0% found this document useful (0 votes)
37 views48 pages

MMS101 Data Sheet

Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
0% found this document useful (0 votes)
37 views48 pages

MMS101 Data Sheet

Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
You are on page 1/ 48

2023 6/21 Rev5.

MMS101
Miniature 6-axis force torque sensor
Datasheet

DESCRIPTION

This is a 6-axis force torque sensor which has 3-axis force and 3-axis moment. It has a
hybrid structure of a MEMS chip and a metal structure, realizing 6-axis detection. This product
has AFE ICs built in its module and produces digital output (SPI). Correction coefficients used
for matrix operation (other axis interference components are removed) are stored in
memories inside the AFE ICs. Since they can be read out immediately before the
measurement start, users do not have to control the sensor and the correction coefficients.
Additionally, the LDO built in the module reduces noises. This product is extremely small and
light, suitable for fingertips of robot hands.

*Precautions

 Before installing and using this product, please carefully read “PRECAUTIONS FOR SENSOR
INSTALLATION” and “PRECAUTIONS FOR SENSOR HANDLE” in this document. Otherwise, incorrect
installation may cause damage to this product. Pay particular attention to damage to the inner components
due to incorrect length of the mounting screws and disconnection due to handling of FPC.

 This product is intended to be used with the sensor attachment mounted on a screw. Please read the
"Sensor Attachment" carefully and design and prepare the sensor attachment by yourself.

 Because this product is a metal structure and small, it is sensitive to changes in environmental
temperature and heat, which may affect the output. If necessary, please consider changing the shape
and size of the sensor attachment and using the temperature sensor value update function for offset
temperature correction to make it less susceptible to temperature changes and heat. For details of the
temperature sensor value update function for offset temperature correction, refer to "Update temperature
sensor value for offset temperature correction".

 Immediately after measuring starts, the built-in AFE generates heat and drifts. Therefore, it is
recommended to acquire data after drift stabilization. For details, refer to the "Measurement start
instruction".

 This product is equipped with a sensor attachment for inspection at the time of shipment inspection to
adjust the offset. Therefore, the offset is output when the sensor attachment is not attached. Also, offset
output may occur even when the sensor attachment is mounted in a no-load condition. Use an external
MCU to cancel the offset output. For details, check "Offset cancel".

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 1
Miniature 6-axis force torque sensor MMS101

FEATURES

 Very small:Φ9.6(W) × 9.0(H) mm


 Light weight:3 g
 High load capacity Fx, Fy, Fz:200N / Mx, My, Mz:1.8N・m
 Load rating Fx, Fy, Fz:40N / Mx, My, Mz:0.4N・m

Fig. 1 Product appearance

 Noise reduction by built-in LDO


Fx, Fy:0.04N RMS / Fz:0.06N RMS
Mx, My:0.0004N・m RMS / Mz:0.0008N・m RMS
 Digital output of 6-axis data by built-in sequencer (SPI)
 RoHS compliant
 Halogen-contained

MODEL NUMBER

 MMS101BXXA

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 2
Miniature 6-axis force torque sensor MMS101

INDEX
DESCRIPTION .....................................................................................................................................................1
FEATURES ..........................................................................................................................................................2
MODEL NUMBER .................................................................................................................................................2
BLOCK DIAGRAM .................................................................................................................................................4
PIN CONFIGURATION ..........................................................................................................................................5
TERMINAL EXPLANATIONS ..................................................................................................................................6
ABSOLUTE MAXIMUM RATINGS ...........................................................................................................................7
RECOMMENDED OPERATING CONDITIONS ..........................................................................................................7
Power-on sequence .........................................................................................................................................8
FORCE TORQUE SENSOR CHARACTERISTICS .......................................................................................................9
Definition of Force Torque Sensor Characteristics ............................................................................................ 10
ELECTRICAL CHARACTERISTICS ........................................................................................................................ 13
Analog Characteristics .................................................................................................................................... 13
Digital I/O Characteristics .............................................................................................................................. 13
FUNCTION ........................................................................................................................................................ 14
Operation Description .................................................................................................................................... 14
Read of matrix operation correction coefficients .............................................................................................. 15
Measurement start instruction ........................................................................................................................ 16
ADC data acquisition ...................................................................................................................................... 17
Matrix operation ............................................................................................................................................ 18
Offset cancel ................................................................................................................................................. 22
Measurement finish instruction ....................................................................................................................... 23
Update of temperature sensor value for offset temperature correction .............................................................. 24
Measurement timing chart ............................................................................................................................. 25
COMMAND CODE .............................................................................................................................................. 27
STATE TRANSITION DIAGRAM ........................................................................................................................... 28
SERIAL INTERFACE ........................................................................................................................................... 29
SPI format .................................................................................................................................................... 29
SPI AC Characteristics .................................................................................................................................... 31
TYPICAL APPLICATION CIRCUIT ........................................................................................................................ 32
DIMENSIONS .................................................................................................................................................... 33
Sensor coordination systems .......................................................................................................................... 34
Sensor attachment ............................................................................................................................................ 35
Example of sensor attachment ....................................................................................................................... 35
PRECAUTIONS FOR SENSOR INSTALLATION....................................................................................................... 37
Installation screw .......................................................................................................................................... 37
Positioning hole ............................................................................................................................................. 38
Recommended tightening method of sensor installation screw ......................................................................... 38
Sensor contact surface ................................................................................................................................... 39
PRECAUTIONS FOR SENSOR HANDLE ................................................................................................................. 40
Handling of sensor FPC .................................................................................................................................. 40
OPTION ............................................................................................................................................................ 41
Evaluation Kit ................................................................................................................................................ 41
NOTES .............................................................................................................................................................. 45
NOTES .......................................................................................................................................................... 45
ATTENTION .................................................................................................................................................. 47
ADDITIONAL NOTES...................................................................................................................................... 47

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 3
Miniature 6-axis force torque sensor MMS101

BLOCK DIAGRAM

This product has six AFEs corresponding to each axis. Please switch CSB pin voltage level to access each AFE
for operation.

VLDOOUT VDD VDDIO

LDO
SCLK
SDI
AFEx6
SPI
MEMS SDO_Fx
x6 NVM
MUX
24bit CSB_Fx
ΣADC Arithmetic SDO_Fy
Unit
Temp .
Sensor
CSB_Fy
Sequencer SDO_Fz
CSB_Fz
Digital
SDO_Mx
CSB_Mx
SDO_My
CSB_My
SDO_Mz
CSB_Mz

FG SG
Fig. 2 Block Diagram

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 4
Miniature 6-axis force torque sensor MMS101

PIN CONFIGURATION

20pin 1pin

Fig. 3 Pin configuration

*The terminal are located on the back of the FPC.


The above finger is a perspective view.

