FusionServer 1288H V7 Server

Technical White Paper

Issue 02
Date 2023-05-25

xFusion Digital Technologies Co., Ltd.

Copyright © xFusion Digital Technologies Co., Ltd. 2023. All rights reserved.
No part of this document may be reproduced or transmitted in any form or by any means without prior written
consent of xFusion Digital Technologies Co., Ltd.

Trademarks and Permissions

and other xFusion trademarks are trademarks of xFusion Digital Technologies Co., Ltd.
All other trademarks and trade names mentioned in this document are the property of their respective
holders.

Notice
In this document, "xFusion" is used to refer to "xFusion Digital Technologies Co., Ltd." for concise description
and easy understanding, which does not mean that "xFusion" may have any other meaning. Any "xFusion"
mentioned or described hereof may not be understood as any meaning other than "xFusion Digital
Technologies Co., Ltd.", and xFusion Digital Technologies Co., Ltd. shall not bear any liability resulting from
the use of "xFusion".

The purchased products, services and features are stipulated by the contract made between xFusion and
the customer. All or part of the products, services and features described in this document may not be within
the purchase scope or the usage scope. Unless otherwise specified in the contract, all statements,
information, and recommendations in this document are provided "AS IS" without warranties, guarantees or
representations of any kind, either express or implied.

The information in this document is subject to change without notice. Every effort has been made in the
preparation of this document to ensure accuracy of the contents, but all statements, information, and
recommendations in this document do not constitute a warranty of any kind, express or implied.

xFusion Digital Technologies Co., Ltd.

Address: 9th Floor, Building 1, Zensun Boya Square, Longzihu Wisdom Island
Zhengdong New District 450046
Zhengzhou, Henan Province
People's Republic of China

Website: https://www.xfusion.com

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FusionServer 1288H V7 Server
Technical White Paper About This Document

About This Document

Purpose
This document describes the appearance, features, performance parameters, and
hardware and software compatibility of FusionServer 1288H V7, so that users can
have an in-depth and detailed understanding of FusionServer 1288H V7.

Intended Audience
This document is intended for pre-sales engineers.

Symbolic Conventions
The symbols that may be found in this document are defined as follows:

Symbol Description

Indicates a hazard with a high level of risk which, if not

avoided, could result in death or serious injury.

Indicates a hazard with a medium risk which, if not

avoided, could result in death or serious injury.

Indicates a low-level hazard which, if not avoided, could

result in minor or moderate injury.

Indicates a potentially hazardous situation which, if not

avoided, could result in device damage, data loss, device
performance degradation, or other unpredictable results.
NOTICE is used to address practices not related to
personal injury.

Supplements the important information in the main text.

NOTE is used to address information not related to
personal injury, equipment damage, and environment
deterioration.

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FusionServer 1288H V7 Server
Technical White Paper About This Document

Change History
Issue Release Date Change Description

02 2023-05-25 Added 10 x 2.5" drive pass-through configuration

3 and 10 x 2.5" drive NVMe configuration.

01 2023-01-13 This issue is the first official release.

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FusionServer 1288H V7 Server
Technical White Paper Contents

Contents

About This Document.........................................................................................................ii

1 Overview........................................................................................................................... 1
2 Product Features............................................................................................................. 2
3 Physical Structure........................................................................................................... 5
4 Logic Structure................................................................................................................ 7
5 Hardware Description......................................................................................................9
5.1 Front Panel.................................................................................................................................................. 9
5.1.1 Appearance...............................................................................................................................................9
5.1.2 Indicators and Buttons............................................................................................................................ 10
5.1.3 Ports........................................................................................................................................................14
5.2 Rear Panel.................................................................................................................................................16
5.2.1 Appearance.............................................................................................................................................17
5.2.2 Indicators and Buttons............................................................................................................................ 17
5.2.3 Ports........................................................................................................................................................19
5.3 Processors.................................................................................................................................................20
5.4 Memory......................................................................................................................................................21
5.4.1 DDR5 Memory........................................................................................................................................ 21
5.4.1.1 Memory Identifier................................................................................................................................. 21
5.4.1.2 Memory Subsystem Architecture......................................................................................................... 23
5.4.1.3 Memory Compatibility.......................................................................................................................... 24
5.4.1.4 DIMM Installation Rules.......................................................................................................................25
5.4.1.5 Positions of the Memory Modules........................................................................................................26
5.4.1.6 Memory Protection Technologies.........................................................................................................29
5.5 Storage...................................................................................................................................................... 29
5.5.1 Drive Configuration and Drive Numbering.............................................................................................. 29
5.5.1.1 4 x 3.5" Drive Pass-Through Configuration......................................................................................... 29
5.5.1.2 8 x 2.5" Drive Pass-Through Configuration......................................................................................... 31
5.5.1.3 10 x 2.5" Drive Pass-Through Configuration....................................................................................... 33
5.5.1.4 10 x 2.5" Drive NVMe Configuration.................................................................................................... 37
5.5.2 Drive Indicators.......................................................................................................................................38
5.5.3 RAID Controller Card..............................................................................................................................40

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Technical White Paper Contents

5.6 Network......................................................................................................................................................40
5.6.1 OCP 3.0 NICs......................................................................................................................................... 41
5.7 I/O Expansion............................................................................................................................................ 41
5.7.1 PCIe Card............................................................................................................................................... 41
5.7.2 PCIe Slots...............................................................................................................................................41
5.7.3 PCIe Slot Description..............................................................................................................................42
5.8 PSUs..........................................................................................................................................................44
5.9 Fan Module................................................................................................................................................45
5.10 Board....................................................................................................................................................... 45
5.10.1 Mainboard.............................................................................................................................................46
5.10.2 Drive Backplane....................................................................................................................................48
5.10.3 Fan Board............................................................................................................................................. 51

6 Specifications.................................................................................................................53
6.1 Technical Specifications.............................................................................................................................53
6.2 Environmental Specifications.....................................................................................................................57
6.3 Physical Specifications.............................................................................................................................. 59

7 Software and Hardware Compatibility......................................................................... 61

8 Safety Instructions.........................................................................................................62
8.1 Security......................................................................................................................................................62
8.2 Maintenance and Warranty........................................................................................................................65

9 System Management..................................................................................................... 67
10 Certifications................................................................................................................ 69
A Appendix........................................................................................................................ 71
A.1 Chassis Label Information.........................................................................................................................71
A.1.1 Chassis Head Label............................................................................................................................... 71
A.1.1.1 Nameplate........................................................................................................................................... 72
A.1.1.2 Certificate............................................................................................................................................ 72
A.1.1.3 Quick Access Label.............................................................................................................................74
A.1.2 Chassis Internal Label............................................................................................................................75
A.1.3 Chassis Tail Label...................................................................................................................................75
A.2 Product SN................................................................................................................................................ 75
A.3 Operating Temperature Limitations........................................................................................................... 77
A.4 Nameplate................................................................................................................................................. 82
A.5 RAS Features............................................................................................................................................82
A.6 Sensor List.................................................................................................................................................82

B Glossary......................................................................................................................... 89
B.1 A-E.............................................................................................................................................................89
B.2 F-J............................................................................................................................................................. 90
B.3 K-O............................................................................................................................................................ 90
B.4 P-T.............................................................................................................................................................90

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Technical White Paper Contents

B.5 U-Z.............................................................................................................................................................91

C Acronyms and Abbreviations...................................................................................... 92

C.1 A-E............................................................................................................................................................ 92
C.2 F-J............................................................................................................................................................. 93
C.3 K-O............................................................................................................................................................94
C.4 P-T.............................................................................................................................................................95
C.5 U-Z............................................................................................................................................................ 97

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FusionServer 1288H V7 Server
Technical White Paper 1 Overview

1 Overview

FusionServer 1288H V7 (1288H V7) is a new-generation 1U 2-socket rack server

designed for the Internet, Internet Data Center (IDC), cloud computing, enterprise
business, and telecom.
The 1288H V7 server is ideal for IT core services, cloud computing, virtualization,
high-performance computing, distributed storage, big data processing, enterprise or
telecom applications, and other complex workloads.
The 1288H V7 features low power consumption, high scalability, high reliability, and
easy management and deployment.

NO TE

For details about the 1288H V 7 nameplate, see A.4 Nameplate.

Figure 1-1 1288H V7 with 8 x 2.5" drives (example)

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FusionServer 1288H V7 Server
Technical White Paper 2 Product Features

2 Product Features

Performance
● Powered by the new generation of Intel® Xeon® Scalable processors (Sapphire
Rapids), the server provides up to 60 cores and 120 threads, up to 350 W TDP
per processor, a maximum of 4.1 GHz turbo frequency, 2 MB L2 cache and
1.875 MB L3 cache per core, and four groups of 16 GT/s UPI interconnect links
between the processors, which deliver supreme processing performance.
● The server supports a maximum of 32 DDR5 4800 MT/s registered dual-inline
memory modules (RDIMMs), delivering up to 8192 GB total memory capacity
(calculated using the maximum capacity of a single memory module: 256 GB).
The memory modules feature high speed and availability.

Scalability
● Flexible drive configurations cater to a variety of business requirements and
ensure high elasticity and scalability of storage resources.
● Up to 4 x 3.5" or 10 x 2.5" front drives, and 2 x 2.5" rear drives.
● A maximum of 10 x 2.5" NVMe U.2 drives, improving storage density and I/O
performance.
● The server supports a maximum of three standard PCIe x16 slots, one of which
supports PCIe 5.0.
● Supports two GE/10GE/25GE/100GE OCP 3.0 NICs with PCIe 4.0 x16
bandwidth and orderly hot swap.
NO TE

The hot swap of the OCP NIC depends on the OS driver. Ensure that the system enters
the OS state and the OCP hot swap-related drivers have been loaded.

Availability and Serviceability

● Carrier-class components with process expertise ensure high system reliability
and availability.
● The server uses hot-swappable SAS/SATA drives. SAS/SATA drives support
RAID 0, 1, 1E, 10, 5, 50, 6, and 60, depending on the RAID controller card used.
It also uses a supercapacitor to protect the RAID cache data against power
failures.

