ASSIGNMENT 4
NAME :- Saahil Pradhan
[Link] :- RA2211003010091
SUBJECT :- CAPSTONE PROGRAM IN ELECTRONIC COOLING
SUBJECT CODE :- 21IPE401J
COURSE :- [Link] Computer Science And Engineering
SECTION :- B1
INTRODUCTION
In this assignment we are provided with three files. Cold plates with three different fin
structures. They are Micro-fin, Diamond Fin and NACA-0020 Airfoil Fin.
So the initial power provided to all was 30W and we had to run our simulations for 50W
,100W,150W for all the three different fin structure. The power we change is the Die-pm
Power. We had to mesh it first and run the simulations.
We set the iterations to 1000 iterations and we assign 4 processors.
We had 9 simulations in this assignment.
SIMULATION 1:
DIAMOND FIN 50W:
FIG 1: DIAMOND FIN 50W
QUESTION:
Pressure drop:
Create an object face with “DNVRTON Baseplate” under “Inlet Asm”.
Enable show contours for “Pressure” and note down the Maximum Pressure
value (∆P). Include the contour.
ANSWER:
From the above figure 1 we can note that the Maximum Pressure value(∆P) is 22348.3N/𝑚2.
So the pressure Drop is 22348.3N/𝑚2.
QUESTION:
For Fin Tmax and Tmin.
Create an object face with “DNVRTON Baseplate” under “Inlet Asm”. Enable
show contours. Under Calculated select “This Object”. Note Down Tmax and
Tmin from legend. Include the Contour plot.
ANSWER:
From the above figure 1 we can note that the Maximum Temperature(Tmax) is 20.2298°C
and the Minimum Temperature Tmin is 16.3603°C.
QUESTION:
For Chip Temperature.
Note down the “Die-PM” temperature from solution overview and go to create
and note down the “Die-PM” temperature. Include Contour for Die-PM
temperature.
ANSWER:
From the above figure 1 we can note that the “Die-PM” temperature is 35.2342°C.
Contour in fig1.
QUESTION:
For Fin-plate thermal resistance
Calculate the equation given in the Table. Take Tin as 16°C. W is corresponding
“Power”.
ANSWER:
We know the formulae to calculate the fin plate thermal resistance is:
𝑅ℎ𝑠 = (𝑇𝑚𝑎𝑥 − 𝑇𝑖𝑛)/𝑊
From the observations
Tmax = 20.2298°C
Tin = 16°C
W = 50
𝑅ℎ𝑠 = (𝑇𝑚𝑎𝑥 − 𝑇𝑖𝑛)/𝑊
𝑅ℎ𝑠 = (20.2298 − 16)/50
𝑅ℎ𝑠 = 0.0846°C/W
QUESTION:
Note down the mean temperature (Tcase) for “Top Cover” from Solution overview
under Report.
ANSWER:
From the above figure 1 we can note that the “Top cover” temperature is 16.7596°C.
QUESTION:
Thermal Resistance of the chip Junction to the Ambient.
Use the equation given in table and calculate. Mention the Units.
ANSWER:
We know the formulae to calculate the Thermal Resistance of the chip Junction to the
Ambient is:
𝜓 = (𝑇𝑗 − 𝑇𝑖𝑛)/𝑊
From the observations
Tj = 35.2342°C
Tin = 16°C
W = 50
𝜓 = (𝑇𝑗 − 𝑇𝑖𝑛)/𝑊
𝜓 = (35.2342 − 16)/50
𝜓 = 0.2847°C/W
SIMULATION 2:
DIAMOND FIN 100W:
FIG 2: DIAMOND FIN 100W
QUESTION:
Pressure drop:
Create an object face with “DNVRTON Baseplate” under “Inlet Asm”.
Enable show contours for “Pressure” and note down the Maximum Pressure
value (∆P). Include the contour.
ANSWER:
From the above figure 2 we can note that the Maximum Pressure value(∆P) is 22348.3N/𝑚2.