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 5
Miniature 6-axis force torque sensor MMS101

TERMINAL EXPLANATIONS

Table 1 Pin table

No. Pin Name Type Function

1 FG - Frame ground

2 FG - Frame ground

3 CSB_Fz I AFE3(Fz) Chip select for SPI communication (negative logic)

4 SDO_Fz O AFE3(Fz) Serial Data Output for SPI communication

5 CSB_Mz I AFE6(Mz) Chip select for SPI communication (negative logic)

6 SDO_Mz O AFE6(Mz) Serial Data Output for SPI communication

7 CSB_Mx I AFE4(Mx) Chip select for SPI communication (negative logic)

8 CSB_My I AFE5(My) Chip select for SPI communication (negative logic)

9 VDDIO I Digital I/O power supply


Built-in LDO output
* Not-in-use during normal operation. However, it is recommended to
10 VLDOOUT O
connect a capacitor (10uF) near the sensor connection cable connector
on your circuit board for noise reduction.
11 VDD I Analog power supply

12 SG - Signal ground

13 CSB_Fx I AFE1(Fx) Serial Data Output for SPI communication

14 SCLK I Serial clock for SPI communication

15 SDO_Fy O AFE2(Fy) Serial Data Output for SPI communication

16 SDI I Serial Data Input for SPI communication

17 SDO_My O AFE5(My) Serial Data Output for SPI communication

18 SDO_Fx O AFE1(Fx) Serial Data Output for SPI communication

19 SDO_Mx O AFE4(Mx) Serial Data Output for SPI communication

20 CSB_Fy I AFE2(Fy) Chip select for SPI communication (negative logic)

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 6
Miniature 6-axis force torque sensor MMS101

ABSOLUTE MAXIMUM RATINGS

(unless otherwise specified, Ta = 25℃)


Item Symbol Min. Max. Unit

FMAX -200 200 N


Load capacity
MMAX -1.8 1.8 N・m

Storage temperature range TSTG -10 +60 ℃

Analog supply voltage VDDMAX -0.3 +15 V

Digital I/O voltage VDDIOMAX -0.3 +4.0 V

RECOMMENDED OPERATING CONDITIONS

(unless otherwise specified, Ta = 25℃)


Item Symbol Min. Max. Unit

FOPR -40 40 N
Load rating
MOPR -0.4 0.4 N・m

Operating temperature range TOPR +5 +45 ℃

Analog supply voltage VDDOPR +3.8 +14 V

Digital I/O voltage VDDIOOPR +1.14 +3.6 V

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 7
Miniature 6-axis force torque sensor MMS101

Power-on sequence
There is no specification for the power-on sequence of both VDD and VDDIO supplies. When the power is
turned on, access the device at least 10msec after both VDD and VDDIO supplies have reached 90% of the
applied voltage.

VDDIO supply*0.9
VDDIO
note 1

VDDsupply*0.9
VDD

more than 10 msec

No Supply Rise up
MMS101 Power on Reset & Initial Boot Shutdown(accessible)
Voltage Voltage

Fig. 4 Power-on sequence

note1: No time is specified from starting VDDIO to input VDD. There is no problem even if the power-on
sequence of both VDD and VDDIO supplies is reversed.

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 8
Miniature 6-axis force torque sensor MMS101

FORCE TORQUE SENSOR CHARACTERISTICS

(unless otherwise specified, Ta = 25℃, VDD = 3.8 to 14 V, VDDIO = 1.14 to 3.6 V)


Item Symbol Condition Min. Typ. Max. Unit.

FxFyFz FRES - - 0.001 - N


Theoretical
resolution
MxMyMz MRES - - 0.00001 - N・m

FxFy FEresxy - - 0.04 - N RMS

Effective Fz FEresz - - 0.06 - N RMS


resolution
N・m
(note2) MxMy MEresxy - - 0.0004 -
RMS
N・m
Mz MEresz - - 0.0008 -
RMS
Linearity FL FS=40N or
-1.0 - 1.0 %FS
(note2, 3) ML 0.4N・m
Hysteresis FHys FS=40N or
-1.0 - 1.0 %FS
(note4) MHys 0.4N・m
Accuracy FAcc FS=40N or
-5.0 - 5.0 %FS
(note2, 3) MAcc 0.4N・m
Conversion time
tcon - - 781.25 - usec
(note4)
Conversion time: Typ.
Latency Communication clock: 1MHz
tlat - - 2.0 msec
(note4) No delay in switching of
AFE to access
note2: The values in chart are the results of the measurement using our evaluation equipment and board.
note3: With sensor attachments installed on the upper and lower of this product.
note4: Design assurance item

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 9
Miniature 6-axis force torque sensor MMS101

Definition of Force Torque Sensor Characteristics


 Full Scale FS
Full-scale FS is 40N or 0.4N・m from zero to the load rating for positive and negative.

 Theoretical resolution
The value is equivalent to 1LSB of output data.

 Effective resolution
Standard deviation of 500-point data acquired after measurement is started with no load and the output is
stabled.

 Linearity
Deviation from Reference line connecting the output between no load state and +40N (0.4N・m) applied state
or -40 N (0.4N・m) applied state.

Measurement
Value [N]
Fx

+40N
Ref. line Actual line
0N to +40N FLx

-40N +40N Input Fx [N]


Ref. line
-40N to 0N FLx

-40N

Fig. 5 Linearity (example: Fx)

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 10
Miniature 6-axis force torque sensor MMS101

 Hysteresis
Change amount from the origin after having applied the load ratings (+40N (0.4N・m) or -40N (-0.4N・m)).

Measurement
Value [N]
Fx
FHysx

+40N Input Fx [N]

Fig. 6 Hysteresis (e.g.: Fx)

 Accuracy
Deviation of the applied load and output when a load is applied to the main axis while the offset output in the
unloaded state is canceled. Offset output may occur even under no-load condition after the upper and lower
sensor attachments are installed with screws. Cancel the offset output with an external MCU.
Measurement
Value [N]
Fx

+40N
FAccx
Ideal line
Actual line Actual line - Offset

-40N +40N Input Fx [N]

FAccx -40N

Fig. 7 Accuracy (e.g.: Fx)

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 11
Miniature 6-axis force torque sensor MMS101

 Conversion time
Update interval of ADC data output from each AFE

 Latency
Delay time from the timing of output data measurement to the timing of matrix operation completion.

t latx

ResultCommand+MatrixCal.
Host R M
Controll

AFE1
FxADC FxADC FxADC FxADC FxADC FxADC

Fig. 8 Latency (e.g.: Fx)

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 12
Miniature 6-axis force torque sensor MMS101

ELECTRICAL CHARACTERISTICS

Analog Characteristics
(unless otherwise specified, Ta = 25℃, VDD = 4.5 V, VDDIO = 1.2 V)
Item Symbol Condition Min. Typ. Max. Unit.
VDD Current
IVDDact Measure active - - 10 mA
consumption
VDDIO Current
IVDDIOact Measure active - - 20 uA
consumption

Digital I/O Characteristics


(unless otherwise specified, Ta = 25℃, VDD = 3.8 to 14 V, VDDIO = 1.14 to 3.6 V)
Item Symbol Condition Min. Typ. Max. Unit
High level Input
VIH - 0.8 × VDDIO - VDDIO + 0.3 V
voltage
Low level Input
voltage VIL - -0.3 - 0.2 × VDDIO V

VOH1 VDDIO ≧ 2.0V, VDDIO - 0.4 - - V


Output voltage Iload = -3mA
High level VDDIO < 2.0V,
VOH2 0.8 × VDDIO - - V
Iload = -1mA
VDDIO ≧ 2.0V,
VOL1 Iload = 3mA - - 0.4 V
Output voltage
Low level VDDIO < 2.0V,
VOL2 - - 0.2 × VDDIO V
Iload = 1mA

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 13
Miniature 6-axis force torque sensor MMS101

FUNCTION

Operation Description
MMS101 can acquire data following the operation flow shown below.
Correction coefficients used in the matrix operation are stored in the memory (NVM: Non-Volatile Memory)
built in each AFE. Reading out the correction coefficients before issuance of measurement start instruction
allows the matrix operation after ADC data of each axis is acquired. Offset output may occur even under no-load
condition after the upper and lower sensor attachments are installed with screws. Cancel the offset output with
an external MCU.
ADC data offset changes depending on ambient temperature. If needed, temperature sensor values used for
offset correction arithmetic done in each AFE should be updated at any timing.