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FusionServer 1288H V7 Server
Technical White Paper 2 Product Features

● The panel provides a UID/Healthy LED indicator and a fault diagnosis LED. The
iBMC Web management interface provides key component status. The iBMC
web management interface helps technical personnel quickly find faulty
components or the components with risk of faults, simplifying maintenance,
speeding up troubleshooting, and improving system availability.
● The panel provides the iBMC direct connect management port to support local
iBMC O&M, improving O&M efficiency.
● A server provides two hot-swappable PSUs in 1+1 redundancy mode and eight
hot-swappable fan modules in N+1 redundancy mode, improving system
availability.
● The onboard Intelligent Baseboard Management Controller (iBMC) can
continuously monitor system parameters, trigger alarms, and take recovery
measures to minimize shutdown.
● For the warranty information in China, see Warranty.

Manageability and Security

● The built-in iBMC monitors server operating status and provides remote
management.
● Supports BIOS menu passwords to ensure the security of system startup and
system management.
● Supports the Network Controller Sideband Interface (NC-SI) feature that allows
a network port to provide functions of both a management network port and a
service network port. The NC-SI feature can be enabled or disabled through the
iBMC or BIOS. The NC-SI feature is disabled by default.
NO TE

The service network port of the NC-SI feature supports the following configurations:
● It can be bound to any network port of the server's OCP 3.0 NIC or other standard
PCIe NICs that support the NC-SI function.
● It allows users to enable or disable the virtual local area network ID (VLAN ID) and
configure the VLAN ID. The VLAN ID is 0 and disabled by default.
● It supports IPv4 and IPv6 addresses, and allows users to configure the IP address,
subnet mask, default gateway, or prefix length of an IPv6 address.
● The integrated Unified Extensible Firmware Interface (UEFI) improves setup,
configuration, and update efficiency and simplifies fault clearance.
● Supports the lockable server front bezel to ensure local data security.
● Supports chassis cover opening detection to enhance physical security.
● Intel Execute Disable Bit (EDB) function prevents certain types of malicious
buffer overflow attacks when working with a supported OS.
● Intel® Trusted Execution Technology defends against malicious software attacks
based on hardware, prevents the firmware on the device from being maliciously
modified, and prevents unauthorized boot block execution.
● Intel® Software Guard Extensions (SGX) technology allows applications to run in
their own independent space without being affected by other software running in
the system, thereby enhancing security.
● Supports secure boot based on the chip-level Root of Trust (RoT) and provides
the level-by-level verification function starting from the hardware trusted root,
building a complete secure boot chain.

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FusionServer 1288H V7 Server
Technical White Paper 2 Product Features

● Supports the trusted platform module (TPM) and trusted password module
(TCM) to provide advanced encryption functions, such as digital signature and
remote authentication.
● Meets the following requirements in NIST SP 800-147B:
– The BIOS firmware digital signature update mechanism is supported. During
the upgrade, the digital signature is verified to prevent unauthorized BIOS
firmware upgrade.
– The flash security protection mechanism is supported to prevent
unauthorized modification of the flash in the OS.

Energy Efficiency
● Provides 80 PLUS Platinum/Titanium PSUs with different energy efficiency
levels. The efficiency of the PSUs reaches 96% when the load is 50%.
● Supports active/standby power supply and high-voltage DC power supply to
improve the efficiency of the power supply system.
● Efficient Voltage Regulator Down (VRD) power supplies for boards minimize the
energy loss from DC/DC power conversion.
● Area-based Proportional-Integral-Derivative (PID) intelligent fan speed
adjustment and intelligent CPU frequency scaling optimize heat dissipation and
reduce overall system power consumption.
● The improved thermal design with energy-efficient fans ensures optimal heat
dissipation and reduces system power consumption.
● The server is protected with power capping and power control measures.
● Staggered spinup of drives reduces the server boot power consumption.

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FusionServer 1288H V7 Server
Technical White Paper 3 Physical Structure

3 Physical Structure

Figure 3-1 Physical structure of a server with 8 x 2.5" drives (example)

1 I/O module 1 2 I/O module 2

3 PSU 4 Chassis

5 Air duct 6 Intrusion sensor

7 Front-drive backplane 8 Front drives

9 Indicator board module 10 Fan modules

11 Fan module bracket 12 Cable management arm

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FusionServer 1288H V7 Server
Technical White Paper 3 Physical Structure

13 Fan board 14 Processor heat sinks

15 Processors 16 Mainboard

17 Memory modules 18 TPM/TCM

19 OCP 3.0 NICs 20 BMC card

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FusionServer 1288H V7 Server
Technical White Paper 4 Logic Structure

4 Logic Structure

Figure 4-1 Logic structure

● The server supports one or two new-generation Intel® Xeon® Scalable

processors (Sapphire Rapids). It supports 32 DDR5 DIMMs. The processors
interconnect with each other through four UltraPath Interconnect (UPI) links at a
speed of up to 16 GT/s.
● The PCIe bus resources of the processor are connected to the PCIe riser card
through PCBs or cables. Different PCIe riser cards support PCIe slots of different
specifications. CPU 1 and CPU 2 each support one OCP 3.0 NIC. The PCIe slot
bandwidth is scalable to x16.

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FusionServer 1288H V7 Server
Technical White Paper 4 Logic Structure

● The BMC management chip integrated on the mainboard supports ports such as
a video graphic array (VGA) port, a management network port, and a serial port.

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FusionServer 1288H V7 Server
Technical White Paper 5 Hardware Description

5 Hardware Description

5.1 Front Panel

5.2 Rear Panel
5.3 Processors
5.4 Memory
5.5 Storage
5.6 Network
5.7 I/O Expansion
5.8 PSUs
5.9 Fan Module
5.10 Board

5.1 Front Panel

5.1.1 Appearance
● 4 x 3.5" drive configuration

Figure 5-1 Front view

1 Drive 2 Slide-out label plate (with

an SN label)

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FusionServer 1288H V7 Server
Technical White Paper 5 Hardware Description

● 8 x 2.5" drive configuration

Figure 5-2 Front view

1 Drive 2 Slide-out label plate (with

an SN label)

● 10 x 2.5" drive configuration

Figure 5-3 Front view

1 Drive 2 Slide-out label plate (with

an SN label)

5.1.2 Indicators and Buttons

Indicator and Button Positions

● 4 x 3.5" drive configuration

Figure 5-4 Indicators and buttons on the front panel

1 Fault diagnosis LED 2 Health status indicator

3 FlexIO card 1 presence 4 FlexIO card 2 presence

indicator indicator

5 Power button/indicator 6 UID button/indicator

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FusionServer 1288H V7 Server
Technical White Paper 5 Hardware Description

7 iBMC direct connect - -

management port
indicator

● 8 x 2.5" drive configuration

Figure 5-5 Indicators and buttons on the front panel

1 Fault diagnosis LED 2 Health status indicator

3 FlexIO card 1 presence 4 FlexIO card 2 presence

indicator indicator

5 UID button/indicator 6 iBMC direct connect

management port
indicator

7 Power button/indicator - -

● 10 x 2.5" drive configuration

Figure 5-6 Indicators and buttons on the front panel

1 Fault diagnosis LED 2 Health status indicator

3 FlexIO card 1 presence 4 FlexIO card 2 presence

indicator indicator

5 UID button/indicator 6 iBMC direct connect

management port
indicator

7 Power button/indicator - -

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FusionServer 1288H V7 Server
Technical White Paper 5 Hardware Description

Indicator and Button Descriptions

Table 5-1 Description of indicators and buttons on the front panel

Sign Indicator and Description
Button

Fault ● ---: The device is operating properly.

diagnosis LED ● Error code: A component is faulty.
For details about error codes, see the
FusionServer Rack Server iBMC Alarm
Handling.

Health status ● Off: The device is powered off or faulty.

indicator ● Blinking red at 1 Hz: A major alarm has been
generated on the system.
● Blinking red at 5 Hz: A critical alarm has been
generated on the system.
● Steady green: The device is operating
properly.

FlexIO card Indicates whether the FlexIO card is detected.

presence ● Off: The FlexIO card is not detected.
indicator
● Blinking green at 0.5 Hz: The FlexIO card is
detected but is not powered on.
● Blinking green at 2 Hz: The FlexIO card is
detected and has just been inserted.
● Steady green: The FlexIO card is detected
and the power supply is normal.

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FusionServer 1288H V7 Server
Technical White Paper 5 Hardware Description

Sign Indicator and Description

Button

Power button/ Power indicator:

indicator ● Off: The device is powered off.
● Steady green: The device is powered on.
● Blinking yellow: The iBMC is starting. The
power button is locked and cannot be
pressed. The iBMC is started in about 1
minute, and then the power indicator is
steady yellow.
● Steady yellow: The device is in the standby
state.
Power button:
● When the device is powered on, you can
press this button to gracefully shut down the
OS.
NOTE
For different OSs, you may need to shut down the
OS as prompted.
● When the device is powered on, you can hold
down this button for 6 seconds to forcibly
power off the device.
● When the power indicator is steady yellow,
you can press this button to power on the
device.

UID button/ The UID button/indicator helps identify and

indicator locate a device.
UID indicator:
● Off: The device is not being located.
● Blinking or steady blue: The device is being
located.
UID button:
● You can control the UID indicator status by
pressing the UID button or using the iBMC.
● You can press this button to turn on or off the
UID indicator.
● You can press and hold down this button for 4
to 6 seconds to reset the iBMC.

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FusionServer 1288H V7 Server
Technical White Paper 5 Hardware Description

Sign Indicator and Description

Button

iBMC direct Indicates the status when the iBMC direct

connect connect management port connects to a
management terminal (local PC):
port indicator ● Off: No terminal is connected.
● Blinking green at short intervals for 3 seconds
and then off: The port is disabled.
● Steady green: The terminal is connected.
Indicates the status when the iBMC direct
connect management port connects to a USB
device:
● Blinking red at long intervals: The job fails or
an error is reported when the job is complete.
● Blinking green at short intervals: The job is
being executed.
● Blinking green at short intervals for 3 seconds
and then off: The port is disabled.
● Steady green: The server configuration file is
being copied from the USB device or the job
is successfully completed.

