MMS101 Data Sheet
MMS101 Data Sheet
MMS101
Miniature 6-axis force torque sensor
Datasheet
DESCRIPTION
This is a 6-axis force torque sensor which has 3-axis force and 3-axis moment. It has a
hybrid structure of a MEMS chip and a metal structure, realizing 6-axis detection. This product
has AFE ICs built in its module and produces digital output (SPI). Correction coefficients used
for matrix operation (other axis interference components are removed) are stored in
memories inside the AFE ICs. Since they can be read out immediately before the
measurement start, users do not have to control the sensor and the correction coefficients.
Additionally, the LDO built in the module reduces noises. This product is extremely small and
light, suitable for fingertips of robot hands.
*Precautions
Before installing and using this product, please carefully read “PRECAUTIONS FOR SENSOR
INSTALLATION” and “PRECAUTIONS FOR SENSOR HANDLE” in this document. Otherwise, incorrect
installation may cause damage to this product. Pay particular attention to damage to the inner components
due to incorrect length of the mounting screws and disconnection due to handling of FPC.
This product is intended to be used with the sensor attachment mounted on a screw. Please read the
"Sensor Attachment" carefully and design and prepare the sensor attachment by yourself.
Because this product is a metal structure and small, it is sensitive to changes in environmental
temperature and heat, which may affect the output. If necessary, please consider changing the shape
and size of the sensor attachment and using the temperature sensor value update function for offset
temperature correction to make it less susceptible to temperature changes and heat. For details of the
temperature sensor value update function for offset temperature correction, refer to "Update temperature
sensor value for offset temperature correction".
Immediately after measuring starts, the built-in AFE generates heat and drifts. Therefore, it is
recommended to acquire data after drift stabilization. For details, refer to the "Measurement start
instruction".
This product is equipped with a sensor attachment for inspection at the time of shipment inspection to
adjust the offset. Therefore, the offset is output when the sensor attachment is not attached. Also, offset
output may occur even when the sensor attachment is mounted in a no-load condition. Use an external
MCU to cancel the offset output. For details, check "Offset cancel".
FEATURES
MODEL NUMBER
MMS101BXXA
INDEX
DESCRIPTION .....................................................................................................................................................1
FEATURES ..........................................................................................................................................................2
MODEL NUMBER .................................................................................................................................................2
BLOCK DIAGRAM .................................................................................................................................................4
PIN CONFIGURATION ..........................................................................................................................................5
TERMINAL EXPLANATIONS ..................................................................................................................................6
ABSOLUTE MAXIMUM RATINGS ...........................................................................................................................7
RECOMMENDED OPERATING CONDITIONS ..........................................................................................................7
Power-on sequence .........................................................................................................................................8
FORCE TORQUE SENSOR CHARACTERISTICS .......................................................................................................9
Definition of Force Torque Sensor Characteristics ............................................................................................ 10
ELECTRICAL CHARACTERISTICS ........................................................................................................................ 13
Analog Characteristics .................................................................................................................................... 13
Digital I/O Characteristics .............................................................................................................................. 13
FUNCTION ........................................................................................................................................................ 14
Operation Description .................................................................................................................................... 14
Read of matrix operation correction coefficients .............................................................................................. 15
Measurement start instruction ........................................................................................................................ 16
ADC data acquisition ...................................................................................................................................... 17
Matrix operation ............................................................................................................................................ 18
Offset cancel ................................................................................................................................................. 22
Measurement finish instruction ....................................................................................................................... 23
Update of temperature sensor value for offset temperature correction .............................................................. 24
Measurement timing chart ............................................................................................................................. 25
COMMAND CODE .............................................................................................................................................. 27
STATE TRANSITION DIAGRAM ........................................................................................................................... 28
SERIAL INTERFACE ........................................................................................................................................... 29
SPI format .................................................................................................................................................... 29
SPI AC Characteristics .................................................................................................................................... 31
TYPICAL APPLICATION CIRCUIT ........................................................................................................................ 32
DIMENSIONS .................................................................................................................................................... 33
Sensor coordination systems .......................................................................................................................... 34
Sensor attachment ............................................................................................................................................ 35
Example of sensor attachment ....................................................................................................................... 35
PRECAUTIONS FOR SENSOR INSTALLATION....................................................................................................... 37
Installation screw .......................................................................................................................................... 37
Positioning hole ............................................................................................................................................. 38
Recommended tightening method of sensor installation screw ......................................................................... 38
Sensor contact surface ................................................................................................................................... 39
PRECAUTIONS FOR SENSOR HANDLE ................................................................................................................. 40
Handling of sensor FPC .................................................................................................................................. 40
OPTION ............................................................................................................................................................ 41
Evaluation Kit ................................................................................................................................................ 41
NOTES .............................................................................................................................................................. 45
NOTES .......................................................................................................................................................... 45
ATTENTION .................................................................................................................................................. 47
ADDITIONAL NOTES...................................................................................................................................... 47
BLOCK DIAGRAM
This product has six AFEs corresponding to each axis. Please switch CSB pin voltage level to access each AFE
for operation.