START

Matrix operation correction coefficients of each axis are stored in NVM of


Read of matrix operation the corresponding AFE.
correction coefficients Read correction coefficients of all axes and use them in the matrix
operation.
For details, refer to “Read of matrix operation correction coefficients”.

Issue Active command to each AFE.


Measurement start instruction For details, refer to ”Measurement start instruction”.

Issue Result command to each AFE.


ADC data acquisition
For details, refer to “ADC data acquisition”.

Execute matrix operation by the external MCU.


Matrix operation For details, refer to “Matrix operation”.

Cancel the offset output by the external MCU.


Offset cancel
For details, refer to “Offset cancel”.

Update temperature sensor values as needed.


Issue an instruction to update temperature sensor value to each AFE.
Update of temperature sensor value
For details, refer to “Update of temperature sensor value for offset
for offset temperature correction temperature correction”.

Yes Data acquistition


continue?

No

Issue Reset command or Shutdown command to each AFE.


Measurement finish instruction For details, refer to “Measurement finish instruction”

End

Fig. 9 Operation flow chart

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 14
Miniature 6-axis force torque sensor MMS101

Read of matrix operation correction coefficients


Matrix operation correction coefficients are stored in the memory (NVM: Non-Volatile Memory) built in each
AFE. The coefficients in the memory are expanded to the memory area (MAC RAM) used for calculation. MAC
RAM map in which the matrix operation correction coefficients are expanded is shown in Table2. The
coefficients can be read by executing MAC RAM read command. MAC RAM read command reads data with 4
bytes 32bits width of [31:0], but the matrix operation correction coefficient is 3 bytes 24bits of [27:4]. To
execute MAC RAM command, AFEs must be in the Idle state. Therefore, Idle command must be issued and
executed in advance. For command code and format, refer to “COMMAND CODE” and “SPI format”.

b31 b30 b29 b28 b27 b26 b25 b24 b23 b22 b21 b20 b19 b18 b17 b16 b15 b14 b13 b12 b11 b10 b9 b8 b7 b6 b5 b4 b3 b2 b1 b0

0 0 0 0 Matrix operation correction coefficient [27:4] 0 0 0 0

Fig. 10 MAC RAM read data

Table 2 MAC RAM map in which the matrix operation correction coefficients
Symbols in matrix operation formula(note5)
MAC RAM
Addr. Bit
AFE1 AFE2 AFE3 AFE4 AFE5 AFE6

[31:28] -
Matrix operation correction
66h [27:4] A1 B1 C1 D1 E1 F1
coefficient 1
[3:0]
[31:28]
Matrix operation correction
67h [27:4] A2 B2 C2 D2 E2 F2
coefficient 2
[3:0]
[31:28]
Matrix operation correction
68h [27:4] A3 B3 C3 D3 E3 F3
coefficient 3
[3:0]
69h-6Bh - For Manufacturer
[31:28]
Matrix operation correction
6Ch [27:4] A4 B4 C4 D4 E4 F4
coefficient 4
[3:0]
[31:28]
Matrix operation correction
6Eh [27:4] A5 B5 C5 D5 E5 F5
coefficient 5
[3:0]
[31:28]
Matrix operation correction
6Fh [27:4] A6 B6 C6 D6 E6 F6
coefficient 6
[3:0]
note :For details of matrix operation formula, refer to “Matrix operation”.
5

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 15
Miniature 6-axis force torque sensor MMS101

Measurement start instruction


Each AFE starts AD conversion when receiving Active command. For command code and format, refer to
“COMMAND CODE” and “SPI format”. Fig. 10 schematically shows an example of AD conversion start instruction
issued to AFE1. This instruction must be issued to all AFEs because matrix operation uses ADC data of all axes.
ADC data is subject to offset temperature correction in each AFE. Approximately 7.5 msec is required to
complete the first AD conversion because of temperature sensor measurement for offset temperature correction
and waiting for filter stabilization. From the second AD conversion, the conversion is repeated at the interval of
approximately 0.8 msec because neither the temperature sensor measurement nor waiting for filter stabilization
is required.

Active command
Host 0xA0

Controll

Measure temperature sensor value for offset temperature correction

AFE1 TempADC FxADC


+Waiting stable filter +Waiting stable filter FxADC FxADC FxADC FxADC

First FxADC data measurement

About 7.5msec FxADC data consecutive measurement


(781.25usec)

Fig. 11 Schematic of AD conversion start instruction

Immediately after AD converter starts, the built-in AFE heats up and deforms the structure. This causes the
output to drift. Therefore, it is recommended to wait for stabilization about 5min before acquiring data.

0.4 0.004
ーFx ーFy ーFz ーMx ーMy ーMz
0.3 0.003
Moment Output [Nm]

0.2 0.002
Force Output [N]

0.1 0.001
0 0
-0.1 -0.001
-0.2 -0.002
-0.3 -0.003
-0.4 -0.004
0 50 100 150 200 250 300 0 50 100 150 200 250 300
Measure Time [sec] Measure Time [sec]

Fig. 12 Outputting data immediately after AD conversion starts

The second and subsequent ADC data are subject to offset temperature correction using temperature sensor
values acquired during the initial AD conversion. This makes correction error larger with changes in ambient
temperature, requiring regular update of the temperature sensor values. For update of temperature sensor
values, refer to “Update of temperature sensor value for offset temperature correction”.

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 16
Miniature 6-axis force torque sensor MMS101

ADC data acquisition


To acquire ADC data (3 bytes / 24 bits), Result command should be issued to each AFE. For command code
and format, refer to “COMMAND CODE” and “SPI format”. Fig. 11 schematically shows an example of ADC data
acquisition from AFE1. Result command must be issued to all AFEs to acquire ADC data of all axes because
matrix operation uses this data.
Each AFE returns the last AD-converted data when receiving Result command. If Result command is issued
during the first AD conversion, ADC data will be 000000 h.

Result command
Host 0xC0

Controll

Each AFE outputs the ADC data acquired immediately


before receiving Result command
AFE1
FxADC FxADC FxADC FxADC FxADC FxADC FxADC FxADC FxADC

Fig. 13 Schematic of ADC data acquisition

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 17
Miniature 6-axis force torque sensor MMS101

Matrix operation
Please execute the matrix operation below by an external MCU, using matrix operation correction coefficients
(3 bytes / 24 bits) and ADC data (3 bytes / 24 bits).

