BEST SOUND ELECTRONICS Doc.
Number : 제품-130814
SPECIFICATION OF
ELECTRET CONDENSER MICROPHONE
( TO : )
HF
BFRs/CFRs/PVC - Free
MODEL NO. : (R)SOB-413S42-EM H/F
DIRECTIVITY : OMNI-DIRECTIONAL
Prepared Checked Approved
Name
Sign.
Prepared Checked Approved
BSE Name KM Cheong MH Ham WT Lee
Sign.
BSE CO., LTD
# 626-3 58B-4L, Gozan-dong, Namdong-Ku
INCHEON-City. KOREA
TEL :(8232) 500-1965
FAX :(8232) 500-1898
※ All Parts are Halogen Free Material. 4 0 5 -8 1 7
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BEST SOUND ELECTRONICS Doc. Number : 제품-130814
SPECIFICATION HISTORY
History
Date Item Contents Grounds
Change
ISSUE From BSE 1st Submission of
2013.08.14 (R)SOB-413S42-EM H/F
To Microphone spec.
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BEST SOUND ELECTRONICS Doc. Number : 제품-130814
CONTENTS
1.SCOPE
2. MODEL NO.
3. ELECTRICAL CHARACTERISTICS
3.1 Sensitivity
3.2 Output Impedance
3.3 Current Consumption
3.4 Signal to Noise Ratio
3.5 Decreasing Voltage
3.6 Operating Voltage
3.7 Maximum input S.P.L.
3.8 Reflow Sensitivity test
4. MEASUREMENT CIRCUIT
5. TYPICAL FREQUENCY RESPONSE CURVE ( FAR FIELD )
6. MECHANICAL CHARACTERISTICS
7. RELIABILITY TEST
7.1 Vibration Test
7.2 Drop Test
7.3 Temperature Test
7.4 Humidity Test
7.5 Temperature Cycle
7.6 Temperature Shock
7.7 ESD ( Electrostatic Discharge ) TEST
8. TEMPERATURE CONDITIONS
8.1 Storage Temperature
8.2 Operating Temperature
9. MEASUREMENT SYSTEM
10. REFLOW PROFILE (Guaranteed Maximum Reflow Condition)
11. CAUTIONS WITH USING SMD MICROPHONE
12. PACKAGE
13. REWORK
14. MICROPHONE PCB DRAWING
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BEST SOUND ELECTRONICS Doc. Number : 제품-130814
1. INTRODUCTION
This specification is for the SMD possible Electret Condenser Microphone(ECM) which has endurable reflow temperature of up to
250℃ for under 30 seconds.
2. MODEL NO.
(R)SOB-413S42-EM H/F
3. ELECTRICAL CHARACTERISTICS
Temp. = 23 ± 2 ℃ Room Humidity = 65 ± 5 %
Limits
NO. Parameter Symbol Condition Unit
Min. Center Max.
1 Sensitivity S f=1㎑, S.P.L =1Pa, 0㏈=1V/Pa -45 -42 -39 ㏈
2 Output impedance ZOUT f= 1㎑ 2.2 ㏀
3 Current Consumption IDSS VCC=2.0V , RL = 2.2㏀ 300 ㎂
f=1㎑, S.P.L =1Pa
4 Signal to Noise Ratio S/N 58 ㏈
(A-Weighted Curve)
5 Decreasing Voltage ΔS-VS VCC=2.0V to 1.5V -3 ㏈
6 Operating Voltage 1.5 10 V
7 Maximum input S.P.L. 110 ㏈
8 Reflow Sensitivity test R After 3 times reflow -45 -42 -39 dB
4. MEASUREMENT CIRCUIT
Terminal 1 1 ㎌
R
FET 1 Output
C
RL
Power Supply Vs
C
ECM Unit
2 Earth
Terminal 2
MIC.CASE RL:2.2 ㏀ (external resistance)
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BEST SOUND ELECTRONICS Doc. Number : 제품-130814
5. TYPICAL FREQUENCY RESPONSE CURVE ( FAR FIELD )
Far Field Measurement Condition
Temperature : 23 ± 2 ℃
Bias Voltage : 2.0V ( with 2.2㏀ series resistor )
Acoustic stimulus : 1Pa ( 94㏈ SPL at 1㎑ ) at 50 ㎝ from the loud-speaker.
