User's Guide

SBOU116A – September 2011 – Revised August 2016

BUF12800EVM Evaluation Board and Software Tutorial

This user's guide describes the characteristics, operation, and use of the BUF12800EVM evaluation
board. It discusses how to set up and configure the software and hardware and reviews various aspects of
the program operation. Throughout this document, the terms evaluation board, evaluation module, and
EVM are synonymous with the BUF12800EVM. This user's guide also includes information regarding
operating procedures and input/output connections, an electrical schematic, printed circuit board (PCB)
layout drawings, and a parts list for the EVM.

Contents
1 Overview ..................................................................................................................... 2
2 BUF12800EVM Hardware Setup .......................................................................................... 3
3 BUF12800EVM Hardware .................................................................................................. 5
4 BUF12800EVM Features.................................................................................................. 11
5 BUF12800EVM Software Setup .......................................................................................... 13
6 BUF12800EVM Software Overview...................................................................................... 16
7 BUF12800EVM Documentation .......................................................................................... 24

List of Figures
1 BUF12800EVM Hardware Setup .......................................................................................... 3
2 BUF12800EVM Board Block Diagram .................................................................................... 4
3 USB DIG Platform Block Diagram ......................................................................................... 5
4 Typical Hardware Connections for the BUF12800EVM ................................................................ 6
5 Connecting External Power to the BUF12800EVM ..................................................................... 7
6 Connecting the USB Cable to the USB DIG Platform .................................................................. 8
7 Confirmation of USB DIG Platform Driver Installation .................................................................. 8
8 Default Jumper Locations for BUF12800EVM ........................................................................... 9
9 BUF12800EVM Software Install Window ............................................................................... 14
10 BUF12800EVM Software License Agreements ........................................................................ 14
11 BUF12800EVM Software Installation Progress ........................................................................ 15
12 BUF12800EVM Software About Button ................................................................................. 15
13 BUF12800EVM Software Interface ...................................................................................... 16
14 Communication Error with USB DIG Platform .......................................................................... 17
15 JMP6 Setting for Logic ‘0’ ................................................................................................. 17
16 JMP6 Setting for Logic ‘1’ ................................................................................................. 18
17 Measuring and Entering Power-Supply Voltage ....................................................................... 18
18 Auto Write Feature Enabled .............................................................................................. 19
19 Save File Prompt ........................................................................................................... 20
20 Saved Data Format ........................................................................................................ 21
21 Load File Prompt ........................................................................................................... 21
22 Run Batch Dialog........................................................................................................... 22
23 Control Panel Window ..................................................................................................... 23

PowerPAD is a trademark of Texas Instruments.

Microsoft, Windows are registered trademarks of Microsoft Corporation.
WinZIP is a registered trademark of WinZip International LLC.
All other trademarks are the property of their respective owners.

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Overview [Link]

24 BUF12800EVM Board Schematic........................................................................................ 24

25 BUF12800EVM PCB Top Layer (Component Layout) ................................................................ 25

1 Overview
The BUF12800 is a programmable gamma-voltage generator. This device offers 12 programmable
gamma channels, making it ideal for 10-bit source TFT-LCD reference drivers.
The BUF12800EVM is a platform for evaluating the performance of the BUF12800 under various signal,
reference, and supply conditions. This document gives a general overview of the BUF12800EVM, and
provides a general description of the features and functions to be considered while using this evaluation
module.

1.1 BUF12800EVM Kit Contents

Table 1 lists the contents of the BUF12800EVM kit. Contact the Texas Instruments Product Information
Center nearest you if any component is missing. It is highly recommended that you also check the
BUF12800 product folder on the TI web site at [Link] to verify that you have the latest versions of
the related software.

Table 1. BUF12800EVM Kit Contents

Item Quantity
BUF12800EVM PCB Test Board 1
USB_DIG_Platform PCB 1
USB Cable 1
Barrel plug cable assembly (part # 10-01935 - 1
Tensility International Corporation) for external power supply
User’s Guide CD-ROM 1

1.2 Related Documentation from Texas Instruments

The following documents provide information regarding Texas Instruments' integrated circuits used in the
assembly of the BUF12800EVM. This user's guide is available from the TI web site under literature
number SBOU116. Any letter appended to the literature number corresponds to the document revision
that is current at the time of the writing of this document. Newer revisions may be available from the TI
web site, or call the Texas Instruments' Literature Response Center at (800) 477-8924 or the Product
Information Center at (972) 644-5580. When ordering, identify the document by both title and literature
number.

