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Features Descriptio: LTC4052-4.2 Lithium-Ion Battery Pulse Charger With Overcurrent Protection

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0% found this document useful (0 votes)
25 views12 pages

Features Descriptio: LTC4052-4.2 Lithium-Ion Battery Pulse Charger With Overcurrent Protection

Kebutuhan komponen smd

Uploaded by

muhamadjayadi9
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd

LTC4052-4.

2
Lithium-Ion Battery
Pulse Charger with
Overcurrent Protection
U
FEATURES DESCRIPTIO
■ Very Low Power Dissipation: 350mW at 1A The LTC®4052 is a complete standalone pulse charger
■ Complete Standalone Pulse Charger for 1-Cell with integrated MOSFET for 1-cell lithium-ion batteries.
Lithium-Ion Batteries An external sense resistor provides overcurrent limiting as
■ Requires No Microcontroller, MOSFET or a safety precaution against a user connecting a wall
Blocking Diode adapter with the incorrect or no current limit. The internal
■ Sense Resistor Limits Maximum Current for Safety MOSFET prevents reverse battery current from flowing if
■ Programmable Charge Termination Timer for the input voltage is shorted to ground, eliminating the
Maximum Capacity Charging need for a blocking diode.
■ ±1% Float Voltage Accuracy
■ Near End-of-Charge (C/10) Detection Output As the battery accepts charge and approaches the
■ AC Wall Adapter Present Output programmed float voltage, the internal MOSFET begins
■ Low Battery Drain when Input Supply Is Removed switching off and on with the duty cycle gradually decreas-
■ Automatic Trickle Charge for Low Battery ing as the battery approaches a fully charged condition.
■ Automatic Battery Refresh A programmable timer terminates the charge cycle. The
■ Thermal Shutdown Protection near end-of-charge C/10 condition is indicated at the
■ Tiny Thermally Enhanced MSOP Package CHRG pin when the average charge current falls to one-
U tenth of the wall adapter current. Removing the input
APPLICATIO S voltage puts the LTC4052 into a sleep mode, dropping the
battery current drain to less than 1µA.
■ Handheld Computers
■ Cellular Telephones The LTC4052 is available in a tiny 8-pin thermally
■ Cradle Chargers enhanced MSOP package.
, LTC and LT are registered trademarks of Linear Technology Corporation.

U
TYPICAL APPLICATIO
Single Cell 4.2V, 1A, Standalone Li-Ion Battery Charger LTC4052 Charge Profile
VIN = 4.5V TO 10V 4.5
WITH 1A
CURRENT LIMIT 3 4.0
VOLTAGE (V)

4.7Ω
BATTERY

VIN 10k CHARGE


1k RSENSE 3.5 CYCLE
1µF 0.05Ω ENDS
1k LTC4052 0.047µF CONSTANT PULSING
3.0
CURRENT CURRENT
7
CHARGE STATUS GATE
CURRENT (A)

1.0
6
CHARGE

CHRG 0.022µF
AC PRESENT 0.5
2 1
ACPR SENSE 0
C/10
8
BAT
CHRG (V)