5.1.3 Ports
Port Positions
● 4 x 3.5" drive configuration

Figure 5-7 Ports on the front panel

1 iBMC direct connect 2 USB 3.0 port

management port

3 USB 3.0 port 4 VGA port

● 8 x 2.5" drive configuration

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FusionServer 1288H V7 Server
Technical White Paper 5 Hardware Description

Figure 5-8 Ports on the front panel

1 VGA port 2 USB 3.0 port

3 iBMC direct connect 4 USB 3.0 port

management port

● 10 x 2.5" drive configuration

Figure 5-9 Ports on the front panel

1 iBMC direct connect 2 USB 3.0 port

management port

Port Description

Table 5-2 Ports on the front panel

Name Type QuantityNote Description

VGA port DB15 1 Used to connect a display

terminal, such as a monitor or
KVM.

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FusionServer 1288H V7 Server
Technical White Paper 5 Hardware Description

Name Type QuantityNote Description

iBMC direct USB Type-C 1 Used to connect to a local PC

connect NOTE using a USB Type-C cable to
management The USB 2.0 monitor and manage the
port protocol is system.
supported.
NOTE
Only local PCs running Windows
10 are supported.
● To log in to the iBMC from a
local PC, enter https://IP
address of the iBMC
management network port in
the address box of the browser
on the local PC.
Used to connect to a USB
device.
NOTICE
● Before connecting an external
USB device, ensure that the
USB device functions properly;
otherwise, it may adversely
impact the server.
● For details about how to
connect a USB device to the
iBMC direct connect
management port, see the
FusionServer Rack Server
iBMC User Guide.

USB port USB 3.0 2 Used to connect to a USB 3.0

device.
NOTICE
● Before connecting an external
USB device, ensure that the
USB device functions properly;
otherwise, it may adversely
impact the server.
● The USB 3.0 port can be used
to supply power to low-power
peripherals. However, the USB
3.0 port must comply with the
USB specifications. To run
advanced peripherals, such as
external CD/DVD drives, an
external power supply is
required.

Note: The number of ports varies depending on server configuration. This table
lists the maximum number of ports in different configurations.

5.2 Rear Panel

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FusionServer 1288H V7 Server
Technical White Paper 5 Hardware Description

5.2.1 Appearance

Figure 5-10 Rear view

1 I/O module 1 2 I/O module 2

3 PSU 1 4 PSU 2

5 (Optional) FlexIO card 2 6 (Optional) FlexIO card 1

NOTE NOTE
The FlexIO card slot supports The FlexIO card slot supports
only OCP 3.0 NICs. only OCP 3.0 NICs.

NO TE

● I/O module 1 supports a PCIe riser module or rear drive module.

● I/O module 2 supports only the PCIe riser module.
● For details about the OCP 3.0 NIC, see 5.6.1 OCP 3.0 NICs.
● The figure is for reference only. The actual configuration may vary.

5.2.2 Indicators and Buttons

Indicator Positions

Figure 5-11 Indicators on the rear panel

1 Data transmission status 2 Connection status indicator

indicator of the of the management
management network port network port

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FusionServer 1288H V7 Server
Technical White Paper 5 Hardware Description

3 Serial port indicator 4 PSU indicator

NOTE
Reserved and unavailable
currently.

5 UID Indicator - -

Indicator Description

Table 5-3 Description of indicators on the rear panel

Sign Indicator Description

- Data transmission ● Off: No data is being transmitted.

status indicator of ● Blinking yellow: Data is being
the management transmitted.
network port

- Connection status ● Off: The network is not connected.

indicator of the ● Steady green: The network port is
management properly connected.
network port

- PSU indicator ● Off: No power is supplied.

● Blinking green at 1 Hz:
– The input is normal, and the
server is in the standby state.
– The input is overvoltage or
undervoltage.
– The PSU is in deep hibernation
mode.
● Blinking green at 4 Hz: The firmware
is being upgraded online.
● Steady green: The input and output
are normal.
● Steady orange: The input is normal
but there is no output.
NOTE
The possible causes of no output are as
follows:
● Power supply overtemperature
protection
● Power output overcurrent or short-
circuit
● Output overvoltage
● Short-circuit protection
● Device failure (excluding failure of all
devices)

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FusionServer 1288H V7 Server
Technical White Paper 5 Hardware Description

Sign Indicator Description

UID Indicator The UID indicator helps identify and

locate a device.
● Off: The device is not being located.
● Blinking or steady blue: The device is
being located.
NOTE
You can control the UID indicator status by
pressing the UID button or using the iBMC.

5.2.3 Ports
Port Positions

Figure 5-12 Ports on the rear panel

1 Management network port 2 Serial port

3 VGA port 4 USB 3.0 port

5 Socket for PSU 1 6 Socket for PSU 2

Port Description

Table 5-4 Ports on the rear panel

Name Type Quantity Description

Management RJ45 1 iBMC management network

network port port, which is used to manage
the server.
NOTE
The management network port is
a GE port that supports 100 Mbit/s
and 1000 Mbit/s auto-negotiation.

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FusionServer 1288H V7 Server
Technical White Paper 5 Hardware Description

Name Type Quantity Description

Serial port RJ45 1 A port used for debugging. By

default, it serves as the OS
serial port. You can also set it
as the iBMC serial port on the
iBMC CLI.
NOTE
The port is a 3-wire serial
communication port, and its
default baud rate is 115,200 bit/s.

VGA port DB15 1 Used to connect a display

terminal, such as a monitor or
KVM.

USB port USB 3.0 2 Used to connect to a USB 3.0

device.
NOTICE
● The maximum current is 1.3 A
for an external USB device.
● Before connecting an external
USB device, ensure that the
USB device functions properly;
otherwise, it may adversely
impact the server.
● The USB 3.0 port can be used
to supply power to low-power
peripherals. However, the USB
3.0 port must comply with the
USB specifications. To run
advanced peripherals, such as
external CD/DVD drives, an
external power supply is
required.

PSU socket - 2 Used to connect to a power

distribution unit (PDU) through
a power cable. You can select
the PSUs as required.
NOTE
When determining the PSUs,
ensure that the rated power of the
PSUs is greater than that of the
server.

5.3 Processors
● The server supports one or two processors.
● If only one processor is required, install it in socket CPU 1.
● Processors of the same model must be used in a server.

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● For details about the optional components, consult the local sales representative
or see "OS and Parts Compatibility" in the Compatibility Checker.

Figure 5-13 Positions of the processors

5.4 Memory

5.4.1 DDR5 Memory

5.4.1.1 Memory Identifier

You can determine the memory module properties based on the label attached to the
memory module.

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Figure 5-14 Memory identifier

No. Description Example

1 Capacity ● 16 GB
● 32 GB
● 64 GB
● 128 GB
● 256 GB

2 rank(s) ● 1R = Single rank

● 2R = Dual rank
● 4R = Quad rank
● 8R = Octal rank

3 Data width on the DRAM ● x4: 4-bit

● x8: 8-bit

4 Type of the memory interface ● PC5 = DDR5

5 Maximum memory speed ● 4800 MT/s

6 Memory Delay Parameter (CL- ● A = 34-34-34

nRCD-nRP) ● B = 40-40-40
● C = 42-42-42

7 DIMM type ● Reference design for

version RDIMM D0

8 SPD Version ● 10: SPD version

● 10: SPD versions from Byte
192 to Byte 447

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No. Description Example

9 Temperature class ● Extended temperature grade

(XT): 0°C to 95°C (32°F to
203°F)
● Normal temperature grade
(NT): 0°C to 85°C (32°F to
185°F)

5.4.1.2 Memory Subsystem Architecture

The server provides 32 memory slots. Each processor integrates eight memory
channels.

Install the memory modules in the primary memory channels first. If the primary
memory channel is not populated, the memory modules in secondary memory
channels cannot be used.

Table 5-5 Memory channels

CPU Channel Memory Slot

CPU 1 A (primary) DIMM000(A)

A DIMM001(I)

B (primary) DIMM010(B)

B DIMM011(J)

C (primary) DIMM020(C)

C DIMM021(K)

D (primary) DIMM030(D)

D DIMM031(L)

E (primary) DIMM040(E)

E DIMM041(M)

F (primary) DIMM050(F)

F DIMM051(N)

G (primary) DIMM060(G)

G DIMM061(O)

H (primary) DIMM070(H)

H DIMM071(P)

CPU 2 A (primary) DIMM100(A)

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CPU Channel Memory Slot

A DIMM101(I)

B (primary) DIMM110(B)

B DIMM111(J)

C (primary) DIMM120(C)

C DIMM121(K)

D (primary) DIMM130(D)

D DIMM131(L)

E (primary) DIMM140(E)

E DIMM141(M)

F (primary) DIMM150(F)

F DIMM151(N)

G (primary) DIMM160(G)

G DIMM161(O)

H (primary) DIMM170(H)

H DIMM171(P)

5.4.1.3 Memory Compatibility

Observe the following rules when configuring DDR5 memory modules:

NO TICE

● A server must use DDR5 memory modules of the same part number (P/N code),
and the memory speed is the lower one of the following two speed values:
● Memory speed supported by a CPU
● Maximum operating speed of a memory module
● The DDR5 memory modules of different types (RDIMM and RDIMM-3DS) and
specifications (capacity, bit width, rank, and height) cannot be used together.
● For details about the optional components, consult the local sales representative
or see "OS and Parts Compatibility" in the Compatibility Checker.

● The memory module can be used with the new-generation Intel® Xeon®
Scalable processors (Sapphire Rapids). The maximum memory capacity
supported by all processor models is the same.
● The calculation formula of total memory capacity supported is as follows: the
total memory capacity equals the capacity sum of all DDR5 memory modules.

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● For details about the capacity type of a single memory module, see "Search
Parts" in the Compatibility Checker.
● The maximum number of memory modules supported depends on the memory
module type and number of ranks.

Table 5-6 DDR5 memory parameters

Parameter Specifications

Capacity of a DDR5 16 32 64 128 256

memory (GB)

Type RDIMM RDIMM RDIMM RDIMM-3 RDIMM-3

DS DS

Rated speed (MT/s) 4800 4800 4800 4800 4800

Operating voltage (V) 1.1 1.1 1.1 1.1 1.1

Maximum number of 32 32 32 32 32
DDR5 DIMMs of a
servera

Maximum DDR5 512 1024 2048 4096 8192

memory capacity of
the server (GB)

Actual 1DPCb 4800 4800 4800 4800 4800

rate
(MT/s) 2DPC 4400 4400 4400 4400 4400

● a: The maximum number of DDR5 memory modules is based on dual-

processor configuration. The number is halved for a server with only one
processor.
● b: DIMM per channel (DPC) indicates the number of memory modules per
channel.
● The information listed in this table is for reference only. For details, consult the
local sales representative.