Table 2. Related Documentation

Document Literature Number
BUF12800 Product Data Sheet SBOS315
USB_DIG_Platform User Guide SBOU058

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2 BUF12800EVM Hardware Setup

This section discusses the overall system setup for the BUF12800EVM. The PC runs software that
communicates with the USB_DIG_Platform. The USB DIG Platform generates the analog and digital
signals used to communicate with the BUF12800 test board. Connectors on the BUF12800 test board
allow the user to connect to the system under various test conditions and monitor the power, current, and
voltage. A block diagram of the overall hardware setup is shown in Figure 1.

+ 6 VDC BUF12800
Wall Supply Analog Supply

BUF12800 Measurement
Test Board Device
Outputs
Computer USB DIG Platform

Figure 1. BUF12800EVM Hardware Setup

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2.1 Theory of Operation for BUF12800 Hardware

Figure 2 shows the BUF12800 test board hardware setup. The functionality of the PCB is such that it
provides connections to the I2C and general-purpose inputs/outputs (GPIOs) on the USB DIG Platform
board. It also provides connection points for external connections of the shunt voltage, bus voltage, and
ground.
External BUF12800
Analog Power Supply

T1

VDUT Supply
(VSD Power Supply)

25-Pin Male
J1 Test Outputs
DSUB Test Point
BUF12800 TP1
Header
2
I C Interface

2
I C A0 Address
Jumper

Figure 2. BUF12800EVM Board Block Diagram

2.2 Signal Definitions of J1 (25-Pin Male DSUB)

Table 3 shows the various signals connected to J1 on the BUF12800 test board.

Table 3. J1 Signal Definition for BUF12800EVM

Pin No on U1 Signal BUF12800 Pin
1 N/C No connection
2 N/C No connection
3 N/C No connection
4 N/C No connection
5 N/C No connection
6 N/C No connection
7 N/C No connection
8 N/C No connection
9 I2C_SCK No connection
10 I2C_SDA2 No connection
11 N/C No connection
12 I2C_SCK_ISO I2C clock signal (SCL) channel 1; can be
disconnected using a switch
13 I2C_SDA_ISO I2C data signal (SDA) channel 1; can be
disconnected using a switch
14 N/C No connection
15 N/C No connection
16 N/C No connection
17 VDUT Switched 3-V/5-V power (1)
18 VCC No connection
19 N/C No connection
20 N/C No connection
21 GND Common ground connection
22 SPI_SCK No connection
23 SPI_CS1 No connection
24 SPI_DOUT1 No connection
25 SPI_DIN1 No connection
(1)
When power is switched off, digital I/O is also switched off.

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2.2.1 Theory of Operation for USB DIG Platform

Figure 3 shows the block diagram for the USB DIG platform. This platform is a general-purpose data
acquisition system that is used on several different Texas Instruments evaluation modules. The details of
its operation are included in a separate document, SBOU058 (available for download at [Link]). The
block diagram shown in Figure 3 gives a brief overview of the platform. The primary control device on the
USB DIG platform is the TUSB3210.

3.3-V
USB_DIG_Platform
Regulator

VSmC
V_USB 3.3V
5V 2
Buffers and I C, SPI
Latches Control Bits and
TUSB3210 Measure Bits
USB 8052mC
From Computer with USB Interface
and UART
Calibration
EEPROM

Reset Button
8K Byte
and
EEPROM
Power-On Reset

VCC VDUT
Adjustable (2.7 V to 5.5 V) Power (2.7 V to 5.5 V)
Regulator Switching Switched Power
External Power
(6 VDC)

Figure 3. USB DIG Platform Block Diagram

3 BUF12800EVM Hardware
This section provides details about connecting the two PCBs of the BUF12800EVM together, applying
power, connecting the USB cable, and setting the jumpers.

3.1 Electrostatic Discharge Warning

CAUTION
Many of the components on the BUF12800EVM are susceptible to damage by
electrostatic discharge (ESD). Customers are advised to observe proper ESD
handling precautions when unpacking and handling the EVM, including the use
of a grounded wrist strap at an approved ESD workstation.

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3.2 Typical Hardware Connections

Setting up the BUF12800EVM hardware involves connecting the BUF12800 test board and the USB DIG
Platform together via a 25-pin DSUB connector and then applying power. The external connections may
be connected to the real-world system that the BUF12800 is to be incorporated into. Figure 4 shows the
typical hardware connections.

Figure 4. Typical Hardware Connections for the BUF12800EVM

3.3 Connecting the Hardware

To connect the BUF12800 Test Board and the USB DIG Platform together, gently push on both sides of
the DSUB connectors. Note that the USB DIG Platform board has two DSUB connectors; either DSUB
connector may be used. Make sure that the two connectors are completely pushed together; loose
connections may cause intermittent operation.