LDO
SCLK
SDI
AFEx6
SPI
MEMS SDO_Fx
x6 NVM
MUX
24bit CSB_Fx
ΣADC Arithmetic SDO_Fy
Unit
Temp .
Sensor
CSB_Fy
Sequencer SDO_Fz
CSB_Fz
Digital
SDO_Mx
CSB_Mx
SDO_My
CSB_My
SDO_Mz
CSB_Mz
FG SG
Fig. 2 Block Diagram
PIN CONFIGURATION
20pin 1pin
TERMINAL EXPLANATIONS
1 FG - Frame ground
2 FG - Frame ground
12 SG - Signal ground
FOPR -40 40 N
Load rating
MOPR -0.4 0.4 N・m
Power-on sequence
There is no specification for the power-on sequence of both VDD and VDDIO supplies. When the power is
turned on, access the device at least 10msec after both VDD and VDDIO supplies have reached 90% of the
applied voltage.
VDDIO supply*0.9
VDDIO
note 1
VDDsupply*0.9
VDD
No Supply Rise up
MMS101 Power on Reset & Initial Boot Shutdown(accessible)
Voltage Voltage
note1: No time is specified from starting VDDIO to input VDD. There is no problem even if the power-on
sequence of both VDD and VDDIO supplies is reversed.
Theoretical resolution
The value is equivalent to 1LSB of output data.
Effective resolution
Standard deviation of 500-point data acquired after measurement is started with no load and the output is
stabled.
Linearity
Deviation from Reference line connecting the output between no load state and +40N (0.4N・m) applied state
or -40 N (0.4N・m) applied state.
Measurement
Value [N]
Fx
+40N
Ref. line Actual line
0N to +40N FLx
-40N
Hysteresis
Change amount from the origin after having applied the load ratings (+40N (0.4N・m) or -40N (-0.4N・m)).
Measurement
Value [N]
Fx
FHysx
Accuracy
Deviation of the applied load and output when a load is applied to the main axis while the offset output in the
unloaded state is canceled. Offset output may occur even under no-load condition after the upper and lower
sensor attachments are installed with screws. Cancel the offset output with an external MCU.
Measurement
Value [N]
Fx
+40N
FAccx
Ideal line
Actual line Actual line - Offset
FAccx -40N
Conversion time
Update interval of ADC data output from each AFE
Latency
Delay time from the timing of output data measurement to the timing of matrix operation completion.
t latx
ResultCommand+MatrixCal.
Host R M
Controll
AFE1
FxADC FxADC FxADC FxADC FxADC FxADC
ELECTRICAL CHARACTERISTICS
Analog Characteristics
(unless otherwise specified, Ta = 25℃, VDD = 4.5 V, VDDIO = 1.2 V)
Item Symbol Condition Min. Typ. Max. Unit.
VDD Current
IVDDact Measure active - - 10 mA
consumption
VDDIO Current
IVDDIOact Measure active - - 20 uA
consumption
FUNCTION
Operation Description
MMS101 can acquire data following the operation flow shown below.
Correction coefficients used in the matrix operation are stored in the memory (NVM: Non-Volatile Memory)
built in each AFE. Reading out the correction coefficients before issuance of measurement start instruction
allows the matrix operation after ADC data of each axis is acquired. Offset output may occur even under no-load
condition after the upper and lower sensor attachments are installed with screws. Cancel the offset output with
an external MCU.
ADC data offset changes depending on ambient temperature. If needed, temperature sensor values used for
offset correction arithmetic done in each AFE should be updated at any timing.