5.4.1.4 DIMM Installation Rules

Observe the following rules when configuring DDR5 memory modules:
● At least one DDR5 memory module must be configured with SPR CPU
(excluding HBM CPU). SPR HBM CPU can be configured without memory
module.
● The memory modules configured must be DDR5 RDIMMs.
● The memory modules must be configured with the same number of ranks.
● Install filler memory modules in vacant slots.

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5.4.1.5 Positions of the Memory Modules

The server supports up to 32 DDR5 memory modules. Observe the memory module
installation rules when configuring memory modules. For details, see the Server
Assembly Guide.

Figure 5-15 Positions of the memory modules

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Figure 5-16 DDR5 memory module installation guidelines (1 processor)

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Figure 5-17 DDR5 memory module installation guidelines (2 processors)

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5.4.1.6 Memory Protection Technologies

DDR5 memory modules support the following memory protection technologies:

● ECC
● Memory Mirroring
● Memory Single Device Data Correction (SDDC)
● Failed DIMM Isolation
● Memory Thermal Throttling
● Command/Address Parity Check and Retry
● Memory Demand/Patrol Scrubbing
● Memory Data Scrambling
● Post Package Repair (PPR)
● Write Data CRC Protection
● Adaptive Data Correction - Single Region (ADC-SR)
● Adaptive Double Device Data Correction - Multiple Region (ADDDC-MR)
● Partial Cache Line Sparing (PCLS, HBM only)

5.5 Storage

5.5.1 Drive Configuration and Drive Numbering

5.5.1.1 4 x 3.5" Drive Pass-Through Configuration

Drive Configuration

Table 5-7 Drive configuration

Configuration Front Drive Rear Drive Drive

Management
Mode

4 x 3.5" drive ● Front drives (4 - ● PCH

pass-through x 3.5"):
configuration 1 – Slots 0 to 3
support only
SATA drives.

4 x 3.5" drive ● Front drives (4 - ● 1 x PCIe RAID

pass-through x 3.5"): controller card
configuration 2 – Slots 0 to 3 The PCIe RAID
support only controller card
SAS/SATA is installed in
drives. slot 1 by
default.

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Configuration Front Drive Rear Drive Drive

Management
Mode

For details about the optional components, consult the local sales representative or
see "OS and Parts Compatibility" in the Compatibility Checker.

Drive Numbering

NO TICE

The drive numbers identified by the RAID controller card vary depending on the
cabling of the RAID controller card. This section uses the drive numbers identified by
a RAID controller card that adopts the default cabling described in "Internal Cabling"
in the FusionServer 1288H V7 Server Maintenance and Service Guide.

● Drive numbers of the 4 x 3.5" drive pass-through configuration 1 in Table 5-7.

Figure 5-18 Drive numbering

Table 5-8 Drive numbering

Drive Number Drive Number Displayed on the
iBMC WebUI

0 0

1 1

2 2

3 3

● Drive numbers of the 4 x 3.5" drive pass-through configuration 2 in Table 5-7.

Figure 5-19 Drive numbering

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Table 5-9 Drive numbering

Drive Number Drive Number Drive Number
Displayed on the iBMC Identified by the RAID
WebUI Controller Card

0 0 0

1 1 1

2 2 2

3 3 3

5.5.1.2 8 x 2.5" Drive Pass-Through Configuration

Drive Configuration

Table 5-10 Drive configuration

Configuration Front Drive Rear Drive Drive
Management
Mode

8 x 2.5" drive ● Front drive (8 x - ● PCH

pass-through 2.5"):
configuration 1 – Slots 0 to 7
support only
SATA drives.

8 x 2.5" drive ● Front drive (8 x - ● 1 x PCIe RAID

pass-through 2.5"): controller card
configuration 2 – Slots 0 to 7 The PCIe RAID
support only controller card
SAS/SATA is installed in
drives. slot 1 by
default.

For details about the optional components, consult the local sales representative or
see "OS and Parts Compatibility" in the Compatibility Checker.

Drive Numbering

NO TICE

The drive numbers identified by the RAID controller card vary depending on the
cabling of the RAID controller card. This section uses the drive numbers identified by
a RAID controller card that adopts the default cabling described in "Internal Cabling"
in the FusionServer 1288H V7 Server Maintenance and Service Guide.

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● Drive numbers of the 8 x 2.5" drive pass-through configuration 1 in Table 5-10.

Figure 5-20 Drive numbering

Table 5-11 Drive numbering

Drive Number Drive Number Displayed on the

iBMC WebUI

0 0

1 1

2 2

3 3

4 4

5 5

6 6

7 7

● Drive numbers of the 8 x 2.5" drive pass-through configuration 2 in Table 5-10.

Figure 5-21 Drive numbering

Table 5-12 Drive numbering

Drive Number Drive Number Drive Number

Displayed on the iBMC Identified by the RAID
WebUI Controller Card

0 0 0

1 1 1

2 2 2

3 3 3

4 4 4

5 5 5

6 6 6

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Drive Number Drive Number Drive Number

Displayed on the iBMC Identified by the RAID
WebUI Controller Card

7 7 7

5.5.1.3 10 x 2.5" Drive Pass-Through Configuration

Drive Configuration

Table 5-13 Drive configuration

Configuration Front Drive Rear Drive Drive
Management
Mode

10 x 2.5" drive ● Front drive (10 - ● SATA drive:

pass-through x 2.5"): PCH
configuration 1 – Slots 0 to 5 ● NVMe drive:
support only CPU pass-
SATA drives. through
– Slots 6 and
7 support
only SATA/
NVMe
drives.
– Slots 8 and
9 support
only NVMe
drives.

10 x 2.5" drive ● Front drive (10 - ● SAS/SATA

pass-through x 2.5"): drive: 1 x PCIe
configuration 2 – Slots 0 to 5 RAID controller
support only card
SAS/SATA The PCIe RAID
drives. controller card
is installed in
– Slots 6 and slot 1 by
7 support default.
SAS/SATA/
NVMe ● NVMe drive:
drives. CPU pass-
through
– Slots 8 and
9 support
only NVMe
drives.

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Configuration Front Drive Rear Drive Drive

Management
Mode

10 x 2.5" drive ● Front drive (10 ● I/O module 1 (2 ● 1 x PCIe RAID

pass-through x 2.5"): x 2.5")a: controller card
configuration 3 – Slots 0 to 9 – When I/O
– Slots 12 and
support only 13 support module 1 is
SAS/SATA only SAS/ configured
drives. SATA drives. with drives,
the PCIe
RAID
controller
card is
configured
in slot 3.
– When I/O
module 1 is
not
configured
with drives,
the PCIe
RAID
controller
card is
configured
in slot 1.

● a: I/O module 1 (2 x 2.5") is configured with 2 x 2.5" rear drives and PCIe riser
modules.
For details about the optional components, consult the local sales representative or
see "OS and Parts Compatibility" in the Compatibility Checker.

Drive Numbering

NO TICE

The drive numbers identified by the RAID controller card vary depending on the
cabling of the RAID controller card. This section uses the drive numbers identified by
a RAID controller card that adopts the default cabling described in "Internal Cabling"
in the FusionServer 1288H V7 Server Maintenance and Service Guide.

● Drive numbers of the 10 x 2.5" drive pass-through configuration 1 in Table 5-13.

Figure 5-22 Drive numbering

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Table 5-14 Drive numbering

Drive Number Drive Number Displayed on the

iBMC WebUI

0 0

1 1

2 2

3 3

4 4

5 5

6 6

7 7

8 8

9 9

● Drive numbers of the 10 x 2.5" drive pass-through configuration 2 in Table 5-13.

Figure 5-23 Drive numbering

Table 5-15 Drive numbering

Drive Number Drive Number Drive Number

Displayed on the iBMC Identified by the RAID
WebUI Controller Card

0 0 0

1 1 1

2 2 2

3 3 3

4 4 4

5 5 5

6 6 6Note

7 7 7Note

8 8 -

9 9 -

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Drive Number Drive Number Drive Number

Displayed on the iBMC Identified by the RAID
WebUI Controller Card

Note: If the slot is configured with a SAS/SATA drive, the RAID controller card
can manage the drive and allocate a number to the drive.

● Drive numbers of the 10 x 2.5" drive pass-through configuration 3 in Table 5-13.

Figure 5-24 Drive numbering

Table 5-16 Drive numbering

Drive Number Drive Number Drive Number
Displayed on the iBMC Identified by the RAID
WebUI Controller Card

0 0 0

1 1 1

2 2 2

3 3 3

4 4 4

5 5 5

6 6 6

7 7 7

8 8 8

9 9 9

12 12 10

13 13 11

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5.5.1.4 10 x 2.5" Drive NVMe Configuration

Drive Configuration

Table 5-17 Drive Configuration

Configuration Front Drive Rear Drive Drive
Management
Mode

10 x 2.5" Drive ● Front drive (10 - ● SAS/SATA

NVMe x 2.5"): drive: 1 x PCIe
Configuration – Slots 0 to 9 RAID controller
support card
SAS/SATA/ The PCIe RAID
NVMe controller card
drives. is installed in
slot 1 by
default.
● NVMe drive:
CPU pass-
through

For details about the optional components, consult the local sales representative or
see "OS and Parts Compatibility" in the Compatibility Checker.

Drive Numbering

NO TICE

The drive numbers identified by the RAID controller card vary depending on the
cabling of the RAID controller card. This section uses the drive numbers identified by
a RAID controller card that adopts the default cabling described in "Internal Cabling"
in the FusionServer 1288H V7 Server Maintenance and Service Guide.

● Drive numbers of the 10 x 2.5" drive NVMe configuration in Table 5-17.

