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High Voltage Power Schottky Rectifier

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0% found this document useful (0 votes)
41 views17 pages

High Voltage Power Schottky Rectifier

Uploaded by

belkacemi omar
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd

STPS20150C

High voltage power Schottky rectifier

Datasheet - production data

A1 Features
K
A2  High junction temperature capability
 Good trade off between leakage current and
K forward voltage drop
 Low leakage current
 Avalanche capability specified
 Insulated package: TO-220FPAB
A2 A2  Insulating voltage = 2000 VRMS sine
K K  ECOPACK®2 compliant component for
A1 A1
K
D²PAK on demand
TO-220AB TO-220FPAB
Description
Dual center tap Schottky rectifier designed for
high frequency switch mode power supply.
A2 Table 1: Device summary
K
A1
I2PAK Symbol Value

K IF(AV) 2 x 10 A
K
VRRM 150 V
Tj (max) 175 °C
VF (typ) 0.69 V
A2
A2
A1 A1

D2PAK

August 2015 DocID7756 Rev 10 1/17


This is information on a product in full production. www.st.com
Characteristics STPS20150C

1 Characteristics
Table 2: Absolute ratings (limiting values, per diode, at 25 °C, unless otherwise specified)
Symbol Parameter Value Unit
VRRM Repetitive peak reverse voltage 150 V
IF(RMS) Forward rms current 30 A
TO-220AB,
TC = 155 °C
Average forward D2PAK, I2PAK Per diode 10
IF(AV) current δ = 0.5, A
TO-220FPAB TC = 135 °C
square wave
All types Per device 20
Surge non
IFSM repetitive forward tp = 10 ms sinusoidal 180 A
current
Repetitive peak
PARM tp = 10 µs, Tj = 125 °C 480 W
avalanche power
Tstg Storage temperature range -65 to + 175 °C
(1)
Tj Maximum operating junction temperature + 175 °C

Notes:
(1)
(dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink.

Table 3: Thermal parameter


Symbol Parameter Value Unit
TO-220AB, D2PAK, I2PAK 2.2
Per diode
TO-220FPAB 4.5
Rth(j-c) Junction to case °C/W
2 2
TO-220AB, D PAK, I PAK 1.3
Total
TO-220FPAB 3.5
TO-220AB, D2PAK, I2PAK 0.3
Rth(c) Coupling - °C/W
TO-220FPAB 2.5

When the diodes 1 and 2 are used simultaneously:


ΔTj (diode1) = P(diode1) x Rth(j-c) (per diode) + P(diode2) x Rth(c)

2/17 DocID7756 Rev 10


STPS20150C Characteristics
Table 4: Static electrical characteristics (per diode)
Symbol Parameter Test conditions Min. Typ. Max. Unit
Tj = 25 °C - 5.0 µA
IR(1) Reverse leakage current VR = VRRM
Tj = 125 °C - 5.0 mA
Tj = 25 °C - 0.92
IF = 10 A
Tj = 125 °C - 0.69 0.75
VF(2) Forward voltage drop V
Tj = 25 °C - 1
IF = 20 A
Tj = 125 °C - 0.79 0.86

Notes:
(1)Pulse test: tp = 5 ms, δ < 2%
(2)Pulse
test: tp = 380 µs, δ < 2%

To evaluate the conduction losses use the following equation:


P = 0.64 x IF(AV) + 0.011 IF2(RMS)

DocID7756 Rev 10 3/17


Characteristics STPS20150C
1.1 Characteristics (curves)
Figure 1: Average forward power dissipation Figure 2: Average forward current versus ambient
versus average forward current (per diode) temperature (δ = 0.5, per diode)
IF(AV) (A)
PF(AV)(W)
12
10
δ = 0.1 δ = 0.2 δ = 0.5 11
2 2
R th(j-a )=R th(j-c) (TO-220A B, I PAK and D PAK)
9 δ = 0.05
10
8
9 R th(j-a )=R th(j-c) (TO-220F PAB)
7 8
δ= 1
6 7
5 6 R th(j-a) =15°C/W

4 5
4
3
T T
3
2
2
1
IF(AV)(A) δ=tp/T tp 1 δ=tp/T tp
T amb (°C)
0
0
0 1 2 3 4 5 6 7 8 9 10 11 12
0 25 50 75 100 125 150 175

Figure 4: Relative variation of thermal impedance


Figure 3: Normalized avalanche power derating
junction to case versus pulse duration (TO-220AB,
versus pulse duration (Tj = 125 °C)
D²PAK, I²PAK)
PARM(t p )
PARM(10 µs) Zth(j-c) /Rth(j-c)
1 1.0