So the pressure Drop is 22348.3N/𝑚2.
QUESTION:
For Fin Tmax and Tmin.
Create an object face with “DNVRTON Baseplate” under “Inlet Asm”. Enable
show contours. Under Calculated select “This Object”. Note Down Tmax and
Tmin from legend. Include the Contour plot.
ANSWER:
From the above figure 2 we can note that the Maximum Temperature(Tmax) is 24.46°C and
the Minimum Temperature Tmin is 16.72°C.
QUESTION:
For Chip Temperature.
Note down the “Die-PM” temperature from solution overview and go to create
and note down the “Die-PM” temperature. Include Contour for Die-PM
temperature.
ANSWER:
From the above figure 2 we can note that the “Die-PM” temperature is 56.47°C.
Contour in fig2.
QUESTION:
For Fin-plate thermal resistance
Calculate the equation given in the Table. Take Tin as 16°C. W is corresponding
“Power”.
ANSWER:
We know the formulae to calculate the fin plate thermal resistance is:
𝑅ℎ𝑠 = (𝑇𝑚𝑎𝑥 − 𝑇𝑖𝑛)/𝑊
From the observations
Tmax = 24.46°C
Tin = 16°C
W = 100
𝑅ℎ𝑠 = (𝑇𝑚𝑎𝑥 − 𝑇𝑖𝑛)/𝑊
𝑅ℎ𝑠 = (24.46 − 16)/100
𝑅ℎ𝑠 = 0.0846°C/W
QUESTION:
Note down the mean temperature (Tcase) for “Top Cover” from Solution overview
under Report.
ANSWER:
From the above figure 2 we can note that the “Top cover” temperature is 17.52°C.
QUESTION:
Thermal Resistance of the chip Junction to the Ambient.
Use the equation given in table and calculate. Mention the Units.
ANSWER:
We know the formulae to calculate the Thermal Resistance of the chip Junction to the
Ambient is:
𝜓 = (𝑇𝑗 − 𝑇𝑖𝑛)/𝑊
From the observations
Tj = 56.47°C
Tin = 16°C
W = 100
𝜓 = (𝑇𝑗 − 𝑇𝑖𝑛)/𝑊
𝜓 = (56.47 − 16)/100
𝜓 = 0.4047°C/W
SIMULATION 3:
DIAMOND FIN 150W:
FIG 3: DIAMOND FIN 150W
QUESTION:
Pressure drop:
Create an object face with “DNVRTON Baseplate” under “Inlet Asm”.
Enable show contours for “Pressure” and note down the Maximum Pressure
value (∆P). Include the contour.
ANSWER:
From the above figure 3 we can note that the Maximum Pressure value(∆P) is 22348.3N/𝑚2.
So the pressure Drop is 22348.3N/𝑚2.
QUESTION:
For Fin Tmax and Tmin.
Create an object face with “DNVRTON Baseplate” under “Inlet Asm”. Enable
show contours. Under Calculated select “This Object”. Note Down Tmax and
Tmin from legend. Include the Contour plot.
ANSWER:
From the above figure 3 we can note that the Maximum Temperature(Tmax) is 28.69°C and
the Minimum Temperature Tmin is 17.08°C.
QUESTION:
For Chip Temperature.
Note down the “Die-PM” temperature from solution overview and go to create
and note down the “Die-PM” temperature. Include Contour for Die-PM
temperature.
ANSWER:
From the above figure 3 we can note that the “Die-PM” temperature is 76.7°C.
Contour in fig3.
QUESTION:
For Fin-plate thermal resistance
Calculate the equation given in the Table. Take Tin as 16°C. W is corresponding
“Power”.