Matrix operation formula (note6)

𝐴1 𝐴2 𝐴3 𝐴4 𝐴5 𝐴6 𝐹𝑥𝐴𝐷𝐶 𝐹𝑥𝑀𝐷
𝐵1 𝐵2 𝐵3 𝐵4 𝐵5 𝐵6 𝐹𝑦𝐴𝐷𝐶 𝐹𝑦𝑀𝐷
𝐶1 𝐶2 𝐶3 𝐶4 𝐶5 𝐶6 𝐹𝑧𝐴𝐷𝐶 𝐹𝑧𝑀𝐷
=
𝐷1 𝐷2 𝐷3 𝐷4 𝐷5 𝐷6 𝑀𝑥𝐴𝐷𝐶 𝑀𝑥𝑀𝐷
𝐸1 𝐸2 𝐸3 𝐸4 𝐸5 𝐸6 𝑀𝑦𝐴𝐷C 𝑀𝑦𝑀𝐷
( 𝐹1 𝐹2 𝐹3 𝐹4 𝐹5 𝐹6 ) (𝑀𝑧𝐴𝐷𝐶 ) ( 𝑀𝑧𝑀𝐷 )
Matrix operation correction coefficients ADC data Matrix operation data
(3 bytes / 24 bits) (3 bytes / 24 bits) (Input range equal to or less than load capacity
=> Max. 4 bytes / 32 bits)

Matrix operation data FxMD to MxMD should be right-shifted by 11 bits to convert the force into 0.001*N and
the moment into 0.00001*N・m.

Fx = FxMD ÷ 211 [0.001*N]


Fy = FyMD ÷ 211 [0.001*N]
Fz = FzMD ÷ 211 [0.001*N]
Mx = MxMD ÷ 211 [0.00001*N・m]
My = MyMD ÷ 211 [0.00001*N・m]
Mz = MzMD ÷ 211 [0.00001*N・m]

note6:Determinant expansion
FxMD = A1 × FxADC + A2 × FyADC + A3 × FzADC + A4 × MxADC + A5 × MyADC + A6 × MzADC
FyMD = B1 × FxADC + B2 × FyADC + B3 × FzADC + B4 × MxADC + B5 × MyADC + B6 × MzADC
FzMD = C1 × FxADC + C2 × FyADC + C3 × FzADC + C4 × MxADC + C5 × MyADC + C6 × MzADC
MxMD = D1 × FxADC + D2 × FyADC + D3 × FzADC + D4 × MxADC + D5 × MyADC + D6 × MzADC
MyMD = E1 × FxADC + E2 × FyADC + E3 × FzADC + E4 × MxADC + E5 × MyADC + E6 × MzADC
MzMD = F1 × FxADC + F2 × FyADC + F3 × FzADC + F4 × MxADC + F5 × MyADC + F6 × MzADC

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 18
Miniature 6-axis force torque sensor MMS101

 Matrix operation correction coefficient (A1 to F6)


Matrix operation correction coefficient is 3 bytes (24 bits). A negative number is expressed by 2’s
complement.
Table 3 Example of matrix operation correction coefficient
HEX. DEC.
800000 h -8388608
FFFFFF h -1
000000 h 0
000001 h 1
000800 h 2048
7FFFFF h 8388607

 ADC data (FxADC to MzADC)


ADC data is 3 bytes (24 bits). A negative number is expressed by 2’s complement.

Table 4 Example of ADC data output


HEX. DEC.
800000 h -8388608
FF63C0 h -40000
FFFFFF h -1
000000 h 0
000001 h 1
009C40 h 40000
7FFFFF h 8388607

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 19
Miniature 6-axis force torque sensor MMS101

 Matrix operation data (FxMD to MzMD)


According to calculations, the range of the matrix operation data is 6 bytes (48 bits). For the data
measured at the load capacity or less, the range is 4 bytes (32 bits) at the maximum. The matrix
operation data uses negative numbers expressed by 2’s complement.

Table 5 Example of matrix operation data – force output


Matrix operation Matrix operation data
Force
data After right-shift by 11 bits
[N]
HEX. HEX. DEC.
E7960000 h
FFFCF2C0 h -200000 -200.000
~

E79607FF h
FB1E0000 h
FFFF63C0 h -40000 -40.000
~

FB1E07FF h
FFFFF800 h
FFFFFFFF h -1 -0.001
~

FFFFFFFF h
00000000 h
00000000 h 0 0.000
~

000007FF h
00000800 h
00000001 h 1 0.001
~

00000FFF h
04E20000 h
00009C40 h 40000 40.000
~

04E207FF h
186A07FF h
00030D40 h 200000 200.000
~

186A0000 h

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 20
Miniature 6-axis force torque sensor MMS101

Table 6 Example of matrix operation data - moment output


Matrix operation Matrix operation data
Moment
data After right-shift by 11 bits
[N・m]
HEX. HEX. DEC.
EA070000 h
FFFD40E0 h -180000 -1.80000

~
EA0707FF h
FB1E0000 h
FFFF63C0 h -40000 -0.40000
~

FB1E07FF h
FFFFF800 h
FFFFFFFF h -1 -0.00001
~

FFFFFFFF h
00000000 h
00000000 h 0 0.00000
~

000007FF h
00000800 h
00000001 h 1 0.00001
~

00000FFF h
04E20000 h
00009C40 h 40000 0.40000
~

04E207FF h
15F907FF h
0002BF20 h 180000 1.80000
~

15F90000 h

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 21
Miniature 6-axis force torque sensor MMS101
Offset cancel
Offset output may occur even under no-load condition after the upper and lower sensor attachments are
installed with screws. Also, Immediately after AD converter starts, the built-in AFE generates heat and drifts.
Therefore, the data acquired in the no-load condition after drift stabilization should be the offset data Fxoff~
Mzoff and the process of offset cancel by the external MCU should be performed.

Fx ′ = Fx − Fxoff [0.001*N]
Fy ′ = Fy − Fyoff [0.001*N]
Fz ′ = Fz − Fzoff [0.001*N]
Mx ′ = Mx − Mxoff [0.00001*N・m]
My ′ = My − Myoff [0.00001*N・m]
Mz ′ = Mz − Mzoff [0.00001*N・m]

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 22
Miniature 6-axis force torque sensor MMS101
Measurement finish instruction
Each AFE completes AD conversion and ends measurement when receiving Reset command or Shutdown
command. For command code and format, refer to “COMMAND CODE” and “SPI format”. Fig. 12 schematically
shows an example of measurement finish instruction issued to AFE1. Measurement finish instruction must be
issued to all AFEs.

Reset or Shutdown command


Host 0x72
or
Controll 0x90

AFE1
FxADC FxADC FxADC FxADC FxADC Shift to Shutdown state

Fig. 14 Schematic of measurement finish instruction

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 23
Miniature 6-axis force torque sensor MMS101
Update of temperature sensor value for offset temperature correction
After AD conversion starts, the second and subsequent ADC data are subject to offset temperature correction
using temperature sensor values acquired during the first AD conversion. This makes correction error larger with
changes in ambient temperature, requiring regular update of the temperature sensor values. However, note that
this feature is not effective enough if the temperature distribution in the sensor is uneven when the
environmental temperature is changing.