The loud-speaker must be calibrated to make a flat frequency response input signal
Position : The frequency response of microphone unit measured at 50㎝ from the loud-speaker
6. MECHANICAL CHARACTERISTICS
SMD Type
(R)SOB-413S-RC10
1.3±0.1
4.0±0.1
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BEST SOUND ELECTRONICS Doc. Number : 제품-130814
7. RELIABILITY TEST
7.1 VIBRATION TEST
To be no interference in operation after vibrations. 10㎐ to 55㎐ for 1 minute full amplitude 1.52㎜ , for 2 hours at three axis
7.2 DROP TEST
To be no interference in operation after dropped to concrete floor each one time from 1 meter height at three directions in state
of packing
7.3 TEMPERATURE TEST
- After exposure at 85℃ for 96 hours, sensitivity to be within ±3㏈ from initial sensitivity.
( The measurement to be done after 2 hours of conditioning at room temperature )
- After exposure at -30℃ for 96 hours, sensitivity to be within ±3㏈ from initial sensitivity.
( The measurement to be done after 2 hours of conditioning at room temperature)
7.4 HUMIDITY TEST
After exposure at 60℃ and 90 to 90% relative humidity for 96 hours, sensitivity to be within ± 3㏈ from initial sensitivity.
7.5 TEMPERATURE CYCLE TEST
After exposure at 25℃ for 2 hours, at 60℃ 90% for 4 hours, 2 hours, at 45℃ 95% for 12 hours, 2 hours, at 20℃ for 1 hour,
at 25℃ for 1 hour. 5 cycles, sensitivity to be within ±3㏈ from initial sensitivity
( The measurement to be done after 2 hours of conditioning at room temperature )
7.6 TEMPERATURE SHOCK
Temperature change from –30℃ to 70℃ for 30 minutes . (changing time : 20 sec. )
After 48 cycles, sensitivity to be within ±3㏈from initial sensitivity
( The measurement to be done after 2 hours of conditioning at room temperature )
7.7 ESD ( Electrostatic Discharge ) TEST
The microphone under test must be discharged between each ESD exposure with ground.
( contact : ± 8㎸ , air : ± 15㎸ Æ IEC 61000-4-2)
There is no interference in operation after 5 times exposure
8 . TEMPERATURE CONDITIONS
8.1 STORAGE TEMPERATURE : -30℃ ~ +85℃
8.2 OPERATING TEMPERATURE : -30℃ ~ +85℃
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BEST SOUND ELECTRONICS Doc. Number : 제품-130814
9. MEASUREMENT SYSTEM
Loud-speaker 4231 Sound Calibrator
50㎝
Desk-jet
Color Printer
Turn-
table
(Input S.P.L : 94dB 1V/Pa)
K8127
System
Program
2012 Audio Analyzer
Power Amplifier GPIB
Basic circuit
Controller
10. REFLOW PROFILE (Guaranteed Maximum Reflow Condition)
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BEST SOUND ELECTRONICS Doc. Number : 제품-130814
11. CAUTIONS WITH USING SMD MICROPHONE
11-1 X-ray inspection
- X-ray inspection is possible only under the setting conditions with Voltage : 60~80kV, Current : 60~100㎂, Time : within 1min
- Don’t do the REFLOW or REWORK process after X-ray inspection
- BUT, post-baking (at 105℃ for 2hrs) after X-ray inspection is recommended for stabilizing
SMD microphone
11-2 Cleaning process
- Don’t do the cleaning process with any kind of volatile solvent(Acetone, TCE, alcohol, etc.,), water, or detergent
→ Possible only for the purpose of removing any dust or particle only with tissue or cotton tip without direct contact to the
microphone
11-3 Router process on Printed Circuit Board after reflow
- It’s possible to affect the acoustic properties of SMD microphone, when any particle gets into the
SMD microphone inside through sound holes
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BEST SOUND ELECTRONICS Doc. Number : 제품-130814
12 .1 TAPING SPECIFICATION
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12 .2 Recommended Metal Mask(Stencil Design) and Land Pattern
Pattern Ø4.1 (Unit: mm)
Metal Mask Pattern
Soldering Surface – Land Pattern
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BEST SOUND ELECTRONICS Doc. Number : 제품-130814
12 .3 Test Board Layout
(Unit: mm)
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BEST SOUND ELECTRONICS Doc. Number : 제품-130814
13. REWORK
13 .1 Rework Machine
13 .1.1 Rework Machine
Manufacturer Meisho
Model MS9000S
Temperature
6 zones
control
Hot air flow
Type
Top N2 gas (recommended)
heater Flow
≤ 20(30) ℓ/min
rate
Bottom heater 150℃~200℃ (IR heater)
Alignment vision
Pick-up nozzle ≤ Φ0.5 mm
1. Removing or pre-heating the solder residue before
mounting new part
Solder/flux
2. Apply lead-free flux only or apply 2 ~ 3 points of
solder paste instead
* Note : It’s possible to use the ‘hot air gun’ for SMD mic. rework, but it might affect to microphone
characteristics depending on rework conditions.