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3.4 Connecting Power

After the boards are conjoined, connect the +6-V wall supply to the USB DIG Platform board as shown in
Figure 5. Note that it is always necessary to connect the power to the DIG before connecting the USB
cable. If the USB cable is connected before the power, the computer may attempt communication to an
unpowered device that is unable to respond. In addition, the BUF12800 test board requires an external dc
power source. This source is not included with the kit, and its voltage may differ depending on your testing
needs. The source will be used to provide dc supply voltage to the BUF12800 test board.

Figure 5. Connecting External Power to the BUF12800EVM

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3.5 Connecting the USB Cable to the USB DIG Platform

Once power is connected, the USB cable must be connected to the DIG, as shown in Figure 6.

Figure 6. Connecting the USB Cable to the USB DIG Platform

Note that the Test Board and USB DIG Platform must be powered on before connecting the USB cable.
Typically, the computer responds with a Found New Hardware, USB Device pop-up dialog. The popup
window typically changes to Found New Hardware, USB Human Interface Device. This pop-up window
indicates that the device is ready to be used. The USB DIG Platform uses the human interface device
drivers that are part of the Microsoft® Windows® operating system.
In some cases, the Windows Add Hardware wizard is shown. If this prompt appears, allow the system
device manager to install the human interface drivers by clicking Yes when requested to install drivers.
Windows then confirms installation of the drivers with the message shown in Figure 7.

Figure 7. Confirmation of USB DIG Platform Driver Installation

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3.6 BUF12800EVM Default Jumper Settings

Figure 8 shows the default jumpers configuration for the BUF12800EVM. In general, the jumper settings of
the USB DIG Platform do not need to be changed. You may want to change some of the jumpers on the
BUF12800 Test Board to match your specific configuration. For instance, you may wish to set a specific
I2C address.

Figure 8. Default Jumper Locations for BUF12800EVM

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Table 4 summarizes the function of the BUF12800 Test Board jumpers. For most application, jumpers 2
through 5 are all set to the default positions.

Table 4. BUF12800 Test Board Jumper Functions

Jumper Default Purpose/Description
JMP1 INT This jumper selects whether the VSD pin on the
BUF12800 is connected to the VDUT signal
generated from the USB DIG Platform or whether
digital supply pin is connected to terminal T2,
allowing for an external supply to power the digital
circuitry. The default INT position connects the VSD
pin to the VDUT control signal.
JMP2 INT This jumper selects whether the SCL pin on the
BUF12800 is connected to the I2C_SCK_ISO signal
generated from the USB DIG Platform or whether
the SCL pin is connected to terminal T5, allowing
for an external source to control the I2C clock line.
The default INT position connects the SCL pin to
the I2C_SCK_ISO control signal.
JMP3 INT This jumper selects whether the SDA pin on the
BUF12800 is connected to the I2C_SDA_ISO signal
generated from the USB DIG Platform or whether
the SDA pin is connected to terminal T5, allowing
for an external source to control the I2C data line.
The default INT position connects the SDA pin to
the I2C_SDA_ISO control signal.
JMP4 INT This jumper selects whether the LD pin on the
BUF12800 is connected to jumper JMP5 or whether
the LD pin is connected to terminal T3, allowing for
an external source to control the latch pin. The
default INT position connects the LD pin to jumper
JMP5.
JMP5 L This jumper selection depends on the configuration
of JMP4. If JMP4 is set to INT, JMP5 is used to
select whether or not the LD pin on the BUF12800
is connected to the VSD digital supply or whether the
LD pin is connected to ground. The default LOW
position connects the LD pin to ground. If JMP4 is
set to the EXT position, JMP4 is not used.
JMP6 0 This jumper selects I2C A0 address selection. Two
separate I2C addresses can be selected, depending
upon whether JMP6 is set high or low.
JMP7 INT This jumper selects whether or not the RefH pin on
the BUF12800 is connected to the VS signal
generated by the external analog power-supply
input at terminal T1, or whether the RefH pin is
connected to a user-designated reference, which is
set using an external input at terminal T4 as well as
resistors R1 and R2. The default INT position
connects the RefH pin to the external power-supply
input at terminal T1.
JMP8 INT This jumper selects whether or not the RefL pin on
the BUF12800 is connected to ground or whether
the RefL pin is connected to a user-designated
reference, which is set using an external input at
terminal T4 as well as resistors R3 and R4. The
default INT position connects the RefL pin to
ground.

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Table 5 summarizes the function of the USB DIG Platform jumpers. For most applications, the default
positions should be used. A separate document (SBOU058) provides details regarding the operation and
design of the USB DIG Platform.