ANSWER:
We know the formulae to calculate the fin plate thermal resistance is:
𝑅ℎ𝑠 = (𝑇𝑚𝑎𝑥 − 𝑇𝑖𝑛)/𝑊
From the observations
Tmax = 28.69°C
Tin = 16°C
W = 150
𝑅ℎ𝑠 = (𝑇𝑚𝑎𝑥 − 𝑇𝑖𝑛)/𝑊
𝑅ℎ𝑠 = (28.69 − 16)/150
𝑅ℎ𝑠 = 0.0844°C/W
QUESTION:
Note down the mean temperature (Tcase) for “Top Cover” from Solution overview
under Report.
ANSWER:
From the above figure 3 we can note that the “Top cover” temperature is 18.28°C.
QUESTION:
Thermal Resistance of the chip Junction to the Ambient.
Use the equation given in table and calculate. Mention the Units.
ANSWER:
We know the formulae to calculate the Thermal Resistance of the chip Junction to the
Ambient is:
𝜓 = (𝑇𝑗 − 𝑇𝑖𝑛)/𝑊
From the observations
Tj = 76.7°C
Tin = 16°C
W = 150
𝜓 = (𝑇𝑗 − 𝑇𝑖𝑛)/𝑊
𝜓 = (76.7 − 16)/150
𝜓 = 0.4047°C/W
SIMULATION 4:
MICRO FIN 50W:
FIG 4: MICRO FIN 50W
QUESTION:
Pressure drop:
Create an object face with “DNVRTON Baseplate” under “Inlet Asm”.
Enable show contours for “Pressure” and note down the Maximum Pressure
value (∆P). Include the contour.
ANSWER:
From the above figure 4 we can note that the Maximum Pressure value(∆P) is
2.29051e+22N/𝑚2.
So the pressure Drop is 2.29051e+22N/𝑚2.
QUESTION:
For Fin Tmax and Tmin.
Create an object face with “DNVRTON Baseplate” under “Inlet Asm”. Enable
show contours. Under Calculated select “This Object”. Note Down Tmax and
Tmin from legend. Include the Contour plot.
ANSWER:
From the above figure 4 we can note that the Maximum Temperature(Tmax) is 26.2442°C
and the Minimum Temperature Tmin is 24.6130°C.
QUESTION:
For Chip Temperature.
Note down the “Die-PM” temperature from solution overview and go to create
and note down the “Die-PM” temperature. Include Contour for Die-PM
temperature.
ANSWER:
From the above figure 4 we can note that the “Die-PM” temperature is 42.7129°C.
Contour in fig4.
QUESTION:
For Fin-plate thermal resistance
Calculate the equation given in the Table. Take Tin as 16°C. W is corresponding
“Power”.
ANSWER:
We know the formulae to calculate the fin plate thermal resistance is:
𝑅ℎ𝑠 = (𝑇𝑚𝑎𝑥 − 𝑇𝑖𝑛)/𝑊
From the observations
Tmax = 26.2442°C
Tin = 16°C
W = 50
𝑅ℎ𝑠 = (𝑇𝑚𝑎𝑥 − 𝑇𝑖𝑛)/𝑊
𝑅ℎ𝑠 = (26.2422 − 16)/50
𝑅ℎ𝑠 = 0.2048°C/W
QUESTION:
Note down the mean temperature (Tcase) for “Top Cover” from Solution overview
under Report.
ANSWER:
From the above figure 4 we can note that the “Top cover” temperature is 24.7252°C.
QUESTION:
Thermal Resistance of the chip Junction to the Ambient.
Use the equation given in table and calculate. Mention the Units.
ANSWER:
We know the formulae to calculate the Thermal Resistance of the chip Junction to the
Ambient is:
𝜓 = (𝑇𝑗 − 𝑇𝑖𝑛)/𝑊
From the observations
Tj = 42.7129°C
Tin = 16°C
W = 50
𝜓 = (𝑇𝑗 − 𝑇𝑖𝑛)/𝑊
𝜓 = (42.7129 − 16)/50
𝜓 = 0.5342°C/W
SIMULATION 5:
MICRO FIN 100W:
FIG 5: MICRO FIN 100W
QUESTION:
Pressure drop:
Create an object face with “DNVRTON Baseplate” under “Inlet Asm”.
