SURFACE ENGINEERING
AND
COATING TECHNOLOGY (SENT – 510)
JJME
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Surface Engineering Techniques
Physical vapour deposition (PVD)
Chemical vapour deposition (CVD)
Ion implantation
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Surface Engineering Techniques
Formation of Plasma Electrode
Plasma: a collection of free charged
+
particles moving in random directions. ~
V Plasma
On average, it is electrically neutral. - Gas
Discharge of gas: DC voltage applied
between two electrodes; low-pressure
gas (>0.1 Pa) ; electron-atom collision: - -
+
+ +
+
e- + G0 G+ + 2e- - -
+ -
ionisation of gas atoms and emission of +
more electrons - plasma Plasma
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Surface Engineering Techniques
Glow Discharge
Cathode dark space:
provide accelerating
force driving the ions
into the cathode, but
driving electrons away
from the cathode
Negative glow: secondary electrons accelerated back into the negative glow
region, creating additional ions – sustaining the discharge
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Surface Engineering Techniques
Physical Vapour Deposition (PVD)
Step 1: Generation of the material to be
deposited by a source - vaporization
Step 2: Vapour transport through the
vacuum from the source to the substrate
Step 3: Condensation of the vapour on the
substrate followed by film nucleation and
growth
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Surface Engineering Techniques
Physical Vapour Deposition (PVD)
Three Main PVD Techniques
Vacuum (thermal) evaporation: Heating a material until
it forms a vapour that condenses on a substrate to form
a coating
Sputtering: Electrical generation of a plasma between
the coating species and the substrate
Ion plating: A combination of the two processes
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Surface Engineering Techniques
Physical Vapour Deposition (PVD)
Vacuum (Thermal) Evaporation
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Surface Engineering Techniques
Physical Vapour Deposition (PVD)
Vacuum (Thermal) Evaporation – Electron Beam Evaporation
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Surface Engineering Techniques
Physical Vapour Deposition (PVD)
Vacuum (Thermal) Evaporation – Advantages
• High-purity films can be deposited from high-purity
source material.
• Source of material to be vaporized may be a solid in
any form and purity.
• Deposition rate is relatively higher than the other PVD
• It is the least expensive of the PVD processes
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Surface Engineering Techniques
Physical Vapour Deposition (PVD)
Vacuum (Thermal) Evaporation – Disadvantages
• Line-of-sight and limited-area sources result in poor
surface coverage on complex surfaces, and poor film
thickness uniformity over large areas without proper
fixturing and movement.
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Surface Engineering Techniques
Physical Vapour Deposition (PVD)
Vacuum (Thermal) Evaporation – Applications
• Al and Cr coatings for automotive trim
• Al and Ni-Cr in aerospace applications
for corrosion protection
• Ceramic thermal barrier coatings
(ZrO2 …) using EB/PVD
for gas turbine blades and vans for
oxidation and hot corrosion protection.
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Surface Engineering Techniques
Physical Vapour Deposition (PVD)
Sputter Coating
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Surface Engineering Techniques
Physical Vapour Deposition (PVD)
Sputter Coating – Magnetron Sputtering
Applying a magnetic field
Trapping the secondary
electrons
Confinement of plasma
Increasing ionisation
efficiency
Increasing sputtering rate
Increasing deposition rate
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Surface Engineering Techniques
Physical Vapour Deposition (PVD)
Ion Plating
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Surface Engineering Techniques
Physical Vapour Deposition (PVD)
Ion Plating
Ion bombardment on the substrate to be coated:
• to sputter off superficial oxide or other contamination prior to
the deposition
• to promote intermixture of atoms around the critical interfacial
zone by a combination of collisions and radiation enhanced
diffusion, to form compositional gradient coatings with excellent
adhesion bonding,
• to generate considerable densification of the coating by low
energy bombardment by providing mobility and displacing atoms
into vacancies
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Surface Engineering Techniques
Main characteristics of Various PVD Methods
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Surface Engineering Techniques
Main characteristics of Various PVD Methods
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Surface Engineering Techniques
Physical Vapour Deposition (PVD)
Substrate Preparation
PVD requires high cleanliness for good adhesion
Cleaning Metals
• Dry blasting
• Chemical cleaning
• Ultrasonic cleaning
Cleaning Non-Metals
Sputter Cleaning
Storage
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Surface Engineering Techniques
Applications of PVD
Decorative PVD coatings (<0.5 µm) as an environmentally
clean alternative to chrome plating
Gold – TiN
Lift interior in Coloured Rose gold – ZrN Dark gray
SS PVD Coating Bronze – TiAlN TiCN coating
Blue – TiAlN on a Gerber
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Black – TiAlCN pocketknife
Surface Engineering Techniques
Applications of PVD
Functional PVD coatings (normally, < 25 µm)
TiN: A general purpose coating designed for
moderate to high abrasion applications.
TiAlN: Universal high-performance coating
for cutting, drilling, milling, reaming and
turning.
AlTiN: High-performance coating with high
aluminum content and very high heat
resistance for dry high speed machining.
ZrN: A special coating for aluminum and
copper cutting tools for drilling or milling
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Surface Engineering Techniques
Applications of PVD
Functional PVD coatings (normally, < 25 µm)
CrN, CrCN: Unique coating with an optimum release
for forming tools, used for molds and dies, machine
components, piercing and punching.
TiCN: A conventional carbon nitride coating for
interrupted cutting, milling, tapping, stamping,
punching and forming.
