2SK3934

TOSHIBA Field Effect Transistor Silicon N-Channel MOS Type (π-MOSVI)

2SK3934
Switching Regulator Applications
Unit: mm

• Low drain-source ON resistance: RDS (ON) = 0.23Ω (typ.)

• High forward transfer admittance: |Yfs| = 8.2 S (typ.)
• Low leakage current: IDSS = 100 μA (VDS = 500 V)
• Enhancement model: Vth = 2.0~4.0 V (VDS = 10 V, ID = 1 mA)

Absolute Maximum Ratings (Ta = 25°C)

Characteristic Symbol Rating Unit

Drain-source voltage VDSS 500 V

Drain-gate voltage (RGS = 20 kΩ) VDGR 500 V
Gate-source voltage VGSS ±30 V
DC (Note 1) ID 15
Drain current Pulse (t = 1 ms) A 1: Gate
IDP 60
(Note 1) 2: Drain
3: Source
Drain power dissipation (Tc = 25°C) PD 50 W
JEDEC ―
Single pulse avalanche energy
EAS 1.08 J
(Note 2) JEITA SC-67
Avalanche current IAR 15 A
TOSHIBA 2-10U1B
Repetitive avalanche energy (Note 3) EAR 5.0 mJ
Weight: 1.7 g (typ.)
Channel temperature Tch 150 °C
Storage temperature range Tstg -55~150 °C

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate
reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and
Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).

Thermal Characteristics
2
Characteristic Symbol Max Unit

Thermal resistance, channel to case Rth (ch-c) 2.5 °C/W

Thermal resistance, channel to ambient Rth (ch-a) 62.5 °C/W

Note 1: Ensure that the channel temperature does not exceed 150°C during 1
use of the device.

Note 2: VDD = 90 V, Tch = 25°C (initial), L = 8.16mH, IAR = 15 A, RG = 25 Ω

Note 3: Repetitive rating: pulse width limited by maximum channel temperature

3
This transistor is an electrostatic-sensitive device. Handle with care.

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 2SK3934
Electrical Characteristics (Ta = 25°C)

Characteristic Symbol Test Condition Min Typ. Max Unit

Gate leakage current IGSS VGS = ±25 V, VDS = 0 V ⎯ ⎯ ±10 μA

Gate-source breakdown voltage V (BR) GSS IG = ±10 μA, VDS = 0 V ±30 ⎯ ⎯ V
Drain cutoff current IDSS VDS = 500 V, VGS = 0 V ⎯ ⎯ 100 μA
Drain-source breakdown voltage V (BR) DSS ID = 10 mA, VGS = 0 V 500 ⎯ ⎯ V
Gate threshold voltage Vth VDS = 10 V, ID = 1 mA 2.0 ⎯ 4.0 V
Drain-source ON resistance RDS (ON) VGS = 10 V, ID = 7.5 A ⎯ 0.23 0.3 Ω
Forward transfer admittance ⎪Yfs⎪ VDS = 10 V, ID = 7.5 A 2.3 8.2 ⎯ S
Input capacitance Ciss ⎯ 3100 ⎯
Reverse transfer capacitance Crss VDS = 25 V, VGS = 0 V, f = 1 MHz ⎯ 20 ⎯ pF

Output capacitance Coss ⎯ 270 ⎯

Rise time tr 10 V ID = 7.5 A VOUT ⎯ 70 ⎯

VGS
0V
Turn-on time ton RL =26Ω ⎯ 130 ⎯
Switching time 50 Ω ns
Fall time tf ⎯ 70 ⎯
VDD ∼
− 200 V
Duty <
= 1%, tw = 10 μs
Turn-off time toff ⎯ 280 ⎯

Total gate charge Qg ⎯ 62 ⎯

Gate-source charge Qgs VDD ∼
− 400 V, VGS = 10 V, ID = 15 A ⎯ 40 ⎯ nC

Gate-drain charge Qgd ⎯ 22 ⎯

Source-Drain Ratings and Characteristics (Ta = 25°C)

Characteristic Symbol Test Condition Min Typ. Max Unit

Continuous drain reverse current

IDR ⎯ ⎯ ⎯ 15 A
(Note 1)
Pulse drain reverse current (Note 1) IDRP ⎯ ⎯ ⎯ 60 A
Forward voltage (diode) VDSF IDR = 15 A, VGS = 0 V ⎯ ⎯ −1.7 V
Reverse recovery time trr IDR = 15 A, VGS = 0 V, ⎯ 1.3 ⎯ μs
Reverse recovery charge Qrr dIDR/dt = 100 A/μs ⎯ 18 ⎯ μC

Marking

K3934 Part No. (or abbreviation code)

Lot No.

A line indicates
lead (Pb)-free package or
lead (Pb)-free finish.