Enable show contours for “Pressure” and note down the Maximum Pressure
value (∆P). Include the contour.
ANSWER:
From the above figure 5 we can note that the Maximum Pressure value(∆P) is
2.29051e+22N/𝑚2.
So the pressure Drop is 2.29051e+22N/𝑚2.
QUESTION:
For Fin Tmax and Tmin.
Create an object face with “DNVRTON Baseplate” under “Inlet Asm”. Enable
show contours. Under Calculated select “This Object”. Note Down Tmax and
Tmin from legend. Include the Contour plot.
ANSWER:
From the above figure 5 we can note that the Maximum Temperature(Tmax) is 32.4756°C
and the Minimum Temperature Tmin is 29.2136°C.
QUESTION:
For Chip Temperature.
Note down the “Die-PM” temperature from solution overview and go to create
and note down the “Die-PM” temperature. Include Contour for Die-PM
temperature.
ANSWER:
From the above figure 5 we can note that the “Die-PM” temperature is 65.4132°C.
Contour in fig5.
QUESTION:
For Fin-plate thermal resistance
Calculate the equation given in the Table. Take Tin as 16°C. W is corresponding
“Power”.
ANSWER:
We know the formulae to calculate the fin plate thermal resistance is:
𝑅ℎ𝑠 = (𝑇𝑚𝑎𝑥 − 𝑇𝑖𝑛)/𝑊
From the observations
Tmax = 32.4756°C
Tin = 16°C
W = 100
𝑅ℎ𝑠 = (𝑇𝑚𝑎𝑥 − 𝑇𝑖𝑛)/𝑊
𝑅ℎ𝑠 = (32.4756 − 16)/100
𝑅ℎ𝑠 = 0.1648°C/W
QUESTION:
Note down the mean temperature (Tcase) for “Top Cover” from Solution overview
under Report.
ANSWER:
From the above figure 5 we can note that the “Top cover” temperature is 29.4371°C.
QUESTION:
Thermal Resistance of the chip Junction to the Ambient.
Use the equation given in table and calculate. Mention the Units.
ANSWER:
We know the formulae to calculate the Thermal Resistance of the chip Junction to the
Ambient is:
𝜓 = (𝑇𝑗 − 𝑇𝑖𝑛)/𝑊
From the observations
Tj = 65.4132°C
Tin = 16°C
W = 100
𝜓 = (𝑇𝑗 − 𝑇𝑖𝑛)/𝑊
𝜓 = (65.4132 − 16)/100
𝜓 = 0.4941°C/W
SIMULATION 6:
MICRO FIN 150W:
FIG 6: MICRO FIN 150W
QUESTION:
Pressure drop:
Create an object face with “DNVRTON Baseplate” under “Inlet Asm”.
Enable show contours for “Pressure” and note down the Maximum Pressure
value (∆P). Include the contour.
ANSWER:
From the above figure 6 we can note that the Maximum Pressure value(∆P) is
2.29051e+22N/𝑚2.
So the pressure Drop is 2.29051e+22N/𝑚2.
QUESTION:
For Fin Tmax and Tmin.
Create an object face with “DNVRTON Baseplate” under “Inlet Asm”. Enable
show contours. Under Calculated select “This Object”. Note Down Tmax and
Tmin from legend. Include the Contour plot.
ANSWER:
From the above figure 6 we can note that the Maximum Temperature(Tmax) is 38.7924°C
and the Minimum Temperature Tmin is 33.8977°C.
QUESTION:
For Chip Temperature.
Note down the “Die-PM” temperature from solution overview and go to create
and note down the “Die-PM” temperature. Include Contour for Die-PM
temperature.
ANSWER:
From the above figure 6 we can note that the “Die-PM” temperature is 88.1986°C.
Contour in fig6.
