DISCRETE SEMICONDUCTORS
DATA SHEET
PMBT3904
NPN switching transistor
Product data sheet 2004 Jan 12
Supersedes data of 1999 Apr 27
NXP Semiconductors Product data sheet
NPN switching transistor PMBT3904
FEATURES QUICK REFERENCE DATA
• Collector current capability IC = 200 mA SYMBOL PARAMETER MAX. UNIT
• Collector-emitter voltage VCEO = 40 V. VCEO collector-emitter voltage 40 V
IC collector current (DC) 200 mA
APPLICATIONS
• General switching and amplification. PINNING
PIN DESCRIPTION
DESCRIPTION
1 base
NPN switching transistor in a SOT23 plastic package. 2 emitter
PNP complement: PMBT3906.
3 collector
MARKING
handbook, halfpage
TYPE NUMBER MARKING CODE(1) 3
3
PMBT3904 *1A
Note 1
1. * = p : Made in Hong Kong.
* = t : Made in Malaysia. 2
1 2
* = W : Made in China.
Top view MAM255
Fig.1 Simplified outline (SOT23) and symbol.
ORDERING INFORMATION
TYPE PACKAGE
NUMBER NAME DESCRIPTION VERSION
PMBT3904 − plastic surface mounted package; 3 leads SOT23
2004 Jan 12 2
NXP Semiconductors Product data sheet
NPN switching transistor PMBT3904
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VCBO collector-base voltage open emitter − 60 V
VCEO collector-emitter voltage open base − 40 V
VEBO emitter-base voltage open collector − 6 V
IC collector current (DC) − 200 mA
ICM peak collector current − 200 mA
IBM peak base current − 100 mA
Ptot total power dissipation Tamb ≤ 25 °C; note 1 − 250 mW
Tstg storage temperature −65 +150 °C
Tj junction temperature − 150 °C
Tamb operating ambient temperature −65 +150 °C
Note
1. Transistor mounted on an FR4 printed-circuit board.
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS VALUE UNIT
Rth(j-a) thermal resistance from junction to ambient note 1 500 K/W
Note
1. Transistor mounted on an FR4 printed-circuit board.
CHARACTERISTICS
Tamb = 25 °C unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
ICBO collector cut-off current IE = 0; VCB = 30 V − 50 nA
IEBO emitter cut-off current IC = 0; VEB = 6 V − 50 nA
hFE DC current gain VCE = 1 V; see Fig.2; note 1
IC = 0.1 mA 60 −
IC = 1 mA 80 −
IC = 10 mA 100 300
IC = 50 mA 60 −
IC = 100 mA 30 −
VCEsat collector-emitter saturation IC = 10 mA; IB = 1 mA − 200 mV
voltage IC = 50 mA; IB = 5 mA − 300 mV
VBEsat base-emitter saturation voltage IC = 10 mA; IB = 1 mA 650 850 mV
IC = 50 mA; IB = 5 mA − 950 mV
Cc collector capacitance IE = Ie = 0; VCB = 5 V; f = 1 MHz − 4 pF
Ce emitter capacitance IC = Ic = 0; VBE = 500 mV; − 8 pF
f = 1 MHz
2004 Jan 12 3
NXP Semiconductors Product data sheet
NPN switching transistor PMBT3904
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
fT transition frequency IC = 10 mA; VCE = 20 V; 300 − MHz
f = 100 MHz
F noise figure IC = 100 µA; VCE = 5 V; RS = 1 kΩ; − 5 dB
f = 10 Hz to 15.7 kHz
Switching times (between 10% and 90% levels); see Fig.3
td delay time ICon = 10 mA; IBon = 1 mA; − 35 ns
tr rise time IBoff = −1 mA − 35 ns
ts storage time − 200 ns
tf fall time − 50 ns
Note
1. Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
MGU821 MGU822
500 250
handbook, halfpage handbook, halfpage
IC
h FE
(mA) (1) (2) (3) (4) (5) (6) (7)
400 200
(1)
300 150
(8)
(2) (9)
200 100
(10)
(3)
100 50
0 0
10 −1 1 10 102 103 0 2 4 6 8 10
I C (mA) VCE (V)
Tamb = 25 °C.
VCE = 1 V. (1) IB = 5.5 mA. (5) IB = 3 mA. (9) IB = 1 mA.