1-CELL 4.2V 5
TIMER GND Li-Ion
5 4 BATTERY 0
0 0.5 1.0 1.5 2.0 2.5 3.0
CTIMER
0.1µF TIME (HOURS)
4052 TA01 4052 • TA01b

405242f

1
LTC4052-4.2
W W W U U W U
ABSOLUTE AXI U RATI GS PACKAGE/ORDER I FOR ATIO
(Note 1)
Input Supply Voltage (VIN)....................................... 12V ORDER PART
BAT Voltage ...............................................– 0.3V to 12V TOP VIEW NUMBER
SENSE 1 8 BAT
GATE (Note 2) .............................................– 0.3V to 8V ACPR 2 7 GATE LTC4052EMS8E-4.2
SENSE, TIMER .................................. – 0.3V to VIN +0.3V VIN 3 6 CHRG
GND 4 5 TIMER
CHRG, ACPR .............................................– 0.3V to 12V
MSE EXPOSED PAD PACKAGE
SENSE, BAT Peak Current ...................................... 1.5A 8-LEAD PLASTIC MSOP MS8 PART MARKING
Operating Temperature Range (Note 3) .. – 40°C to 85°C TJMAX = 125°C, θJA = 35°C/W
EXPOSED PAD IS GROUND. LTYY
Junction Temperature (Note 4) ............................. 125°C (MUST BE SOLDERED TO PCB).
Storage Temperature Range ................. – 65°C to 150°C
Lead Temperature (Soldering, 10 sec).................. 300°C Consult LTC Marketing for parts specified with wider operating temperature ranges.

DC ELECTRICAL CHARACTERISTICS The ● denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VIN = 6V unless otherwise noted.
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
VIN Input Supply Voltage Wall Adapter Open Circuit Voltage ● 4.5 10 V
IIN Input Quiescent Supply Current Full Charge Mode ● 0.7 1.4 mA
VBAT Battery Float Voltage 0°C ≤ TA ≤ 85°C 4.158 4.200 4.242 V
● 4.137 4.200 4.242 V
VRECHRG Recharge Battery Voltage Threshold Battery Voltage Falling 0°C ≤ TA ≤ 85°C 3.990 4.050 4.110 V
● 3.969 4.050 4.110 V
VMARGIN VBAT – VRECHRG Margin ● 75 150 225 mV
VIMAX Overcurrent Trip Sense Voltage ● 90 105 120 mV
ITRICKLE Trickle Charge Current VBAT = 2V ● 14 24 34 mA
VTRICKLE Trickle Charge Threshold Voltage VBAT Rising ● 2.35 2.45 2.55 V
RDS(ON) Internal Switch On-Resistance VBAT = 2.6V 0.45 0.7 Ω
VBAT = 4V 0.35 0.5 Ω
VGATE GATE Pin Voltage VBAT = 2.6V 6.5 V
VBAT = 4V 10.5 V
TTIMER TIMER Period Accuracy CTIMER = 0.1µF, Full Charge Mode ±10 %
ILEAK Battery Leakage Current Through Charger VBAT = 4V, VIN = 0V ● 1 µA
VSLEEP Sleep Threshold Voltage (VIN – VBAT) Low to High 20 45 70 mV
(VIN – VBAT) High to Low 0 15 mV
VACPR ACPR Pin Output Low Voltage IACPR = 3mA ● 0.5 0.8 V
I LEAKACPR ACPR Pin Leakage Current VIN = 0, VACPR = 6V ● 1 µA
VCHRG CHRG Pin Output Low Voltage ICHRG = 3mA, Charging, C/10 Not Reached ● 0.5 0.8 V
I LEAKCHRG CHRG Pin Leakage Current VIN = 0, VCHRG = 6V ● 1 µA
ICHRG CHRG Pin Weak Pull-Down Current VCHRG = 1V, Charging, C/10 Reached 20 40 70 µA

405242f

2
LTC4052-4.2
ELECTRICAL CHARACTERISTICS
Note 1: Absolute Maximum Ratings are those values beyond which the life Note 4: Junction temperature TJ is calculated from the ambient
of a device may be impaired. temperature TA and power dissipation PD according to the following
Note 2: Absolute Maximum Rating for GATE pin applies only to externally formula: TJ = TA + (PD • θJA°C/W)
applied voltage. During normal operation the LTC4052-4.2’s internal Note 5. This IC includes overtemperature protection that is intended to
charge pump can generate GATE pin voltage exceeding absolute protect the device during momentary overload conditions. Junction
maximum but it is internally current limited. temperature will exceed 125°C when overtemperature protection is active.
Note 3: The LTC4052EMS8E-4.2 is guaranteed to meet performance Continuous operation above the specified maximum operating junction
specifications from 0°C to 70°C. Specifications over the – 40°C to 85°C temperature may impair device reliability.
operating temperature range are assured by design, characterization and
correlation with statistical process controls.

