Lecture 8

23 September 2024

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 Outer layer process-1

Source: [Link] 2
 Drilling and punching

➢ PCBs require large number of holes at the designed

locations
• Accommodate pins/leads
• Serve as vias for interconnection
• Mechanical attachments

➢ Holes formed by drilling or punching

➢ Punching is limited
• Single sided boards of XXXPC
• Quality of punched walls not suitable for plating
Source: Dally 1990

➢ Mechanical drilling
• Performed with computer-controlled precision drill bits

Source: Prof. Anandaroop Bhattacharya, NOC Jan 2019: Electronic Packaging and Manufacturing
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 Plating
➢Now we have drilled the holes, we need to plate the inner walls with
a conductor
• necessary to connect circuits on both sides of the board
➢Inner plating divided into 2 steps
• Electroless plating of copper
• Electroplating
➢Electroless plating
• Chemical deposition process - inner walls activated first by stannous and
palladium ions followed by deposition of thin layer (5-10μ) of copper
➢Electroplating
• Additional deposition of copper in an electrolytic solution where the through
holes form the cathode accepting Cu ions.

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 Solder Mask
➢Heat resistant thin polymeric coating applied to the board to
prevent the deposition of solder in areas where solder joints are
not to be made
➢Functions:
• Prevents solder bridging between conductive tracks
• Controls outer layer impedance
• Minimizes handling damage during assembly
• Increases resistance to corrosion
• flammability resistance
• Improves board appearance

Watch Video: Click

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 Solder Mask - process

• Film lamination uses photopolymer mask to expose areas to be

soldered
• Screening - uses a fine mesh screen (nylon of SS fibres)
➢Stencil film placed on top of the screen
➢Liquid polymer forced through the screen using a "squeegee".
➢Polymer coating dries and forms the mask

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 Silkscreen or Screen printing
• The silkscreen is a layer on the surface of a PCB that is used
to identify a lot of information about the electronic printed
circuit board.
• The silkscreen is a layer of ink traces that typically includes
labels for the various components on the PCB, such as the
names of the connectors and the values of resistors and
capacitors. It may also include other information, such as the
PCB's title, the polarity of parts, and the test point locations.
• The silkscreen is applied to the component part of the
printed circuit board.

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 Outer layer process-2

Source: [Link]
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 Outer layer process-3

Source: [Link]
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Final step - Component assembly

➢Assembly Components placed on the board by automated pick

and place machines
➢The board with the components undergo soldering process
➢Cleaning and coating

Watch Video: Click

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Characterizing PCB (Printed Circuit Board)
materials
• Characterizing PCB (Printed Circuit Board) materials involves assessing
their physical, mechanical, thermal, and electrical properties to
ensure they meet performance and reliability standards.

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 Required Material Properties
• Thermal Properties
• Mechanical Properties
• Thermal Conductivity
• Young's Modulus
• Density
• Poisson's Ratio
• Specific Heat Capacity
• Coefficient of Thermal Expansion, etc…
• Emissivity, etc....
Any layer inner via hole (ALIVH) board

Representing PCBs for Simulation

 Digital Image Correlation(DIC)
• Digital image correlation is a non-contact optical method which measures deformation on the surface of an object
• This method tracks the displacements in the speckle pattern in small neighborhoods called subsets (indicated in red
dot in the figure below) during deformation.
• Used to evaluate Coefficient of thermal expansion(CTE)

Bare Board White Base Black Speckles

PCB

Testing Dummy Sample

Sample

Thermocouple 1
DIC with Oven and Illumination System
Sample Inside Oven 14
 Warpage Measurements
Package Full Board Warpage Single Package Warpage

2D and 3D Warpage Graph at 50°C 2D and 3D Warpage Graph at 125°C Warpage Graph 50°C

Warpage Graph at 125°C

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 DIC Results for CTE

0.0025
exx [1] - engr. 0.0025 exx [1] - engr.
eyy [1] - engr. eyy [1] - engr.
0.002 y = 2.09E-05x - 5.44E-04
0.002
Strain(mm/mm)

y = 1.78E-05x - 3.91E-04

Strain(mm/mm)
0.0015
0.0015 y = 1.85E-05x - 4.11E-04

0.001
0.001
y = 1.72E-05x - 3.93E-04
0.0005
0.0005

0
0
0 20 40 60 80 100 120 140
0 20 40 60 80 100 120 140
Temperature(°C)
Temperature(°C)
 Instron Micro Tester
• To perform static tensile and compression tests

Dog bone Sample Dimensions

Dimensions Value (mm)
L - Overall Length 100

C – Width of grip section 10

W – Width 6
Instron Micro tester Sample Mounted in a Grip
A – Length of Reduced
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Section