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BEST SOUND ELECTRONICS Doc. Number : 제품-130814
13 .1.2 Setting Condition
① Setting Condition I
Temperature(℃)
Time
setting Real
0 50
10 95 Setting 조건
20 148 Top 450
450 Temperature
30 186 bottom 420
40 216
Time 45 sec
45 229
cooling 40 sec
50 234
60 220 Air flow rate 20ℓ/min
70 cooling 200
80 180
85 172
Recommended Rework Profile
250
200
Temperature (C)
150
100
50
0
0 20 40 60 80 100
Time (sec)
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BEST SOUND ELECTRONICS Doc. Number : 제품-130814
② Setting Condition II
Temperature(℃)
Time
setting Real
0 49
10 77 Setting Condition
20 450 142 Top 450
30 188 Temperature
bottom 450
40 232
Time 40 sec
45 234
cooling 40 sec
50 223
60 cooling 199 Air flow rate 30ℓ/min
70 175
80 156
Recommended Rework Profile
250
200
Temperature (C)
150
100
50
0
0 20 40 60 80 100
Time (sec)
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BEST SOUND ELECTRONICS Doc. Number : 제품-130814
13 .1.3 Rework Process Condition (using ‘Rework Machine’)
Bottom heater IR heater is the best option
Alignment Using a vision equipment to do alignment easily and precisely
Pick up the center of the SMD microphone using a nozzle with
less than 0.5 mm in diameter.
If the whole nozzle fixture can cover the front side
Pick-up nozzle Φ0.5
mm
of the SMD microphone
nozzle
like the picture on left,
SMD
mic
it’s better for safe rework.
1. Removing the solder residue before mounting new part
- print lead-free solder paste on the SMD mic
terminals using mask Æ mounting
2-1. Pre-heating the solder residue before mounting new part
- apply lead-free flux onto the land pattern
Solder/flux
(halogen-free flux : ALPHA Solids 26F FLUX by Alpha
Process
Metal Co. Ltd.,)
Options
2-2. Pre-heating the solder residue before mounting new part
- apply 2 ~ 3 points of lead-free solder paste onto the land
pattern
3. After removing damaged part, apply lead-free flux or 2~3
points of lead-free solder paste onto the land pattern
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BEST SOUND ELECTRONICS Doc. Number : 제품-130814
13 .2 Heater Gun (1)
13 .2 .1 Heater Gun Specification
Manufacturer Quick Korea
Model 990D ESD
Temperature control PID control
Top Type Hot air flow
heater Flow rate < 20 ℓ/min
Alignment visual
Pick-up Manual
1. Removing or pre-heating the solder
residue before mounting new part
Solder/flux
2. Apply lead-free flux only or apply
2 ~ 3 points of solder paste instead
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BEST SOUND ELECTRONICS Doc. Number : 제품-130814
13 .2 .2 Setting Condition
Heater gun nozzle
1.5cm SMD Mic
PCB
Heater gun setting
330℃
Temperature
Distance between
1.5 cm
Nozzle and mic
Flow setting 7.0
Alignment Visual
Pick-up Manual
Work removal 20 ~ 25 sec
Period rework 20 ~ 25 sec
No 01. It’ll be the safest rework condition, when ‘rework’ time is set as same period as ‘removal’.