U W
TYPICAL PERFOR A CE CHARACTERISTICS
Trickle Charge Threshold Voltage Trickle Charge Current Trickle Charge Current vs Input
vs Temperature vs Temperature Supply Voltage
2.47 24.2 35
VBAT = 2V
24.0 TA = 25°C
2.46
23.8 30
ITRICKLE (mA)

ITRICKLE (mA)
23.6
VTRICKLE (V)

2.45
23.4 25
2.44
23.2

23.0 20
2.43
22.8

2.42 22.6 15
–50 –25 0 25 50 75 100 125 –50 –25 0 25 50 75 100 125 5 6 7 8 9 10
TEMPERATURE (°C) TEMPERATURE (°C) VIN (V)
4052 G01 4052 G02 4052 G03

Normalized Timer Duration Battery Float Voltage CHRG Pin C/10 Pulldown Current
vs Temperature vs Temperature vs Temperature
103 4.205 55
CTIMER= 0.1µF
4.200 50
102
4.195
45
101
TTIMER (%)

ICHRG (µA)

4.190
VBAT (V)

40
4.185
100
35
4.180
99
4.175 30

98 4.170 25
–50 –25 0 25 50 75 100 125 –50 –25 0 25 50 75 100 125 –50 –25 0 25 50 75 100 125
TEMPERATURE (°C) TEMPERATURE (°C) TEMPERATURE (°C)
4052 G04 4052 G05 4052 G06

405242f

3
LTC4052-4.2
U W
TYPICAL PERFOR A CE CHARACTERISTICS
Switch On-Resistance vs
Overcurrent Sense Voltage Temperature
105.8 650

600
105.6
550
105.4

RDS(ON) (mΩ)
500
VIMAX (mV)

VBAT = 2.6V
105.2 450
VBAT = 4V
400
105.0
350
104.8
300

104.6 250
–50 –25 0 25 50 75 100 125 –50 –25 0 25 50 75 100 125
TEMPERATURE (°C) TEMPERATURE (°C)
4053 G07 4053 G08

U U U
PI FU CTIO S
SENSE (Pin 1): Overcurrent Sense Input. A sense resistor ON time, minimum OFF time and the overcurrent time-out
(RSENSE) should be connected from VIN to the SENSE pin period all scale with tTIMER.
to program the current limit level. When overcurrent limit CHRG (Pin 6): Charge Status Open-Drain Output. When a
is tripped, the pass transistor immediately turns off and depleted battery is being charged, the CHRG pin is pulled
turns back on after a 640ms time-out period (CTIMER = to ground by an internal N-channel MOSFET capable of
0.1µF). The on-off cycle will continue as long as the driving an LED. Once the duty cycle at the GATE pin drops
overcurrent condition persists or until the timer runs out.
below 10%, the N-MOSFET turns off and a weak 40µA
If overcurrent protection is not needed, short SENSE to current source to ground turns on to indicate a near end-
VIN. of-charge C/10 condition. When a time-out occurs or the
ACPR (Pin 2): AC Wall Adapter Present Open-Drain Out- input supply is removed, the CHRG pin becomes high
put. When the input voltage (wall adapter) is applied to the impedance.
LTC4052, this pin is pulled to ground by an internal GATE (Pin 7): Gate Drive Output Pin for Internal and
N-channel MOSFET capable of driving an LED. External Pass Transistors. An external N-MOSFET transis-
VIN (Pin 3): Positive Input Supply Voltage (4.5V ≤ VIN ≤ tor can be connected in parallel with the internal transistor
10V). Bypass this pin with a 1µF capacitor in series with a to reduce the on-resistance for higher charge current. In
4.7Ω resistor. this case, an external blocking diode on VIN is required to
prevent damage to the battery if VIN is shorted to ground.
GND (Pin 4): Electrical Ground Connection and provides
A 10µA current source pulls this pin up to the charge pump
a thermal path from the IC to the PC board copper. The
voltage when turned on and a 40µA current source pulls it
exposed backside of the package is also ground and must
down to ground to turn it off. If an overcurrent condition
be soldered to the PC board for maximum power dissipa-
is detected, the GATE pin is immediately pulled to ground.
tion.
The voltage at this pin is internally clamped to 12V above
TIMER (Pin 5): Timer Set Pin. The timer period is pro- the GND pin.
grammed by a capacitor (CTIMER) to ground. The timer
period is: tTIMER = (CTIMER • 3Hr)/(0.1µF). The minimum
405242f