Figure 5-25 Drive numbering

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Table 5-18 Drive numbering

Drive Number Drive Number Drive Number

Displayed on the iBMC Identified by the RAID
WebUI Controller Card

0 0 0Note

1 1 1Note

2 2 2Note

3 3 3Note

4 4 4Note

5 5 5Note

6 6 6Note

7 7 7Note

8 8 8Note

9 9 9Note

Note: If the slot is configured with a SAS/SATA drive, the RAID controller card
can manage the drive and allocate a number to the drive.

5.5.2 Drive Indicators

SAS/SATA Drive Indicators

Figure 5-26 SAS/SATA drive indicators

Table 5-19 SAS/SATA drive indicator description

Activity Indicator Fault Indicator Description

(Green) (Red/Blue)

Off Off The drive is not detected.

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Activity Indicator Fault Indicator Description

(Green) (Red/Blue)

Steady on Off The drive is detected.

Blinking at 4 Hz Off Data is being read or written properly, or

data on the primary drive is being
rebuilt.

Steady on Blinking blue at 4 The drive is being located.

Hz

Blinking at 1 Hz Blinking red at 1 Data on the secondary drive is being

Hz synchronously rebuilt.

Off Red steady on A drive in a RAID array is removed.

Steady on Red steady on The drive is faulty.

NVMe Drive Indicator

Figure 5-27 NVMe drive indicator

● If the VMD function is enabled and the latest VMD driver is installed, the NVMe
drives support surprise hot swap.

Table 5-20 NVMe drive indicator description (VMD function enabled)

Activity Fault Indicator Description
Indicator (Red/Blue)
(Green)

Off Off The NVMe drive is not detected.

Steady on Off The NVMe drive is detected and

operating properly.

Blinking at 2 Hz Off Data is being read from or written to

the NVMe drive.

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Activity Fault Indicator Description

Indicator (Red/Blue)
(Green)

Off Blinking blue at 4 The NVMe drive is being located.

Hz

Off Blinking red at 1 Data on the NVMe secondary drive is

Hz synchronously being rebuilt.

Steady on/Off Red steady on The NVMe drive is faulty.

● If the VMD function is disabled, the NVMe drives support only orderly hot swap.

Table 5-21 NVMe drive indicator description (VMD function disabled)

Activity Fault Indicator Description

Indicator (Red/Blue)
(Green)

Off Off The NVMe drive is not detected.

Steady on Off The NVMe drive is detected and

operating properly.

Blinking at 2 Hz Off Data is being read from or written to

the NVMe drive.

Off Blinking blue at 4 The NVMe drive is being located.

Hz

Off Blinking red at The NVMe drive has completed the

0.5 Hz hot swap process and is removable.

Off Blinking red at 2 The NVMe drive is being hot-

Hz swapped.

Steady on/Off Red steady on The NVMe drive is faulty.

5.5.3 RAID Controller Card

The RAID controller card supports RAID configuration, RAID level migration, and
drive roaming.

● For details about the optional components, consult the local sales representative
or see "OS and Parts Compatibility" in the Compatibility Checker.
● For details about the RAID controller card, see the V7 Server RAID Controller
Card User Guide.

5.6 Network

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5.6.1 OCP 3.0 NICs

OCP 3.0 NICs provide network expansion capabilities.
● The FlexIO slot supports an OCP 3.0 NIC, which can be configured as required.
● For details about the optional components, consult the local sales representative
or see "OS and Parts Compatibility" in the Compatibility Checker.
● For details about OCP 3.0 NICs, see the documents of each OCP 3.0 NIC.

5.7 I/O Expansion

5.7.1 PCIe Card

PCIe cards provide ease of expandability and connection.
● The server supports a maximum of three standard PCIe expansion slots.
● For details about the optional components, consult the local sales representative
or see "OS and Parts Compatibility" in the Compatibility Checker.
● When IB cards are used to build an IB network, ensure that the IPoIB modes of
the IB cards at both ends of the network connection are the same. For details,
contact technical support.

5.7.2 PCIe Slots

PCIe Slots

Figure 5-28 PCIe slots

● I/O module 1 provides slots 1 and 2.

● I/O module 2 provides slot 3.

PCIe Riser Card

● PCIe riser card of I/O module 1
Provides PCIe slots 1 and 2 in I/O module 1.

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Figure 5-29 PCIe riser card

● PCIe riser card of I/O module 2

Provides PCIe slot 3 in I/O module 2.

Figure 5-30 PCIe riser card

5.7.3 PCIe Slot Description

Server PCIe Slot Information
NO TE

● When CPU 2 is not detected, the corresponding PCIe slot is unavailable.

● The PCIe port numbers in table 1 correspond to CPUs. For details about the PCIe port
number displayed on the BIOS screen, see the Server Eagle Stream Platform BIOS
Parameter Reference.

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Table 5-22 PCIe slot description

PCIe PCIe PCIe PCIe CPU PCIe PCIe
Riser Riser Slots on Slot or Port Devices
Card Card the PCIe Interface Number Support
Installati Riser Descripti ed by
on Card on the PCIe
Position Slot or
Interface

PCIe I/O Slot 1 PCIe4.0 CPU 1 Port1A FHHL

riser card module 1 x16a
of I/O (x16)b
module 1
Slot 2 PCIe 4.0 CPU 1 Port2A HHHL
x16 (x16)

PCIe I/O Slot 3 PCIe 5.0 CPU 2 Port0A HHHL

riser card module 2 x16 (x16)
of I/O
module 2

- - Flex I/O PCIe4.0 - Port0A OCP 3.0

card 1 x16 (x8, specificat
x16c, or ions
x8+x8d)

- - FlexIO PCIe 4.0 - Port2A OCP 3.0

card 2 x16 (x8 specificat
or x16e) ions

● a: PCIe 5.0 refers to the PCIe of the fifth generation, and x16 refers to the
physical slot width. This also applies to the content below.
● b: The x16 in brackets indicates that the link bandwidth is x16.
● c: The default link bandwidth of FlexIO card 1 is x8. The link bandwidth can be
extended to x16 using cables.
● d: FlexIO card 1 can jump to connect using a cable. FlexIO card 1 supports
Socket-Direct function.
● e: The default link bandwidth of FlexIO card 2 is x8. The link bandwidth can be
extended to x16 using cables. When FlexIO card 1 supports the Socket-Direct
function, FlexIO card 2 can only support x8.
● The PCIe x16 slots are compatible with PCIe x16, PCIe x8, PCIe x4, and PCIe
x1 cards. The bandwidth of the PCIe slot cannot be less than that of the
inserted PCIe card.
● The FHHL PCIe slots are compatible with FHHL PCIe cards and HHHL PCIe
cards.
● The maximum power supply of each PCIe slot is 75 W.

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Server Bus/Device/Function Number (B/D/F) Information

The server's B/D/F information may change with PCIe card configurations. You can
obtain the B/D/F information of the server using the following methods:
● BIOS serial port log: If the serial port log has been collected, you can query the
B/D/F information of the server by searching for the keyword "dumpiio".
● UEFI Shell: You can obtain the B/D/F of the server using the pci command. Run
the help pci command to obtain the specific usage of the pci command.
● You can obtain the B/D/F of the server using the pci command. Run the help pci
command to obtain the specific usage of the pci command.
– Linux OS: You can obtain the B/D/F information of the server using the lspci
-vvv command.
NO TE

If the OS does not support the lspci command by default, obtain the pci-utils
package from the yum source and install it to make the OS support the command.
– Windows OS: After installing the pci-utils package, run the lspci command
to obtain the B/D/F information of the server.
– VMware OS: The lspci command is supported by default. You can directly
obtain the B/D/F information of the server using the lspci command.

5.8 PSUs
● Supports one PSU or two PSUs.
● Supports AC or DC PSUs.
● Supports hot swap.
● When two PSUs are configured, 1+1 redundancy is supported.
● PSUs of the same P/N code must be used in a server.
● Short-circuit protection is provided, and bipolar fuses are provided for PSUs that
support dual live wire input.
● If you want to use a DC power supply, purchase a DC power supply that meets
the requirements of the safety standards or a DC power supply that has passed
the CCC certification.
● For details about the optional components, consult the local sales representative
or see "OS and Parts Compatibility" in the Compatibility Checker.

Figure 5-31 Positions of PSUs

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5.9 Fan Module

● Supports eight fan modules.
● Supports hot swap.
● Supports N+1 redundancy. The server runs properly when one fan fails.
● Supports intelligent fan speed adjustment.
● Fan modules of the same part number (P/N code) must be used in a server.

Figure 5-32 Positions of the fan modules

5.10 Board

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5.10.1 Mainboard
Figure 5-33 Mainboard

1 Leak detection connector 2 VROC key connector

(LIQUID CONN/J6078)a (VROC KEY/J6066)

3 Cell battery holder (U6222) 4 CPU 2 UBC DD connector

(UBCDD2-7/J6053)

5 OCP 3.0 NIC 2 connector 6 RAID&M.2 mezzanine card

(OCP2 CONN/J6073) signal connector (RAID&M.
2/J6063)a

7 OCP 3.0 NIC 2 UBC 8 Built-in HDD backplane &

connector (UBC2-5/J6071) BBU signal connector
(INNER BP&BBU/J6084)

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9 CPU 1 UBC DD connector 10 Rear I/O module 2 power

(UBCDD1-8/J6052) connector (IO2 PWR/
J6091)

11 2 x USB 3.0 ports (USB3.0 12 TPM/TCM connector (TPM

CONN/J88) CONN/J6065)

13 Front drive power 14 Rear VGA port (VGA

connector (HDD PWR/ CONN/J60)
J6105)a

15 Built-in USB 2.0 connector 16 Serial port (COM/J6020)

(INNER USB2.0/J6067)

17 BMC management port 18 BMC management board

(BMC_GE/J6019)

19 LCD connector (LCD 20 OCP 3.0 NIC 1 connector

CONN/J6025) (OCP1 CONN/J6072)

21 OCP 3.0 NIC 1 UBC 22 CPU 1 UBC DD connector

connector (UBC1-5/J42) (UBCDD1-7/J6051)

23 PCH SATA connector 2 24 Rear I/O module 1 power

(SATA2/J6099) connector (IO1 PWR/
J6092)

25 PCH SATA port C 26 Right mounting ear

connector (PORTC/J6100) connector (J6060)

