the product:

A best in class
solder paste
that exceeds the
®
demand for both
process yield and
ALPHA
solderability
WS-809
Solder
Paste
product guide

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding 1
SM-888
the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
WS-809 Water-Soluble Solder Paste
Contents

Welcome to the ALPHA® WS-809 Product Guide

TOPIC PAGE

Introduction 3
Performance Summary 4
Print Performance 5-8
Reflow Performance 9-20
Post-Reflow Cosmetics 21-23
Reliability 24
Summary 25-27
Technical Bulletin 28
MSDS 31

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
2
WS-809 Water-Soluble Solder Paste
Introduction
Introduction
Introducing ALPHA® WS-809, ALPHA’s solution to the problems
associated with environmental variability when using water soluble
solder paste.
Cookson considered what you need from a water soluble solder paste –
longer stencil life and superior print volume consistency. In addition, we
addressed the need for high reflow throughput and yield, without
compromising the cleanability of flux residue. That’s why we developed
ALPHA WS-809 Water Soluble Tin/Lead Solder Paste.
ALPHA WS-809 was developed with broad print and reflow process
windows. It offers best in class resistance to exposure to humidity, while
offering residue free results over a broad range of water based cleaning
parameters. And with our local teams of technical experts, you can count
on Cookson’s complete support whenever and however you need us.
It’s the kind of support you would expect from a company that’s
remained dedicated to serving the needs of the electronic assembly
market for over 80 years.

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
3
WS-809 Water-Soluble Solder Paste
Performance Summary
Performance Summary
Process Benefit WS-809 Attributes Performance Capability
Fine Feature Print Excellent print definition and consistent volumetric performance to 16
Print Process Definition mil pitch QFP and 15 mil circles (BGA225)
Window Stencil Life Superior performance at high temperature and humidity.
Tack Life Best in class tack life
Repeatable volume deposition and low volume variability at print
Print Cycle Time Print Speed Range
speeds ranging from 25 to 125 mm/second (1 to 6 inches/second)
Mid Chip Solder Balling Superior pre-cleaning performance versus leading competitors
100% cross print wetting across a spectrum of surface finishes and
Cross Print Wetting
reflow profiles
Best in class solder spread on OSP, ENIG, Immersion Tin and
Solder Spread
Immersion Silver
Reflow Yield
Random Solderballs Best in class even after 4 hour exposure to 75% RH
Meets requirements of IPC 7095 Class lll for low voiding using straight
Resistance to Voids
ramp and soak profiles
Resistance to Hot and
Exceeds the requirements of IPC J-STD-005
Cold Slump
Extremely low ionic contamination and no visible residue at multiple
Post Cleaning Residue
combinations of conveyor speed and wash water temperatures
Cleanability Ability to effectively clean up to 48 hours after reflow. This provides
Cleaning Process Window maximum process flexability and can eliminate a redundant cleaning
step in double-sided reflow

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
4
 WS-809 Water-Soluble Solder Paste
Print Performance
Superior Volumetric Print Performance
ALPHA WS-809 Competitor C
BGA56-12 (12 mil Squares) BGA56-12 (12 mil Squares)
800 800
Theoretical Volume (720 cubic mils) Theoretical Volume (720 cubic mils)
700 700

Volume (Cubic Mils)

600
Volume (Cubic Mils)

600

500 500

Volume
Volume

400 400

300
300
200
200
100
100
0
0 T-0 T-1 T-2 T-3 T-4
T-0 T-1 T-2 T-3 T-4
Time
Time

Time (hours) Time (hours)

Delivers Consistently High Fine Feature Print Yields

Process Parameters:
• Excellent print definition and consistent volumetric performance
• Stencil: 5mil LC
to 0.30mm (12mil) squares under extreme environmental
• Print Speed: 4.9 in/s conditions
• 4 Hour Continuous Print Test @ 80oF, 55% RH on BGA 12 mil
squares

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
5
 WS-809 Water-Soluble Solder Paste
Print Performance
Stencil Life – Paste Volume