4
LTC4052-4.2
U U U
PI FU CTIO S
A series RC network from the GATE to the VIN pin is BAT (Pin 8): Battery Sense Input Pin. An internal resistor
required to control the slew rate at the VIN pin when the divider presets the final float voltage to 4.2V. If the BAT pin
switch is turned on or off. The slew rate control prevents drops below 4.05V after the charge cycle has ended, the
excessive current from the capacitor usually located in the timer resets and a new charge cycle begins. This pin is
wall adapter from flowing into the battery when the pass clamped to 4.7V if the battery is disconnected while
transistor turns on. charging.

W
BLOCK DIAGRA
ACPR
2

45mV 105mV
+ – – +
VIN 3 + + VIN
100ms SLEEP IMAX
FILTER 10mΩ
BAT – – 1 SENSE

GND 4 24mA

7 GATE

CHARGE
PUMP
TRIPLER
TIMER 5 OSCILLATOR 8 BAT

TRICKLE FAST
+
CLK VMIN


CHRG 6

+
STOP VRECHRG

LOGIC

+
40µA TIMERS

+
C/10 VFLOAT

+
TEMP VMAX
THERMAL
SHUTDOWN

REFERENCE 1.23V 1.23V

4052 BD

405242f

5
LTC4052-4.2
U
OPERATIO
The LTC4052 is a complete lithium-ion battery pulse tion in the pass transistor. The charge current is deter-
charger with an internal 0.35Ω N-MOSFET switch driven mined by the current limit of the input supply.
by an internal charge pump. The charge current is set by When the battery voltage reaches the final float voltage,
the current limit of the input supply (wall adapter). An the pass transistor turns off for 100ms (minimum off-
external RSENSE sets the maximum allowable charge
time). It remains off as long as the battery voltage stays
overcurrent and prevents a wall adapter with a high
above the float voltage after the 100ms off-time. After the
current limit from damaging the battery. If the current limit
minimum off-time, if the battery voltage drops below the
of the input supply is above IMAX, the charger will imme-
float voltage, the pass transistor turns back on for at least
diately turn off the N-MOSFET switch and will retry after
400ms (minimum on-time). As the battery approaches full
640ms, thus reducing the average charge current to
charge, the off-time will get longer and the on-time will
approximately 1% of the overcurrent value (CTIMER =
stay at 400ms. When the N-MOSFET switch is on, the
0.1µF). If the battery is disconnected while in full charge
voltage at the BAT pin will be slightly higher than the final
mode, the charge pump turns off when the voltage at the
float voltage due to the ESR associated with the battery
BAT pin rises above 4.7V and turns back on when the
pack. This voltage level should not be high enough to turn
voltage drops below the float voltage.
on the overvoltage protection circuitry often located in the
A charge cycle begins when the voltage at the VIN pin rises battery pack. When the duty cycle at the GATE pin drops
above the BAT pin by 45mV. The charger will go into trickle below 10%, a comparator turns off the N-FET at the CHRG
charge mode if the battery voltage is below 2.45V. The pin and connects a weak current source (40µA) to ground
trickle charge current is preset to 24mA and is provided by to indicate a near end-of-charge C/10 condition. The pulse
an internal current source. In trickle mode, both the pass charging will continue until the timer stops.
transistor and charge pump are off.
An external capacitor at the TIMER pin sets the total charge
When the cell voltage exceeds 2.45V, the charger goes time, the minimum on- and off-time and the overcurrent
into full charge mode. In this mode, the charge pump turns retry period. After a time-out has occurred, the charge
on and ramps up the gate voltage of the pass transistor cycle terminates and the CHRG pin is forced high imped-
turning it on. The current limited voltage at the VIN pin will ance. After the charging stops, if the battery voltage drops
ramp down to VBAT plus the voltage drop across the pass below 4.05V due to external loading or internal battery
transistor and RSENSE, thus reducing the power dissipa- leakage current, a new charge cycle will automatically
resume.

