High Voltage Power Schottky Rectifier
High Voltage Power Schottky Rectifier
A1 Features
K
A2 High junction temperature capability
Good trade off between leakage current and
K forward voltage drop
Low leakage current
Avalanche capability specified
Insulated package: TO-220FPAB
A2 A2 Insulating voltage = 2000 VRMS sine
K K ECOPACK®2 compliant component for
A1 A1
K
D²PAK on demand
TO-220AB TO-220FPAB
Description
Dual center tap Schottky rectifier designed for
high frequency switch mode power supply.
A2 Table 1: Device summary
K
A1
I2PAK Symbol Value
K IF(AV) 2 x 10 A
K
VRRM 150 V
Tj (max) 175 °C
VF (typ) 0.69 V
A2
A2
A1 A1
D2PAK
1 Characteristics
Table 2: Absolute ratings (limiting values, per diode, at 25 °C, unless otherwise specified)
Symbol Parameter Value Unit
VRRM Repetitive peak reverse voltage 150 V
IF(RMS) Forward rms current 30 A
TO-220AB,
TC = 155 °C
Average forward D2PAK, I2PAK Per diode 10
IF(AV) current δ = 0.5, A
TO-220FPAB TC = 135 °C
square wave
All types Per device 20
Surge non
IFSM repetitive forward tp = 10 ms sinusoidal 180 A
current
Repetitive peak
PARM tp = 10 µs, Tj = 125 °C 480 W
avalanche power
Tstg Storage temperature range -65 to + 175 °C
(1)
Tj Maximum operating junction temperature + 175 °C
Notes:
(1)
(dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink.
Notes:
(1)Pulse test: tp = 5 ms, δ < 2%
(2)Pulse
test: tp = 380 µs, δ < 2%
4 5
4
3
T T
3
2
2
1
IF(AV)(A) δ=tp/T tp 1 δ=tp/T tp
T amb (°C)
0
0
0 1 2 3 4 5 6 7 8 9 10 11 12
0 25 50 75 100 125 150 175
0.9
0.8
0.1 0.7
δ = 0.5
0.6
0.5
0.3 δ = 0.1
T
0.2
t p (µs) Single pulse
0.1
0.001 t p(s) δ=tp/T tp
1 10 100 1000 0.0
1.E-0 3 1.E-0 2 1.E-0 1 1.E+00
Figure 5: Relative variation of thermal impedance Figure 6: Reverse leakage current versus reverse
junction to case versus pulse duration voltage applied (typical values, per diode)
(TO-220FPAB)
Z th(j-c ) /Rth(j-c)
IR (µA)
1.0
1E+5
0.9 T j=175°C
0.8 1E+4
T j=150°C
0.7
1E+3 T j=125°C
0.6 δ = 0.5
0.5 1E+2
0.4 T j=100°C
δ = 0.2 1E+1
0.3
T
δ = 0.1
0.2 1E+0 T j=25°C
C(pF)
1000
F=1MHz
T j=25°C
100
V R (V)
10
1 2 5 10 20 50 100 200
Figure 9: Thermal resistance junction to ambient versus copper surface under tab for D²PAK
(typical values)
Rth(j-a) (°C/W)
80
D²PAK
70
60
50
40
30
20
Epoxy printed board FR4, e CU= 35 µm
10
0
0 5 10 15 20 25 30 35 40
SCu(cm²)
2 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK ®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Cooling method: by conduction (C)
Epoxy meets UL 94,V0
Recommended torque value: 0.55 N·m (for TO-220AB and TO-220FPAB)
Maximum torque value: 0.7 N·m (for TO-220AB and TO-220FPAB)
This package drawing may slightly differ from the physical package. However, all
the specified dimensions are guaranteed.
Mounting (soldering) the I2PAK metal slug (heatsink) with alloy, like a surface mount
device, IS NOT PERMITTED. A standard through-hole mounting is mandatory.
H2 A
Dia C
L5
L7
L6
L2
F2
F1 L9 D
L4
F
M
G1 E
A
H B
Dia
L6
L2 L7
L3
L5
D
F1
L4 F2
F E
G1
3 Ordering information
Table 9: Ordering information
Order code Marking Package Weight Base qty Delivery mode
STPS20150CT STPS20150CT TO-220AB 1.95g 50 Tube
STPS20150CFP STPS20150CFP TO-220FPAB 1.9g 50 Tube
STPS20150CR STPS20150CR I2PAK 1.5g 50 Tube
STPS20150CG-TR STPS20150CG D2PAK 1.38g 1000 Tape and reel
2
STPS20150CG STPS20150CG D PAK 1.38g 50 Tube
4 Revision history
Table 10: Document revision history
Date Revision Changes
Jul-2003 6D Last update
Reformatted to current standard. Added ECOPACK statement.
31-May-2006 7
Changed nF to pF in Figure 10.
07-Mar-2007 8 Reworked footnote to Table 1. Corrected typing error in Table 3.
28-Jan-2011 9 Updated weight in Table 9. Added warning paragraph above Table 6.
Updated features, Table 1: "Device summary" and packages
silhouette in cover page.
24-Aug-2015 10 Updated Section 1: "Characteristics" and Section 1.1: "Characteristics
(curves)"
Updated Section 2.2: "D²PAK package information".
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and
improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST
products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order
acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the
design of Purchasers’ products.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.