TiAlCN: A special universal coating with high hardness,
heat resistance and low friction coefficient. Suitable for
several applications such as milling, hobbing, tapping,
stamping and punching.
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Surface Engineering Techniques
Chemical Vapour Deposition (CVD)
Step 1: Production of a volatile carrier
compound (chemical vapour precursor,
like C2H2, TiCl4, WCl6 etc.)
Step 2: Transport of the gas to the
deposition site
Step 3: Chemical reaction necessary to
produce the coating on the substrate
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Surface Engineering Techniques
Chemical Vapour Deposition (CVD) – Chemical Reactions
Pyrolysis: Thermal decomposition of gaseous species on
hot substrates
e.g. carbonyls, hydrides, halides
SiH4(g) → Si(s) + 2H2(g) at 650
Ni(CO)4(g) → Ni(s) + 4CO (g) at 180C
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Surface Engineering Techniques
Chemical Vapour Deposition (CVD) – Chemical Reactions
Reduction: Use hydrogen gas to reduce halides, carbonyl
halides and oxyhalides
SiCl4(g) + 2H2 → Si(s) + 4HCl(g) at 1200C
WF6(g) + 3H2 → W(s) + 6HF(g) at 300C
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Surface Engineering Techniques
Chemical Vapour Deposition (CVD) – Chemical Reactions
Oxidation: Using oxygen gas to produce oxides
SiH4(g) + O2 → SiO2(s) + 2H2 (g) at 450
2AlCl3(g) + 3H2 +3CO2 → Al2O3(s) + 3CO (g) + 6HCl(g)
Oxidation: Compounds Formation
SiCl4 (g) + CH4 → SiC(s) + 4HCl(g)
BF3(g) + NH3 → BN(s) + 4HF(g)
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Surface Engineering Techniques
Chemical Vapour Deposition (CVD)
CVD Processes
Thermal CVD (Pyrolytic and Photolytic):
• High temperature above 800 C
• Deposition rate is measured in micrometer per minute
Plasma-enhanced CVD:
• Electrical discharge is maintained in the gas phase adjacent to the
substrate
• Lower temperature (300 – 700 C)
• Deposition rate is measured in angstroms per minute
Laser CVD
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Surface Engineering Techniques
Chemical Vapour Deposition (CVD)
Laser CVD – Pyrolytic Process
Gas phase is transparent to the laser
beam
Laser beam it perpendicular to the
substrate
Substrate absorbed beam energy, to raise
temperature locally
Thermal-induced chemical reaction
Deposition
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Surface Engineering Techniques
Chemical Vapour Deposition (CVD)
Laser CVD – Photolytic Process
Suitable lasers:
wavelength – sufficient
photon energy to
break gas molecule.
Short wavelength –
Excimer laser
Laser beam parallel to the substrate surface
Laser photons absorbed by reactive gas phase – bond breaking non-
thermally, photon-activated reaction
One of the resultant species condenses onto the substrate surface
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Surface Engineering Techniques
Chemical Vapour Deposition (CVD)
Comparison of Conventional CVD to Laser CVD
Laser CVD
CVD
Highly localised treatment, to
Excellent throwing power
form selective area growth
Good adhesion of coating
Suitable for temperature
Thick and uniform layer sensitive materials by photolytic
High temperature process, such as GaAs, and
polymers
Low efficiency for large area
applications
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Surface Engineering Techniques
Chemical Vapour Deposition (CVD)
Typical Applications of CVD
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Surface Engineering Techniques
Chemical Vapour Deposition (CVD)
Typical Applications of CVD
Titankote™ H+S [ TiC/ Titankote™ H Drill tools with
(Mo, W)S2 ] Coated Draw (TiN/TiCN diamond coating
Form Insert /TiC/TiN)
Coated
Extrusion Die
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Surface Engineering Techniques
PDV vs. CVD
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Surface Engineering Techniques
PDV vs. CVD
PVD CVD
PVD coating is deposited CVD uses high
at a relatively low temperatures in the
temperature (around range of 450°C to
250°C~450°C). 1050°C.
PVD is suitable for coating CVD is mainly used for
tools that are used in depositing compound
applications that demand protective coatings.
a tough cutting edge.
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Surface Engineering Techniques
Ion Implantation
Generation of plasma
Extraction of ions from
plasma
Acceleration of ions as
a directed beam to high
energy (30 to 200 keV)
Bombardment into the substrate
Ion penetration by collisions with free electrons in the target and atom
nuclei on lattice sites
Formation of ion implanted layer (typical thickness: less than a m)
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Surface Engineering Techniques
Ion Implantation
The heavier is the
ion, the shorter is
its penetration
range at the same
energy
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Surface Engineering Techniques
Ion Implantation
The larger is the
energy of the ions
during ion
implantation, the
deeper penetrate
the ions into the
target
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Surface Engineering Techniques
Ion Implantation - Advantages
• No delamination concerns
• No significant dimensional changes
• Generation of non-equilibrium phases or amorphous
structure
• Ambient-temperature processing possible
• Enhanced surface properties while retaining bulk
properties
• High degree of control and reproducibility
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Surface Engineering Techniques
Ion Implantation - Limitations
• Limited thickness of treated material
• High-vacuum process
• Process strictly line of sight or beam line
• Relatively costly process
• Intensively training required compared with other
surface treatment processes
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Surface Engineering Techniques
Ion Implantation - Applications
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