Ansys Sherlock Webinar
Series
Session 2 – Exploring Solder Fatigue in Sherlock
Ansys Sherlock Webinar Series
No. Session Content
Starting a Sherlock project
- Initial Pats Selection
1 - Ad-hoc creation of non-standard parts
- Life Cycle Definitions
- Early Reliability Analysis
Exploring Solder Fatigue in Sherlock
2 - Solder Fatigue and PTH Fatigue
- Vibration Analysis
Sherlock to Icepak
3 - Export a Sherlock project to Icepak
- Import refined results from Icepak
Sherlock to Mechanical
4 - Export to Mechanical
- Workbench flow
- Import results from Mechanical
System Level Effects on Thermal Cycling
5 - Including Housing effects
- Including Underfill and Mirroring
6 Random Vibration with Sherlock & Ansys Workbench
7 BGA Reliability Workflow
8 PCB Modelling Techniques
9 Sherlock Trace Reinforcement flow
10 Modelling Rigid Flex with Sherlock and Ansys Mechanical
11 Modelling Hot Tear
12 Modelling Mechanical Shock with Sherlock and LS-Dyna
2
Agenda
• Introduction to Solder Joint Fatigue
• Thermal Cycling
• Vibration
• Open Forum
3
Failure Mechanisms in Solder Interconnects
• Mechanical Failures:
Fatigue Shock
Overstress
Steinberg D.S. Vibration analysis for
High Cycle Low Cycle Single load failure electronic equipment. John Wiley &
Sons, 2000.
Vibration Thermal cycling Drop Board bending
Vandevelde, Bart, et al. "Four-point bending cycling: The alternative for thermal cycling solder fatigue testing
of electronic components." Microelectronics Reliability 74 (2017): 131-135.
4
Thermal Cycling
Temperature cycling: The solder fatigue mechanism
• Grain growth in solder is an indicator of fatigue
Source: Werner Engelmaier, Engelmaier Associates, L.C.
• Textbook calculation of solder fatigue
• Lead-free and Tin-Lead
N f = (0.0019 W ) N f = (0.0006061 W )
−1 −1
Source: Ahmer Syed, Amkor technology
Low Cycle Fatigue
• Impossible to directly measure the stress or strain in the solder
• Fully reversed shear strain due to CTE mismatch between the component and
the PCB
• Use strain energy density as a damage indicator
7
Thermal Cycling
8
Vibration
Vibration
• Vibration Analysis for Electronic
Equipment
Dave S. Steinberg, 1973
• Fatigue due to critical
PCB deflection Zc
10
Vibration
• Sherlock replaces critical deflection by
critical strain εc
11
Ansys Learning Hub (ALH) Electronics Reliability Page Revamp
- New and improved user experience
- 3-pronged learning paths including Basic,
Fundamentals, Intermediate & Advanced
Training
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technical papers, and more
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12
Thank You