15 mil BGA 16 mil Pitch QFP

100 100

Average % Volume Transfer

Average % Volume Transfer

90 90
80 80
70 70
60 60
50 50
40 40
30 30
20 20
68°F, 42% RH 80°F, 60% RH 10 68°F, 42% RH 80°F, 60% RH
10
0 0
1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8
Hours Hours

Repeatable volumes over time support high print yields

• Continuous monitoring of paste volume over time demonstrates
ALPHA WS-809’s consistent printability
• Less than 15% change in average volume over an 8 hour production run
down to 0.38mm (15 mil) BGAs and 0.4mm (16 mil) pitch QFPs
• Providing repeatable volumes over time even at environmental extremes

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
6
 WS-809 Water-Soluble Solder Paste
Print Performance
Tack Life

Initial 16 hrs @ 25% RH 16 hrs @ 50% RH 16 hrs @ 75% RH

2 2 2 2
(g/mm ) (g/mm ) (g/mm ) (g/mm )
ALPHA WS-809 2.21 2.40 1.90 1.90
Competitor C 1.1 1.1 0.8 0.2
Competitor A 1.4 1.2 1.1 0.3

Performance Indicator
Maintains consistent tack strength
over a broad humidity range • High initial tack and low
change in tack over time
IPC Classification when subject to extreme
environmental conditions
• Less than 1 unit change in tack when allow for best-in-class
process flexibility between
tested at a humidity range of 25% - 75% the print and reflow cycles
RH measured over a 8 hour period

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
7
 WS-809 Water-Soluble Solder Paste
Print Performance
Print Consistency Over Range of Print Speeds
QFP120 – 16 mil Pitch BGA36 – 15 mil squares

WS809 Print Consistency Data WS809 Print Consistency Data

QFP120-2 (16 MP QFP deposits, 56.7x9 mils) BGA36 (15 mil Squares)
Theoretical Volume (2552 cubic mils) Print Speed 1200 Print Speed
2500 1 inch/sec
Theoretical Volume (1125 cubic mils)
1 inch/sec
2 inches/sec 2 inches/sec
4 inches/sec 1000 4 inches/sec
6 inches/sec 6 inches/sec
2000
800

1500
Volume

Volume
600

1000
400

500 200

0 0
Board 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 Board 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4
Print Speed 1 inch/sec 2 inches/sec 4 inches/sec 6 inches/sec Print Speed 1 inch/sec 2 inches/sec 4 inches/sec 6 inches/sec

Process Parameter:
Wide print speed capability allows for maximum throughput
• Repeatable volume deposition and low variability • Stencil: 5mil LC
based on theoretical aperture volumes
• Faster print speed reduces print cycle time Performance Indicator
• Ability to consistently print at high speeds reduces probability that • Consistent Transfer
printing is the rate controlling step Efficiency (i.e. flat line) over
a range of print speeds
demonstrates robust printing
process

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
8
 WS-809 Water-Soluble Solder Paste
Reflow Performance
Reflow Profiles Used for Product Testing
Straight Ramp Profiles Tested Reflow Profiles Tested

250 250

200 200

Temp (deg C)
150
Temp (deg C)

150

100 100

1.3°C/sec, 200°C
1.3oC/sec, 200oPeak, 5040
C Peak, secsec
TAL
TAL
0.50.5
°C/sec, 235
oC/sec, °CoCPeak,
235 Peak,120
120sec
secTAL
TAL
183°C
183oC
50 50
145 °CoC
145 Soak,
Soak,220
220°C
oCPeak,
Peak,40
40sec
sec TAL
TAL
160°CoSoak, 235°Co Peak, 120 sec TAL
160 C Soak, 235 C Peak, 120 sec TAL
183°Co
183 C
0 0
0 25 50 75 100 125 150 175 200 225 250 275 300 325 350 375 400 425 450 475 500 0 50 100 150 200 250 300 350 400 450 500
Time (seconds) Time (sec)