27 Fan board power connector 28 PCH SATA ports A and B

(FAN PWR/J6094) connector (PORT A-B/
J6104)

29 CPU 1 northbound UBC 30 Fan board signal connector

connector (UBC1-6/J64) (FAN BOARD/J6077)

31 PCH SATA connector 1 32 NC-SI connector (NCSI

(SATA1/J6098) CONN/J31)

33 CPU 1 southbound UBC 34 CPU 1 southbound UBC

connector (UBC1-4/J38) connector (UBC1-3/J37)

35 CPU 1 southbound UBC 36 CPU 1 southbound UBC

connector (UBC1-2/J49) connector (UBC1-1/J48)

37 Intrusion sensor connector 38 CPU 2 southbound UBC

(INTRUDER CONN/S2) connector (UBC2-4/J45)

39 CPU 2 southbound UBC 40 CPU 2 southbound UBC

connector (UBC2-3/J44) connector (UBC2-2/J41)

41 CPU 2 southbound UBC 42 CPU 2 northbound UBC

connector (UBC2-1/J40) connector (UBC2-6/J53)

43 Left mounting ear 44 BBU power connector

connector (J6081) (BBU PWR/J6079)a

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45 Front-drive backplane 46 Front-drive backplane

signal connector (FRONT power connector (FRONT
HDD BP/J6082) HDD PWR/J6093)a

47 Rear I/O module 3 drive 48 Rear I/O module 3 power

backplane signal connector connector (IO3 PWR/
(PSU HDD BP/J6087)a J6089)

49 PSU 2 connector (PSU2/ 50 PSU 1 connector (PSU1/

J6096) J6095)

51 CPU 2 UBC DD connector 52 Built-in drive module power

(UBCDD2-8/J6054) connector (INNER PWR/
J6090)

a: The reserved connector is temporarily unavailable.

5.10.2 Drive Backplane

Front-Drive Backplane
● 4 x 3.5" drive pass-through backplane
This backplane is used for all drive configurations described in section 5.5.1.1 4
x 3.5" Drive Pass-Through Configuration.

Figure 5-34 4 x 3.5" drive pass-through backplane

No. Connector Managed Drive Slot

1 Mini-SAS HD connector Slots 2 and 3

(PORT B/J401)

2 Mini-SAS HD connector Slots 0 and 1

(PORT A/J28)

3 Backplane signal cable -

connector (HDD BP/
J19)

4 Power connector -
(HDD_POWER/J21)

● 8 x 2.5" drive pass-through backplane

This backplane is used for all drive configurations described in section 5.5.1.2 8
x 2.5" Drive Pass-Through Configuration.

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Figure 5-35 8 x 2.5" drive pass-through backplane

No. Connector Managed Drive Slot

1 Mini-SAS HD connector Slots 4 to 7

(PORT B/J1)

2 Mini-SAS HD connector Slots 0 to 3

(PORT A/J28)

3 Backplane signal cable -

connector (HDD BP/
J12)

4 Power connector -
(HDD_POWER/J14)

● 10 x 2.5" drive pass-through backplane

This backplane is used for all drive configurations described in section 5.5.1.3 10
x 2.5" Drive Pass-Through Configuration.

Figure 5-36 10 x 2.5" drive pass-through backplane

No. Connector Managed Drive Slot

1 Mini-SAS HD connector Slots 8 and 9

(PORT C/J8)

2 Mini-SAS HD connector Slots 4 to 7

(PORT B/J7)

3 Mini-SAS HD connector Slots 0 to 3

(PORT A/J6)

4 Backplane signal cable -

connector (HDD BP/
J20)

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No. Connector Managed Drive Slot

5 Power connector -
(HDD_POWER/J21)

6 UBC connector 1 Slots 6 and 7

(UBC1/J1)

7 UBC connector 2 Slots 8 and 9

(UBC2/J2)

● 10 x 2.5" drive NVMe backplane

This backplane is used for all drive configurations described in section 5.5.1.4 10
x 2.5" Drive NVMe Configuration.

Figure 5-37 10 x 2.5" drive NVMe backplane

No. Connector Managed Drive Slot

1 Mini-SAS HD connector Slots 8 and 9

(PORT C/J8)

2 UBC connector Slots 8 and 9

(UBC2CPU0 /J5)

3 Mini-SAS HD connector Slots 4 to 7

(PORT B/J7)

4 Mini-SAS HD connector Slots 0 to 3

(PORT A/J6)

5 UBC connector Slots 2 and 3

(UBC12CPU1 /J2)

6 PSU connector (HDD -

POWER /J21)

7 Indicator signal cable -

connector (HDD_BP/
J20)

8 UBC connector Slots 0 and 1

(UBC11CPU1 /J1)

9 UBC connector Slots 4 and 5

(UBC13CPU1 /J3)

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No. Connector Managed Drive Slot

10 UBC connector Slots 6 and 7

(UBC1CPU0 /J4)

Rear-Drive Backplane
● 2 x 2.5" drive backplane

Figure 5-38 2 x 2.5" drive backplane

Number Connector Managed Drive Slot

1 Indicator signal cable -

connector (HDD_BP/
J902)

2 Mini SAS HD connector Slots 12 to 13

(PORT A/J401)

3 Power connector (HDD -

POWER /J1101)

5.10.3 Fan Board

Figure 5-39 Fan board

1 Fan board signal connector 2 Fan connector (FAN8 /

(FAN_BOARD/J3) J1401)

3 Fan connector (FAN7 / 4 Fan connector (FAN6 /

J1301) J1201)

5 Fan connector (FAN5 / 6 Fan board power

J1101) connector (J1)

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7 Fan connector (FAN4 / 8 Fan connector (FAN3 /

J1001) J901)

9 Fan connector (FAN2 / 10 Fan connector (FAN1 /

J801) J701)

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FusionServer 1288H V7 Server
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6 Specifications

6.1 Technical Specifications

6.2 Environmental Specifications
6.3 Physical Specifications

6.1 Technical Specifications

Table 6-1 Technical specifications
Component Specifications

Form factor 1U rack server

Chipset Emmitsburg PCH

Processor Supports one or two processors.

● New-generation Intel® Xeon® Scalable processors
(Sapphire Rapids)
● Built-in memory controller and eight memory channels
per processor
● Built-in PCIe controller, supporting PCIe 5.0 and 80
lanes per processor
● Four UltraPath Interconnect (UPI) buses between
processors, providing up to 16 GT/s transmission per
channel
● Up to 60 cores
● Max. 4.2 GHz turbo frequency
● Min. 1.875 MB L3 cache per core
● Max. 350 W TDP
NOTE
The preceding information is for reference only. For details, see
"Search Parts" in the Compatibility Checker.

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Component Specifications

Memory 32 memory slots.

● Up to 32 DDR5 DIMMs
– RDIMM or RDIMM-3DS support
– Max. 4800 MT/s memory speed
– The DDR5 memory modules of different types
(RDIMM and RDIMM-3DS) and specifications
(capacity, bit width, rank, and height) cannot be
used together.
– A server must use DDR5 DIMMs of the same P/N
code.
NOTE
The preceding information is for reference only. For details, see
"Search Parts" in the Compatibility Checker.

Storage Supports a variety of drive configurations. For details,

see 5.5.1 Drive Configuration and Drive Numbering.
● Supports hot swap of SAS/SATA/NVMe U.2 drives.
NOTE
When you configure NVMe drives:
● Before using the VMD function, contact technical support
engineers of the OS vendor to check whether the OS
supports the VMD function. If yes, check whether the
VMD driver needs to be manually installed and check the
installation method.
● When the VMD function is enabled and the latest VMD
driver is installed, surprise hot swap is supported.
● When the VMD function is disabled, orderly hot swap is
supported.
● Supports a variety of RAID controller cards. For
details, see "Search Parts" in the Compatibility
Checker.
– The RAID controller card supports RAID
configuration, RAID level migration, and drive
roaming.
– The RAID controller card supports a
supercapacitor for power-off protection to ensure
user data security.
– The PCIe RAID controller card occupies one PCIe
slot.
For details about the RAID controller card, see the V7
Server RAID Controller Card User Guide.
NOTE
If the BIOS is in legacy mode, the 4K drive cannot be used as
the boot drive.

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Component Specifications

Network OCP 3.0 NICs provide network expansion capabilities.

● Supports two OCP 3.0 NICs, which can be configured
as required.
● Supports orderly hot swap.
NOTE
The OCP 3.0 NIC supports orderly hot swap only when the
VMD function is disabled.
● Supports a variety of OCP 3.0 NICs. For details, see
"Search Parts" in the Compatibility Checker.

I/O expansion Supports five PCIe slots.

● Supports two PCIe slots dedicated for OCP 3.0 NICs
and three standard PCIe slots.
For details, see 5.7.2 PCIe Slots and 5.7.3 PCIe Slot
Description.
NOTE
The preceding information is for reference only. For details, see
"Search Parts" in the Compatibility Checker.

Ports Supports a variety of ports.

● Ports on the front panel:
– One USB Type-C iBMC direct connect
management port
– Two USB 3.0 ports
– One DB15 VGA port
NOTE
The front panel of 10 x 2.5" drives provides only one USB
Type-C iBMC direct connect management port and one USB
3.0 port.
● Ports on the rear panel:
– Two USB 3.0 ports
– One DB15 VGA port
– One RJ45 serial port
– One RJ45 management network port
● Built-in ports:
– Two SATA ports
NOTE
You are not advised to install the OS on the USB storage media.

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Component Specifications

Video card An SM750 video chip with 32 MB display memory is

integrated on the mainboard. The maximum display
resolution is 1920 x 1200 at 60 Hz with 16M colors.
NOTE
● The integrated video card can provide the maximum display
resolution (1920 x 1200) only after the video card driver
matching the operating system version is installed.
Otherwise, only the default resolution supported by the
operating system is provided.
● If both the front and rear VGA ports are connected to
monitors, only the monitor connected to the front VGA port
displays information.