405242f

6
LTC4052-4.2
U U W U
APPLICATIO S I FOR ATIO
Input Voltage (Wall Adapter) The timer starts when an input voltage which is at least
40mV greater than VBAT is applied. After a time-out has
The input voltage to the LTC4052 must have some
occurred, the charge cycle stops and the CHRG pin be-
method of current limit capability. The current limit
comes high impedance.
level of the input power source must be lower than
the overcurrent limit (IMAX) set by the sense resistor CHRG Status Output Pin
IMAX = 105mV/(RSENSE + 10mΩ). The 10mΩ represents
bond wire resistance internal to the IC. If a wall adapter This open-drain output can report three different charger
without current limit is used, or the current limit level is conditions:
above IMAX, the charger will turn on briefly and then Charger Status CHRG Pin Behavior
immediately turn off when the overcurrent condition is
Not Charging High Impedance
detected. This cycle will be resumed every 640ms (CTIMER
Charging Strong Pulldown
= 0.1µF) until the total charge time has run out. If overcurrent
Charging, C/10 Reached Weak 40µA Pulldown
protection is not needed, short the SENSE pin to VIN. The
overcurrent limit selected should be approximately twice
Using a simple two-resistor network a microprocessor
the charge current (input supply current limit).
can distinguish all three states. See Figure 1.
Trickle Charge and Defective Battery Detection VIN VDD

At the beginning of the charge cycle, if the cell voltage is 3


VIN
low (less than 2.45V) the charger goes into a 24mA trickle 620k
LTC4052 MICROPROCESSOR
charge mode. If the low cell voltage persists for one 6 2k
CHRG OUT
quarter of the total charge time, the battery is considered
defective and the charge cycle is terminated. The CHRG IN
4052 F01
pin output is then forced to a high impedance state.
Figure 1. Interfacing with Microprocessor
Battery Charge Current When the LTC4052 is charging a battery, an internal N-
The battery charge current is determined by the current MOSFET pulls the CHRG pin to ground. When C/10 is
limit of the input supply (wall adapter). However, this reached, the strong NMOS pulldown is replaced by a weak
current must not exceed the maximum charge overcurrent, 40µA current source pulldown. When the LTC4052 is not
IMAX. If an overcurrent condition is detected, the internal charging a battery, the CHRG pin is high impedance.
switch immediately turns off, the GATE pin is pulled to Using the network in Figure 1, the microprocessor can
ground and the charge pump turns off. The charging will determine charger state using the following procedure:
resume after a 640ms time off (CTIMER = 0.1µF).
1. Force the digital output pin, OUT, high and read the logic
Programming the Timer value at the digital input, IN. If IN reads low, a charger cycle
is in progress.
The programmable timer is used to terminate the charge
cycle and set the minimum ON/OFF time and the overcurrent 2. If the IN pin is high, force the OUT pin to be high
time-off period. The length of the timer is programmed by impedance, then read the logic level at the IN pin again. If
an external capacitor from the TIMER pin to ground. The IN is low, the charge cycle is still in progress, the timer is
total charge time is: still running, but the charge current has dropped below
10% of the programmed value indicating that the charge
Time (Hours) = (3 Hours)(CTIMER/0.1µF) or
cycle is nearly complete.
CTIMER = 0.1µF • Time (Hours)/3 (Hours)
3. If the logic level at the IN pin is high, the charge cycle has
ended.
405242f

