Technical Data Sheet

LOCTITE® 348™
August-2008

PRODUCT DESCRIPTION 100

LOCTITE® 348™ provides the following product 150°C 125 °C
characteristics:

% of Full Strength
100 °C
75
Technology Epoxy
Chemical Type Epoxy
Appearance (uncured) Red high viscosity gelLMS 50
Components One component - requires no mixing
Fluorescence Positive under UV light
25
Cure Heat cure
Application Surface mount adhesive
Key Substrates SMD components to PCB 0
Other Application Areas Small parts bonding 0 1 2 3 4 5 6 7 8 9 10
Residence Time at Temperature, minutes
Dispense Method Syringe
Dispense Speed Medium 15,000 -25,000 dots/h Isothermal DSC Conversion
Wet Strength High 5 minutes @ 125 °C, % ≥80LMS

LOCTITE® 348™ is designed for the bonding of surface TYPICAL PROPERTIES OF CURED MATERIAL
mounted devices to printed circuit boards prior to wave Cured for 30 minutes @ 150 °C
soldering. Particularly suited for applications where medium to Physical Properties:
Coefficient of Thermal Expansion,
high dispense speeds, high dot profile, high wet strength and
ISO 11359-2, K-1:
good electrical characteristics are required. Temperature Range 25 °C to 70 °C 50
Temperature Range 90 °C to 150 °C 160
TYPICAL PROPERTIES OF UNCURED MATERIAL Coefficient of Thermal Conductivity, ISO 8302, 0.25
Specific Gravity @ 25 °C 1.2 W/(m·K)
Yield Point, 25 °C, Pa 300 to 700LMS Specific Heat, kJ/(kg·K) 0.3
Cone & Plate Rheometer: Density, BS 5350-B1 @ 25 °C, g/cm³ 1.3
Haake PK 100, M10/PK 1 2° Cone
Electrical Properties:
Casson Viscosity @ 25 °C, Pa∙s 1 to 5
Dielectric Constant / Dissipation Factor, IEC 60250:
Cone & Plate Rheometer:
1-kHz 4.4 / 0.016
Haake PK 100, M10/PK 1 2° Cone
1,000-kHz 4.0 / 0.028
Flash Point - See MSDS
Volume Resistivity, IEC 60093, Ω·cm 2×1015
Surface Resistivity, IEC 60093, Ω 60×1012
TYPICAL CURING PERFORMANCE Dielectric Breakdown Strength, 29.3
Recommended conditions for curing are exposure to heat IEC 60243-1, kV/mm
above 100 °C (typically 90-120 seconds @ 150 °C). Rate of
cure and final strength will depend on the residence time at the TYPICAL PERFORMANCE OF CURED MATERIAL
cure temperature.
Adhesive Properties
Cure Speed vs. Time, Temperature
The following graph shows the rate of torque strength Cured for 30 minutes @ 150 °C
developed with time at different temperatures. These times are Lap Shear Strength, ISO 4587:
defined from the moment the adhesive reaches cure Steel (grit blasted) N/mm² ≥10LMS
(psi) (≥1,450)
temperature. In practice, total oven time may be longer to allow
for heat up period. Strength is measured on 1206 capacitors @ Cured for 5 minutes @ 125 °C
22 °C, tested according to IPC SM817, TM-650 Method 2.4.42. Torque Strength, IPC SM817 , TM-650 Method 2.4.42:
C-1206 on bare FR4 board N·m 30 to 70
(lb.in.) (4 to 10)

Cured for 3 minutes @ 150 °C

Push-off Strength:
C-1206 on bare FR4 board N ≥36.6LMS
(lb) (8.2)
 TDS LOCTITE® 348™, August-2008

Bond strength achieved in practice will vary considerably 2. After storage in a refrigerator the adhesive must be
depending on the SMD component type, adhesive dot size allowed to equilibrate to room temperature before use,
and the type, grade and degree of cure of the solder typically 2 to 4 hours.
mask/resist. 3. Avoid cross contamination with other adhesive residues
TYPICAL ENVIRONMENTAL RESISTANCE by ensuring dispense nozzels, adapters etc. are
Cured for 30 minutes @ 150 °C thoroughly cleaned.
Lap Shear Strength, ISO 4587: 4. Do not leave dirty nozzles on dispensing equipment while
Mild steel (grit blasted) not in use or soaking in solvents for long periods of time.
5. The quantity of adhesive dispensed will depend on the
dispense pressure, time, nozzle size and temperature.
Hot Strength 6. These parameters will vary depending on the type of
Tested at temperature dispensing system used and should be optimised
120 accordingly.
% Initial Strength at 22 °C