Write Register command is used to update temperature sensor values for offset temperature correction. Fig.
13 schematically shows an example of the update of such data in AFE1. By executing Write Register command
and writing data 0x01 to register address 0x3F at any timing, on-going AD conversion is completed, AD
conversion of the temperature sensor is done again, and the data is updated. For command code and format,
refer to “COMMAND CODE” and “SPI format”.
The last ADC data can also be acquired during update of the temperature sensor values.

Active command WriteRegister command


Host 0xA0 0xE0

Controll

AFE1
RegisterAdd.
0x3F 0x00 0x01 0x00

Measure temperature sensor value for offset temperature correction Measure temperature sensor value for offset temperature correction

TempADC FxADC TempADC FxADC


+Waiting stable filter +Waiting stable filter FxADC FxADC FxADC +Waiting stable filter +Waiting stable filter FxADC FxADC

First FxADC data measurement First FxADC data measurement after update temperature sensor value

About 7.5msec FxADC data consecutive measurement About 7.5msec FxADC data consecutive measurement
781.25usec 781.25usec

Fig. 15 Schematic of update of temperature sensor values for offset temperature correction

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 24
Miniature 6-axis force torque sensor MMS101
Measurement timing chart

ActiveCommand ResultCommand MatrixCal.


Host A R M R M R M
Controll

SDI A R R R

CSB1~6

SDO1

AFE1
TempADC+FxADC FxADC FxADC FxADC FxADC FxADC FxADC

SDO2

AFE2
TempADC+FyADC FyADC FyADC FyADC FyADC FyADC FyADC

SDO6

AFE6
TempADC+MzADC MzADC MzADC MzADC MzADC MzADC MzADC

TempADCupdate
WriteRegister
Host R M W R M R M
Controll

SDI R W R R

CSB1~6

SDO1

AFE1
FxADC FxADC FxADC TempADC+FxADC FxADC FxADC FxADC

SDO2

AFE2
FyADC FyADC FyADC TempADC+FxADC FyADC FyADC FyADC

SDO6

AFE6
MzADC MzADC MzADC TempADC+FxADC MzADC MzADC MzADC

*AD conversion cycle depends on AFE because internal clock is different from each AFE.
Fig. 16 Integrated CSB pin - Measurement timing chart

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 25
Miniature 6-axis force torque sensor MMS101
MatrixCal.
Host Active Result M Result M Result M
Controll Command Command Command Command

SDI A A A R R R R R R R R R
1 2 …6 1 2 …6 1 2 …6 1 2 …6

SDO1~6

CSB1

AFE1
TempADC+FxADC FxADC FxADC FxADC FxADC FxADC FxADC

CSB2

AFE2
TempADC+FyADC FyADC FyADC FyADC FyADC FyADC FyADC

CSB6

AFE6
TempADC+MzADC MzADC MzADC MzADC MzADC MzADC MzADC

Host Result M TempADCupdate Result M Result M


Controll Command WriteRegister Command Command

SDI R R R W W W R R R R R R
1 2 …6 1 2 …6 1 2 …6 1 2 …6

SDO1~6

CSB1

AFE1
FxADC FxADC FxADC TempADC+FxADC FxADC FxADC FxADC

CSB2

AFE2
FyADC FyADC FyADC TempADC+FyADC FyADC FyADC FyADC

CSB6

AFE6
MzADC MzADC MzADC TempADC+MzADC MzADC MzADC MzADC

*AD conversion cycle depends on AFE because internal clock is different from each AFE.
Fig. 17 Integrated SDO pin - Measurement timing chart

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 26
Miniature 6-axis force torque sensor MMS101
COMMAND CODE

Table 7 Command code list


Command Code
Command Name BIN. Format
HEX.
C7 C6 C5 C4 C3 C2 C1 C0
0x72 0 1 1 1 0 0 1 0 SPI Write format
Reset Reset and Return to Shutdown state. It becomes busy for the maximum 1.8msec.
Operation only with command code.
0x90 1 0 0 1 0 0 0 0 SPI Write format
Shutdown Shift to Shutdown state.
Operation only with command code.
0x94 1 0 0 1 0 1 0 0 SPI Write format
Idle Start up the internal circuit and put it in the Idle state.
Operation only with command code.
0xA0 1 0 1 0 0 0 0 0 SPI Write format
Active Start AD conversion.
Operation only with command code.
0xC0 1 1 0 0 0 0 0 0 SPI Write/Read format
ADC data (3 bytes /24 bits) is output MSB first.
A negative number is expressed by 2’s complement.
Read ADC Result For output range, positive output is 000000 h to 7FFFFF h (0 to +8388607 in decimal number),
while negative output is FFFFFF h to 800000 h (-1 to -8388608 in decimal number).
However, the measurement data acquired during the usage beyond the recommended operating
conditions cannot be guaranteed.
0xC2 1 1 0 0 0 0 1 0 SPIWrite/Read format
ADC data (3 bytes /24 bits) is output MSB first.
A negative number is expressed by 2’s complement.
For output range, positive output is 000000 h to 7FFFFF h (0 to +8388607 in decimal number),
while negative output is FFFFFF h to 800000 h (-1 to -8388608 in decimal number).
However, the measurement data acquired during the usage beyond the recommended operating
Read Temperature conditions cannot be guaranteed.
ADC Result
Temperature value[℃] = DEC./2^16
Output example
BIN. HEX. DEC. Temperature
000001010000000000000000 b 050000 h 327680 5.000℃
000110010000000000000000 b 190000 h 1638400 25.000℃
001011010000000000000000 b 2D0000 h 2949120 45.000℃
0xE0 1 1 1 0 0 0 0 0 SPI Write format
It is used for writing date to resister.
Write Register After sending command code, send in the order of memory address of 8 bits and write data of 8
bits.
After transmitting command code,
0xD4 1 1 0 1 0 1 0 0 SPI Write/Read format (Busy)
Read MAC RAM
It is used for reading matrix operation correction coefficients of MAC RAM.

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 27
Miniature 6-axis force torque sensor MMS101
STATE TRANSITION DIAGRAM

Fig. 18 State transition diagram

Table 8 State transition table

State
Shutdown Active Idle
Command

Power on Reset Power on Reset Power on Reset


Reset & Initial Boot & Initial Boot & Initial Boot
=>Shutdown state =>Shutdown state =>Shutdown state
Shutdown =>Keep state =>Shutdown state =>Shutdown state
Reset & Boot Load
Ignore(note7) =>Active state
Active =>Active state
=>Keep state (AD conversion)
(AD conversion)
Ignore(note7) Output result Do not issue(note8)
Result
=>Keep state =>Keep state =>Keep state
Reset & Boot Load Do not issue(note9)
Idle =>Keep state
=>Idle state =>Idle state
Temperature ADC
Ignore(note7) Do not issue(note10)
Write Register update
=>Keep state =>Keep state
=>Keep state
Ignore(note7) Do not issue(note9) Output Matrix coeff.
Read MAC RAM
=>Keep state =>Keep state =>Keep state
note7: NACK is returned to the command.
note8: The correct result is not output. Additionally, ACK is returned to the command.
note9: Although command is acceptable, it goes unintended behavior since sequence is running.
note10: Although command is acceptable, it goes unintended behavior during sequence execution.