Table 5. USB DIG Platform Jumper Functions

Jumper Default Purpose/Description
JUMP1 EXT This jumper selects external power or bus power.
External power is applied on J5 or T3 (up to +9 V
DC). Bus power is +5 V from the USB. External
power is typically used because the USB bus power
introduces additional noise.
JUMP2 EXT Same as JUMP1.
JUMP3 EE ON This jumper determines where the TUSB3210 loads
the USB DIG Platform firmware upon power-up or
reset. The EE Off position is used for development
or firmware update.
JUMP4, JUMP5 L, L This jumper sets the address for the USB DIG
Platform board. The only reason to change from the
default is if multiple boards are being used.
JUMP9 5V This jumper selects the voltage of the device under
test supply (VDUT = 5 V or 3 V). This jumper is
typically the only jumper that changes for most
applications.
JUMP10 WP ON This write protects the firmware EEPROM.
JUMP11 WP ON This write protects the calibration EEPROM.
JUMP13 REG Uses the regulator output to generate the VDUT
supply. The USB bus can be used as the VDUT
supply.
JUMP14 9V Uses the external power (9 V as opposed to the
bus)
JUMP17 BUS While in the BUS position, VDUT operation is normal.
While in the VRAW position, the VDUT supply is
connected to an external source. This configuration
allows for any value of VDUT between 3 V and 5 V. (1)
JUMP18 VDUT Connects the pull-up on GPIO to the VDUT supply or
the VCC supply.
(1)
Adjusting beyond this range damages the EVM.

4 BUF12800EVM Features
This section describes some of the hardware features present on the BUF12800 Test Board.

4.1 JMP1: VSD Control Setting

Jumper JMP1 selects where the BUF12800 digital supply pin is connected. If JMP1 is set to the INT
position, the DVDD pin is connected to the switchable VDUT signal generated from the USB DIG Platform.
This voltage can be set to either +3.3 V or +5 V, depending on how JUMP9 on the USB DIG Platform is
set. While JMP1 is set to the INT position, the VSD Power button on the BUF12800 software is able to
control whether the VDUT supply voltage is turned on or off.
When JMP1 is set in the EXT position, an external supply connected to terminal T2 can be used to
provide the digital supply voltage for the BUF12800.

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2
4.2 JMP2: I C SCL Control Setting
Jumper JMP2 selects where the BUF12800 I2C SCL pin is connected. If JMP2 is set to the INT position,
the I2C clock signal is generated from the I2C_SCK_ISO signal from the USB DIG Platform.
When JMP2 is set in the EXT position, an external source connected to SCL pin of terminal T5 can be
used to provide the I2C SCK signal to the BUF12800.

4.3 JMP3: I2C SDA Control Setting

Jumper JMP3 selects where the BUF12800 I2C SDA pin is connected. If JMP3 is set to the INT position,
the I2C data signal is generated from the I2C_SDA_ISO signal from the USB DIG Platform.
When JMP3 is set in the EXT position, an external source connected to SDA pin of terminal T5 can be
used to provide the I2C SDA signal for the BUF12800.

4.4 JMP4: LD Control Setting

Jumper JMP4 selects the input that the LD latch pin of the BUF12800 is connected to. If JMP4 is set in
the INT position, it is routed through the JMP5 jumper where the reference voltage can be set high or low
(see Section 4.5).
When JMP4 is set to the EXT position, an external source connected to the LD pin of terminal T3 can be
used to provide a reference voltage for the latch pin, which dictates the method by which the digital-to-
analog converter (DAC) output voltage is updated.

4.5 JMP5: LD Reference Setting

Jumper JMP5 is used to select the reference voltage that is connected to the LD latch pin. It is used only
when jumper JMP4 is set to INT. If JMP5 is set to H, the latch pin is connected to the VSD supply voltage;
this configuration allows all DAC output voltages to retain the respective values during data transfer until
LD sees a low reference (such as when JMP5 is set to the L position).
When JMP5 is set to the L position, the LD latch pin is connected to ground. This setting updates each
DAC output voltage whenever its corresponding register is updated.

4.6 JMP6: I2C Address Hardware Setting

Jumper JMP6 sets the hardware configuration for the A0 I2C address pin on the BUF12800. Using JMP6,
the A0 address can be set to either a logic '1' or a logic '0' to allow for two unique I2C addresses. See
Section 6.2.1 on how to configure the BUF12800EVM software to match the JMP6 hardware setting.

