Model No.

： FYLP-3535EUVAUVCC

Date / Rev. 2021.03.02 / B

PRODUCT SPECIFICATION
Model No. ：FYLP-3535EUVAUVCC
Features:
■SMD Type
■Size (mm):3.50*3.50*1.59
■Emitting Color:Deep ultraviolet
■SMT package
■Suitable for all SMT assembly and soldering method
■Pb-free Reflow soldering application
■RoHS Compliant
■MSL:6

Applications:
■Ultraviolet disinfection.
■Phototherapy.
■Bio-Analysis/Detection.
■Currency Detecors
■Insect Trap lamps
■Mine Identification
■Plant Growth Lamps

CUSTOMER APPROVED
APPROVED BY CHECKED BY PREPARED BY
SIGNATURES

NINGBO FORYARD OPTOELECTRONICS CO.,LTD.

Add:No. 666 Jinghua Road, Hi-tech Park, Ningbo, Zhejiang, China Zip:315103
Tel: 0086-574-87933652 87927870 87922206
Fax: 0086-574-87927917
E-mail:[email protected] ( General)

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 Model No. ： FYLP-3535EUVAUVCC

Date / Rev. 2021.03.02 / B

Model No. ：FYLP-3535EUVAUVCC

■ Mechanical Dimensions

■ Recommend Soldering pad design(unit=mm)

Notes:
1. Dimension in millimeter, tolerance is ±0.10.
2.Angle:±5 °
3.The specifications,characteristics and technical data described in the datasheet are subject to change without prior notice.
4.The drawing is different from the actual one, please refer to the sample.

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 Model No. ： FYLP-3535EUVAUVCC

Date / Rev. 2021.03.02 / B

Model No.：FYLP-3535EUVAUVCC
■ Absolute maximum ratings
MAX.
Parameter Symbol Unit
UVA UVC
Power Dissipation PD 260 260 mW
Peak Forward Current* IFP 150 80 mA
Continuous Forward Current IF 80 40 mA
Reverse Voltage VR 5 5 V
Operating Temperature Range Topr -30~ +85 ℃
Storage Temperature Range Tstg -40~ +80 ℃
Reflow soldering : 260°C，10s
Hand soldering : 300°C ，3s
Soldering Temperature Tsol

*1/10 Duty Cycle, 0.1ms Pulse Width

■ Typical Electrical &Optical Charcteristics(Ta=25ºC)
Parameter Symbol Test Condition Min. Typ. Max. Unit
IF=20mA 8.00 12.00
UVA IF=30mA 12.00 20.00
IF=40mA 20.00 50.00
Luminous Intensity IV mW
IF=20mA 1.00 --- 2.00
UVC IF=30mA 2.00 --- 3.00
IF=40mA 3.00 --- 4.00
UVA
Viewing Angle 2θ1/2 IF=20mA --- 120 --- Deg
UVC
UVA 395 --- 405
Peak Emission Wavelength λp IF=20mA nm
UVC 270 --- 285
UVA 3.00 3.40
Forward Voltage VF IF=20mA V
UVC 5.00 7.00
Reverse Current IR VR=5V --- --- 10.00 µA
■ Material
Item Reflector Encapsulate Wire Chip
Material PPA Silicone Gold InGaN
Note:
1.Luminous Intensity is based on the Foryard standards.
2.Pay attention about static for InGaN

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 Model No. ： FYLP-3535EUVAUVCC

Date / Rev. 2021.03.02 / B

Model No. ：FYLP-3535EUVAUVCC

■ Electrical-Optical Characteristics-

NOTE:25°C free air temperature unless otherwise specified

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 Model No. ： FYLP-3535EUVAUVCC

Date / Rev. 2021.03.02 / B

Model No. ：FYLP-3535EUVAUVCC

■ Package-
1. Reel Dimension

2. Tape Dimension

Notice:
1.Tolerance unless mentioned is ±0.2mm
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 Model No. ： FYLP-3535EUVAUVCC

