This device is designed specifically to power IMVP Mobile Processors under a strict disclosure
agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For
more information please contact IMVP@[Link].
PACKAGE MATERIALS INFORMATION
[Link] 4-Feb-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS51620RHAR VQFN RHA 40 2500 330.0 16.4 6.3 6.3 1.1 12.0 16.0 Q2
TPS51620RHAT VQFN RHA 40 250 180.0 16.4 6.3 6.3 1.1 12.0 16.0 Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
[Link] 4-Feb-2015
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS51620RHAR VQFN RHA 40 2500 367.0 367.0 38.0
TPS51620RHAT VQFN RHA 40 250 210.0 185.0 35.0
Pack Materials-Page 2
GENERIC PACKAGE VIEW
RHA 40 VQFN - 1 mm max height
6 x 6, 0.5 mm pitch PLASTIC QUAD FLATPACK - NO LEAD
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4225870/A
[Link]
PACKAGE OUTLINE
RHA0040B SCALE 2.200
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
6.1 B
A
5.9
PIN 1 INDEX AREA
6.1
5.9
1 MAX
SEATING PLANE
0.05
0.00 0.08
2X 4.5
4.15 0.1 (0.2) TYP
11 20
36X 0.5
10
21
EXPOSED
THERMAL PAD
2X 41 SYMM
4.5
30 0.27
1 40X
0.17
PIN 1 ID 0.1 C A B
(OPTIONAL) 40 31
SYMM 0.05
0.5
40X
0.3
4219052/A 06/2016
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
[Link]
EXAMPLE BOARD LAYOUT
RHA0040B VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
( 4.15)
SYMM
40X (0.6)
40 31
40X (0.22)
1
30
(0.25) TYP
41 SYMM
(0.685) (5.8)
TYP
36X (0.5) (1.14)
TYP
( 0.2) TYP
VIA
10 21
(R0.05) TYP
11 20
(0.685) (1.14)
TYP TYP
(5.8)
LAND PATTERN EXAMPLE
SCALE:12X
0.07 MAX 0.07 MIN
ALL AROUND ALL SIDES
SOLDER MASK
METAL OPENING
SOLDER MASK METAL UNDER
OPENING SOLDER MASK
NON SOLDER MASK
SOLDER MASK
DEFINED
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4219052/A 06/2016
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 ([Link]/lit/slua271).
[Link]
EXAMPLE STENCIL DESIGN
RHA0040B VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
9X ( 1.17)
(1.37) TYP
40X (0.6) 40 31
40X (0.22)
1
41 30
(1.37)
(0.25) TYP TYP
SYMM
(5.8)
36X (0.5)
(R0.05) TYP
10 21
11 20
METAL
TYP
SYMM
(5.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 41:
72% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:12X
4219052/A 06/2016
NOTES: (continued)
5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
[Link]
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