Please check out the ‘removal’ time first, then ‘rework’ will be finished within ‘removal’ time + 5 sec.
No 02. It might be impossible to be done properly with this rework setting condition according to
the main board specification. In this case, one possible way is search for the ‘removal’ time with
same condition first, then set the ‘rework’ time as ‘removal’ time + 5sec. It’s important to find out
the way to shorten work period to maintain the original property by controlling setting temperature
and air flow.
* Note : The guaranteed sensitivity deviation after rework with this temperature condition is within±2.0 dB.
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BEST SOUND ELECTRONICS Doc. Number : 제품-130814
13 .2 .3 Rework Process Condition (using ‘Heater Gun (1)’)
Bottom heater IR heater is the best option
Alignment Visual
Temperature 330℃
Time 20 ∼ 25 Seconds
Nozzle No additional nozzle is needed
1. Removing the solder residue before mounting new part
- print lead-free solder paste on the SMD mic terminals using
mask Æ mounting
2-1. Pre-heating the solder residue before mounting new part
- apply lead-free flux onto the land pattern
Solder/flux
(halogen-free flux : ALPHA Solids 26F FLUX by Alpha Metal
Process Co. Ltd.,)
Options
2-2. Pre-heating the solder residue before mounting new part
- apply 2 ~ 3 points of lead-free solder paste onto the land
pattern
3. After removing damaged part, apply lead-free flux or 2~3
points of lead-free solder paste onto the land pattern
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BEST SOUND ELECTRONICS Doc. Number : 제품-130814
13 .3 Heater Gun (2)
13 .3 .1 Heater Gun Specification
Manufacturer HAKKO
Model 850B ESD
Temperature control 100 ~ 420
Top Type Hot air flow
heater Flow rate < 23 ℓ/min
Alignment visual
Pick-up Manual
1. Removing or pre-heating the solder
residue before mounting new part
Solder/flux
2. Apply lead-free flux only or apply
2 ~ 3 points of solder paste instead
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BEST SOUND ELECTRONICS Doc. Number : 제품-130814
13 .3 .2 Setting Condition
Heater gun nozzle
1.5cm SMD Mic
PCB
Heater gun setting
3.75
Temperature
Distance between
1.5 cm
Nozzle and mic
Flow setting 2.0
Alignment Visual
Pick-up Manual
Work removal 15 ~ 25 sec
Period rework 15 ~ 25 sec
No 01. It’ll be the safest rework condition, when ‘rework’ time is set as same period as ‘removal’.
Please check out the ‘removal’ time first, then ‘rework’ will be finished within ‘removal’ time + 5 sec.
No 02. It might be impossible to be done properly with this rework setting condition according to
the main board specification. In this case, one possible way is search for the ‘removal’ time with
same condition first, then set the ‘rework’ time as ‘removal’ time + 5sec. It’s important to find out
the way to shorten work period to maintain the original property by controlling setting temperature
and air flow.
* Note : The guaranteed sensitivity deviation after rework with this temperature condition is within
±2.0 dB.
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BEST SOUND ELECTRONICS Doc. Number : 제품-130814
13 .3 .3 Rework Process Condition (using ‘Heater Gun (2)’)
Bottom heater IR heater is the best option
Alignment Visual.
Temperature 330℃
Time 20 ∼ 25 Seconds
Nozzle No additional nozzle is needed
1. Removing the solder residue before mounting new part
- print lead-free solder paste on the SMD mic terminals using
mask Æ mounting
2-1. Pre-heating the solder residue before mounting new part
- apply lead-free flux onto the land pattern
Solder/flux
(halogen-free flux : ALPHA Solids 26F FLUX by Alpha Metal
Process Co. Ltd.,)
Options
2-2. Pre-heating the solder residue before mounting new part
- apply 2 ~ 3 points of lead-free solder paste onto the land
pattern
3. After removing damaged part, apply lead-free flux or 2~3
points of lead-free solder paste onto the land pattern
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BEST SOUND ELECTRONICS Doc. Number : 제품-130814
14. MICROPHONE PCB DRAWING
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