0.9

0.8

0.1 0.7
δ = 0.5
0.6

0.5

0.01 0.4 δ = 0.2

0.3 δ = 0.1
T
0.2
t p (µs) Single pulse
0.1
0.001 t p(s) δ=tp/T tp
1 10 100 1000 0.0
1.E-0 3 1.E-0 2 1.E-0 1 1.E+00

Figure 5: Relative variation of thermal impedance Figure 6: Reverse leakage current versus reverse
junction to case versus pulse duration voltage applied (typical values, per diode)
(TO-220FPAB)
Z th(j-c ) /Rth(j-c)
IR (µA)
1.0
1E+5
0.9 T j=175°C

0.8 1E+4
T j=150°C
0.7
1E+3 T j=125°C
0.6 δ = 0.5

0.5 1E+2

0.4 T j=100°C

δ = 0.2 1E+1
0.3
T
δ = 0.1
0.2 1E+0 T j=25°C

0.1 t p(s) δ=tp/T tp VR (V)


Single pulse
1E-1
0.0 0 25 50 75 100 125 150
1.E-0 3 1.E-0 2 1.E-0 1 1.E+0 0 1.E+01

4/17 DocID7756 Rev 10


STPS20150C Characteristics
Figure 7: Junction capacitance versus reverse Figure 8: Forward voltage drop versus forward
voltage applied (typical values, per diode) current (per diode)

C(pF)
1000
F=1MHz
T j=25°C

100

V R (V)
10
1 2 5 10 20 50 100 200

Figure 9: Thermal resistance junction to ambient versus copper surface under tab for D²PAK
(typical values)
Rth(j-a) (°C/W)
80
D²PAK
70

60

50

40

30

20
Epoxy printed board FR4, e CU= 35 µm
10

0
0 5 10 15 20 25 30 35 40
SCu(cm²)

DocID7756 Rev 10 5/17


Package information STPS20150C

2 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK ®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
 Cooling method: by conduction (C)
 Epoxy meets UL 94,V0
 Recommended torque value: 0.55 N·m (for TO-220AB and TO-220FPAB)
 Maximum torque value: 0.7 N·m (for TO-220AB and TO-220FPAB)

6/17 DocID7756 Rev 10


STPS20150C Package information
2.1 D²PAK package information
Figure 10: D²PAK package outline

This package drawing may slightly differ from the physical package. However, all
the specified dimensions are guaranteed.

DocID7756 Rev 10 7/17


Package information STPS20150C
Table 5: D²PAK package mechanical data
Dimensions
Ref. Millimeters Inches
Min. Max. Min. Max.
A 4.36 4.60 0.172 0.181
A1 0.00 0.25 0.000 0.010
b 0.70 0.93 0.028 0.037
b2 1.14 1.70 0.045 0.067
c 0.38 0.69 0.015 0.027
c2 1.19 1.36 0.047 0.053
D 8.60 9.35 0.339 0.368
D1 6.90 8.00 0.272 0.311
D2 1.10 1.50 0.043 0.060
E 10.00 10.55 0.394 0.415
E1 8.10 8.90 0.319 0.346
E2 6.85 7.25 0.266 0.282
e 2.54 typ. 0.100
e1 4.88 5.28 0.190 0.205
H 15.00 15.85 0.591 0.624
J1 2.49 2.90 0.097 0.112
L 1.90 2.79 0.075 0.110
L1 1.27 1.65 0.049 0.065
L2 1.30 1.78 0.050 0.070
R 0.4 typ. 0.015
V2 0° 8° 0° 8°

8/17 DocID7756 Rev 10


STPS20150C Package information
Figure 11: D²PAK recommended footprint (dimensions in mm)

DocID7756 Rev 10 9/17


Package information STPS20150C
2.2 I²PAK package information
Figure 12: I²PAK package outline

10/17 DocID7756 Rev 10


STPS20150C Package information
Table 6: I²PAK package mechanical data
Dimensions
Ref. Millimeters Inches
Min. Max. Min. Max.
A 4.40 4.60 0.173 0.181
A1 2.40 2.72 0.094 0.107
b 0.61 0.88 0.024 0.035
b1 1.14 1.70 0.044 0.067
F 0.75 1.0 0.03 0.039
F1 1.15 1.70 0.045 0.067
F2 1.15 1.70 0.045 0.067
G 4.95 5.20 0.195 0.205
G1 2.40 2.70 0.094 0.106
H 10.00 10.40 0.393 0.409
L2 16.00 typ. 0.63 typ.
L3 28.60 30.60 1.126 1.205
L4 9.80 10.6 0.386 0.417
L5 2.90 3.60 0.114 0.142
L6 15.90 16.40 0.626 0.646
L7 9.00 9.30 0.354 0.366
Dia 3.0 3.20 0.118 0.126

Mounting (soldering) the I2PAK metal slug (heatsink) with alloy, like a surface mount
device, IS NOT PERMITTED. A standard through-hole mounting is mandatory.