7
LTC4052-4.2
U U W U
APPLICATIO S I FOR ATIO
C/10 Detection (Near End-of-Charge) 10µA/C 50µA/C

The LTC4052 includes a comparator to monitor the duty VIN

cycle at the GATE pin to detect when the battery is nearing 50µA/C

full charge. When the duty cycle falls below 10%, the GATE
VOLTAGE
10µA/C
comparator trips and turns off the N-MOSFET at the CHRG
pin and switches in a weak (40µA) current source to 10µA/C 50µA/C 4052 TA02

ground. The 40µA turns off when the timer terminates the
charge cycle. C/10 detection is disabled in trickle charge Figure 2. Slew Rate at GATE and VIN Pins
mode. with the RC Network from GATE to VIN

Internal Pass Transistor For higher current applications an external power


An N-channel MOSFET (0.35Ω) pass transistor is included N-channel MOSFET can be connected in parallel with the
in the LTC4052. The gate of the MOSFET is controlled by internal pass transistor. Because the charge pump output is
an internal charge pump. The body is connected to ground clamped to 12V above GND, the external MOSFET gate to
instead of source terminal. There is no body diode from the source voltage rating should be 16V or more.
BAT pin back to the VIN pin; therefore, no blocking diode
is required in series with the battery or the input supply. Thermal Considerations
This will not only reduce cost but also reduce the heat The power handling capability is limited by the maximum
generated while in full charge mode. An internal thermal rated junction temperature (125°C) and the amount of PC
shutdown circuit turns the pass transistor off if the die
board copper used as a heat sink. The power dissipated by
temperature exceeds approximately 140°C with 5°C of
the IC consists of two components:
thermal hysteresis.
1. Input supply quiescent current multiplied by the input
Gate Drive voltage
The MOSFET gate drive consists of a regulated 10µA 2. The voltage drop across the switch (SENSE pin to BAT
current source charge pump. A series RC network is pin) multiplied by the charge current
required from the GATE pin to the VIN pin. When the
MOSFET is turned on, the voltage at the VIN pin will begin The LTC4052 has internal thermal shutdown designed to
slewing down to a voltage equal to VBAT plus the voltage protect the IC from overtemperature conditions. For con-
drop across the pass transistor and RSENSE. The slew rate tinuous charging in the fast charge mode, the maximum
is equal to 10µA/C. By ramping the VIN pin down slowly, junction temperature must not be exceeded. It is important
the inrush current is reduced. The resistor in series with to give careful consideration to all sources of thermal
the capacitor is required to limit the transient current when resistance from junction to ambient. Additional heat sources
the input supply is first applied. mounted nearby must also be considered.
When the charge pump is turned off, a 50µA current Surface mount packages rely primarily on the PC board
source to ground will start pulling the GATE voltage down. copper to dissipate the heat generated by the package to the
Once the pass transistor is off, the voltage at the VIN pin surrounding air. Since the PC board copper is the heat sink,
will begin slewing up with the rate equal to 50µA/C. With generous amounts of copper surrounding the package are
this external capacitor, the voltage at the VIN pin is ramping recommended to increase the effectiveness of the heat sink.
in a controlled manner (Figure 2).