Straight Ramp Profiles Soak Profiles

Process Window Characterization

Soak Profile Straight Ramp Profile
Peak Temp 200˚C - 235˚C 200˚C - 235˚C
TAL 40 - 120 sec 40 - 120 sec
Ramp Rate N/A 0.5˚C/sec - 1.3˚C/sec
Soak Temp 145˚C - 160˚C N/A
Recommended Soak Time < 90 sec. N/A

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
9
 WS-809 Water-Soluble Solder Paste
Reflow Performance
Reflow Yield: Mid-Chip Solderball Performance
MCSB: Square 1:1 M CSB: Square 10% Re duction

100
100
90
90

Yield (% Components Pass)

Yield (% components

80 80

70 70
60 60
pass)

50 50
40 ALPHA WS-809 ALPHA WS-809
40
30 Competitor D Competitor D
30
20
20
10
10
0
402 603 805 1206 0
402 603 805 1206
Com ponent Size
Com ponent Size

Excellent mid-chip solderball performance

Test Parameters:
• Outperforms leading competitor for various different • 200˚C Straight Ramp
stencil designs • 0402, 0603, 0805,
1206 component size
- 1:1 pad to aperture ratio
• 5 mil LC Stencil
- 10% aperture area reduction
• 1.3˚C/sec ramp rate,
• Reduced aperture design recommended for smaller TAL=33-50s

components • OSP Pad Finish

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
10
WS-809 Water-Soluble Solder Paste
Reflow Performance
Reflow Yield: Application Note
Mid-Chip Solderballs in the Print Process

Print process parameters that can impact mid-chip solderballs

• Excess solder paste being deposited
– Mask defined pads increase likelihood of mid-chip solder balls because
of increased print volumes
– Ineffective board support (See next page)
– Excessive print pressure
– Aperture size or stencil thickness greater than required
-- Aperture shape can deposit incorrect amount of paste under component termination

• Accuracy of print deposition

– Paste deposited on solder mask can increase mid-chip balls

Printing recommendations to minimize mid-chip solderballs

• Consult with IPC guidelines for board design
• Effective board support
• Sufficient print pressure and effective under stencil wiping program
• Stencil aperture modification (reduced size and/or shape)
• Optimized stencil thickness
• Utilize ALPHA WS-809, engineered to reduce mid-chip balls
• Verify accuracy of fiducial alignment and integrity of stencil
• Scale stencil image to compensate for PWB positional inaccuracies
• Consult with Cookson Standard stencil design guidelines

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
11
WS-809 Water-Soluble Solder Paste
Reflow Performance
Reflow Yield: Application Note
Mid-Chip Solderballs in the Print Process

Effect of board support Close-up of deposits

Paste Stencil

Good Support Consistent Deposits

Poor Support Inconsistent Deposits

Diagram shows how poor board support can lead to inconsistent

deposits and potentially increase mid-chip solderballs.

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
12
WS-809 Water-Soluble Solder Paste
Reflow Performance
Random Solderball Resistance

ALPHA WS-809 Competitor A Competitor D

4 hours @ 75% RH 4 hours @ 75% RH 4 hours @ 75% RH

PASS FAIL FAIL

Excellent Random Solderball Test Results:

• Outperforms the leading competitive products for resistance to
random solderball formation
• Rated Preferred for solderballing per the IPC J-STD-005

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
13
WS-809 Water-Soluble Solder Paste
Reflow Performance
Cross-Print Wetting: Description of Test

Cookson Electronics Cookson Electronics

Spreading Test Cross Print pattern Prior Spreading Test Cross Print pattern
to reflow Post reflow

Excellent spreading characteristics

Performance Indicator
• Spacing between the solder paste stripes range from
0.1mm up to 0.8mm (increasing by 0.1mm increments) • The higher the percentage of
gaps bridged the better the
• Stripes of solder are printed perpendicular to the traces spreading characteristics.
on the board • As the inter-stripe distance
• Upon reflow, the solder melts. between printed paste deposit
increases, spreading becomes
• Since it does not wet to the masked surface between the more difficult
traces, it “pulls back” to the metal and spreads out along
the traces.
• If there is enough solder spread, the gap between the
two adjacent solder spots is bridged.