DocID7756 Rev 10 11/17


Package information STPS20150C
2.3 TO-220AB package information
Figure 13: TO-220AB package outline

H2 A

Dia C

L5
L7

L6

L2
F2

F1 L9 D

L4
F

M
G1 E

12/17 DocID7756 Rev 10


STPS20150C Package information
Table 7: TO-220AB package mechanical data
Dimensions
Ref. Millimeters Inches
Min. Max. Min. Max.
A 4.40 4.60 0.173 0.181
C 1.23 1.32 0.048 0.051
D 2.40 2.72 0.094 0.107
E 0.49 0.70 0.019 0.027
F 0.61 0.88 0.024 0.034
F1 1.14 1.70 0.044 0.066
F2 1.14 1.70 0.044 0.066
G 4.95 5.15 0.194 0.202
G1 2.40 2.70 0.094 0.106
H2 10.00 10.40 0.393 0.409
L2 16.40 typ. 0.645 typ.
L4 13.00 14.00 0.511 0.551
L5 2.65 2.95 0.104 0.116
L6 15.25 15.75 0.600 0.620
L7 6.20 6.60 0.244 0.259
L9 3.50 3.93 0.137 0.154
M 2.6 typ. 0.102 typ.
Diam 3.75 3.85 0.147 0.151

DocID7756 Rev 10 13/17


Package information STPS20150C
2.4 TO-220FPAB package information
Figure 14: TO-220FPAB package outline

A
H B

Dia

L6

L2 L7

L3

L5

D
F1
L4 F2

F E
G1

14/17 DocID7756 Rev 10


STPS20150C Package information
Table 8: TO-220FPAB package mechanical data
Dimensions
Ref. Millimeters Inches
Min. Max. Min. Max.
A 4.40 4.60 0.173 0.181
B 2.5 2.7 0.098 0.106
D 2.50 2.75 0.098 0.108
E 0.45 0.70 0.018 0.027
F 0.75 1.0 0.03 0.039
F1 1.15 1.70 0.045 0.067
F2 1.15 1.70 0.045 0.067
G 4.95 5.20 0.195 0.205
G1 2.40 2.70 0.094 0.106
H 10.00 10.40 0.393 0.409
L2 16.00 typ. 0.63 typ.
L3 28.60 30.60 1.126 1.205
L4 9.80 10.6 0.386 0.417
L5 2.90 3.60 0.114 0.142
L6 15.90 16.40 0.626 0.646
L7 9.00 9.30 0.354 0.366
Dia 3.0 3.20 0.118 0.126

DocID7756 Rev 10 15/17


Ordering information STPS20150C

3 Ordering information
Table 9: Ordering information
Order code Marking Package Weight Base qty Delivery mode
STPS20150CT STPS20150CT TO-220AB 1.95g 50 Tube
STPS20150CFP STPS20150CFP TO-220FPAB 1.9g 50 Tube
STPS20150CR STPS20150CR I2PAK 1.5g 50 Tube
STPS20150CG-TR STPS20150CG D2PAK 1.38g 1000 Tape and reel
2
STPS20150CG STPS20150CG D PAK 1.38g 50 Tube

4 Revision history
Table 10: Document revision history
Date Revision Changes
Jul-2003 6D Last update
Reformatted to current standard. Added ECOPACK statement.
31-May-2006 7
Changed nF to pF in Figure 10.
07-Mar-2007 8 Reworked footnote to Table 1. Corrected typing error in Table 3.
28-Jan-2011 9 Updated weight in Table 9. Added warning paragraph above Table 6.
Updated features, Table 1: "Device summary" and packages
silhouette in cover page.
24-Aug-2015 10 Updated Section 1: "Characteristics" and Section 1.1: "Characteristics
(curves)"
Updated Section 2.2: "D²PAK package information".

16/17 DocID7756 Rev 10


STPS20150C

IMPORTANT NOTICE – PLEASE READ CAREFULLY

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and
improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST
products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order
acknowledgement.

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the
design of Purchasers’ products.

No license, express or implied, to any intellectual property right is granted by ST herein.

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.

ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.

Information in this document supersedes and replaces information previously supplied in any prior versions of this document.

© 2015 STMicroelectronics – All rights reserved

DocID7756 Rev 10 17/17

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