QUESTION:
For Fin-plate thermal resistance
Calculate the equation given in the Table. Take Tin as 16°C. W is corresponding
“Power”.
ANSWER:
We know the formulae to calculate the fin plate thermal resistance is:
𝑅ℎ𝑠 = (𝑇𝑚𝑎𝑥 − 𝑇𝑖𝑛)/𝑊
From the observations
Tmax = 38.7924°C
Tin = 16°C
W = 150
𝑅ℎ𝑠 = (𝑇𝑚𝑎𝑥 − 𝑇𝑖𝑛)/𝑊
𝑅ℎ𝑠 = (38.2974 − 16)/150
𝑅ℎ𝑠 = 0.1486°C/W
QUESTION:
Note down the mean temperature (Tcase) for “Top Cover” from Solution overview
under Report.
ANSWER:
From the above figure 6 we can note that the “Top cover” temperature is 34.2353°C.
QUESTION:
Thermal Resistance of the chip Junction to the Ambient.
Use the equation given in table and calculate. Mention the Units.
ANSWER:
We know the formulae to calculate the Thermal Resistance of the chip Junction to the
Ambient is:
𝜓 = (𝑇𝑗 − 𝑇𝑖𝑛)/𝑊
From the observations
Tj = 88.1986°C
Tin = 16°C
W = 150
𝜓 = (𝑇𝑗 − 𝑇𝑖𝑛)/𝑊
𝜓 = (88.1986 − 16)/150
𝜓 = 0.4813°C/W
SIMULATION 7:
NACA FIN 50W:
FIG 7: NACA FIN 50W
QUESTION:
Pressure drop:
Create an object face with “DNVRTON Baseplate” under “Inlet Asm”.
Enable show contours for “Pressure” and note down the Maximum Pressure
value (∆P). Include the contour.
ANSWER:
From the above figure 7 we can note that the Maximum Pressure value(∆P) is
3.42390e+20N/𝑚2.
So the pressure Drop is 3.42390e+20N/𝑚2.
QUESTION:
For Fin Tmax and Tmin.
Create an object face with “DNVRTON Baseplate” under “Inlet Asm”. Enable
show contours. Under Calculated select “This Object”. Note Down Tmax and
Tmin from legend. Include the Contour plot.
ANSWER:
From the above figure 7 we can note that the Maximum Temperature(Tmax) is 21.6793°C
and the Minimum Temperature Tmin is 20.1424°C.
QUESTION:
For Chip Temperature.
Note down the “Die-PM” temperature from solution overview and go to create
and note down the “Die-PM” temperature. Include Contour for Die-PM
temperature.
ANSWER:
From the above figure 7 we can note that the “Die-PM” temperature is 38.0491°C.
Contour in fig7.
QUESTION:
For Fin-plate thermal resistance
Calculate the equation given in the Table. Take Tin as 16°C. W is corresponding
“Power”.
ANSWER:
We know the formulae to calculate the fin plate thermal resistance is:
𝑅ℎ𝑠 = (𝑇𝑚𝑎𝑥 − 𝑇𝑖𝑛)/𝑊
From the observations
Tmax = 21.6793°C
Tin = 16°C
W = 50
𝑅ℎ𝑠 = (𝑇𝑚𝑎𝑥 − 𝑇𝑖𝑛)/𝑊
𝑅ℎ𝑠 = (21.6793 − 16)/50
𝑅ℎ𝑠 = 0.1136°C/W
QUESTION:
Note down the mean temperature (Tcase) for “Top Cover” from Solution overview
under Report.
ANSWER:
From the above figure 7 we can note that the “Top cover” temperature is 20.1609°C.
QUESTION:
Thermal Resistance of the chip Junction to the Ambient.
Use the equation given in table and calculate. Mention the Units.