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
14
WS-809 Water-Soluble Solder Paste
Reflow Performance
Cross-Print Wetting: ALPHA WS-809 Performance
ALPHA WS-809
WS809 Cross Print Wetting Results
Straight Ramp 1.3C/s 220C Peak Re flow Profile

100%
90%

Percentage of gaps bridged

80%
70%
60%
Entek
50%
Imm. Tin
40% Imm. Silver
30% ENIG
20%
10%
0%

0.1mm

0.2mm

0.3mm

0.4mm

0.5mm

0.6mm

0.7mm

0.8mm
Test Parameters: Gap

• All results shown on Entek HT OSP finish

Excellent wetting
Competitor A Competitor C Competitor D performance
• Excellent Copper Wetting across
various pad finishes including
ENIG, Immersion Silver, Immersion
Tin, and OSP-Coated Copper
• Outperforms the Leading
Competitive Products

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
15
WS-809 Water-Soluble Solder Paste
Reflow Performance
Solder Spread

Excellent solder
Solder Spread - % Increase in Deposit Area spread performance
Entek HT - OSP Pad Finish

14%
• Spread was analyzed by
12% measuring the %
10% increase in solder
deposit area after reflow
%Spread

8% Straight Ramp Profile

160C Soak Profile
6% • ALPHA WS-809 exhibits
4% best-in class
2%
performance for solder
spread
0%
C

D
A

B
09

or

or

or

or
-8

tit

tit

tit

tit
S

pe

pe

pe

pe
W

om

om

om

om
C

Straight Ramp Profile 160C Soak Profile

Paste Original Deposit Area
Area After Reflow % Spread Area After Reflow % Spread
WS-809 0.0299 0.0338 13% 0.0319 7%
Competitor A 0.0299 0.0315 5% 0.0299 0%
Competitor B 0.0299 0.0332 11% 0.031 4%
Competitor C 0.0299 0.0316 6% 0.0309 3%
Competitor D 0.0299 0.0326 9% 0.0311 4%

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
16
WS-809 Water-Soluble Solder Paste
Reflow Performance
Solder Spread

WS-809 Competitor A
Excellent solder
spread performance
Straight
Ramp • ALPHA WS-809
Profile outperforms all leading
competitors for solder spread
using various reflow profiles

Process Parameter:
• Entek HT OSP Pad
WS-809 Competitor B Finish

Soak
Profile

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
17
 WS-809 Water-Soluble Solder Paste
Reflow Performance
Voiding Performance

145 C, 60 sec soak, 220 C peak on BGA256 Straight Ramp, 1.3 C/sec, 200 C Peak, 50 sec TAL

100% 100%
80% 80%
% of Joints

OSP

% of Joints
OSP
60% Im Tin 60% Im Tin
40% Im Ag Im Ag
40%
ENIG ENIG
20%
20%
0%
0%
%
ro

%
2%

4%

6%

8%

Zero 0-2% 2-4% 4-6% 6-8% 8- 10- >

Ze

12
2
10
0-

2-

4-

6-

-1
8-

10% 12% 12%

>
10

% of Joint Area % of Joint Area

Voiding - Soak Profile Voiding – Straight Ramp Profile

Process Parameter:
• Stencil: 5 mil LC
Voiding Performance
Performance Indicator
• Excellent Low Voiding Performance on multiple • Ideal result is 100% at
pad finishes “zero voids”
• IPC calls for less than 9%
• Exceeds IPC 7095 Class III requirements void in joint area for Class
III requirements

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
18
WS-809 Water-Soluble Solder Paste
Reflow Performance
Reflow Yield: Application Note
Definition of Voiding Performance

Solder Outline
Void Outlines

Location of Void Class I Class II Class III

Void in Solder 60% of diameter 42% of diameter 30% of diameter

(Solder Sphere) = 36% of Area = 20.25% of Area = 9% of Area
0.1d
Void at interface of
50% of diameter 25% of diameter 20% of diameter
Solder (Sphere) 0.25d
= 25% of Area = 12.25% of Area = 4% of Area
and Substrate

d
Example:
IPC Criteria for Voids in BGAs, IPC 7095 [Link] Total Void Diameter
0.10d +0.25d = 0.35d
The IPC criteria provide three classes of acceptance
for both the solder sphere and the sphere-pad
interface.