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 2SK3934

ID – VDS ID – VDS
20 50
COMMON SOURCE COMMON SOURCE 10V
6.6V
Tc = 25°C Tc = 25°C
PULSE TEST PULSE TEST 8V

(A)
(A)

16 6.4V 40
10V 7.5V
6.2V

DRAIN CURRENT ID
DRAIN CURRENT ID

8V
12 7V 30 7V
6V
6.8V

5.8V
8 20 6.5V

5.4V 6V
4 10
VGS = 5V
VGS = 5 V

0 0
0 2 4 6 8 10 0 4 8 12 16 20

DRAIN−SOURCE VOLTAGE VDS (V) DRAIN−SOURCE VOLTAGE VDS (V)

ID – VGS VDS – VGS

50 10
VDS (V)

COMMON SOURCE
COMMON SOURCE
Tc = 25℃
VDS = 20 V Tc = 25°C
(A)

40 8 PULSE TEST
PULSE TEST
DRAIN CURRENT ID

DRAIN−SOURCE VOLTAGE

30 6

Tc = 100°C Tc = −55°C
20 4 ID = 15 A

10 2 ID = 7.5 A
ID = 3.8 A

0 0
0 2 4 6 8 10 0 4 8 12 16 20

GATE−SOURCE VOLTAGE VGS (V) GATE−SOURCE VOLTAGE VGS (V)

⎪Yfs⎪ – ID RDS (ON) – ID

100 1000
FORWARD TRANSIENT ADMITTANCE

DRAIN−SOURCE ON RESISTANCE

COMMON SOURCE
VDS = 20 V
PULSE TEST Tc = −55°C VGS = 10 V
RDS (ON) (mΩ)

10
100
⎪Yfs⎪ (S)

25 100

COMMON SOURCE
Tc = 25°C
PULSE TEST
0.1 10
0.1 1 10 100 1 10 100

DRAIN CURRENT ID (A) DRAIN CURRENT ID (A)

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RDS (ON) – Tc IDR – VDS

1000 100

(A)
COMMON SOURCE
COMMON SOURCE
DRAIN−SOURCE ON RESISTANCE

VGS = 10 V Tc = 25°C

DRAIN REVERSE CURRENT IDR

800 PULSE TEST PULSE TEST
RDS (ON) (mΩ)

10
600

ID = 15A
400 10
7.5 1
3.8 5

200 3
1
VGS = 0 V
0 0.1
−80 −40 0 40 80 120 160 0 −0.4 −0.8 −1.2 −1.6

CASE TEMPERATURE Tc (°C) DRAIN−SOURCE VOLTAGE VDS (V)

C – VDS Vth – Tc
10000 5

Ciss
GATE THRESHOLD VOLTAGE

4
(pF)

1000
C

3
CAPACITANCE

Vth (V)

Coss

2
100 COMMON SOURCE

COMMON SOURCE VDS = 10 V

Crss 1
VGS = 0 V ID = 1 mA
f = 1 MHz PULSE TEST
Tc = 25°C
10 0
0.1 1 10 100 −80 −40 0 40 80 120 160

DRAIN−SOURCE VOLTAGE VDS (V) CASE TEMPERATURE Tc (°C)

DYNAMIC INPUT/OUTPUT
PD – Tc CHARACTERISTICS
80 500 20
(V)
(W)

VDS (V)

VGS
PD

400 16
VDS
60
GATE−SOURCE VOLTAGE
DRAIN POWER DISSIPATION

DRAIN−SOURCE VOLTAGE

VDD = 100 V 400V

300 12

40
200V
200 8

VGS COMMON SOURCE

20
100 ID = 15 A 4
Tc = 25°C
PULSE TEST
0 0 0
0 40 80 120 160 0 20 40 60 80 100

CASE TEMPERATURE Tc (°C) TOTAL GATE CHARGE Qg (nC)

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NORMALIZED TRANSIENT THERMAL rth – tw

10
IMPEDANCE rth (t)/Rth (ch-c)

1
Duty=0.5

0.2
0.1
0.1
0.05
PDM
0.02
t
0.01 0.01 T
SINGLE PULSE
Duty = t/T
Rth (ch-c) = 2.5°C/W
0.001
10μ 100μ 1ｍ 10ｍ 100ｍ 1 10

PULSE WIDTH tw (s)

SAFE OPERATING AREA EAS – Tch

100 1200
ID max (PULSED) *
(mJ)

100 μs *
1000

ID max (CONTINUOUS) *
AVALANCHE ENERGY EAS

10 1 ms * 800
(A)
DRAIN CURRENT ID

600

DC OPERATION
1 400
Tc = 25°C

200

0
0.1 *SINGLE NONREPETITIVE PULSE 25 50 75 100 125 150
Tc = 25°C
CHANNEL TEMPERATURE (INITIAL)
VDSS max

CURVES MUST BE DERATED

Tch (°C)
LINEARLY WITH INCREASE IN

TEMPERATURE
0.01 BVDSS
1 10 100 1000 15 V
DRAIN−SOURCE VOLTAGE VDS (V) −15 V IAR

VDD VDS

TEST CIRCUIT WAVEFORM

RG = 25 Ω 1 ⎛ B VDSS ⎞
Ε AS = ⋅ L ⋅ I2 ⋅ ⎜ ⎟
VDD = 90 V, L = 8.13 mH 2 ⎜B − V ⎟
⎝ VDSS DD ⎠

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RESTRICTIONS ON PRODUCT USE 20070701-EN

• The information contained herein is subject to change without notice.

• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.

• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his
document shall be made at the customer’s own risk.

• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.

• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patents or other rights of
TOSHIBA or the third parties.

• Please contact your sales representative for product-by-product details in this document regarding RoHS
compatibility. Please use these products in this document in compliance with all applicable laws and regulations
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses
occurring as a result of noncompliance with applicable laws and regulations.

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