4.7 JMP7: RefH Control Setting

Jumper JMP7 is selects where the BUF12800 high reference supply pin RefH is connected. If JMP7 is set
to the INT position, RefH is connected to VS, the external analog supply input at terminal T1.
When JMP7 is set to the EXT position, the reference voltage is then designated by the user with the RefH
pin of terminal T4, along with resistors R1 and R2. An external power supply is connected to the RefH pin
of terminal T4, and R1 and R2 act as a voltage-divider circuit; the user sets the values of R1 and R2 to
achieve the desired reference voltage using Equation 1:
RefH = VSUP_H ( R2
R1 + R2 ( (1)
Where VSUP_H is the input supply voltage seen at the RefH pin of terminal T4.

4.8 JMP8: RefL Control Setting

Jumper JMP8 is selects where the BUF12800 high reference supply pin RefL is connected. If JMP8 is set
to the INT position, RefL is connected to ground.

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When JMP8 is set to the EXT position, the reference voltage is then designated by the user with the RefL
pin of terminal T4, along with resistors R3 and R4. An external power supply is connected to the RefL pin
of terminal T4, and R3 and R4 act as a voltage-divider circuit; the user sets the values of R3 and R4 to
achieve the desired reference voltage using Equation 2:
RefL = VSUP_L ( R4
R3 + R4 ( (2)
Where VSUP_L is the input supply voltage seen at the RefL pin of terminal T4.

4.9 BUF12800 Device Placement

The BUF12800EVM provides two separate locations on the board where the BUF12800 test device can
be installed.
Location U1 allows for a BUF12800 device that is soldered down on a DIP adaptor board to be installed
on the BUF12800 Test Board. The output capability of the BUF12800 that is soldered on this adaptor
board can be fully evaluated. The PowerPAD™ of this soldered BUF12800 is connected correctly and
allows the device to dissipate the necessary power while being evaluated.
Location U2 on the BUF12800 Test Board is a 24-pin, QFN-package test socket that allows the user to
evaluate and program many devices very quickly. One drawback to this socket is that there is no
connection to the PowerPAD of the BUF12800. Because of this limitation, while the device is placed in this
socket, it cannot be operated to its full output capability as a result of thermal dissipation limitations.

CAUTION
Only one location should be populated at a time. The use of both locations
simultaneously will likely damage one or both of the devices under test.

4.10 Terminal Strip TP1

Terminal strip TP1 provides the individual output signals on a single row of headers as well as a row of
vias. This footprint offers the user multiple options to interface the output signals of the BUF12800 with an
available display panel (provided by the user). The user can also develop a custom cable to connect the
headers to this panel directly, or to solder the headers directly to the individual vias.

5 BUF12800EVM Software Setup

This section discusses how to install the BUF12800EVM software.

5.1 BUF12800EVM Software Operating Systems

The BUF12800EVM software has been tested on Microsoft Windows XP, Vista, and Windows7 operating
systems (OS) with United States and European regional settings. The software should also function on
other Windows OS platforms.

5.2 BUF12800 Software Installation

The BUF12800EVM software is included on the CD that is shipped with the EVM kit. It is also available
through the BUF12800EVM product folder on the TI web site. To download the software to your system,
insert the disc into an available CD-ROM drive. Navigate to the drive contents and open the
BUF12800EVM software folder. Locate the compressed file ([Link]) and open it. Using
WinZIP®® or a similar file compression program; extract the BUF12800EVM files into a specific
BUF12800EVM folder (for example, C:\BUF12800EVM) on your hard drive.

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Once the files are extracted, navigate to the BUF12800EVM folder you created on your hard drive. Locate
the [Link] file and execute it to start the installation. The BUF12800 software installer file then opens
to begin the installation process, as shown in Figure 9.

Figure 9. BUF12800EVM Software Install Window

After the installation process initializes, the user is given the choice of selecting the directory to install the
program. Generally, defaulting to C:\Program Files\BUF12800\ and C:\Program Files\National Instruments\
is an acceptable choice. Following this option, two license agreements are presented that must be
accepted as shown in Figure 10.

Figure 10. BUF12800EVM Software License Agreements

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After accepting the Texas Instruments and National Instruments license agreements, the progress bar
opens and shows the installation of the software, as Figure 11 illustrates. Once the installation process is
completed, click Finish.

Figure 11. BUF12800EVM Software Installation Progress

5.3 Software Description and Set-Up

The BUF12800EVM software allows the user to read and write to all registers in the BUF12800 gamma
correction buffer. Furthermore, it allows programming of the OTP register on the BUF12800. The software
also permits the user to select either I2C address. Press the About button to verify that you have the latest
version of the software; the contents of this window are shown in Figure 12 .

Figure 12. BUF12800EVM Software About Button

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6 BUF12800EVM Software Overview

This section discusses how to use the BUF12800EVM software.

