Remote HIGH Setpoint High Byte
08h 0Eh 0000 0000 0 RLSHB Remote LOW Setpoint High Byte
NA 0Fh One Shot Writing to this register will initiate a
one shot conversion

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Command Select Address Power On Default State Register Register Function

Name
Read Address Write Address <D7:D0> binary <D7:D0>
<P7:P0> hex <P7:P0> hex decimal
10h NA 0000 0000 0 RTLB Remote Temperature Low Byte
11h 11h 0000 0000 0 RTOHB Remote Temperature Offset High
Byte
12h 12h 0000 0000 0 RTOLB Remote Temperature Offset Low
Byte
13h 13h 0000 0000 0 RHSLB Remote HIGH Setpoint Low Byte
14h 14h 0000 0000 0 RLSLB Remote LOW Setpoint Low Byte
19h 19h 0110 1110 110 RCS Remote T_CRIT Setpoint
20h 20h 0101 0101 85 LCS Local T_CRIT Setpoint
21h 21h 0000 1010 10 TH T_CRIT Hysteresis
B0h-BEh B0h-BEh Manufacturers Test Registers
BFh BFh 0000 0000 0 RDTF Remote Diode Temperature Filter
FEh NA 0000 0001 1 RMID Read Manufacturer's ID
FFh NA LM99 0011 0001 49 RDR Read Stepping or Die Revision Code
LM99-1 0011 0100 52

LOCAL and REMOTE TEMPERATURE REGISTERS (LT, RTHB, RTLB)

Table 3. (Read Only Address 00h, 01h):

BIT D7 D6 D5 D4 D3 D2 D1 D0
Value SIGN 64 32 16 8 4 2 1

For LT and RTHB D7–D0: Temperature Data. LSB = 1°C. Two's complement format.

Table 4. (Read Only Address 10h):

BIT D7 D6 D5 D4 D3 D2 D1 D0
Value 0.5 0.25 0.125 0 0 0 0 0

For RTLB D7–D5: Temperature Data. LSB = 0.125°C. Two's complement format.
The maximum value available from the Local Temperature register is 127; the minimum value available from the
Local Temperature register is -128. The maximum value available from the Remote Temperature register is
127.875; the minimum value available from the Remote Temperature registers is −128.875.
Note that the remote diode junction temperature is actually 16°C higher than the Remote Temperature Register
value.

STATUS REGISTER (SR)

Table 5. (Read Only Address 02h):

D7 D6 D5 D4 D3 D2 D1 D0
Busy LHIGH LLOW RHIGH RLOW OPEN RCRIT LCRIT

Power up default is with all bits “0” (zero).

D0: LCRIT: When set to “1” indicates a Local Critical Temperature alarm.
D1: RCRIT: When set to “1” indicates a Remote Diode Critical Temperature alarm.
D2: OPEN: When set to “1” indicates a Remote Diode disconnect.
D3: RLOW: When set to “1” indicates a Remote Diode LOW Temperature alarm
D4: RHIGH: When set to “1” indicates a Remote Diode HIGH Temperature alarm.
D5: LLOW: When set to “1” indicates a Local LOW Temperature alarm.

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D6: LHIGH: When set to “1” indicates a Local HIGH Temperature alarm.
D7: Busy: When set to “1” ADC is busy converting.

CONFIGURATION REGISTER

Table 6. (Read Address 03h / Write Address 09h):

D7 D6 D5 D4 D3 D2 D1 D0
Remote T_CRIT_A Local T_CRIT_A mask
ALERT mask RUN/STOP 0 0 0 Fault Queue
mask

Power up default is with all bits “0” (zero)

D7: ALERT mask: When set to “1” ALERT interrupts are masked.
D6: RUN/STOP: When set to “1” SHUTDOWN is enabled.
D5: is not defined and defaults to “0”.
D4: Remote T_CRIT_A mask: When set to “1” a diode temperature reading that exceeds T_CRIT_A setpoint will
not activate the T_CRIT_A pin.
D3: is not defined and defaults to “0”.
D2: Local T_CRIT_A mask: When set to “1” a Local temperature reading that exceeds T_CRIT_A setpoint will
not activate the T_CRIT_A pin.
D1: is not defined and defaults to “0”.
D0: Fault Queue: when set to “1” three consecutive remote temperature measurements outside the HIGH, LOW,
or T_CRIT setpoints will trigger an “Outside Limit” condition resulting in setting of status bits and associated
output pins..

