AML Overview
AML – Wafer Bonding Machines & Services
AML- Company History
• Company founded 1992
• MEMS Design, Manufacture & Process Development background
• Founders made first in-situ aligner-wafer bonder in 1985
• AML focus on & Provide Wafer Bonding equipment & Wafer bonding
services (BONDCENTRE)
•Worldwide installed base of machines
From MEMS
background not Mask
Aligner for IC
AML – Wafer Bonding Machines & Services
Basic features of AML bonders
AML – Wafer Bonding Machines & Services
AML AWB04 Aligner Bonder
AML – Wafer Bonding Machines & Services
Schematic of Unique in-situ Activation, Alignment &
Bond
T <560 C
HV <2500V
• Heat + Pump + Align
• Independent platen T
• Flexible
• 2 to 8 inch wafers
AML – Wafer Bonding Machines & Services
• Fast cycles times
AML Wafer Bonders
Wafer bonding capabilities:-
• Anodic Bonding Si-Glass
• Direct Bonding e.g. Si-Si
• Glass Frit Bonding
• Eutectic Bonding
• Thermo-compression
• Adhesive Bonding
• Aligned Embossing
In bond chamber alignment
& bonding
in one machine
= higher throughput
AML – Wafer Bonding Machines & Services
AML Advantages
• In-bond chamber alignment at bond temperature
• No alignment shiftage between align & bond
• No mask aligner required
• NOTE:-You are free to choose the best mask
aligner for your ‘mask aligning’- not tied to one
needed by the wafer bonder system
• Small footprint
• No alignment jig required (smaller mass) *
• Simultaneous alignment and vac pump-down *
• No flags in contact with bond surfaces
• In chamber RAD activation option
• Forced cooling *
* = faster throughput
AML – Wafer Bonding Machines & Services
Commercial benefits of the
In-situ AML Wafer bonders
•Lowest cost per bond & ownership
•Easy to install, (2-3 days) use/ maintain/ service – minimal training
needed.
•Very high reliability.
•Small footprint
•No time required on customer’s mask aligner
•Standard machines & custom options to suit customer needs
•Excellent technical process support – fast response
•System is complete – no other equipment required
•Extensive machine & bonding process experience.
•Worldwide Machine base UK, Europe, USA , India & Far East.
AML – Wafer Bonding Machines & Services
New system features, now
and planned
AML – Wafer Bonding Machines & Services
New Processes on AML Wafer Bonders
• Hot Embossing – Characterisation has just started
New Developments on AML Wafer Bonders
• Inclusion of RAD in-situ surface activation for low temperature bonding
(available for new orders) see pages 19-24
• Addition of Pattern recognition software
• Improvements for sub-micron alignment accuracy
• Upgrading of manipulators from manual to stepper motor control
• Motorised Z Drive
Development pipeline:- System Automation
AML – Wafer Bonding Machines & Services
New Polymer Micro Hot Embossing
& Nano Print tool
• Applications: e.g. Bio-sensors &
Microfluidic devices
• Polymers: SU8, PDMS, PMMA..
• Tool fits AML bonder platform or
stand alone machine
Outline Specification
Force up to 5000N Stroke up to 750 microns
T up to 500 C (cooling) up to 6” wafers
2 micron alignment between
Operation in Vacuum
stamp & substrate
AML – Wafer Bonding Machines & Services
Radical Activation Tool
Experimental set-up using glass vacuum chamber – showing
electrical discharge confined between the ring electrodes
AML – Wafer Bonding Machines & Services
IR transmission Image
150mm RAD activated
bond
Void free in situ activated bond
– annealed at 200C for 1 hr
AML – Wafer Bonding Machines & Services
Radical Activation Benefits
¾Produces less roughening of the surface than plasma activation
¾Uniform activation (no edge effects as typically seen for plasmas)
¾Wider process time window for activation
¾In situ process eliminates variation in activation strength with
time
¾No exposure of wafers to energetic ions
¾Bond can be heated and contacted at bonding temperature =
significant advantage for dissimilar substrates or “hard to bond”
substrates
AML – Wafer Bonding Machines & Services
AML Wafer Bonding Machines
One System does it all!
AML – Wafer Bonding Machines & Services
BONDCENTRE
Wafer Bonding Services
AML – Wafer Bonding Machines & Services
AML’s Strengths
• Very strong MEMS design & process background –
especially with respect to Wafer Bonding
• Relevant customer base
• Strong network of partners built up over many years
• Equipment supplier – transfer the process onto a machine
• Selected by UK government to be best to provide the
service
AML – Wafer Bonding Machines & Services
BONDCENTRE SERVICES OFFERED
• Wafer Bonding Process Development e.g. for many novel materials;
silicon, glass, sapphire, strained silicon, InP, GaAs,…
• Wafer Bonding process selection & design for your application
• Commercial Wafer Bonding Service prototype to production
• Wafer Bonding Technology Transfer (inc Equipment) & Training
• Associated Processes (Pre & Post Bond)
• Applications knowledge for:
MEMS Smart cut layer transfer
Advanced Substrates Wafer Level Packaging
3D integration Vacuum Encapsulation
Temporary Bonding LEDs
AML – Wafer Bonding Machines & Services
Associated Pre & Post Bond Services:
• Wafer Cleaning & Activation
• Wafer Characterisation e.g. Profiling & Surface
Roughness
• Wafer Structuring: e.g. Channels, Holes &
Conducting Vias
• Wafer Processing: e.g. Deposition, Electroplating
• Wafer Preparation: Thin to required Thickness &
Surface Finish - Planarisation (CMP)
• Inspection of bonded assemblies - SAM & IR
AML – Wafer Bonding Machines & Services
Equipment Set Available:
• WAFER ALIGNER BONDERS 4 machines in Class 10
• METROLOGY; AFM, Ra, PROFILE, TTV
• MEGASONIC WAFER CLEANING
• NEW ‘RAD’ ACTIVATION
• INSPECTION: ACOUSTIC MICROSCOPE (SAM) & IR
• ELECTROPLATING
• SCREEN PRINT - GLASS FRIT/ADHESIVE
• POWDER BLASTING E.G. GLASS MACHINING
• WAFER THINNING
• CMP
• Also access via long term collaboration with CMF @ Rutherford to:
• PHOTOLITHOGRAPHY DEPOSITION- PVD & CVD & FURNACES
• ETCHING – DRY & WET
• WAFER SAW WIRE & BUMP BONDING
• METROLOGY: THIN FILM, LINE WIDTH, SEM
AML – Wafer Bonding Machines & Services
AML Wafer Bonding Machines &
Services
One Company does it all!
AML – Wafer Bonding Machines & Services