Where multiple voids exist, the dimensions will be

added to calculate total voiding in the joint.

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
19
WS-809 Water-Soluble Solder Paste
Reflow Performance
Hot and Cold Slump Performance

Cold Slump Hot Slump

After 10 min @ Room Temp After 10 min @ 150 C
Largest Gap Bridged
Pad Size (mm) 0.33 x 2.03 0.33 x 2.03
25% RH 0.1 0.15
50% RH 0.1 0.15
75% RH 0.1 0.25
IPC max 0.2 0.25
bridge allowed PASS PASS

Meets Hot & Cold Slump Requirements per IPC J-STD-005

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
20
WS-809 Water-Soluble Solder Paste
Post-Reflow Cosmetics
Solder Joint Cosmetics
0402 Resistor – OSP Pad Finish 0805 Resistor – Imm. Ag Pad Finish

Profile: Straight Ramp 1.3°C/sec Profile: 165°C, 60 sec Soak

200°C Peak, 50 sec TAL 235°C Peak, 120 sec TAL

Excellent Solder Joint Cosmetics

• Uniform Shiny Appearance
• Exceeds IPC Workmanship Standards
•Consistent Joint Cosmetics using Soak or Straight Ramp Profiles
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
21
WS-809 Water-Soluble Solder Paste
Post-Reflow Cosmetics
Flux Residue Cosmetics

QFP: Immersion Tin, Straight Ramp BGA36: Immersion Silver, Low Soak

Excellent Residue Cosmetics

• No Visible Post Cleaning Flux Residues (10x magnification)
• Highly Soluble Flux Residue Readily Cleanable in Water

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
22
 WS-809 Water-Soluble Solder Paste
Post-Reflow Cosmetics
Flux Residue Cleanability
Cleanability Matrix - 135° Water at Various Conveyor Speeds

2.0 ft/min 2.5 ft/min 3.0 ft/min 3.5 ft/min 4.0 ft/min 4.5 ft/min 5.0 ft/min

Alpha WS-809 Y Y Y Y Y Y Y
Competitor A Y N N N N N N
Competitor B Y N N N N N N
Competitor C Y N N N N N N

Y Indicates the board passed both visual and ionic contamination acceptance requirements for cleanliness
N Indicates the board failed either visual and/or ionic contamination acceptance requirements for cleanliness

Flux Residue Board Cleanliness Test Method Cleanliness Criteria

States that “no discernable residues from cleanable
• ALPHA WS-809 outperforms all leading Visual Standard
fluxes are allowed”. This includes: white residues on
competitors for flux residue cleanliness PWB surface, white residues on or around solder
IPC-A-610D
terminations and crystalline white deposits on
• Excellent reliability and cosmetics at metallic areas.
States the contamination limit for assemblies tested
higher conveyor speeds, increasing Ionic Cleanliness using the dynamic method of detecting ionic surface
throughput rate Standard contamination (method used with the Ionograph) is
IPC J-STD-001D 10 µg/in2 (1.56 µg/cm2) sodium chloride equivalent
ionic or ionizable flux residue.