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 28
Miniature 6-axis force torque sensor MMS101
SERIAL INTERFACE

It supports SPI as an interface for serial communication.

Table 9 Baud rate


Items Symbol Condition Min. Typ. Max. Unit.

BRSPI1 VDDIO ≧ 2.0V - - 5.0


Cb ≦ 100pF

BRSPI2 VDDIO < 2.0V - - 1.0


SPI communication Cb < 100pF
Mbps
speed VDDIO ≧ 2.0V
BRSPI3 - - 2.5
Cb ≦ 400pF
VDDIO < 2.0V
BRSPI4 Cb < 400pF - - 0.5

SPI format
The basic format of SPI is shown below. The relationship between clock(SCLK)and data(SDI/SDO)is
[Link] send/receive is started when CSB becomes low level from the status when SCLK is high level. Data
is updated on falling edges of the SCLK, and sampled on rising edges of the SCLK. Data send/receive is ended
when CSB becomes high level from the status when SCLK is high level.

CSB

SCLK

SDI MSB Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 LSB

SDO Hiz MSB Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 LSB Hiz

Fig. 19 SPI Waveform

SPI Write format


Please send command code of 8 bits. When the command is received, it turns over ACK to 8 bits. If there is
data, please continue sending.

SDI Command (8bit) Data (8bit) Data (8bit)

SDO 1111111b A H Level

Fig. 20 SPI Write format

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 29
Miniature 6-axis force torque sensor MMS101

SPI Write/Read format


Please send command code of 8 bits. When the command is received, it turns over ACK to 8 bits and it
outputs the data MSB first.

SDI Command (8bit) L Level

Data
SDO 1111111b A (MSB first)

Fig. 21 SPI Write/Read format

SPI Write/Read format (Busy)


Please send command code of 8 bits. When their commands are received, it turns over ACK to 8 bits. Then,
please send memory address of 8 bits. After receiving the memory address, the internal area becomes busy for
25usec at the maximum in order to prepare for data transmission. During this time, it returns 0x00 which
indicates busy state. When data preparation is completed, it outputs 0x01, followed by data of 8 bits.

How to discern busy state:


Please continue clock input in the same communication status after transmitting the write data. Then, it
returns 0x00 which indicates busy status. It returns 0x01 when writing is completed.
* 0x00 to indicate busy may sometimes be output or not depending on the clock frequency.

Command (8bit) Memory address


Write Data
SDI (8bit) (8bit) L Level

Continue
SDO 1111111b A H Level
0x00
0x01 Data

Busy
(Max 25usec)
Fig. 22 SPI Write/Read format (Busy)

SPI ACK
When command code which is send in each SPI format is received, it outputs L level to 8 bits as ACK. If
command code is not accepted or command code is not valid, it outputs H level to 8 bits as NACK.

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 30
Miniature 6-axis force torque sensor MMS101
SPI AC Characteristics
SPI ACタイミング
t CSH
t SCLKI t LEAD t SCLKH t SCLKL t LAG t SCLKD

CSB

SCLK

SDI

SDO

t SU t HD t DHZ

t DO t DF t DR
t DD

Fig. 23 SPI AC timing chart

Table 10 SPI AC Characteristics


VDDIO<2V VDDIO≧2V
Items Symbol Unit.
min. max. min. max.
SCLK frequency(Duty 50±10%) fSCLK - 1 - 5 MHz
SCLK High period(90%~90%) tSCLKH 400 - 80 - ns
SCLK Low period(10%~10%) tSCLKL 400 - 80 - ns
SCLK wait time tSCLKI 500 - 100 - ns
SCLK Delay time tSCLKD 0 - 0 - ns
CSB High period(90%~90%) tCSH 1000 - 200 - ns
Time from CSB falling to SCLK falling tLEAD 0 - 0 - ns
Time from SCLK rising to CSB rising tLAG 500 - 100 - ns
SDI setup time tSU 100 - 10 - ns
SDI hold time tHD 10 - 10 - ns
SDO rise time(Load 100pF)(10%~90%) tDR - 50 - 50 ns
SDO fall time(Load 100pF)(10%~90%) tDF - 50 - 50 ns
SDO output delay time(Load 100pF) tDD - 120 - 60 ns
SDO output delay time from CSB falling
tDO - 120 - 60 ns
(Load 100pF)
Time from CSB rising to SDO output HiZ
tDHZ - 170 - 170 ns
(Load 100pF)

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 31
Miniature 6-axis force torque sensor MMS101
TYPICAL APPLICATION CIRCUIT

VDD Power-supply voltage for MCU

SCLK
SDI
VDD SDO_Fx~Mz
SPI
VDDIO
MMS101BXXA
CSB_Fx~Mz
SG

10uF 0.1uF 10uF VLDOOUT FG


(note11) MCU

Fig. 24 Integrated CSB pin – Example application circuit

VDD Power-supply voltage for MCU

SCLK
SDI
VDD SDO_Fx~Mz
SPI
VDDIO
MMS101BXXA
CSB_Fx~Mz
SG

10uF 0.1uF 10uF VLDOOUT FG


(note11) MCU

Fig. 25 Integrated SDO pin – Example application circuit

note11:It is recommended to be placed as close as possible for noise reduction.

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 32
Miniature 6-axis force torque sensor MMS101
DIMENSIONS

Fig. 26 Dimensions

 Recommended FPC connector


 FH52K-20S-0.5SH (HIROSE ELECTRIC CO.,LTD)
 FH28D-20S-0.5SH (HIROSE ELECTRIC CO.,LTD)
 046288020600846+ (KYOCERA Corporation)

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 33
Miniature 6-axis force torque sensor MMS101
Sensor coordination systems
*The origin is the sensor top surface center.

Fig. 27 Sensor coordination systems

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 34
Miniature 6-axis force torque sensor MMS101
Sensor attachment

This product is intended to be used with the sensor attachment mounted on the top and bottom of the
product by screws. If the sensor attachment is used without mounting the screws, the input force is not
sufficiently transmitted to the product and the accuracy is not satisfied, or the output may drift in response to
changes in the environmental temperature.
Please design and prepare the sensor attachment by yourself according to your purpose and application.

Points in designing sensor attachments:


 In order to minimize the deformation of the sensor when applying a load and to avoid affecting the
sensor output, use a highly rigid material such as SUS that is not easily deformed.
 In an environment where the ambient temperature is likely to change, the shape should be such that the
heat capacity can be secured as large as possible.

Example of sensor attachment


Fig.29, 30 and 31 show examples of shapes of top and bottom side sensor attachments supposed to be
mounted on a gripper and examples of their mounting.

Fig. 28 Gripper-mounted image

Fig. 29 Example of top side attachment


Top side attachment sample CAD data: Top side attachment [Link]

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 35
Miniature 6-axis force torque sensor MMS101

Fig. 30 Example of bottom side attachment


Bottom side attachment sample CAD data: Bottom side attachment [Link]

Fig. 31 Example of attachment installation

It is recommended to fix the board connected to FPC to the attachment with a screw so that the FPC is not
bent repeatedly. Additionally, cables should be inserted and removed with the FPC fixed to the attachment with
a screw to minimize load to the FPC.