(1) Tamb = 150 °C. (2) IB = 5 mA. (6) IB = 2.5 mA. (10) IB = 0.5 mA.
(2) Tamb = 25 °C. (3) IB = 4.5 mA. (7) IB = 2 mA.
(3) Tamb = −55 °C. (4) IB = 3.5 mA. (8) IB = 1.5 mA.
Fig.3 Collector current as a function of
Fig.2 DC current gain; typical values. collector-emitter voltage.
2004 Jan 12 4
NXP Semiconductors Product data sheet
NPN switching transistor PMBT3904
MGU823 MGU824
1200 1200
handbook, halfpage handbook, halfpage
VBE VBEsat
(mV) (mV)
1000 1000
(1)
(1)
800 800 (2)
(2)
600 600 (3)
(3)
400 400
200 200
10 −1 1 10 102 103 10 −1 1 10 102 103
I C (mA) I C (mA)
VCE = 1 V. IC/IB = 10.
(1) Tamb = −55 °C. (1) Tamb = −55 °C.
(2) Tamb = 25 °C. (2) Tamb = 25 °C.
(3) Tamb = 150 °C. (3) Tamb = 150 °C.
Fig.4 Base-emitter voltage as a function of Fig.5 Base-emitter saturation voltage as a
collector current. function of collector current.
MGU825
103
handbook, halfpage
VCEsat
(mV)
(1)
(2)
(3)
102
10
10 −1 1 10 102 103
I C (mA)
IC/IB = 10.
(1) Tamb = 150 °C.
(2) Tamb = 25 °C.
(3) Tamb = −55 °C.
Fig.6 Collector-emitter saturation voltage as a
function of collector current.
2004 Jan 12 5
NXP Semiconductors Product data sheet
NPN switching transistor PMBT3904
handbook, full pagewidth VBB VCC
RB RC
(probe) Vo (probe)
oscilloscope oscilloscope
450 Ω 450 Ω
R2
Vi DUT
R1
MLB826
Vi = 5 V; T = 500 µs; tp = 10 µs; tr = tf ≤ 3 ns.
R1 = 56 Ω; R2 = 2.5 kΩ; RB = 3.9 kΩ; RC = 270 Ω.
VBB = −1.9 V; VCC = 3 V.
Oscilloscope: input impedance Zi = 50 Ω.
Fig.7 Test circuit for switching times.
2004 Jan 12 6
NXP Semiconductors Product data sheet
NPN switching transistor PMBT3904
PACKAGE OUTLINE
Plastic surface-mounted package; 3 leads SOT23
D B E A X
HE v M A
A1
1 2 c
e1 bp w M B Lp
e
detail X
0 1 2 mm
scale
DIMENSIONS (mm are the original dimensions)
A1
UNIT A bp c D E e e1 HE Lp Q v w
max.
1.1 0.48 0.15 3.0 1.4 2.5 0.45 0.55
mm 0.1 1.9 0.95 0.2 0.1
0.9 0.38 0.09 2.8 1.2 2.1 0.15 0.45
OUTLINE REFERENCES EUROPEAN
ISSUE DATE
VERSION IEC JEDEC JEITA PROJECTION
04-11-04
SOT23 TO-236AB
06-03-16
2004 Jan 12 7
NXP Semiconductors Product data sheet
NPN switching transistor PMBT3904
DATA SHEET STATUS
DOCUMENT PRODUCT
DEFINITION
STATUS(1) STATUS(2)
Objective data sheet Development This document contains data from the objective specification for product
development.
Preliminary data sheet Qualification This document contains data from the preliminary specification.
Product data sheet Production This document contains the product specification.
Notes
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and may differ in case of multiple devices. The latest product status information is available on the Internet at
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Quick reference data ⎯ The Quick reference data is an
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extract of the product data given in the Limiting values and
Applications ⎯ Applications that are described herein for Characteristics sections of this document, and as such is
any of these products are for illustrative purposes only. not complete, exhaustive or legally binding.
NXP Semiconductors makes no representation or
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specified use without further testing or modification.
Limiting values ⎯ Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) may cause permanent damage to
the device. Limiting values are stress ratings only and
operation of the device at these or any other conditions
2004 Jan 12 8
NXP Semiconductors
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Printed in The Netherlands R75/04/pp9 Date of release: 2004 Jan 12 Document order number: 9397 750 12461