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
23
 WS-809 Water-Soluble Solder Paste
Reliability
Electrical Reliability
IPC Surface Insulation Resistance (SIR):
ALPHA WS-809 ALPHA WS-809 Cleanliness and
DI Water Washed Immediately After Reflow DI Water Washed 48 hours After Reflow Electrical Reliability
Sample 1 Day 4 Day 7 Day Sample 1 Day 4 Day 7 Day
a 5.9E+09 6.0E+09 7.9E+09 a 2.6E+08 7.6E+08 1.2E+09 • ALPHA WS-809 can be
1
b 6.1E+09 5.6E+09 2.6E+09
1
b 2.3E+08 8.4E+08 1.3E+09 effectively cleaned up to
c 3.9E+09 3.5E+09 2.5E+09 c 1.5E+08 7.6E+08 1.2E+09
d 6.4E+09 6.3E+09 8.7E+09 d 1.5E+08 9.8E+08 1.0E+09
48 hours after reflow.
a 1.8E+09 1.7E+09 1.6E+09 a 2.0E+08 7.5E+08 1.1E+09
b 2.6E+09 2.4E+09 1.3E+09 b 2.0E+08 8.9E+08 1.3E+09
• This allows maximum
2 2
c 5.7E+09 5.8E+09 4.7E+09 c 3.5E+08 1.0E+09 1.5E+09 process flexibility and
d 4.5E+09 5.4E+09 4.0E+09 d 2.1E+08 7.9E+08 1.2E+09 can eliminate a
a 4.1E+09 4.0E+09 5.2E+09 a 2.1E+08 5.8E+08 8.0E+08
b 3.2E+09 2.3E+09 1.9E+09 b 2.9E+08 8.1E+08 7.8E+08 redundant cleaning
3 3
c 5.9E+09 5.7E+09 3.7E+09 c 3.1E+08 8.4E+08 1.2E+09 step if double-sided
d 5.2E+09 5.7E+09 6.0E+09 d 2.3E+08 6.6E+08 9.3E+08 reflow is used
Arithmetic Mean 4.6E+09 4.5E+09 4.2E+09 Arithmetic Mean 2.3E+08 8.1E+08 1.1E+09
> 1.0E+08 PASS PASS PASS > 1.0E+08 PASS PASS PASS
Bellcore Electromigration
Test Condition SIR (Initial) SIR (Final) Requirement Result Visual Result
ALPHA WS-809 2.5E+09 5.0E+10 SIR (Initial)/SIR (Final) < 10 PASS PASS
Control 2.8E+09 8.9E+10 SIR (Initial)/SIR (Final) < 10 PASS PASS
Bellcore Test Condition (per GR 78-CORE, Issue 1): 65°C/85%RH/500 Hours/10V, measurement @ 100V/IPC B-25
B Pattern (12.5 mil lines, 12.5 mil spacing). All values in ohms.

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
24
WS-809 Water-Soluble Solder Paste
Summary
Delivers excellent print yield and process window
• Consistent print deposit volume
• Fine feature printing after 4 hours stencil life
• Consistent response to 1 hour pause
• Print speeds of 1 to 6 inches per second

Delivers excellent reflow yield and process window

• Best-in-class for Solder Spread and Wetting
– Consistent results under multiple reflow profiles
– Compatible with OSP, ENIG, Immersion Tin and
Immersion Silver Finishes
• Best-in-class resistance to random solder balls
• IPC Class III resistance to voiding

Delivers excellent cleanability and cleaning process window

• Exceeds IPC and Bellcore Cleanliness Standards
• No visible residue post water cleaning (10x magnification)
• Cleanable after exposure to 2 reflow cycles
• Wide cleaning process window
– Water temperatures from 120° F to 160° F (49° C to 70° C)
– Conveyor Speeds from 2 to 5 feet/minute (0.6 – 1.5 meter/minute)
– Can be effectively cleaned up to 48 hours after reflow

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
25
WS-809 Water-Soluble Solder Paste
Summary
Leading Products

No-Clean, SnPb
• ALPHA OM-6106
• ALPHA OM-5200
• ALPHA OM-5100
No-Clean, Lead-Free
• ALPHA OM-338
• ALPHA OM-325
Water-Soluble, SnPb
• ALPHA WS-809
• ALPHA WS-709
• ALPHA WS-609
Water-Soluble, Lead-Free
• ALPHA WS-619

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
26
WS-809 Water-Soluble Solder Paste
Summary

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding
the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
27
 SM-887-1

ALPHA WS-809 WATER SOLUBLE SOLDER PASTE

DESCRIPTION
ALPHA WS-809 is a SnPb, water-soluble solder paste which is designed for a broad range of SMT processes where
aqueous post reflow cleaning is required.