6.1 Starting the BUF12800EVM Software

The BUF12800EVM software can be operated through the Start menu in Windows. From the Start menu,
select All Programs, and then select the BUF12800EVM program to start the software. Figure 13 shows
how the software should appear if the BUF12800EVM is functioning properly.

Figure 13. BUF12800EVM Software Interface

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Figure 14 shows an error that pops up if the computer cannot communicate with the EVM. If you receive
this error, first ensure that the USB cable is properly connected on both ends. This error can also occur if
you connect the USB cable before the USB DIG Platform power source. Another possible cause for this
error is a problem with the USB Human Interface Device Driver on the computer you are using. Make sure
that the device is recognized when the USB cable is plugged in; this action is indicated by a Windows-
generated confirmation sound.

Figure 14. Communication Error with USB DIG Platform

6.2 Using the BUF12800 Software

6.2.1 I2C Address Selection

As mentioned previously (refer to Section 4.6), jumper JMP6 is used to set the I2C address pin of the
BUF12800. Figure 15 shows how the hardware and software must both be set to enable communication
between the BUF12800EVM and the software. Without jumper JMP6 and the software address button
configured correctly, the software cannot communicate with the BUF12800 device.

Figure 15. JMP6 Setting for Logic ‘0’

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When JMP6 and the software are set as shown in Figure 16, the second I2C address can be configured.

Figure 16. JMP6 Setting for Logic ‘1’

6.2.2 Measuring the Power Supply

You must measure the power supply (VS) with respect to the GND on the BUF12800 Test Board and enter
it in the Vsup field located in the top section of the software interface as shown in Figure 17.

Figure 17. Measuring and Entering Power-Supply Voltage

The voltage out of each DAC is calculated according to the VS value entered.
Changing the value in the channel 6 cell as shown below, for instance, immediately changes the output of
channel 6 to 0.996 V. The calculation is performed according to Equation 3.
VDAC_CHANNEL = VS x Code_in_decimal
1024 (3)

18 BUF12800EVM Evaluation Board and Software Tutorial SBOU116A – September 2011 – Revised August 2016
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[Link] BUF12800EVM Software Overview

For example:
Channel 6: Code 44 (hexadecimal) = 68 (decimal)
VDAC_CHANNEL = 15 V x 68 = 0.996 V
1024 (4)

6.2.3 Read DAC Button

By pressing the Read DAC button in the BUF12800EVM software, all of the BUF12800 DAC registers are
read to obtain the respective current register contents. Once the read procedure is complete, all of the
corresponding text boxes are updated to show the current values present in the DAC registers.

6.2.4 Write DAC Button

The method used to write the values in the DAC registers is based on whether or not the Auto Write
feature is enabled. The BUF12800 has two methods of writing information into the DAC registers. The first
method allows for the output voltage to change immediately after the writing to the DAC register. In the
BUF12800EVM software, this mode is configured by enabling the Auto Write feature found in the Buffer
Menu drop-down menu. In this mode, as an individual channel is written to, the output voltage changes as
soon as the user moves to a different text box in the software.
The second method of writing to the DAC registers allows for the user to write multiple channels and then
have all of the output voltages change at the same time, rather than each channel voltage changing as
soon as it is written to. Disabling the Auto Write feature in the software allows the user to enter all of the
desired values for all of the channels, and then press the Write DAC button to change all of the output
voltage of all of the channels at one time. When the Auto Write feature is enabled, no change occurs to
the output voltages when the Write DAC button is pressed. This action occurs because after the text box
for a given channel has been updated, as soon as another item in the software is clicked, the Auto Write
feature automatically performs a write command to the updated channel that then updates the output
voltage. When in the Auto Write enabled mode, the Write DAC button cannot be pressed with data in the
corresponding channel text boxes that are different than the values already stored in the DAC register; no
change to the DAC registers will occur. Figure 18 shows the location in the Buffer Menu with the Auto
Write feature enabled. Click the Auto Write feature again to enable/disable the feature, depending upon its
current state.

Figure 18. Auto Write Feature Enabled

6.2.5 Reset Button

Pressing the Reset button in the BUF12800EVM software performs two functions. First, a General-Call
Reset for the BUF12800 is performed. The status of the DAC registers after this General-Call Reset
default to 1000000000, or mid-supply. The second function performed after the Reset button is pressed is
that a Read DAC call is made to update the corresponding channel text boxes to the current value for
each channel.