B – Length of Grip Section 30

Dc – Curvature Distance 4

R – Radius of Curvature 6
Standard Dogbone Sample
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 Dynamic Mechanical Analyzer

DMA 7100

• Used for measuring frequency and temperature dependent Loss modulus (measure of a material's
ability to dissipate energy) and Storage modulus (measure of the energy stored during the load
phase.) 18
 Dynamic Mechanical Analysis
• Study and characterize materials
• Most useful for studying the viscoelastic behavior of polymers
• A sinusoidal stress is applied and the strain in the material is measured
• Strain gives the complex modulus, E ( A measure of a material's stiffness, calculated as the ratio of stress
and strain amplitude.)
• Temperature of the sample and the frequency of the stress are varied
• Used to locate the glass transition temperature of the material

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Recommended Sample Size Requirement - DMA

Bending Mode

Tension Mode

𝜶: Geometry factor (m)

S : Sample Cross-Section (𝑚𝑚2 )
l : Sample Length (mm) = 20
w: Sample width(mm) = 10

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 Thermo-Mechanical Analyzer (TMA)

TMA6000

• Used for measuring coefficient of thermal expansion (CTE) and glass

transition temperature (Tg)
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 Thermo - Mechanical Analysis
• Measurement of a change of a dimension or a mechanical property of the sample while it is subjected to a
temperature regime

• Characterize physical properties of materials when force is applied at specified temperatures and time
periods

• Involve selection of an appropriate probe type for measuring the properties of interest

• Coefficient of thermal expansion(CTE), melting point, softening point, glass transition

Fig. Different types of probes used in TMA

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[Link]
 Recommended Sample Size Requirement - TMA
• Sample should be less than ~10 mm in diameter
• With the TMA specs given below, the required minimum
thickness as a function of CTE values is given in the figure
o Maximum sensitivity: 0.1 μm
o Maximum resolution: 3 nm
o Baseline drift (0°C - 500°C): 0.5 μm**
Source: “Determining Minimum Usable Sample Thickness in TMA”, TA
Instruments

Required Thickness for expected CTE Values

700

600
Minimum Thickness (um)

500

400

300

200

100

0
0 100 200 300 400 500
CTE (ppm)
Stage with Sample for Compression Test

** The temperature range and base line drift assumptions kept constant. The assumptions were provided for a similar TMA equipment, and the extrapolation 23
to different temperature ranges not necessarily linear because of the different factors affecting the measured values. See slide 9 for details.
 Nano Indenter

• Nanoindenter is a quasistatic indentation system for

nanomechanical testing of mechanical properties, including
Young’s modulus, hardness, wear, fracture toughness

Images from: Characterization Center for Materials and Biology. [Link] Images from: Hysitron Probe Selection Guide. [Link]
Thermophysical property
• Laser Flash Analysis (LFA) – To measure thermal diffusivity
• Differential Scanning Calorimeter (DSC)- To measure Specific heat
capacity (Cp)
• Infrared Thermography- For Surface temperature distribution and
heat dissipation
• Fourier Transform Infrared Spectroscopy (FTIR)- To measure
Chemical composition changes with heat
• Dielectric Thermal Analysis (DETA)- To measure dielectric properties
as a function of temperature

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System Integration

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Motherboards and Daughter Cards
• Motherboard: Major circuit board in a system that houses components
and smaller (daughter) boards and expansion cards
• Daughter or Expansion cards: smaller circuit card assemblies with special
functionalities that can be plugged into mating sockets on the
motherboard PCMCIA cards, memory cards, ethernet cards, etc

Memory card
Motherboard 27
 Typical Daughter cards

Audio daughter card

Ethernet card
Memory cards

Power supply daughter card

Wireless network card 28
Connectors
➢ Electromechanical device providing a separable interface
between two electronic subsystems
• With minimal loss of power and signal integrity
• Plays vital role in performance and reliability

➢ Functions and Features

• Meet functional criteria (current, connections)
• Maintain temperature rating
• Durability - number of insertions and extractions [Link]
Withstand vibrations and shock
• Resistance to moisture ingress and corrosion

➢ Surface materials
• Ability to maintain performance and reliability
• Gold, Gold over Ni, Tin-lead solder, beryllium-copper-
nickel with gold, silver

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 Connectors

SCSI

Ribbon cable
VGA

Rounded cable USB HDMI

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 Enclosure assembly

➢Final housing for all systems and subsystems

• Protection from external forces
• Protection of internal components from EM radiation
• Amenable to field replacement
• Adequate air flow for efficient cooling
• Easy access to essential controls, ports, switches
• Indicators (LEDs) to indicate/alert for functioning/
malfunctioning/warning
• AESTHETICS

Source: Prof. Anandaroop Bhattacharya, NOC Jan 2019: Electronic Packaging and Manufacturing
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Different form factors

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Aesthetic

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END

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