FEATURES & BENEFITS

• Excellent volume transfer efficiency over broad range of environmental conditions
• Fine-pitch printing with consistent shape and volume to 16 mil pitch QFP (63x10x5 mil deposits) and 15 mil circles
(BGA225)
• High throughput and yield with consistent print volumes at print speeds ranging from 1 – 6 inches/second
• Exhibits resistance to slumping and drying at temperature up to 66 – 84°F (19- 29°C) and relative humidity extremes
(35%-65% RH)
• Water cleanable after two paste reflow cycles
• Excellent low voiding performance that exceeds IPC Class III requirement
• Superior solder spread performance on Cu OSP

PRODUCT INFORMATION
Alloys: 63Sn/37Pb, 62Sn/36Pb/2Ag, NT4S
Powder Size: 89.8% Metal, Type 3 (25-45 µm per IPC J-STD-005)
Packaging Sizes: 500 gram jars, 6” and 12” cartridges
Flux Gel: Available in 10cc and 30cc syringes for rework applications.

PRINT CAPABILITY
ALPHA WS-809 is formulated for both standard and fine feature pitch stencil printing, at print speeds between 1”/sec (25
mm/sec) and 6”/sec (150 mm/sec) with stencil thicknesses of 5 mil (0.125 mm) to 6 mil (0.15 mm), particularly when used
in conjunction with ALPHA® Stencils. Blade pressures should be between 1 – 2 lbs/in (0.16 – 0.34 kg/cm), depending on
the print speed. The higher the print speed employed, the higher the blade pressure that is required.

SAFETY
While the ALPHA WS-809 flux system is not considered toxic, its use in typical reflow will generate a small amount of
reaction and decomposition vapors. These vapors should be adequately exhausted from the work area. Consult the MSDS
for additional safety information, and for toxicity data on alloys containing lead and silver.

SHIPPING AND STORAGE

ALPHA WS-809 should be stored refrigerated upon receipt at 32°-46°F (0°-8°C). This will be sufficient to maintain a
nominal shelf life. ALPHA WS-809 should be permitted to reach room temperature before unsealing its package prior to
use. Room temperature storage for sealed containers should not exceed 14 days. The shelf-life of refrigerated ALPHA
WS-809 is 6 months.
(TECHNICAL DATA ON PAGE 2)

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the
accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated.
Rev. 2-9-06
 ALPHA WS-809 TECHNICAL DATA

CATEGORY RESULTS PROCEDURES/REMARKS

CHEMICAL PROPERTIES
Activity Level ORH0 = J-STD Classification IPC J-STD-004A
10 Day Copper Corrosion Pass, (post-cleaning) IPC J-STD-004A
ELECTRICAL PROPERTIES
9 8
SIR (IPC) 1X Reflow 4.2 x 10 ohms Pass, 7 days (>10 = Pass)
9 8
SIR (IPC) 2X Reflow with 48 hr 1.1 x 10 ohms Pass (>10 = Pass)
delayed clean
9 10
Electromigration (Bellcore) Initial: 2.5 X 10 ohms; Final: 5.0 X 10 ohms Pass (Final > Initial/10)
PHYSICAL PROPERTIES
Paste Density 4.4 g/cc typical 63Sn/37Pb alloy
Tack Force vs. Time and Humidity Pass, Change of <1 g/mm2 over 24 hours at 25% and IPC J-STD-005
75% RH
Viscosity 1300 – 2300 poise Malcom Spiral Viscometer; ICP-029 10 rpm
Solderball Preferred IPC J-STD-005
Stencil Life 8 hours @ 30-50% RH, 75-80°F (24-27°C)
Slump Pass IPC J-STD-005
Pass, cold slump after 10 min RH and hot slump
after 10 min at 150°C at 25%, 50%, and 75% RH