START
No
End
b31 b30 b29 b28 b27 b26 b25 b24 b23 b22 b21 b20 b19 b18 b17 b16 b15 b14 b13 b12 b11 b10 b9 b8 b7 b6 b5 b4 b3 b2 b1 b0
Table 2 MAC RAM map in which the matrix operation correction coefficients
Symbols in matrix operation formula(note5)
MAC RAM
Addr. Bit
AFE1 AFE2 AFE3 AFE4 AFE5 AFE6
[31:28] -
Matrix operation correction
66h [27:4] A1 B1 C1 D1 E1 F1
coefficient 1
[3:0]
[31:28]
Matrix operation correction
67h [27:4] A2 B2 C2 D2 E2 F2
coefficient 2
[3:0]
[31:28]
Matrix operation correction
68h [27:4] A3 B3 C3 D3 E3 F3
coefficient 3
[3:0]
69h-6Bh - For Manufacturer
[31:28]
Matrix operation correction
6Ch [27:4] A4 B4 C4 D4 E4 F4
coefficient 4
[3:0]
[31:28]
Matrix operation correction
6Eh [27:4] A5 B5 C5 D5 E5 F5
coefficient 5
[3:0]
[31:28]
Matrix operation correction
6Fh [27:4] A6 B6 C6 D6 E6 F6
coefficient 6
[3:0]
note :For details of matrix operation formula, refer to “Matrix operation”.
5
Active command
Host 0xA0
Controll
Immediately after AD converter starts, the built-in AFE heats up and deforms the structure. This causes the
output to drift. Therefore, it is recommended to wait for stabilization about 5min before acquiring data.
0.4 0.004
ーFx ーFy ーFz ーMx ーMy ーMz
0.3 0.003
Moment Output [Nm]
0.2 0.002
Force Output [N]
0.1 0.001
0 0
-0.1 -0.001
-0.2 -0.002
-0.3 -0.003
-0.4 -0.004
0 50 100 150 200 250 300 0 50 100 150 200 250 300
Measure Time [sec] Measure Time [sec]
The second and subsequent ADC data are subject to offset temperature correction using temperature sensor
values acquired during the initial AD conversion. This makes correction error larger with changes in ambient
temperature, requiring regular update of the temperature sensor values. For update of temperature sensor
values, refer to “Update of temperature sensor value for offset temperature correction”.
Result command
Host 0xC0
Controll
Matrix operation
Please execute the matrix operation below by an external MCU, using matrix operation correction coefficients
(3 bytes / 24 bits) and ADC data (3 bytes / 24 bits).
𝐴1 𝐴2 𝐴3 𝐴4 𝐴5 𝐴6 𝐹𝑥𝐴𝐷𝐶 𝐹𝑥𝑀𝐷
𝐵1 𝐵2 𝐵3 𝐵4 𝐵5 𝐵6 𝐹𝑦𝐴𝐷𝐶 𝐹𝑦𝑀𝐷
𝐶1 𝐶2 𝐶3 𝐶4 𝐶5 𝐶6 𝐹𝑧𝐴𝐷𝐶 𝐹𝑧𝑀𝐷
=
𝐷1 𝐷2 𝐷3 𝐷4 𝐷5 𝐷6 𝑀𝑥𝐴𝐷𝐶 𝑀𝑥𝑀𝐷
𝐸1 𝐸2 𝐸3 𝐸4 𝐸5 𝐸6 𝑀𝑦𝐴𝐷C 𝑀𝑦𝑀𝐷
( 𝐹1 𝐹2 𝐹3 𝐹4 𝐹5 𝐹6 ) (𝑀𝑧𝐴𝐷𝐶 ) ( 𝑀𝑧𝑀𝐷 )
Matrix operation correction coefficients ADC data Matrix operation data
(3 bytes / 24 bits) (3 bytes / 24 bits) (Input range equal to or less than load capacity
=> Max. 4 bytes / 32 bits)
Matrix operation data FxMD to MxMD should be right-shifted by 11 bits to convert the force into 0.001*N and
the moment into 0.00001*N・m.