405242f

8
LTC4052-4.2
U U W U
APPLICATIO S I FOR ATIO
In addition, feedthrough vias or plated through holes (lo- soldered to the PC board is approximately 35°C/W de-
cated directly beneath the package and elsewhere) connect- pending on the copper area. The junction temperature rise
ing internal copper and backside copper layers help transfer above ambient will be approximately:
and spread the heat generated by the package. (0.353W)(35°C/W) = 12.36°C
Calculating Junction Temperature The maximum junction temperature will be equal to the
Example: Find the maximum junction temperature for a maximum junction temperature rise above ambient plus
battery voltage of 4V (VIN will collapse to approximately the maximum ambient temperature or:
VBAT in the full charge mode), charge current of 1A and a TJMAX = 85°C + 12.36°C = 97.36°C
maximum ambient temperature of 75°C.
The power dissipated by the IC is: ACPR Output Pin
P = (IBAT • IBAT • RDS(ON)) + (VIN • IIN) When the input voltage is 45mV higher than the voltage at
the BAT pin, the ACPR pin is pulled to ground to indicate
= (1A • 1A • 0.35Ω) + (4V • 0.7mA)
that the input supply (wall adapter) is applied. After the
= 0.35 + 0.003 input supply is removed, this pin will become high imped-
= 0.353W ance. An internal 100ms filter prevents the LTC4052 from
turning off if the voltage at the VIN pin rings and gets too
The LTC4052 is available in an enhanced 8-pin MSOP close to VBAT due to parasitic inductance.
package which features an exposed copper pad on the
bottom of the package allowing it to be soldered directly to Stop Charging
the PC board copper for maximum heat transfer. This
The charger is off when the voltage at the VIN pin is less
greatly reduces the thermal resistance and increases the
than 45mV above VBAT (sleep mode). The charge pump
power handling capability when compared to a standard
and the internal pass transistor are turned off, and the
MSOP package. The junction to ambient thermal resis-
internal resistor divider is disconnected to reduce the
tance of this package when the backside of the package is
current drain on the battery in the sleep mode.

405242f

9
LTC4052-4.2
U
TYPICAL APPLICATIO

External N-MOSFET for Higher Charge Current

VIN = 5V TO 10V WITH 2A CURRENT LIMIT

MBRS120T3

3
4.7Ω VIN 10k
AC
1k 1k RSENSE
PRESENT
1µF 25mΩ
STATUS LTC4052 0.047µF
1
SENSE
CHARGE
6 7
STATUS CHRG GATE Si2302DS
2 8
ACPR BAT
0.022µF 1-CELL 4.2V
TIMER GND Li-Ion
5 4 BATTERY
CTIMER
0.1µF
4052 TA03

405242f

10
LTC4052-4.2
U
PACKAGE DESCRIPTIO

MS8E Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1662)

BOTTOM VIEW OF
EXPOSED PAD OPTION
2.06 ± 0.102
1 (.080 ± .004)
1.83 ± 0.102
2.794 ± 0.102 0.889 ± 0.127 (.072 ± .004)
(.110 ± .004) (.035 ± .005)

5.23
(.206) 2.083 ± 0.102 3.2 – 3.45
MIN (.082 ± .004) (.126 – .136)

8
3.00 ± 0.102
0.42 ± 0.04 0.65 (.118 ± .004) 0.52
(.0165 ± .0015) (.0256) (NOTE 3) 8 7 6 5 (.206)
TYP BSC REF
RECOMMENDED SOLDER PAD LAYOUT

3.00 ± 0.102
4.90 ± 0.15
DETAIL “A” (.118 ± .004)
0.254 (1.93 ± .006)
NOTE 4
(.010)
0° – 6° TYP
GAUGE PLANE
1 2 3 4
0.53 ± 0.015
(.021 ± .006) 1.10 0.86
(.043) (.034)
DETAIL “A” MAX REF
0.18
(.077)
SEATING
PLANE 0.22 – 0.38 0.13 ± 0.076
(.009 – .015) (.005 ± .003)
0.65
TYP MSOP (MS8E) 0802
(.0256)
NOTE:
BSC
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX

405242f

11
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
LTC4052-4.2
U
TYPICAL APPLICATIO
Minimum Component Count 4.2V Li-Ion Battery Charger

VIN = 5V TO 10V WITH 600mA CURRENT LIMIT

3
VIN 10k

0.047µF
LTC4052
1
SENSE
6 7
NC CHRG GATE
2 8
NC ACPR BAT 0.022µF

TIMER GND
5 4 1-CELL 4.2V
CTIMER 600mA
0.1µF Li-Ion BATTERY
4052 TA04

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PART NUMBER DESCRIPTION COMMENTS
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ThinSOT is a trademark of Linear Technology Corporation

405242f

LT/TP 0303 2K • PRINTED IN USA


Linear Technology Corporation
12 1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 ● FAX: (408) 434-0507 ●
www.linear.com  LINEAR TECHNOLOGY CORPORATION 2001

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