ALPHA WS-809 PROCESSING GUIDELINES

STORAGE-HANDLING PRINTING REFLOW (See Figure #1) CLEANING
•Refrigerate to guarantee stability STENCIL: Recommend Cookson • Clean-dry air or nitrogen • ALPHA WS-809 can generate
@ 0-8°C (32-46°F) Electronics Assembly Materials ALPHA atmosphere. foam while being cleaned in
CUT or ALPHA FORM stencils at recirculating systems. Alpha
•Paste can be stored for 2 weeks 0.125mm – 0.150mm (5-6 mil) thick for PROFILE (63/37 alloy): 2007 is the recommended de-
at room temperature up to 77°F 0.4 – 0.5mm (0.016” or 0.020”) pitch. • Straight ramp of 0.5 – 1.3°C/sec foamer
(25°C) prior to use. Stencil design is subject to many process to 200 – 235°C peak, TAL of 40 -
variables. Contact your local Cookson 120 sec, time to peak < 4 • The flux residues from Alpha
•When refrigerated, warm-up Electronics site for advice. minutes is recommended. WS-809 are water cleanable after
paste to room temperature for up two paste reflow cycles
to 4 hours. Paste must be ≥66°F SQUEEGEE: Metal (recommended) • Soak profile of 1.5 – 2.0°C/sec
(19°C) before processing. Verify to 145-160° soak for a max of 90 • Recommended rinse
o
paste temperature with a PRESSURE: 1.0 – 2.0 pounds per inch seconds, peak temperature of temperature 120-160°F (49-70 C)
thermometer to ensure paste is at of squeegee length (0.16 - 0.34 kg/cm). 200-235°C , TAL of 40 - 120 sec,
66°F (19°C) or greater before time to peak < 4 minutes is • No special nozzle
setup. SPEED: 1- 6 inches (25-150 mm) per recommended. configurations
second.
•Maximum Working Range is Start with straight ramp design if • Effective residue cleanability up
35% - 65% RH and 66-84°F (19- PASTE ROLL: 0.4 - 0.6 inches (1-1.5 new oven settings are required. to 48 hours after reflow. This
cm) diameter and make additions when allows maximum process
29°C).
roll reaches 0.2 inch (0.5cm) diameter. Internal testing has shown flexability and can eliminate an
straight ramp profile to be most extra cleaning step in double-
•Do not remove worked paste
APPERTURE DESIGN: ALPHA WS-809 effective for superior joint sided reflow processes
from stencil and mix with unused
may be printed using various aperture cosmetics (shininess).
paste in jar. This will alter the
designs. A 10% reduction is • Ionic contamination levels
rheology of the unused paste.
recommended to optimize wipe passes IPC J-STD 001D
2
frequency when using a stencil > 5mils. requirement (< 10µg/in ) Typical
•These are starting 2
recommendations and all process result is <3 µg/in attained with
OPTIMAL PRINT SETTINGS: 4.9 in/s heated solution tested with an
settings should be reviewed print speed; 1.5 lb/in print pressure; 0.02
independently. Ionograph™.
in/s stencil release. These are the
recommended starting points for process
•6 month refrigerated shelf-life setup.

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the
accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated.
Rev. 2-9-06
 Straight Ramp Profiles Tested

250

200

150
Temp (deg C)

100
1.3oC/sec, 200
1.3°C/sec,
o
200°C Peak,4050sec
C Peak, sec TAL
TAL
o o
0.5 °C/sec, 235C°C
0.5 C/sec, 235 Peak,
Peak, 120120
sec sec
TALTAL
183oC
183°C
50

0
0 25 50 75 100 125 150 175 200 225 250 275 300 325 350 375 400 425 450 475 500
Time (seconds)

Reflow Profiles Tested

250

200

150
Temp (deg C)

100

50
145
145o°C Soak,220
C Soak, 220
o °C Peak, 40 sec TAL
C Peak, 40 sec TAL
160°C Soak, 235°C Peak,
160 C Soak, 235oC Peak,
o
120120
sec sec
TALTAL
183°C
183oC
0
0 50 100 150 200 250 300 350 400 450 500
Time (sec)

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the
accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated.
Rev. 2-9-06