note6:Determinant expansion
FxMD = A1 × FxADC + A2 × FyADC + A3 × FzADC + A4 × MxADC + A5 × MyADC + A6 × MzADC
FyMD = B1 × FxADC + B2 × FyADC + B3 × FzADC + B4 × MxADC + B5 × MyADC + B6 × MzADC
FzMD = C1 × FxADC + C2 × FyADC + C3 × FzADC + C4 × MxADC + C5 × MyADC + C6 × MzADC
MxMD = D1 × FxADC + D2 × FyADC + D3 × FzADC + D4 × MxADC + D5 × MyADC + D6 × MzADC
MyMD = E1 × FxADC + E2 × FyADC + E3 × FzADC + E4 × MxADC + E5 × MyADC + E6 × MzADC
MzMD = F1 × FxADC + F2 × FyADC + F3 × FzADC + F4 × MxADC + F5 × MyADC + F6 × MzADC
E79607FF h
FB1E0000 h
FFFF63C0 h -40000 -40.000
~
FB1E07FF h
FFFFF800 h
FFFFFFFF h -1 -0.001
~
FFFFFFFF h
00000000 h
00000000 h 0 0.000
~
000007FF h
00000800 h
00000001 h 1 0.001
~
00000FFF h
04E20000 h
00009C40 h 40000 40.000
~
04E207FF h
186A07FF h
00030D40 h 200000 200.000
~
186A0000 h
~
EA0707FF h
FB1E0000 h
FFFF63C0 h -40000 -0.40000
~
FB1E07FF h
FFFFF800 h
FFFFFFFF h -1 -0.00001
~
FFFFFFFF h
00000000 h
00000000 h 0 0.00000
~
000007FF h
00000800 h
00000001 h 1 0.00001
~
00000FFF h
04E20000 h
00009C40 h 40000 0.40000
~
04E207FF h
15F907FF h
0002BF20 h 180000 1.80000
~
15F90000 h
Fx ′ = Fx − Fxoff [0.001*N]
Fy ′ = Fy − Fyoff [0.001*N]
Fz ′ = Fz − Fzoff [0.001*N]
Mx ′ = Mx − Mxoff [0.00001*N・m]
My ′ = My − Myoff [0.00001*N・m]
Mz ′ = Mz − Mzoff [0.00001*N・m]
AFE1
FxADC FxADC FxADC FxADC FxADC Shift to Shutdown state
Write Register command is used to update temperature sensor values for offset temperature correction. Fig.
13 schematically shows an example of the update of such data in AFE1. By executing Write Register command
and writing data 0x01 to register address 0x3F at any timing, on-going AD conversion is completed, AD
conversion of the temperature sensor is done again, and the data is updated. For command code and format,
refer to “COMMAND CODE” and “SPI format”.
The last ADC data can also be acquired during update of the temperature sensor values.
Controll
AFE1
RegisterAdd.
0x3F 0x00 0x01 0x00
Measure temperature sensor value for offset temperature correction Measure temperature sensor value for offset temperature correction
First FxADC data measurement First FxADC data measurement after update temperature sensor value
About 7.5msec FxADC data consecutive measurement About 7.5msec FxADC data consecutive measurement
781.25usec 781.25usec
Fig. 15 Schematic of update of temperature sensor values for offset temperature correction
SDI A R R R
CSB1~6
SDO1
AFE1
TempADC+FxADC FxADC FxADC FxADC FxADC FxADC FxADC
SDO2
AFE2
TempADC+FyADC FyADC FyADC FyADC FyADC FyADC FyADC
…
SDO6
AFE6
TempADC+MzADC MzADC MzADC MzADC MzADC MzADC MzADC
TempADCupdate
WriteRegister
Host R M W R M R M
Controll
SDI R W R R
CSB1~6
SDO1
AFE1
FxADC FxADC FxADC TempADC+FxADC FxADC FxADC FxADC
SDO2
AFE2
FyADC FyADC FyADC TempADC+FxADC FyADC FyADC FyADC
…
SDO6
AFE6
MzADC MzADC MzADC TempADC+FxADC MzADC MzADC MzADC
*AD conversion cycle depends on AFE because internal clock is different from each AFE.
Fig. 16 Integrated CSB pin - Measurement timing chart
SDI A A A R R R R R R R R R
1 2 …6 1 2 …6 1 2 …6 1 2 …6
SDO1~6
CSB1
AFE1
TempADC+FxADC FxADC FxADC FxADC FxADC FxADC FxADC
CSB2
AFE2
TempADC+FyADC FyADC FyADC FyADC FyADC FyADC FyADC
…
CSB6
AFE6
TempADC+MzADC MzADC MzADC MzADC MzADC MzADC MzADC
SDI R R R W W W R R R R R R
1 2 …6 1 2 …6 1 2 …6 1 2 …6
SDO1~6
CSB1
AFE1
FxADC FxADC FxADC TempADC+FxADC FxADC FxADC FxADC
CSB2
AFE2
FyADC FyADC FyADC TempADC+FyADC FyADC FyADC FyADC
…
CSB6
AFE6
MzADC MzADC MzADC TempADC+MzADC MzADC MzADC MzADC
*AD conversion cycle depends on AFE because internal clock is different from each AFE.