Fig. 29, 30 and 31 show examples. The attachment should be designed depending on the intended use.

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 36
Miniature 6-axis force torque sensor MMS101
PRECAUTIONS FOR SENSOR INSTALLATION

This product is a precision measuring instrument. Therefore, it needs to be installed following the appropriate
procedure to avoid overload to it. Failure to observe the recommendations included in this manual may cause
damage to the sensor.

Installation screw
Four M1.6 screws should be used for installation on both top and bottom surfaces. Length of the screws
inserted in the installation holes of both surfaces should be 1.7 mm or shorter. The tapped holes are
1.8 mm (min. 1.7 mm) through holes. If the screw length exceeds 1.7mm, FPC or IC located near the through-
hole inside the product may be damaged.

Top surface Bottom surface

Fig. 32 Installation screw holeIn

Fig. 33 Precautions for installation screw

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 37
Miniature 6-axis force torque sensor MMS101
Positioning hole
For the top surface, a φ1 round hole in the middle, a φ1.7 round hole, or 1.6 x 1.45 mm square holes can be
used for positioning. For the bottom surface, a φ1 round hole and a φ1 slotted hole can be used for positioning.
For details, refer to “DIMENSIONS”.

φ1.7 round hole


φ1 round hole
Top surface Bottom surface
φ1 round hole

6-R0.3

1.6x1.45 square hole

φ1 slotted hole

Fig. 34 Positioning holes

Recommended tightening method of sensor installation screw


The recommended tightening torque is 0.15N・m for M1.6 screws used to install this sensor. DO NOT
fasten one screw tightly at first step, or the sensor may detect incorrect force and moment. In the worst
case, the sensor could be damaged.
Screws must be fastened in the diagonal order as shown below. First, they should be lightly fastened,
and then, fastened in more than 2 steps with the recommended tightening torque.

4) 1)

Ex. 1st round 1)0.05N・m -> 2)0.05N・m -> 3)0.05N・m -> 4)0.05N・m
2nd round 1)0.15N・m -> 2)0.15N・m -> 3)0.15N・m -> 4)0.15N・m
2) 3)

Fig. 35 Example of screw tightening order

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 38
Miniature 6-axis force torque sensor MMS101
Sensor contact surface
Flatness of the sensor side contact surface is 0.03mm, and the installation side contact surface should be
designed at the same flatness. Level difference resulting from poor flatness could cause the force and the
moment to be detected incorrectly. In the worst case, the sensor could be damaged. The installation side
contact surface needs to be rigid enough against loads.

Contact surface
Top surface on the sensor side
Bottom surface

Fig. 36 Sensor side contact surface

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 39
Miniature 6-axis force torque sensor MMS101
PRECAUTIONS FOR SENSOR HANDLE

This product is a precision measuring instrument. Therefore, it needs to be handled following the appropriate
procedure to avoid overload to it. Failure to observe the recommendations included in this manual may cause
damage to the sensor.

Handling of sensor FPC


The FPC must NOT be strongly pulled in a lateral or the upper direction while the sensor body is fixed with
screws. Otherwise, load is applied to the base of the FPC, and the wiring on the FPC might be snapped. Also, do
not mount the product on moving parts that are bent repeatedly.

Do not strongly pull in a


Load concentration
lateral or the upper direction.

Fixed with screw

Fig. 37 Precaution for handling of sensor FPC - 1

In the FPC termination part, a level difference exists between the FPC and the reinforcing plate. Bending the
FPC at this level difference part could cut the wiring on the FPC.

Top view Level difference part

Level difference part


Side view

Reinforcing plate Sharp bending at a level


Level difference part difference part is not allowed.

Fig. 38 Precaution for handling of sensor FPC - 2

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 40
Miniature 6-axis force torque sensor MMS101
OPTION

As options, evaluation kit and conversion board are available. Please order if necessary. However, the options
are guaranteed only for checking the operation at the time of shipment, and will only be provided for sample
support. Please note.

Evaluation Kit
Using evaluation kit with PC applications allows logging data to be acquired. In addition to product to which
conversion board for evaluation kit are connected, they consist of cables and evaluation board. There are two
kinds of evaluation kits. Select them according to the application.
Table 11 Evaluation Kit line-up
Evaluation Kit Name Constitution

Evaluation Board
Conversion Board (ForceSensorControllerBoardVer2.0/3.0)
(Conv. BD Ver1.1)

Product Cable

Evaluation Kit 1
*External communication: USB
(Ver.3 Rev.0) *USB cable is not included.
・Required Spec. USB cable:USB ver.2.0/Type-C
◆Manual: evaluationkit1 manual_en_rev1.pdf
◆Document set: evaluationkit1_en.zip
*You must enter an ID and password to download the document
set. If necessary, contact our contact point.
Evaluation Board
(ForceSensorMultiFingerBoardVer3.0)

Product Cable

Conversion Board
(Conv. BD Ver1.1)

Evaluation Kit 5
(Ver.3 E Rev.0)
*External communication: Ethernet/USB
*Ethernet cable and USB cable are not included.
・Required Spec. Ethernet cable :Cat5e or higher/ RJ-45 Plug
・Required Spec. USB cable: USB ver.2.0/Type-C
*Max. 5 sampled connectable
◆Manual: evaluationkit5_manual_en_rev1.pdf
◆Document set: evaluationkit5_en.zip
*You must enter an ID and password to download the document
set. If necessary, contact our contact point.

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 41
Miniature 6-axis force torque sensor MMS101
Cable
Table 12 Cable line-up
Cable Type Cable length Cable appearance

Lead cable 15, 30cm


 Cable line:UL3302 AWG28 (FURUKAWA ELECTRIC CO.,LTD.)
About
4.5mm
UL3302
AWG28

Spiral tube

 Housing:NSHDR-20V-Z ([Link]. CO., LTD)

Y-shaped terminal
for shield
*Connect SG or
ground as necessary

Robot cable 30, 60, 150cm

 Cable line:RMDHⅡ-SB (21913) (DYDEN CORPORATION)


5.1mm
AWG30

Braided Shield
Sheath

 Housing:NSHDR-20V-Z ([Link]., LTD.)


 Shade terminal (Y type):0.3Y-3 (NICHIFU CO., LTD.)

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 42
Miniature 6-axis force torque sensor MMS101
Evaluation Board
Table 13 Evaluation Board line-up
No. of
External Power
Board Name connectable Board appearance
Communication Supply sensors

40mm

40mm
ForceSensor
ControllerBoard
Ver2.0/3.0 USB USB Max. 1 pc
*No functional differences 1.0mm
between Ver2.0 and Ver3.0 6.1mm

 Conversion Board side connector


:SM20B-NSHDZS ([Link]. CO., LTD)
 External communication side connector
:CAM-L05-024-050-ACGAA
(MITSUMI ELECTRIC CO., LTD)

80mm

115mm

ForceSensor Max. 5 pcs


MultiFingerBoard Ethernet/USB USB *Only for Ethernet
communication
Ver3.0

1.6mm 1.6mm 13.61mm

 Conversion Board side connector


:SM20B-NSHDZS ([Link]. CO., LTD.)
 External communication side connector
:J3011G21DNLT (Pulse Electronics CO., LTD.)
 DC jack:M04-730A0
(MARUSHIN ELECTRIC MFG. CO., LTD)

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 43
Miniature 6-axis force torque sensor MMS101
Conversion Board
Conversion Board is intended to connect a cable to this product. Connect the product terminal to the FPC
connector and convert it to a cable connector with the number of pins according to the application.