ANSWER:
We know the formulae to calculate the Thermal Resistance of the chip Junction to the
Ambient is:
𝜓 = (𝑇𝑗 − 𝑇𝑖𝑛)/𝑊
From the observations
Tj = 38.0491°C
Tin = 16°C
W = 50
𝜓 = (𝑇𝑗 − 𝑇𝑖𝑛)/𝑊
𝜓 = (38.0491 − 16)/50
𝜓 = 0.4409°C/W
SIMULATION 8:
NACA FIN 100W:
FIG 8: NACA FIN 100W
QUESTION:
Pressure drop:
Create an object face with “DNVRTON Baseplate” under “Inlet Asm”.
Enable show contours for “Pressure” and note down the Maximum Pressure
value (∆P). Include the contour.
ANSWER:
From the above figure 8 we can note that the Maximum Pressure value(∆P) is
3.42390e+20N/𝑚2.
So the pressure Drop is 3.42390e+20N/𝑚2.
QUESTION:
For Fin Tmax and Tmin.
Create an object face with “DNVRTON Baseplate” under “Inlet Asm”. Enable
show contours. Under Calculated select “This Object”. Note Down Tmax and
Tmin from legend. Include the Contour plot.
ANSWER:
From the above figure 8’ we can note that the Maximum Temperature(Tmax) is 23.3690°C
and the Minimum Temperature Tmin is 20.3088°C.
QUESTION:
For Chip Temperature.
Note down the “Die-PM” temperature from solution overview and go to create
and note down the “Die-PM” temperature. Include Contour for Die-PM
temperature.
ANSWER:
From the above figure 8 we can note that the “Die-PM” temperature is 65.4132°C.
Contour in fig8.
QUESTION:
For Fin-plate thermal resistance
Calculate the equation given in the Table. Take Tin as 16°C. W is corresponding
“Power”.
ANSWER:
We know the formulae to calculate the fin plate thermal resistance is:
𝑅ℎ𝑠 = (𝑇𝑚𝑎𝑥 − 𝑇𝑖𝑛)/𝑊
From the observations
Tmax = 23.3690°C
Tin = 16°C
W = 100
𝑅ℎ𝑠 = (𝑇𝑚𝑎𝑥 − 𝑇𝑖𝑛)/𝑊
𝑅ℎ𝑠 = (23.3690 − 16)/100
𝑅ℎ𝑠 = 0.0737°C/W
QUESTION:
Note down the mean temperature (Tcase) for “Top Cover” from Solution overview
under Report.
ANSWER:
From the above figure 8 we can note that the “Top cover” temperature is 20.3363°C.
QUESTION:
Thermal Resistance of the chip Junction to the Ambient.
Use the equation given in table and calculate. Mention the Units.
ANSWER:
We know the formulae to calculate the Thermal Resistance of the chip Junction to the
Ambient is:
𝜓 = (𝑇𝑗 − 𝑇𝑖𝑛)/𝑊
From the observations
Tj = 56.1089°C
Tin = 16°C
W = 100
𝜓 = (𝑇𝑗 − 𝑇𝑖𝑛)/𝑊
𝜓 = (56.1089 − 16)/100
𝜓 = 0.4011°C/W
SIMULATION 9:
NACA FIN 150W:
FIG 9: NACA FIN 150W
QUESTION:
Pressure drop:
Create an object face with “DNVRTON Baseplate” under “Inlet Asm”.
Enable show contours for “Pressure” and note down the Maximum Pressure
value (∆P). Include the contour.
ANSWER:
From the above figure 9 we can note that the Maximum Pressure value(∆P) is
3.42390e+20N/𝑚2.
So the pressure Drop is 3.42390e+20N/𝑚2.
QUESTION:
For Fin Tmax and Tmin.
Create an object face with “DNVRTON Baseplate” under “Inlet Asm”. Enable
show contours. Under Calculated select “This Object”. Note Down Tmax and
Tmin from legend. Include the Contour plot.
ANSWER:
From the above figure 9 we can note that the Maximum Temperature(Tmax) is 25.0588°C
and the Minimum Temperature Tmin is 20.4683°C.