Fig. 17 Integrated SDO pin - Measurement timing chart
State
Shutdown Active Idle
Command
SPI format
The basic format of SPI is shown below. The relationship between clock(SCLK)and data(SDI/SDO)is
[Link] send/receive is started when CSB becomes low level from the status when SCLK is high level. Data
is updated on falling edges of the SCLK, and sampled on rising edges of the SCLK. Data send/receive is ended
when CSB becomes high level from the status when SCLK is high level.
CSB
SCLK
SDO Hiz MSB Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 LSB Hiz
Data
SDO 1111111b A (MSB first)
Continue
SDO 1111111b A H Level
0x00
0x01 Data
Busy
(Max 25usec)
Fig. 22 SPI Write/Read format (Busy)
SPI ACK
When command code which is send in each SPI format is received, it outputs L level to 8 bits as ACK. If
command code is not accepted or command code is not valid, it outputs H level to 8 bits as NACK.
CSB
SCLK
SDI
SDO
t SU t HD t DHZ
t DO t DF t DR
t DD
SCLK
SDI
VDD SDO_Fx~Mz
SPI
VDDIO
MMS101BXXA
CSB_Fx~Mz
SG
SCLK
SDI
VDD SDO_Fx~Mz
SPI
VDDIO
MMS101BXXA
CSB_Fx~Mz
SG
Fig. 26 Dimensions
This product is intended to be used with the sensor attachment mounted on the top and bottom of the
product by screws. If the sensor attachment is used without mounting the screws, the input force is not
sufficiently transmitted to the product and the accuracy is not satisfied, or the output may drift in response to
changes in the environmental temperature.
Please design and prepare the sensor attachment by yourself according to your purpose and application.
It is recommended to fix the board connected to FPC to the attachment with a screw so that the FPC is not
bent repeatedly. Additionally, cables should be inserted and removed with the FPC fixed to the attachment with
a screw to minimize load to the FPC.
Fig. 29, 30 and 31 show examples. The attachment should be designed depending on the intended use.
This product is a precision measuring instrument. Therefore, it needs to be installed following the appropriate
procedure to avoid overload to it. Failure to observe the recommendations included in this manual may cause
damage to the sensor.
Installation screw
Four M1.6 screws should be used for installation on both top and bottom surfaces. Length of the screws
inserted in the installation holes of both surfaces should be 1.7 mm or shorter. The tapped holes are
1.8 mm (min. 1.7 mm) through holes. If the screw length exceeds 1.7mm, FPC or IC located near the through-
hole inside the product may be damaged.
6-R0.3
φ1 slotted hole
4) 1)
Ex. 1st round 1)0.05N・m -> 2)0.05N・m -> 3)0.05N・m -> 4)0.05N・m
2nd round 1)0.15N・m -> 2)0.15N・m -> 3)0.15N・m -> 4)0.15N・m
2) 3)
Contact surface
Top surface on the sensor side
Bottom surface
This product is a precision measuring instrument. Therefore, it needs to be handled following the appropriate
procedure to avoid overload to it. Failure to observe the recommendations included in this manual may cause
damage to the sensor.
In the FPC termination part, a level difference exists between the FPC and the reinforcing plate. Bending the
FPC at this level difference part could cut the wiring on the FPC.
As options, evaluation kit and conversion board are available. Please order if necessary. However, the options
are guaranteed only for checking the operation at the time of shipment, and will only be provided for sample
support. Please note.
Evaluation Kit
Using evaluation kit with PC applications allows logging data to be acquired. In addition to product to which
conversion board for evaluation kit are connected, they consist of cables and evaluation board. There are two
kinds of evaluation kits. Select them according to the application.
Table 11 Evaluation Kit line-up
Evaluation Kit Name Constitution
Evaluation Board
Conversion Board (ForceSensorControllerBoardVer2.0/3.0)
(Conv. BD Ver1.1)
Product Cable
Evaluation Kit 1
*External communication: USB
(Ver.3 Rev.0) *USB cable is not included.
・Required Spec. USB cable:USB ver.2.0/Type-C
◆Manual: evaluationkit1 manual_en_rev1.pdf
◆Document set: evaluationkit1_en.zip
*You must enter an ID and password to download the document
set. If necessary, contact our contact point.
Evaluation Board
(ForceSensorMultiFingerBoardVer3.0)
Product Cable
Conversion Board
(Conv. BD Ver1.1)
Evaluation Kit 5
(Ver.3 E Rev.0)
*External communication: Ethernet/USB
*Ethernet cable and USB cable are not included.