Table 14 Conversion board line-up

Board Name Terminal conversion table Board appearance

20pin 20mm
MMS101 [Link] MMS101 [Link]
Output Output Output Output
VDD VDD CSB_Fz CSB_Fz
VDDIO VDDIO CSB_Mx CSB_Mx
17mm
Conv. BD VLDOOUT VLDOOUT CSB_My CSB_My
Ver1.1 SG SG CSB_Mz CSB_Mz 0.5mm
(For Evaluation FG FG SDO_Fx SDO_Fx 6.1mm
Kit) FG N.C. SDO_Fy SDO_Fy
SCLK SCLK SDO_Fz SDO_Fz
 Sensor side connector:FH52K-20S-0.5SH
SDI SDI SDO_Mx SDO_Mx
(HIROSE ELECTRIC CO.,LTD)
CSB_Fx CSB_Fx SDO_My SDO_My
 Controll/Evaluation board side connector:SM20B-NSHDZS
CSB_Fy CSB_Fy SDO_Mz SDO_Mz
([Link]. CO., LTD.)

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 44
Miniature 6-axis force torque sensor MMS101
NOTES

NOTES

【Safety Precautions】

 Though Mitsumi Electric Co., Ltd. (hereinafter referred to as "Mitsumi") works continually to improve our
product's quality and reliability, semiconductor products may generally malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their
hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of
this product could cause loss of human life, bodily injury, or damage to property, including data loss or
corruption. Before customers use this product, create designs including this product, or incorporate this
product into their own applications, customers must also refer to and comply with (a) the latest versions or
all of our relevant information, including without limitation, product specifications, data sheets and
application notes for this product and (b) the user’s manual, handling instructions or all relevant information
for any products which is to be used, or combined with this products. Customers are solely responsible for all
aspects of their own product design or applications, including but not limited to (a) determining the
appropriateness of the use of this product in such design or applications; (b) evaluating and determining the
applicability of any information contained in this document, or in charts, diagrams, programs, algorithms,
sample application circuits, or any other referenced documents; and (c) validating all operating parameters
for such designs and applications. Mitsumi assumes no liability for customers’ product design or applications.

 This product is intended for applying to computers, OA units, communication units, instrumentation units,
machine tools, industrial robots, AV units, household electrical appliances, and other general electronic units.

 If you have any intentions to apply this product to the units related to the control and safety of
transportation units (vehicles, trains, etc.), traffic signaling units, disaster-preventive & burglar-proof units, or
the like, contact our sales representatives in advance.

 Don't apply this product to any aeronautical & space systems, submarine repeaters, nuclear power
controllers, medical units involving the human life, Military-related equipment, or the like.

 Before using this product, even when it is not used for the usage written above, notify and present us
beforehand if special care and attention are needed for its application, intended purpose, environment of
usage, risk, and the design or inspection specification corresponding to them.

 If any damage to our customer is objectively identified to be caused by the defect of this product, Mitsumi is
responsible for it. In this case, Mitsumi is liable for the cost limited to the delivery price of this product.

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 45
Miniature 6-axis force torque sensor MMS101
【Application considerations during actual circuit design】

 The outline of parameters described herein has been chosen as an explanation of the standard parameters
and performance of the product. When you actually plan to use the product, please ensure that the outside
conditions are reflected in the actual circuit and assembling designs.

 Before using this product, please evaluate and confirm the actual application with this product mounted and
embedded.

 To investigate the influence by applied transient load or external noise, it is necessary to evaluate and
confirm them with mounting this product to the actual application.

 Any usage above the maximum rating may destroy this product or shorten the lifetime. Be sure to use this
product under the maximum rating.

 If you continue to use this product highly-loaded (applying high temperature, large current or high voltage;
or variation of temperature) even under the absolute maximum rating and even in the operating range, the
reliability of this product may decrease significantly. Please design appropriate reliability in consideration of
power dissipation and voltage corresponding to the temperature and designed lifetime after confirming our
individual reliability documents (such as reliability test report or estimated failure rate). It is recommended
that, before using this product, you appropriately derate the maximum power dissipation (typically, 80% or
less of the maximum value) considering parameters including ambient temperature, input voltage, and
output current.

【Precautions for Foreign Exchange and Foreign Trade Control Act】

 If you export or take products and technologies in this document which are subject to security trade control
based on the Foreign Exchange and Foreign Trade Act to overseas from Japan, permission of the Japanese
government is required.

【Prohibitions for Industrial Property Rights】

 Since this document contains the contents related to our copyright and know-how, you are requested not to
use this document for any purpose other than the application of this product.

 If a use of this product causes a dispute related to the industrial property rights of a third party, Mitsumi has
no liability for any disputes except those which arise directly from the manufacturing and manufacturing
method of our products.

【Precautions for Product Liability Act】

 No responsibility is assumed by us for any consequence resulting from any wrong or improper use or
operation, etc. of this product.

【Others】

 Any part of the contents contained herein must not be reprinted or reproduced without our prior permission.

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 46
Miniature 6-axis force torque sensor MMS101
 In case of any question arises out of the description in this specification, it shall be settled by the
consultation between both parties promptly.

ATTENTION

 This product is designed and manufactured with the intention of normal use in general electronics. No special
circumstance as described below is considered for the use of it when it is designed. With this reason, any use
and storage under the circumstances below may affect the performance of this product. Prior confirmation
of performance and reliability is requested to customers.
Environment with strong static electricity or electromagnetic wave
Environment with high temperature or high humidity where dew condensation may occur

 This product is not designed to withstand radioactivity, and must avoid using in a radioactive environment.

ADDITIONAL NOTES

 In the event of any defect in this product, you may send us the product. Then, we will perform an
appropriate analysis and consult with you about appropriate remedy for the problem proposed by our sole
discretion.

 Handle with care to prevent foreign matter from entering the screw holes and product gaps.

 When installing this product, design it so that the length of the screw inserted into the product mounting
hole is 1.7mm or less. The product mounting hole is a through hole. If it exceeds 1.7mm, the internal parts
will be damaged or malfunction. Also, we recommend that the tightening torque of the screws during
mounting be 0.15N·m.

 Do not bend the FPC at a sharp angle or pull it hard so that the load is concentrated. Otherwise, the wiring
on the FPC may be broken, resulting in operation failure.

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 47
Miniature 6-axis force torque sensor MMS101

MITSUMI ELECTRIC CO.,LTD.


Strategy Engineering Department Semiconductor Business Division

Tel: +81-46-230-3470 / [Link]

Notes:
Any products mentioned this datasheet are subject to any modification in their appearance and others for
improvements without prior notification. The details listed here are not a guarantee of the individual products at
the time of ordering. When using the products, you will be asked to check their specifications.

The contents of this document are subject to change without notice.


©2022 Mitsumi co., Ltd. All rights reserved. MITSUMI ELECTRIC CO., LTD. Semiconductor Div.
[Link] 48

You might also like