System management ● UEFI

● iBMC
● NC-SI
● Integration with third-party management systems

Security feature ● Power-on password

● Administrator password
● TPM (for China and outside China)/TCM (only for
China)
● Secure boot
● Front bezel (optional)
● Chassis cover opening detection

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6.2 Environmental Specifications

Table 6-2 Environmental specifications
Item Specifications

Temperature ● Operating temperature: 5ºC to 45ºC (41°F to 113°F)

(ASHRAE Classes A1 to A4 compliant)
● Storage temperature (within three months): –30°C to
+60°C (–22°F to +140°F)
● Storage temperature (within six months): –15°C to
+45°C (5°F to 113°F)
● Storage temperature (within one year): –10°C to
+35°C (14°F to 95°F)
● Maximum temperature change rate: 20°C (36°F) per
hour and 5°C (9°F) per 15 minutes
NOTE
The operating temperature limitation varies depending on the
server configuration. For details, see A.3 Operating
Temperature Limitations.

Relative humidity (RH, ● Operating humidity: 8% to 90%

non-condensing) ● Storage humidity (within three months): 8% to 85%
● Storage humidity (within six months): 8% to 80%
● Storage humidity (within one year): 20% to 75%
● Maximum change humidity rate: 20% per hour

Air volume ≥96CFM

Operating altitude ≤ 3050 m (10,006.56 ft)

● When the server configuration complies with ASHRAE
Classes A1 and A2 and the altitude is above 900 m
(2952.76 ft), the highest operating temperature
decreases by 1ºC (1.8°F) for every increase of 300 m
(984.25 ft).
● When the server configuration complies with ASHRAE
Class A3 and the altitude is above 900 m (2952.76 ft),
the highest operating temperature decreases by 1ºC
(1.8°F) for every increase of 175 m (574.15 ft).
● When the server configuration complies with ASHRAE
Class A4 and the altitude is above 900 m (2952.76 ft),
the highest operating temperature decreases by 1ºC
(1.8°F) for every increase of 125 m (410.10 ft).
● HDDs cannot be used at an altitude of over 3050 m
(10,006.56 ft).

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Item Specifications

Corrosive airborne Maximum growth rate of the corrosion product thickness:

contaminants ● Copper corrosion rate test: 300 Å/month (meeting
level G1 requirements of the ANSI/ISA-71.04-2013
standard on gaseous corrosion)
● Silver corrosion rate test: 200 Å/month

Particle contaminant ● Meets the requirements of ISO 14664-1 Class 8.

● There is no explosive, conductive, magnetic, or
corrosive dust in the equipment room.
NOTE
It is recommended that the particulate pollution in the equipment
room be monitored by a professional agency.

Acoustic noise The declared A-weighted sound power levels (LWAd)

and declared average bystander position A-weighted
sound pressure levels (LpAm) listed are measured at
23°C (73.4°F) in accordance with ISO 7779 (ECMA 74)
and declared in accordance with ISO 9296 (ECMA 109).
● Idle:
– LWAd: 6.1 Bels
– LpAm: 45.3 dBA
● Operating:
– LWAd: 6.3 Bels
– LpAm: 47.6 dBA
NOTE
Actual sound levels generated during operation vary depending
on the configuration, load, and ambient temperature.

NO TE

SSDs and HDDs (including NL-SAS, SAS, and SATA) cannot be preserved for a long time in
the power-off state. Data may be lost or faults may occur if the preservation duration exceeds
the specified maximum duration. When drives are preserved under the storage temperature
and humidity specified in the preceding table, the following preservation duration is
recommended:
● Maximum preservation duration of SSDs:
● 12 months in power-off state without data stored
● 3 months in power-off state with data stored
● Maximum preservation duration of HDDs:
● 6 months in unpacked/packed and powered-off state
● The maximum preservation duration is determined according to the preservation
specifications provided by drive vendors. For details, see the manuals provided by drive
vendors.

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6.3 Physical Specifications

Table 6-3 Physical specifications
Category Description

Dimensions (H x W x ● 3.5" drive chassis: 43 mm x 447 mm x 798 mm (1.69

D) in. x 17.6 in. x 31.42 in.)
● 2.5" drive chassis: 43 mm x 447 mm x 798 mm (1.69
in. x 17.6 in. x 31.42 in.)

Figure 6-1 Physical dimensions (example: 2.5" drive

chassis)

NOTE
● See Figure 6-1 for methods of measuring physical
dimensions of the chassis.
● The measuring method for chassis with 3.5" drives and that
for chassis with 2.5" drives are the same. The chassis with
3.5" drives is used as an example.

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Category Description

Installation space ● Requirements for cabinet installation:

Cabinet compliant with the International
Electrotechnical Commission (IEC) 297 standard
– Cabinet width: 482.6 mm (19.00 in.)
– Cabinet depth ≥ 1000 mm (39.37 in.)
● Requirements for guide rail installation:
– L-shaped guide rails: apply only to xFusion
cabinets.
– Static rail kit: applies to cabinets with a distance of
610 mm to 950 mm (24.02 in. to 37.40 in.) between
the front and rear mounting bars.
– Ball bearing rail kit: applies to cabinets with a
distance of 609 mm to 950 mm (23.98 in. to 37.40
in.) between the front and rear mounting bars.

Weight in full ● Net weight:

configuration – Maximum weight for server with 4 x 3.5" drives:
20.5 kg (45.19 lb)
– Maximum weight for server with 8 x 2.5" drives:
18.0 kg (39.68 lb)
– Maximum weight for server with 10 x 2.5" drives:
18.5 kg (40.79 lb)
● Packaging materials: 5 kg (11.03 lb)

Power consumption The power consumption parameters vary with hardware

configurations (including the configurations complying
with EU ErP). Use the Power Calculator to obtain
specific information.

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Technical White Paper 7 Software and Hardware Compatibility

7 Software and Hardware Compatibility

For details about the OS and hardware, see Compatibility Checker.

NO TICE

● If incompatible components are used, the device may be abnormal. Such a fault is
beyond the scope of technical support and warranty.
● The performance of servers is closely related to application software, basic
middleware software, and hardware. The slight differences of the application
software, middleware basic software, and hardware may cause performance
inconsistency between the application layer and test software layer.
● If the customer has requirements on the performance of specific application
software, contact technical support to apply for proof of concept (POC) tests
in the pre-sales phase to determine detailed software and hardware
configurations.
● If the customer has requirements on hardware performance consistency,
specify the specific configuration requirements (for example, specific drive
models, RAID controller cards, or firmware versions) in the presales phase.

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8 Safety Instructions

8.1 Security
8.2 Maintenance and Warranty

8.1 Security
General Statement
● Comply with local laws and regulations when installing equipment. These safety
instructions are only a supplement.
● Observe the safety instructions that accompany all "DANGER", "WARNING",
and "CAUTION" symbols in this document.
● Observe all safety instructions provided on device labels.
● Operators of special types of work (such as electricians, operators of electric
forklifts, and so on.) must be certified or authorized by the local government or
authority.

WARNING

In a household scenario, operation of this device may cause radio interference.

Human Safety
● This device is not suitable for use in places where children may be present.
● Only certified or authorized personnel are allowed to install equipment.
● Discontinue any dangerous operations and take protective measures. Report
anything that could cause personal injury or device damage to a project
supervisor.
● Do not move devices or install cabinets and power cables in hazardous weather
conditions.
● Do not carry the weight that exceeds the maximum load per person allowed by
local laws or regulations. Before moving a device, check the maximum device
weight and arrange required personnel.

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● Wear clean protective gloves, ESD clothing, a protective hat, and protective
shoes, as shown in Figure 8-1.

Figure 8-1 Safety work wear

● Before touching a device, wear ESD clothing and gloves (or wrist strap), and
remove any conductive objects (such as watches and jewelry). Figure 8-2
shows conductive objects that must be removed before you touch a device.

Figure 8-2 Removing conductive objects

Figure 8-3 shows how to wear an ESD wrist strap.

a. Secure the ESD wrist strap around your wrist.
b. Fasten the strap buckle and ensure that the ESD wrist strap is in contact
with your skin.
c. Insert the ground terminal attached to the ESD wrist strap into the jack on
the grounded cabinet or chassis.

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Figure 8-3 Wearing an ESD wrist strap

● Exercise caution when using tools that could cause personal injury.
● If the installation position of a device is higher than the shoulders of the
installation personnel, use a vehicle such as a lift to facilitate installation. Prevent
the device from falling down and causing personal injury or damage to the
device.
● The equipment is powered by high-voltage power sources. Direct or indirect
contact (especially through damp objects) with high-voltage power sources may
result in serious injury or death.
● Ground a device before powering it on. Otherwise, high voltage leakage current
may cause personal injury.
● When a ladder is used, ensure that another person holds the ladder steady to
prevent accidents.
● Do not look into optical ports without eye protection when installing, testing, or
replacing optical cables.

Equipment Safety
● Use the recommended power cables at all times.
● Power cables are used only for dedicated servers. Do not use them for other
devices.
● Before operating equipment, wear ESD clothes and gloves to prevent
electrostatic-sensitive devices from being damaged by ESD.
● When moving a device, hold the bottom of the device. Do not hold the handles of
the installed modules, such as the PSUs, fan modules, drives, and the
mainboard. Handle the equipment with care.
● Exercise caution when using tools that could cause damage to devices.
● Connect the primary and secondary power cables to different power distribution
units (PDUs) to ensure reliable system operation.
● Ground a device before powering it on. Otherwise, high voltage leakage current
may cause device damage.

Transportation Precautions
Improper transportation may damage equipment. Contact the manufacturer for
precautions before attempting transportation.
Transportation precautions include but are not limited to:
● The logistics company engaged to transport the device must be reliable and
comply with international standards for transporting electronics. Ensure that the

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equipment being transported is always kept upright. Take necessary precautions

to prevent collisions, corrosion, package damage, damp conditions and pollution.
● Transport each device in its original packaging.
● If the original packaging is unavailable, package heavy, bulky parts (such as
chassis and blades) and fragile parts (such as PCIe cards and optical modules)
separately.
NO TE

For details about components supported by the server, see "OS and Parts Compatibility"
in Compatibility Checker.
● Power off all devices before transportation.

Maximum Weight Carried by a Person

CAUTION

The maximum weight allowed to be carried by a single person is subject to local laws
or regulations. The markings on the device and the descriptions in the documentation
are for reference only.

Table 8-1 lists the maximum weight one person is permitted to carry as stipulated by
a number of organizations.