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BUF12800EVM Software Overview [Link]

6.2.6 Save to File Button

The register configurations of the BUF12800 DACs are displayed in both analog voltage and in
hexadecimal (refer to Figure 13). The DAC codes (that is, gamma voltages) can also be saved to a text
file (.txt) using the Save to File button.
Pressing the Save to File button opens a file-save dialog box similar to that shown in Figure 19. Pressing
the folder icon creates a new folder on your PC. It is a good idea to create a directory exclusively for
BUF12800 DAC code (gamma voltage) files. Enter a unique file name in the File name field to store your
BUF12800 register information. Press the OK button to save the file.

Figure 19. Save File Prompt

20 BUF12800EVM Evaluation Board and Software Tutorial SBOU116A – September 2011 – Revised August 2016
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[Link] BUF12800EVM Software Overview

Saving the BUF12800 DAC codes (gamma voltages) creates a text file that can be opened in a text editor,
as illustrated in Figure 20.

Figure 20. Saved Data Format

6.2.7 Load From File Button

The BUF12800EVM software is also able to load data saved from previous evaluations. A saved register
configuration can be loaded into the BUF12800 using the Load From File button, shown in Figure 21. The
program recalls where you saved the last register configuration. Simply select the desired configuration
and press Open.

Figure 21. Load File Prompt

SBOU116A – September 2011 – Revised August 2016 BUF12800EVM Evaluation Board and Software Tutorial 21
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BUF12800EVM Software Overview [Link]

6.2.8 Changing DAC Analog Voltage

The voltage of any of the DAC channels can be adjusted in several ways. One way is to change the
voltage by entering the desired voltage directly in the voltage text box. In order to be able to manually type
the voltage into the text box, first click on the cell to be edited. Click a second time and the cell turns from
blue to black and allows the updated voltage to be typed in the cell. The hexadecimal DAC codes can be
entered in the Code column in the same manner.
Another method of changing the voltage of a DAC channel is through the use of the slider on the main
software window (refer to Figure 13). There is only a single slider that is used for all channels. In order to
use the slider to adjust the voltage of a particular channel, the channel must first be selected. Clicking on
either the channel number, voltage, or code of a particular channel highlights the entire channel row and
makes it blue to indicate which channel is selected. Adjusting the slider bar then only updates the
highlighted channel.
The final method to change the DAC voltages is through the ±1 Code and ±5 Code buttons on the main
software window. These buttons allow for fine and coarse adjustments to the highlighted channel to allow
the user to quickly step the channel output up or down as needed, without having to manually enter the
changes in the Code column.

6.2.9 Run Batch Button

The Run Batch button (as indicated in Figure 22) enables the user to configure the BUF12800 to cycle
through different register configurations in a continuous loop. When connected to the end application, this
feature can be used to cycle through different gamma settings to determine what the optimal settings must
be for a given application.

Figure 22. Run Batch Dialog

When the Run Batch button is pressed, a new dialog box displays as Figure 22 shows. The delay time is
the amount of time between loading new configurations into the BUF12800.
Use the Single Step Up and Single Step Down buttons to step through the selected files manually. The
currently-selected file name is displayed in the lower left corner area of the dialog box. Double-click on the
file names to select them. Once the names have been selected, the check box turns dark. Double-click on
the file name again to unselect it from the batch run. In Figure 22, two configuration files are selected.

22 BUF12800EVM Evaluation Board and Software Tutorial SBOU116A – September 2011 – Revised August 2016
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6.2.10 Control Panel Button

Pressing the Control Panel button brings up a display panel that allows you to adjust each channel using
a set of graphical sliders, as shown in Figure 23. Simply drag the slider to adjust the desired channel
output. The DAC code and corresponding output value of each channel changes automatically. This action
is similar to the slider present on the main BUF12800EVM software window that changes based on the
channel that is highlighted.

Figure 23. Control Panel Window

SBOU116A – September 2011 – Revised August 2016 BUF12800EVM Evaluation Board and Software Tutorial 23
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BUF12800EVM Documentation [Link]

7 BUF12800EVM Documentation
This section contains the complete bill of materials and PCB layout for the BUF12800EVM.

NOTE: These board layouts are not to scale. These image are intended to show how the board is
laid out; they are not intended to be used for manufacturing BUF12800EVM PCBs.

7.1 BUF12800EVM Board Schematic

Figure 24 shows the schematic for the BUF12800EVM board.

Figure 24. BUF12800EVM Board Schematic

24 BUF12800EVM Evaluation Board and Software Tutorial SBOU116A – September 2011 – Revised August 2016
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[Link] BUF12800EVM Documentation

7.2 PCB Layout

Figure 25 shows the PCB layout of the BUF12800EVM.