CONVERSION RATE REGISTER

Table 7. (Read Address 04h / Write Address 0Ah)

Value Conversion Rate
00 62.5 mHz
01 125 mHz
02 250 mHz
03 500 mHz
04 1 Hz
05 2 Hz
06 4 Hz
07 8 Hz
08 16 Hz
09 32 Hz
10-255 Undefined

LOCAL and REMOTE HIGH SETPOINT REGISTERS (LHS, RHSHB, and RHSLB)

Table 8. (Read Address 05h, 07h / Write Address 0Bh, 0Dh):

BIT D7 D6 D5 D4 D3 D2 D1 D0
Value SIGN 64 32 16 8 4 2 1

For LHS and RHSHB: HIGH setpoint temperature data. Power-on default is LHIGH = RHIGH = 70°C. 1 LSB =
1°C. Two's complement format.

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Table 9. (RHSLB) (Read / Write Address 13h):

BIT D7 D6 D5 D4 D3 D2 D1 D0
Value 0.5 0.25 0.125 0 0 0 0 0

For RHSLB: Remote HIGH Setpoint Low Byte temperature data. Power–on default is 0°C. 1 LSB = 0.125°C.
Two's complement format.

LOCAL and REMOTE LOW SETPOINT REGISTERS (LLS, RLSHB, and RLSLB)

Table 10. (Read Address 06h, 08h, / Write Address 0Ch, 0Eh):
BIT D7 D6 D5 D4 D3 D2 D1 D0
Value SIGN 64 32 16 8 4 2 1

For LLS and RLSHB: HIGH setpoint temperature data. Power-on default is LHIGH = RHIGH = 0°C. 1 LSB = 1°C.
Two's complement format.

Table 11. (Read / Write Address 14h):

BIT D7 D6 D5 D4 D3 D2 D1 D0
Value 0.5 0.25 0.125 0 0 0 0 0

For RLSLB: Remote HIGH Setpoint Low Byte temperature data. Power-on default is 0°C. 1 LSB = 0.125°C.
Two's complement format.

REMOTE TEMPERATURE OFFSET REGISTERS (RTOHB and RTOLB)

Table 12. (Read / Write Address 11h):

BIT D7 D6 D5 D4 D3 D2 D1 D0
Value SIGN 64 32 16 8 4 2 1

For RTOHB: Remote Temperature Offset High Byte. Power-on default is LHIGH = RHIGH = 0°C. 1 LSB = 1°C.
Two's complement format.

Table 13. (Read / Write Address 12h):

BIT D7 D6 D5 D4 D3 D2 D1 D0
Value 0.5 0.25 0.125 0 0 0 0 0

For RTOLB: Remote Temperature Offset High Byte. Power-on default is 0°C. 1 LSB = 0.125°C. Two's
complement format.
The offset value written to these registers will automatically be added to or subtracted from the remote
temperature measurement that will be reported in the Remote Temperature registers.

LOCAL and REMOTE T_CRIT REGISTERS (RCS and LCS)

Table 14. (Read / Write Address 20h, 19h):

BIT D7 D6 D5 D4 D3 D2 D1 D0
Value SIGN 64 32 16 8 4 2 1
D7–D0: T_CRIT setpoint temperature data. Local power-on default is T_CRIT = 85°C. Remote power-on default
is T_CRIT = 110°C (+126°C actual remote diode temperature). 1 LSB = 1°C, two's complement format.

T_CRIT HYSTERESIS REGISTER (TH)

Table 15. (Read and Write Address 21h):

BIT D7 D6 D5 D4 D3 D2 D1 D0
Value 16 8 4 2 1

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D7–D0: T_CRIT Hysteresis temperature. Power-on default is TH = 10°C. 1 LSB = 1°C, maximum value = 31.

FILTER and ALERT CONFIGURE REGISTER

Table 16. (Read and Write Address BFh):

BIT D7 D6 D5 D4 D3 D2 D1 D0
Value 0 0 0 0 0 Filter Level ALERT Configure

D7-D3: is not defined defaults to "0".