・Required Spec. Ethernet cable :Cat5e or higher/ RJ-45 Plug
・Required Spec. USB cable: USB ver.2.0/Type-C
*Max. 5 sampled connectable
◆Manual: evaluationkit5_manual_en_rev1.pdf
◆Document set: evaluationkit5_en.zip
*You must enter an ID and password to download the document
set. If necessary, contact our contact point.
Spiral tube
Y-shaped terminal
for shield
*Connect SG or
ground as necessary
Braided Shield
Sheath
40mm
40mm
ForceSensor
ControllerBoard
Ver2.0/3.0 USB USB Max. 1 pc
*No functional differences 1.0mm
between Ver2.0 and Ver3.0 6.1mm
80mm
115mm
20pin 20mm
MMS101 [Link] MMS101 [Link]
Output Output Output Output
VDD VDD CSB_Fz CSB_Fz
VDDIO VDDIO CSB_Mx CSB_Mx
17mm
Conv. BD VLDOOUT VLDOOUT CSB_My CSB_My
Ver1.1 SG SG CSB_Mz CSB_Mz 0.5mm
(For Evaluation FG FG SDO_Fx SDO_Fx 6.1mm
Kit) FG N.C. SDO_Fy SDO_Fy
SCLK SCLK SDO_Fz SDO_Fz
Sensor side connector:FH52K-20S-0.5SH
SDI SDI SDO_Mx SDO_Mx
(HIROSE ELECTRIC CO.,LTD)
CSB_Fx CSB_Fx SDO_My SDO_My
Controll/Evaluation board side connector:SM20B-NSHDZS
CSB_Fy CSB_Fy SDO_Mz SDO_Mz
([Link]. CO., LTD.)
NOTES
【Safety Precautions】
Though Mitsumi Electric Co., Ltd. (hereinafter referred to as "Mitsumi") works continually to improve our
product's quality and reliability, semiconductor products may generally malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their
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this product could cause loss of human life, bodily injury, or damage to property, including data loss or
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applicability of any information contained in this document, or in charts, diagrams, programs, algorithms,
sample application circuits, or any other referenced documents; and (c) validating all operating parameters
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This product is intended for applying to computers, OA units, communication units, instrumentation units,
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If any damage to our customer is objectively identified to be caused by the defect of this product, Mitsumi is
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The outline of parameters described herein has been chosen as an explanation of the standard parameters
and performance of the product. When you actually plan to use the product, please ensure that the outside
conditions are reflected in the actual circuit and assembling designs.
Before using this product, please evaluate and confirm the actual application with this product mounted and
embedded.
To investigate the influence by applied transient load or external noise, it is necessary to evaluate and
confirm them with mounting this product to the actual application.
Any usage above the maximum rating may destroy this product or shorten the lifetime. Be sure to use this
product under the maximum rating.
If you continue to use this product highly-loaded (applying high temperature, large current or high voltage;
or variation of temperature) even under the absolute maximum rating and even in the operating range, the
reliability of this product may decrease significantly. Please design appropriate reliability in consideration of
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less of the maximum value) considering parameters including ambient temperature, input voltage, and
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【Others】
Any part of the contents contained herein must not be reprinted or reproduced without our prior permission.
ATTENTION
This product is designed and manufactured with the intention of normal use in general electronics. No special
circumstance as described below is considered for the use of it when it is designed. With this reason, any use
and storage under the circumstances below may affect the performance of this product. Prior confirmation
of performance and reliability is requested to customers.
Environment with strong static electricity or electromagnetic wave
Environment with high temperature or high humidity where dew condensation may occur
This product is not designed to withstand radioactivity, and must avoid using in a radioactive environment.
ADDITIONAL NOTES
In the event of any defect in this product, you may send us the product. Then, we will perform an
appropriate analysis and consult with you about appropriate remedy for the problem proposed by our sole
discretion.
Handle with care to prevent foreign matter from entering the screw holes and product gaps.
When installing this product, design it so that the length of the screw inserted into the product mounting
hole is 1.7mm or less. The product mounting hole is a through hole. If it exceeds 1.7mm, the internal parts
will be damaged or malfunction. Also, we recommend that the tightening torque of the screws during
mounting be 0.15N·m.
Do not bend the FPC at a sharp angle or pull it hard so that the load is concentrated. Otherwise, the wiring
on the FPC may be broken, resulting in operation failure.
Notes:
Any products mentioned this datasheet are subject to any modification in their appearance and others for
improvements without prior notification. The details listed here are not a guarantee of the individual products at
the time of ordering. When using the products, you will be asked to check their specifications.