Figure 25. BUF12800EVM PCB Top Layer (Component Layout)

SBOU116A – September 2011 – Revised August 2016 BUF12800EVM Evaluation Board and Software Tutorial 25
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BUF12800EVM Documentation [Link]

7.3 Bill of Materials

Table 6 lists the bill of materials for the BUF12800EVM.

Table 6. BUF12800EVM Test Board Bill of Materials

Item
No. Qty Value Ref Des Description Vendor/Mfr Part Number
1 4 Various R1 to R4 Resistor, 1/16W 5% 0603 SMD Susumu Co Ltd Various
2 2 4.7 μF C1, C2 Capacitor, tantalum, 4.7 μF 35 V Vishay/Sprague 293D475X9035C2TE3
10% SMD
3 2 1 μF C3, C4 Capacitor, ceramic, 1 μF 25 V X7R Murata Electronics North GRM188F51E105ZA12D
0402 America
4 6 0.1 μF C5 to C10 Capacitor ceramic, 0.1 μF 25 V Kemet C0603C104Z3VACTU
Y5V 0603
5 1 — U1 Connector, Rcpt .100 in, 12-Pos Samtec SS-112-G-2
Gold T/H
6 2 — U2 Socket, TSSOP 24-Pin ZIF ENPLAS OTS-24(28)-0.65-02-00
7 1 DSUB 25M J1 Connector, D-SUB Plug R/A 25- AMP/Tyco Electronics 5747842-4
Pos 30 Gold (with threaded inserts
and board locks)
8 4 — T1 to T4 Terminal block 5 MM 2 Pos On-Shore Technology ED300/2
Inc
9 1 — T5 Terminal block 5 MM 3 Pos On-Shore Technology ED300/3
Inc
10 1 — TP1 Connector, Header 12-Pos .100 Samtec TSW-112-07-G-S
in., SGL Gold
11 6 — All Test Points Connector, Header 1-Pos .100 in., Samtec TSW-101-07-G-S
(VS, VSD, SCL, SGL Gold
SDA, LD, GND)
12 4 Standoff None Standoffs, Hex , 4-40 Threaded, Keystone 2203
0.500 in., length, 0.250 in. OD,
Aluminum Iridite Finish
13 4 Screw None Screw Machine Phillips, 4-40X1/4 B & F Fastener Supply PMSSS 440 0025 PH
SS
14 8 Strip cut to JMP1 to JMP8 Connector, Header 3-Pos .100 in., Samtec TSW-103-07-G-S
size (length SGL Gold
is 3 pos.)
15 8 Jumper JMP1 to JMP8 Shunt LP w/Handle 2-Pos 30AU AMP/Tyco Electronics 881545-2

Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Original (September 2011) to A Revision ............................................................................................... Page

• Changed power supply in the BUF12800EVM Kit Contents section. .............................................................. 2

26 Revision History SBOU116A – September 2011 – Revised August 2016

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 STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or
documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.

2 Limited Warranty and Related Remedies/Disclaimers:

2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
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warranty period.

3 Regulatory Notices:
3.1 United States
3.1.1 Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:

CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.

FCC Interference Statement for Class A EVM devices

NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
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 FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

3.2 Canada
3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.

Concernant les EVMs avec appareils radio:

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

Concerning EVMs Including Detachable Antennas:

Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.

Concernant les EVMs avec antennes détachables

Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1 Notice for EVMs delivered in Japan: Please see [Link] 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
[Link]

3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of
Japan to follow the instructions below with respect to EVMs:
1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
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 【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
2. 実験局の免許を取得後ご使用いただく。
3. 技術基準適合証明を取得後ご使用いただく。

なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル

3.3.3 Notice for EVMs for Power Line Communication: Please see [Link]
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
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4 EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.

5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
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6. Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.

7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.

8. Limitations on Damages and Liability:

8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.

9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.

10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated

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 IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
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endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
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Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
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anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
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In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
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requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
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regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

Products Applications
Audio [Link]/audio Automotive and Transportation [Link]/automotive
Amplifiers [Link] Communications and Telecom [Link]/communications
Data Converters [Link] Computers and Peripherals [Link]/computers
DLP® Products [Link] Consumer Electronics [Link]/consumer-apps
DSP [Link] Energy and Lighting [Link]/energy
Clocks and Timers [Link]/clocks Industrial [Link]/industrial
Interface [Link] Medical [Link]/medical
Logic [Link] Security [Link]/security
Power Mgmt [Link] Space, Avionics and Defense [Link]/space-avionics-defense
Microcontrollers [Link] Video and Imaging [Link]/video
RFID [Link]
OMAP Applications Processors [Link]/omap TI E2E Community [Link]
Wireless Connectivity [Link]/wirelessconnectivity

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