7. Dispensing temperature should ideally be controlled at a

100
value between 30 °C to 35 °C for optimum results,
however higher dispense temperatures are possible.
80
8. LOCTITE® 348™ can also be dispensed using positive
60 displacement pump systems.
9. The product is not recommended for dispensing by pin
40 transfer.
10. Uncured adhesive can be cleaned from the board with
20
isopropanol, MEK or ester blends such as LOCTITE®
0 7360™.
25 50 75 100 125 150 175 200 225 250
Temperature, °C Loctite Material SpecificationLMS
LMS dated August-14, 2006. Test reports for each batch are
Chemical/Solvent Resistance available for the indicated properties. LMS test reports include
Aged under conditions indicated and tested @ 22 °C. selected QC test parameters considered appropriate to
specifications for customer use. Additionally, comprehensive
% of initial strength
controls are in place to assure product quality and
Environment °C 100 h 500 h 1000 h consistency. Special customer specification requirements may
Air 22 100 100 95 be coordinated through Henkel Quality.
Air 150 85 70 70
Storage
98% RH 40 110 110 100 Store product in the unopened container in a dry location.
Storage information may be indicated on the product container
Resistance to Hot Solder Dip labeling.
Cured for 90 seconds @ 150 °C Optimal Storage: 2 °C to 8 °C. Storage below 2 °C or
Hot Solder Dip, IPC SM817, TM-650 Method 2.4.42.1, Pass/Fail: greater than 8 °C can adversely affect product properties.
R-1206 on bare FR4 board: Material removed from containers may be contaminated during
Supported 60 seconds above solder Pass use. Do not return product to the original container. Henkel
bath @ 260°C and dipped for 10 Corporation cannot assume responsibility for product which
seconds has been contaminated or stored under conditions other than
those previously indicated. If additional information is required,
please contact your local Technical Service Center or
Resistance to Process Conditions Customer Service Representative.
Cured for 90 seconds @ 150 °C
Torque Strength, IPC SM817 , TM-650 Method 2.4.42, % of initial Conversions
strength retained: (°C x 1.8) + 32 = °F
C-1206 on bare FR4 board: kV/mm x 25.4 = V/mil
Aged 30 seconds preheat to 100°C 100 mm / 25.4 = inches
and 3 seconds @ 260°C with flux and µm / 25.4 = mil
wave solder N x 0.225 = lb
N/mm x 5.71 = lb/in
N/mm² x 145 = psi
GENERAL INFORMATION MPa x 145 = psi
For safe handling information on this product, consult the N·m x 8.851 = lb·in
Material Safety Data Sheet (MSDS). N·m x 0.738 = lb·ft
N·mm x 0.142 = oz·in
mPa·s = cP
Directions for use:
1. LOCTITE® 348™ is supplied de-aerated in a range of
ready-to-use syringes which fit straight into a variety of air
pressure/time dispensing systems commonly available.

Henkel Americas Henkel Europe Henkel Asia Pacific

+949.789.2500 +44.1442.278.000 +86.21.2891.8000
For the most direct access to local sales and technical support visit: www.henkel.com/electronics
 TDS LOCTITE® 348™, August-2008

Note
The data contained herein are furnished for information only
and are believed to be reliable. We cannot assume
responsibility for the results obtained by others over whose
methods we have no control. It is the user's responsibility to
determine suitability for the user's purpose of any production
methods mentioned herein and to adopt such precautions as
may be advisable for the protection of property and of persons
against any hazards that may be involved in the handling and
use thereof. In light of the foregoing, Henkel Corporation
specifically disclaims all warranties expressed or implied,
including warranties of merchantability or fitness for a
particular purpose, arising from sale or use of Henkel
Corporation’s products. Henkel Corporation specifically
disclaims any liability for consequential or incidental
damages of any kind, including lost profits. The discussion
herein of various processes or compositions is not to be
interpreted as representation that they are free from
domination of patents owned by others or as a license under
any Henkel Corporation patents that may cover such
processes or compositions. We recommend that each
prospective user test his proposed application before repetitive
use, using this data as a guide. This product may be covered
by one or more United States or foreign patents or patent
applications.
Trademark usage
Except as otherwise noted, all trademarks in this document
are trademarks of Henkel Corporation in the U.S. and
elsewhere. ® denotes a trademark registered in the U.S.
Patent and Trademark Office.

Reference 1.1

Henkel Americas Henkel Europe Henkel Asia Pacific

+949.789.2500 +44.1442.278.000 +86.21.2891.8000
For the most direct access to local sales and technical support visit: www.henkel.com/electronics