QUESTION:
For Chip Temperature.
Note down the “Die-PM” temperature from solution overview and go to create
and note down the “Die-PM” temperature. Include Contour for Die-PM
temperature.
ANSWER:
From the above figure 9 we can note that the “Die-PM” temperature is 74.1688°C.
Contour in fig9.
QUESTION:
For Fin-plate thermal resistance
Calculate the equation given in the Table. Take Tin as 16°C. W is corresponding
“Power”.
ANSWER:
We know the formulae to calculate the fin plate thermal resistance is:
𝑅ℎ𝑠 = (𝑇𝑚𝑎𝑥 − 𝑇𝑖𝑛)/𝑊
From the observations
Tmax = 25.0588°C
Tin = 16°C
W = 150
𝑅ℎ𝑠 = (𝑇𝑚𝑎𝑥 − 𝑇𝑖𝑛)/𝑊
𝑅ℎ𝑠 = (25.0588 − 16)/150
𝑅ℎ𝑠 = 0.0604°C/W
QUESTION:
Note down the mean temperature (Tcase) for “Top Cover” from Solution overview
under Report.
ANSWER:
From the above figure 9 we can note that the “Top cover” temperature is 20.5119°C.
QUESTION:
Thermal Resistance of the chip Junction to the Ambient.
Use the equation given in table and calculate. Mention the Units.
ANSWER:
We know the formulae to calculate the Thermal Resistance of the chip Junction to the
Ambient is:
𝜓 = (𝑇𝑗 − 𝑇𝑖𝑛)/𝑊
From the observations
Tj = 74.1688°C
Tin = 16°C
W = 150
𝜓 = (𝑇𝑗 − 𝑇𝑖𝑛)/𝑊
𝜓 = (74.1688 − 16)/150
𝜓 = 0.3878°C/W
QUESTION:
Plot the Tcase versus Power and Tj versus Power. Mention the Units where ever necessary in
the calculations as well as in the Plots.
ANSWER:
FOR MICROFIN
FIG 10(1) Tcase versus Power
FIG 10(2) Tj versus Power
FOR DIAMOND FIN
FIG 10(3) Tcase versus Power
FIG 10(4) Tcase versus Power
FOR NACA FOIL
FIG 10(5) Tcase versus Power
And
FIG 10(6) Tj versus Power
TABULATION OF THE RESULTS FOUND FROM SIMULATIONS:
Fin’s Cross Section MICRO FIN DIAMOND FIN AIRFOIL FIN
Pressure drop(∆P)KPa 2.29051e+22 22348.3 3.423490e+20
Fin plate Tmax(°C) 26.2442 20.2298 21.6793
Fin plate Tmin(°C) 24.6130 16.3603 20.1424
Fin plate ∆T(°C) 1.6312 3.8695 1.5369
Chip Tj(°C) 42.7129 35.2342 38.0491
Package Power(W) 50W
Collant Inlet Temperature(°C) 16
Inlet Flow rate(m/s) 3
Fin-plate thermal resistance 0.2048 0.0846 0.1136
𝑅ℎ𝑠 = (𝑇𝑚𝑎𝑥 − 𝑇𝑖𝑛)/𝑊
(°C/W)
Thermal resistance of the chip 0.5342 0.2847 0.4409
𝜓 = (𝑇𝑗 − 𝑇𝑖𝑛)/𝑊
(°C/W)
Fin’s Cross Section MICRO FIN DIAMOND FIN AIRFOIL FIN
Pressure drop(∆P)KPa 2.29051e+22 22348.3 3.423490e+20
Fin plate Tmax(°C) 32.4756 24.46 23.3690
Fin plate Tmin(°C) 29.2136 16.72 20.3088
Fin plate ∆T(°C) 3.262 7.74 3.0602
Chip Tj(°C) 65.4132 56.47 65.4132
Package Power(W) 100W
Collant Inlet Temperature(°C) 16
Inlet Flow rate(m/s) 3
Fin-plate thermal resistance 0.1648 0.0846 0.0737
𝑅ℎ𝑠 = (𝑇𝑚𝑎𝑥 − 𝑇𝑖𝑛)/𝑊
(°C/W)
Thermal resistance of the chip 0.4941 0.4047 0.4011
𝜓 = (𝑇𝑗 − 𝑇𝑖𝑛)/𝑊
(°C/W)
Fin’s Cross Section MICRO FIN DIAMOND FIN AIRFOIL FIN
Pressure drop(∆P)KPa 2.29051e+22 22348.3 3.423490e+20
Fin plate Tmax(°C) 38.7924 28.64 25.0588
Fin plate Tmin(°C) 33.8977 17.08 20.4683
Fin plate ∆T(°C) 4.8947 11.56 4.5905
Chip Tj(°C) 88.1986 76.7 74.1688
Package Power(W) 150W
Collant Inlet Temperature(°C) 16
Inlet Flow rate(m/s) 3
Fin-plate thermal resistance 0.1486 0.0844 0.0604