D2-D1: input filter setting as defined the table below:

D2 D1 Filter Level
0 0 No Filter
0 1 Level 1
1 0 Level 1
1 1 Level 2

Level 2 sets maximum filtering.

D0: when set to "1" comparator mode is enabled.

MANUFACTURERS ID REGISTER
(Read Address FEh) Default value 01h.

DIE REVISION CODE REGISTER

(Read Address FFh) The LM99 version has a default value 31h or 49 decimal. The LM99-1 version has a default
value of 34h or 52 decimal. This register will increment by 1 every time there is a revision to the die by Texas
Instruments.

Application Hints

The LM99 can be applied easily in the same way as other integrated-circuit temperature sensors, and its remote
diode sensing capability allows it to be used in new ways as well. It can be soldered to a printed circuit board,
and because the path of best thermal conductivity is between the die and the pins, its temperature will effectively
be that of the printed circuit board lands and traces soldered to the LM99's pins. This presumes that the ambient
air temperature is almost the same as the surface temperature of the printed circuit board; if the air temperature
is much higher or lower than the surface temperature, the actual temperature of the of the LM99 die will be at an
intermediate temperature between the surface and air temperatures. Again, the primary thermal conduction path
is through the leads, so the circuit board temperature will contribute to the die temperature much more strongly
than will the air temperature.
To measure temperature external to the LM99's die, use a remote diode. This diode can be located on the die of
a target IC, allowing measurement of the IC's temperature, independent of the LM99's temperature. The LM99
has been optimized to measure the NVIDIA GeForceFX family thermal diode. Remember that a discrete diode's
temperature will be affected, and often dominated, by the temperature of its leads.

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DIODE NON-IDEALITY

Diode Non-Ideality Factor Effect on Accuracy

When a transistor is connected as a diode, the following relationship holds for variables VBE, T and If:
Vbe

IF = IS e KVt - 1

where
Vt = kqT
•
• q = 1.6×10−19 Coulombs (the electron charge),
• T = Absolute Temperature in Kelvin
• k = 1.38×10−23 joules/K (Boltzmann's constant),
• η is the non-ideality factor of the process the diode is manufactured on,
• IS = Saturation Current and is process dependent,
• If = Forward Current through the base-emitter junction
• VBE = Base-Emitter Voltage drop (1)
In the active region, the -1 term is negligible and may be eliminated, yielding the following equation
Vbe
KVt
IF = IS e (2)
In the above equation, η and IS are dependant upon the process that was used in the fabrication of the particular
diode. By forcing two currents with a very controlled ratio (N) and measuring the resulting voltage difference, it is
possible to eliminate the IS term. Solving for the forward voltage difference yields the relationship:
Vbe = K kqT ln (N)
(3)
The voltage seen by the LM99 also includes the IFRS voltage drop of the series resistance. The non-ideality
factor, η, is the only other parameter not accounted for and depends on the diode that is used for measurement.
Since ΔVBE is proportional to both η and T, the variations in η cannot be distinguished from variations in
temperature. Since the non-ideality factor is not controlled by the temperature sensor, it will directly add to the
inaccuracy of the sensor. As an example, assume a temperature sensor has an accuracy specification of ±1°C at
room temperature of 25 °C and the process used to manufacture the diode has a non-ideality variation of ±0.1%.
The resulting accuracy of the temperature sensor at room temperature will be:
TACC = ± 1°C + (±0.1% of 298 °K) = ±1.4 °C (4)
The additional inaccuracy in the temperature measurement caused by η, can be eliminated if each temperature
sensor is calibrated with the remote diode that it will be paired with.

Compensating for Diode Non-Ideality

In order to compensate for the errors introduced by non-ideality, the temperature sensor is calibrated for a
particular processor. Texas Instruments temperature sensors are always calibrated to the typical non-ideality of a
given processor type. The LM99 is calibrated for the non-ideality of the NVIDIA GeForceFX family thermal diode.
When a temperature sensor calibrated for a particular processor type is used with a different processor type or a
given processor type has a non-ideality that strays from the typical, errors are introduced.
Temperature errors associated with non-ideality may be reduced in a specific temperature range of concern
through use of the offset registers (11h and 12h). See Table 17 below.

