21PE401J CAPSTONE PROGRAM IN
ELECTRONIC
COOLING ASSIGNMENT 2
Shiva Chandra
G RAJENDRA
RA2211027010151
RA2211004010647
CSE AD2 section
ECE CORE – J section
Given Problem Statement:
In this Assignment, Icepak file is given to you with a heat profile of 500W.
S
Save it. unpack the file, Change the heat source profile to 1000W
Q = (mdot) (cp) (dT)
Q is the amount of heat that can be removed (1000W),
Cp is the specific heat capacity of air. Calculate the amount of mdot
(mass flow rate) required to cool 1000W using this heat sink with the
Pedestal temperature not to exceed 105℃.
dT can be difference of 105℃ and ambient temperature Change the
required mass flow in the fan and re-run the simulation. You don’t need
to re-mesh it if you did not change the geometry.
Attach and show your simulation results in the report
Write a one- or two-pages report summary on how you calculated the
required mass flow to cool 1000W.
Understanding the Task and Data
Task:
• Increase the heat source power from 500W to 1000W.
• Calculate the required mass flow rate to maintain the pedestal
temperature below 105°C.
• Run a simulation with the calculated mass flow rate.
• Write a report summarizing the process and results.
Data:
• An Icepak file with a heat profile of 500W.
• Heat sink and heat pipe temperature profiles.
• Specific heat capacity of air (cp).
• Ambient temperature.
Calculation of Required Mass Flow Rate
Understanding the Equation
The equation provided, Q = (mdot) (cp) (dT), is the fundamental
equation for heat transfer. It states that the heat transferred (Q) is equal
to the mass flow rate (mdot) multiplied by the specific heat capacity (cp)
and the temperature difference (dT).
Determining Values
1. Q: We've increased the heat source power to 1000W.
2. cp: The specific heat capacity of air is a constant value, which can
be found in engineering tables or online resources.
3. dT: The temperature difference is the difference between the
maximum allowable pedestal temperature (105°C) and the
ambient temperature.
Calculating mdot
Rearranging the equation to solve for mdot:
mdot = Q / (cp * dT)
Substitute the known values into the equation to calculate the required
mass flow rate.
Running the Simulation
1. Modify the Icepak file: Increase the heat source power to 1000W.
2. Adjust the fan: Change the mass flow rate to the calculated
value.
3. Run the simulation: Let the simulation complete.
The formula used to find mass flow rate m = 𝒒/(𝑪𝐩 ∗ ∆𝑻) where:
• m is mass flow rate
• q is the heat profile, which is 1000W
• Cp is the specific heat capacity of air.
• dT is the difference between temperatures. Here it is given that
pedestal temperature is 105 °C. The ambient temperature is
around 20 – 25°C. So, assuming the values dT is set to 81°C.
Using the equation the value of m is 0.01228kg/s
The maximum temperature of the heat profile is maintained at 155°𝐶 and
the power source is maintained around 152°𝐶. As per the equation, the
temperature increases if mass flow rate is low. The main task is to make
the heatsink to maintain below 105°𝐶. Now if we increase the value of
mass flow rate to 3 times, i.e. m = 0.03729kg/s (approx) to maintain it
below 105°𝐶.
FIGURE 1 : Temperature of the heat profile
FIGURE 2 : Temperature of source (104°𝑪)
FIGURE 3 : Temperature of the source when
mass flow rate is increased to 0.003729kg/s or 0.04kg/s.
Temperature has got decreased to 101°𝑪.
After simulation, the maximum temperature of the heat profile is
maintained at 104°𝐶 and the power source is maintained around 101°𝐶.
SUMMARY REPORT
Analyzing the Simulation Results
Key Observations:
• Increased Mass Flow Rate = Enhanced Heat Transfer: The
simulation demonstrates a direct correlation between mass flow
rate and heat transfer efficiency. As more air passes through the
power source, heat is dissipated more effectively, leading to lower
temperatures.
• Reduced Heat Accumulation: Higher mass flow rates result in
less heat accumulation within the power source, preventing
excessive temperature rise and potential damage.
• Faster Cooling: With increased airflow, the power source can cool
down more rapidly, ensuring optimal performance.
Comparison and Analysis:
• Temperature Reduction: The simulation revealed a significant
temperature reduction in the power source after increasing the
mass flow rate. Even under a high heat profile of 1000W, the
temperature remained well below the pedestal temperature of
105℃.
• Improved Cooling Efficiency: The increased airflow effectively
dissipated heat, resulting in a more efficient cooling process.
• Optimized Mass Flow Rate: The simulation identified a mass flow
rate of 0.03729kg/s as optimal for achieving the desired
temperature reduction in the power source under the given
conditions.
Conclusion:
The simulation results clearly indicate that increasing the mass flow rate
is an effective strategy for improving the thermal performance of the
power source. By optimizing the airflow, it is possible to maintain lower
temperatures and ensure reliable operation, even under demanding
conditions.