Date / Rev. 2021.03.02 / B

Model No. ：FYLP-3535EUVAUVCC

3.Packing Diagram

Reel
CAU TION

Part NO: FYLS-XXXXXX

Quant ity: XXXPCS VF: XXX-XXX
WD:XXX-XXX
I V: XXXX-XXXX
QC3
QC:

xxxx/xx/xx xxxxxxxxxx

OUTSIDE LABEL

www.foryard.com 6 Reels /Box

12 Boxes/Carton

LED
PN:FYLS-XXXXXXXXXXX
Qty:XXXXX PCS
Date:XXXX/XX/XX
GW: XX.XX KG
NW: XX.XX KG

RoHS
xxxxxxxxxx ATTENTION

OUTSIDE LABEL

Notice:
1.Quantity:1000 PCS/Reel
2.The specifications are subject to change without notice. Please contact us for updated information.

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 Model No. ： FYLP-3535EUVAUVCC

Date / Rev. 2021.03.02 / B

Model No. ：FYLP-3535EUVAUVCC

■Soldering Characteristics-
●Reflow Soldering
·Lead Solder

275
250 10s Max

225
225 ℃
200 ℃ ℃
3 /S Max

℃ 175
183
℃
6 /S Max
)

150℃
Temperature(

150
125
100
100 ℃ 90s Max

75 60~120s preheating
50
25
℃
4 /S Max

0
0 50 100 150 200 250 300 350
·Lead-free Solder Time(sec)

275 255℃ 10s Max

250
220℃ 3 ℃/S Max
225
200 180 ℃ ℃
℃ 6 /S Max
)

175
150 ℃
Temperature(

150 10~50s

125
100
100 ℃ 60~120s preheating

75
50
25
4 ℃/S Max
0
0 50 100 150 200 250 300 350
Time(sec)
Notes:
1.Although the recommended soldering conditions are specified in above table, reflow or hand soldering at the lowest
possible temperature is desired for the LEDs.
2.A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.
3.All temperatures refer to solder Pad.
●Hand Soldering
Soldering temperature 300 ℃ Max.（25W Max.） One time olny
Soldering time 5 ±1sec

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 Model No. ： FYLP-3535EUVAUVCC

Date / Rev. 2021.03.02 / B

Model No. ：FYLP-3535EUVAUVCC

■ Handling of Silicone Resin LEDs-
● Handling Indications
When handling the product, do not touch it directly with bare hands as it may contaminate the surface and affect on optical
characteristics.In the worst cases,excessive force to the product might result in catastrophic failure due to package damage
and/or wire breakage.

When handling the product with tweezers,LEDs should only be handled from the side and make sure that excessive
force is not applied to the resin portion of the pordct. Failure to comply can cause the resin portion of the product to be
cut,chipped,delaminated and/or deformed, and wire to be broken, and thus resulting in catastrophic failure.

■ Recommended circuit-
· In designing a circuit, the current through each LED must not exceed the absolute maximum rating specified for each LED.
It is recommended to use Circuit B which regulates the current flowing through each LED. In the meanwhile,when driving LEDs
with a constant voltage in Circuit A,the current through the LEDs may vary due to the variation in forward voltage(VF) of the
LEDs. In the worst case, some LED may be subjected to stresses in excess of the absolute maximum rating.

(A) (B)

· This product should be operated in forward bias. A driving circuit must be designed so that the product is not subjected
to either forward or reverse voltage while it is off. In particular, if a reverse voltage is continuously applied to the product;
such operation can cause migration resulting in LED damage.
■ Storage-
● Storage Conditions
1.Unopened moisture barrier bag (MBB) shall be stored at temperature below 5 ℃~30℃, with humidity below 60%RH.
2.Before the MBB be opened, check if have the air leakage, if have, then need to bake at 65℃~70℃ for 24hours.
3.After the MBB has been opened, the LEDs which need for reflow soldering or other soldering methods, must be used
according to below:
a: Must finish the soldering in 12hours
b: Stored with the humidity below 30%RH
c: If not finish the soldering in 12hours, need to bake the LED again at 65 ℃~70℃ for 24hours

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