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Table 17. Offset Register Settings for Specific Devices

Processor Family Offset Register Settings
ΔT, °C Register 11h Register 12h
NVIDIA GeForceFX Graphics Processor default default default
Intel Pentium 4 Processor +2.625 0000 0010 1010 0000
Intel Pentium 3 Processor +2.375 0000 0010 0110 0000

PCB LAYOUT FOR MINIMIZING NOISE

Figure 16. Ideal Diode Trace Layout

In a noisy environment, such as a processor mother board, layout considerations are very critical. Noise induced
on traces running between the remote temperature diode sensor and the LM99 can cause temperature
conversion errors. Keep in mind that the signal level the LM99 is trying to measure is in microvolts. The following
guidelines should be followed:
1. Place a 0.1 µF power supply bypass capacitor as close as possible to the VDD pin and the recommended 2.2
nF capacitor as close as possible to the LM99's D+ and D− pins. Make sure the traces to the 2.2 nF
capacitor are matched.
2. Ideally, the LM99 should be placed within 10 cm of the Processor diode pins with the traces being as
straight, short and identical as possible. Trace resistance of 1 Ω can cause as much as 1°C of error. This
error can be compensated by using the Remote Temperature Offset Registers, since the value placed in
these registers will automatically be subtracted from or added to the remote temperature reading.
3. Diode traces should be surrounded by a GND guard ring to either side, above and below if possible. This
GND guard should not be between the D+ and D− lines. In the event that noise does couple to the diode
lines it would be ideal if it is coupled common mode. That is equally to the D+ and D− lines.
4. Avoid routing diode traces in close proximity to power supply switching or filtering inductors.
5. Avoid running diode traces close to or parallel to high speed digital and bus lines. Diode traces should be
kept at least 2 cm apart from the high speed digital traces.
6. If it is necessary to cross high speed digital traces, the diode traces and the high speed digital traces should
cross at a 90 degree angle.
7. The ideal place to connect the LM99's GND pin is as close as possible to the Processors GND associated
with the sense diode.
8. Leakage current between D+ and GND should be kept to a minimum. One nano-ampere of leakage can
cause as much as 1°C of error in the diode temperature reading. Keeping the printed circuit board as clean
as possible will minimize leakage current.
Noise coupling into the digital lines greater than 400 mVp-p (typical hysteresis) and undershoot less than 500 mV
below GND, may prevent successful SMBus communication with the LM99. SMBus no acknowledge is the most
common symptom, causing unnecessary traffic on the bus. Although the SMBus maximum frequency of
communication is rather low (100 kHz max), care still needs to be taken to ensure proper termination within a
system with multiple parts on the bus and long printed circuit board traces. An RC lowpass filter with a 3 dB
corner frequency of about 40 MHz is included on the LM99's SMBCLK input. Additional resistance can be added
in series with the SMBData and SMBCLK lines to further help filter noise and ringing. Minimize noise coupling by
keeping digital traces out of switching power supply areas as well as ensuring that digital lines containing high
speed data communications cross at right angles to the SMBData and SMBCLK lines.

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REVISION HISTORY

Changes from Revision C (March 2013) to Revision D Page

• Changed layout of National Data Sheet to TI format .......................................................................................................... 22

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PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)

LM99-1CIMM/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS CU SN Level-1-260C-UNLIM 0 to 85 T20C

& no Sb/Br)
LM99CIMM NRND VSSOP DGK 8 1000 TBD Call TI Call TI 0 to 85 T17C
LM99CIMM/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS CU SN Level-1-260C-UNLIM 0 to 85 T17C
& no Sb/Br)
LM99CIMMX/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS CU SN Level-1-260C-UNLIM 0 to 85 T17C
& no Sb/Br)

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 1-Nov-2013

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 23-Sep-2013

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM99-1CIMM/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM99CIMM VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM99CIMM/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM99CIMMX/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 23-Sep-2013

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM99-1CIMM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LM99CIMM VSSOP DGK 8 1000 210.0 185.0 35.0
LM99CIMM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LM99CIMMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0

Pack Materials-Page 2
 IMPORTANT NOTICE

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