𝑅ℎ𝑠 = (𝑇𝑚𝑎𝑥 − 𝑇𝑖𝑛)/𝑊
(°C/W)
Thermal resistance of the chip 0.4813 0.4047 0.3878
𝜓 = (𝑇𝑗 − 𝑇𝑖𝑛)/𝑊
(°C/W)
QUESTION:
Find out which cold plate has the highest thermal resistance for the chip from the
consolidated table and comment on the results in the summary .
ANSWER:
From the table It is clear that the cold plate which has the highest thermal resistance fir the
chip is MICRO FIN .
As we look into the table we can find that for all the power conditions of 50W, 100W and
150W the micro fin id having the highest Fin-plate thermal resistance as week as the thermal
resistance of the chip in all the given 3 conditions.
The thermal resistance values are as follows:
50W: 0.5342°C/W
100W: 0.4941°C/W
150W: 0.4813°C/W
These values are higher compared to the Diamond and NACA cold plates, indicating that the
Micro-fin cold plate has less efficient heat dissipation.
The Micro-fin cold plate demonstrates the highest thermal resistance for the chip, making it
less effective in transferring heat compared to the other two designs. The thermal resistance
is highest for this cold plate under all tested power conditions, which could lead to higher
chip temperatures and reduced cooling performance in applications where minimizing
thermal resistance is critical.
Pressure Drop (∆P): Each design's pressure drop was measured using a face object in the
simulation. The Diamond Fin recorded a significantly lower pressure drop compared to the
Micro-fin, which had the highest.
Temperature (Tmax, Tmin, Tcase, Tj): Simulations calculated the maximum and minimum
fin temperatures, the chip junction temperature (Tj), and the case temperature (Tcase) for
each power load. The Micro-fin structure consistently showed higher temperatures compared
to the Diamond and Airfoil fins.
Thermal Resistance:
The fin-plate thermal resistance was calculated as the difference between Tmax and
the coolant inlet temperature (Tin) divided by the power load.
The chip thermal resistance was calculated by dividing the difference between Tj
and Tin by the power.
Among the three designs, the Micro-fin cold plate consistently exhibited the highest
thermal resistance, indicating it was less efficient in heat dissipation.
The Diamond Fin had the lowest thermal resistance and pressure drop, making it the most
efficient in terms of cooling performance.
The Micro-fin had the highest thermal resistance, resulting in higher junction temperatures
and lower heat transfer efficiency, especially under higher power loads.
The NACA-0020 Airfoil Fin performed moderately, with its results lying between the
Micro-fin and Diamond Fin designs.
The Micro-fin cold plate is the least effective in terms of cooling performance due to its
high thermal resistance across all power levels, while the Diamond Fin offers the best heat
dissipation. These findings suggest that cold plate design is crucial in determining the
thermal performance of electronic cooling systems, with fin structures significantly
impacting the cooling efficiency.