Table 8-1 Maximum weight carried per person

Organization Weight (kg/lb)

European Committee for 25/55.13

Standardization (CEN)

International Organization for 25/55.13

Standardization (ISO)

National Institute for Occupational 23/50.72

Safety and Health (NIOSH)

Health and Safety Executive (HSE) 25/55.13

General Administration of Quality ● Male: 15/33.08

Supervision, Inspection and Quarantine ● Female: 10/22.05
of the People's Republic of China
(AQSIQ)

For more information about safety instructions, see Server Safety Information.

8.2 Maintenance and Warranty

For details about maintenance, see Customer Support Service.

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For details on warranty, see Warranty.

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Technical White Paper 9 System Management

9 System Management

This product integrates the new-generation Intelligent Baseboard Management

Controller (iBMC), which complies with Intelligent Platform Management Interface 2.0
(IPMI 2.0) specifications and provides reliable hardware monitoring and
management.

The iBMC intelligent management system has the following features:

● Various management interfaces.

The iBMC provides the following standard interfaces to meet various system
integration requirements:
– DCMI 1.5 interface
– IPMI 1.5/IPMI 2.0 interface
– Command-line interface
– Redfish interface
– Hypertext Transfer Protocol Secure (HTTPS) interface
– Simple Network Management Protocol (SNMP) interface
● Fault monitoring and diagnosis
The iBMC detects hidden risks and ensures stable, uninterrupted 24/7 system
operation by providing the following features:
– The last screenshot and video recording function when the system crashes
makes it impossible to analyze the cause of the system crash.
– Screen snapshots and screen recordings make scheduled inspection,
operation recording, and audit easy.
– The fault diagnosis & management (FDM) function supports component-
based precise fault diagnosis, facilitating component fault locating and
replacement.
– The iBMC supports the reporting of alarms through syslog packets, trap
packets, and emails, helping the upper-layer NMS platform to collect the
fault information about the server.
– If the server is configured with the LCD module, the LCD can directly obtain
device information from the iBMC.
● Security management methods

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FusionServer 1288H V7 Server
Technical White Paper 9 System Management

– Software image backup improves system security. Even if the running

software completely breaks down, the system can be started from the
backup image.
– Diversified user security control interfaces are provided to ensure user login
security.
– Multiple certificates can be imported and replaced to ensure data
transmission security.
● System maintenance interface
– Supports virtual keyboard, video, and mouse (KVM) and virtual media
functions to facilitate remote maintenance.
– Supports out-of-band RAID monitoring and configuration to improve RAID
configuration efficiency and management capabilities.
– Smart Provisioning implements DVD-free OS installation, RAID
configuration, and upgrades to simplify server installation and configuration.
● Diversified network protocols
– Supports NTP to improve the device time configuration capability and
synchronizes the network time.
– Supports domain management and directory services to simplify the server
management network.
● Intelligent power management
– Power capping technology makes it easy to increase deployment density.
– Dynamic energy saving helps reduce the operating expense (OPEX).
● License management
License management allows advanced features to be used by authorized users.
The advanced edition of the iBMC provides the following features:
– Use Redfish to deploy the OS.
– Use Redfish to collect raw data for intelligent diagnosis.

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FusionServer 1288H V7 Server
Technical White Paper 10 Certifications

10 Certifications

Country/Region Certification Standard

Europe CE Safety:
EN 62368-1:2014+A11:2017
EMC:
ETSI EN 300 386 V2.1.1:2016
ETSI EN 300 386 V1.6.1:2012
EN 55032:2015+A1:2020
CISPR 32:2015+A1:2019
EN IEC 61000-3-2:2019+A1:2021
EN 61000-3-2:2013+A2:2021
EN 61000-3-2:2014
EN 61000-3-3:2013
EN 55035:2017+A11:2020
CISPR 35:2016
EN 55024:2010+A1:2015
CISPR 24:2010+A1:2015
RoHS:
EN IEC 63000:2018
ErP:
Commission Regulation (EU) No
2019/424

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Technical White Paper 10 Certifications

Country/Region Certification Standard

UK UKCA Safety:
EN 62368-1:2014+A11:2017
EMC:
ETSI EN 300 386 V2.1.1:2016
ETSI EN 300 386 V1.6.1:2012
EN 55032:2015+A1:2020
CISPR 32:2015+A1:2019
EN IEC 61000-3-2:2019+A1:2021
EN 61000-3-2:2013+A2:2021
EN 61000-3-2:2014
EN 61000-3-3:2013
EN 55035:2017+A11:2020
CISPR 35:2016
EN 55024:2010+A1:2015
CISPR 24:2010+A1:2015
RoHS:
BS EN IEC 63000:2018
ErP:
Commission Regulation (EU) No
2019/424

China CCC GB4943.1-2011

GB/T 9254.1-2021
GB17625.1-2012

US FCC FCC PART 15

Japan VCCI VCCI 32-1

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FusionServer 1288H V7 Server
Technical White Paper A Appendix

A Appendix

A.1 Chassis Label Information

A.1.1 Chassis Head Label

Figure A-1 Chassis head label

1 Nameplate 2 Certificate

3 Quick access label 4 Product SN

NOTE
For details, see A.2 Product SN.

5 Reserved space for customized 6 Pressure-proof label

label NOTE
This label warns users not to place
any objects on top of a rack-
mounted device.

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A.1.1.1 Nameplate

Figure A-2 Nameplate example

Table A-1 Nameplate description

No. Description

1 Server model
NOTE
For details, see A.4 Nameplate.

2 Device name

3 Power supply requirements

4 Vendor information

5 Certification marks

A.1.1.2 Certificate

Figure A-3 Certificate example

Table A-2 Certificate description

No. Description

1 Order

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FusionServer 1288H V7 Server
Technical White Paper A Appendix

No. Description

2 No.
NOTE
For details, see Figure A-4 and Table A-3.

3 QC inspector

4 Production date

5 No. barcode

Figure A-4 Certificate number example

Table A-3 Certificate number description

No. Description

1 P: a fixed value for this digit

2 Z: a fixed value for this digit

3 ● Y: a server
● B: a semi-finished server
● N: a spare part

4 0: a value for the reserved digit

5 Year (two characters)

6 Month (one character)

● Digits 1 to 9 indicate January to September respectively.
● Letters A to C indicate October to December respectively.

7 Day (one character)

● Digits 1 to 9 indicate the 1st to 9th.
● Letters A to H indicate the 10th to 17th.
● Letters J to N indicate the 18th to 22nd.
● Letters P to Y indicate the 23rd to 31st.

8 Hour (one character)

● Digits 0 to 9 indicate 0:00 to 9:00.
● Letters A to H indicate 10:00 to 17:00.
● Letters J to N indicate 18:00 to 22:00.
● Letters P to Q indicate 23:00 to 24:00.

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Technical White Paper A Appendix

No. Description

9 Serial number (two characters)

10 Manufacturing serial number (five characters)

A.1.1.3 Quick Access Label

Figure A-5 Quick access label example

Table A-4 Quick access label description

No. Description

1 IP address of the iBMC management network port

2 Subnet mask of the iBMC management network port

3 Default iBMC user name

4 Default iBMC password

5 Default BIOS password

6 Technical support website

7 P/N code

8 QR code
NOTE
Scan the QR code to obtain technical support resources.

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Technical White Paper A Appendix

A.1.2 Chassis Internal Label

Figure A-6 Chassis internal label

NO TE

● The quick start guide is located on the inside of the chassis cover. It describes how to
remove the mainboard components, important components of the chassis, precautions,
and QR codes of technical resources. The pictures are for reference only. For details, see
the actual product.
● The quick start guide is optional. For details, see the actual product.

A.1.3 Chassis Tail Label

Figure A-7 Chassis tail label

NO TE

For details about the warning label, see the Server Safety Information.

A.2 Product SN
The serial number (SN) on the label plate uniquely identifies a server. The SN is
required when users contact xFusion technical support.

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Technical White Paper A Appendix

Figure A-8 SN example

Table A-5 SN description

No. Description

1 SN ID (two characters), which is 21.

2 Material identification code (eight characters), that is, the

processing code.

3 Vendor code (two characters), that is, the code of the processing
place.

4 Year and month (two characters)

● The first character indicates the year.
– Digits 1 to 9 indicate years 2001 to 2009 respectively.
– Letters A to H indicate years 2010 to 2017 respectively.
– Letters J to N indicate years 2018 to 2022 respectively.
– Letters P to Y indicate years 2023 to 2032 respectively.
NOTE
The years from 2010 are represented by upper-case letters excluding
I, O, and Z because the three letters are similar to the digits 1, 0, and
2.
● The second character indicates the month.
– Digits 1 to 9 indicate January to September respectively.
– Letters A to C indicate October to December respectively.

5 Serial number (six characters)

6 RoHS compliance status (one character). Y indicates RoHS

compliant.

7 Internal model, that is, product name.

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Technical White Paper A Appendix

A.3 Operating Temperature Limitations

Table A-6 Operating temperature limitations
Configuratio Maximum Maximum Maximum Maximum
n Operating Operating Operating Operating
Temperature Temperature Temperature Temperature
30℃ (86°F) 35°C (95°F) 40°C (104°F) 45°C (113°F)

4 x 3.5" drive ● 6434/6434 ● 6434/6434 ● CPUs with ● Not

pass-through H H /6438Y+ TDP supported.
configuration and CPUs and CPUs greater
with TDP with TDP than 185 W
greater greater are not
than 205 W than 205 W supported.
are not are not ● A2 GPU
supported. supported. cards are
● A2 GPU not
cards are supported.
not ● Rear HDDs
supported. are not
● Rear HDDs supported.
are not ● Supercapa
supported. citors are
not
supported.
● OCP 3.0
NICs
whose rate
is greater
than 100
Gbit/s are
not
supported.
● PCIe NICs
whose rate
is greater
than 100
Gbit/s are
not
supported.

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Configuratio Maximum Maximum Maximum Maximum

n Operating Operating Operating Operating
Temperature Temperature Temperature Temperature
30℃ (86°F) 35°C (95°F) 40°C (104°F) 45°C (113°F)

8 x 2.5" drive ● A2 GPU ● A2 GPU ● 6434/6434 ● CPUs with

pass-through cards are cards are H and TDP
configuration not not CPUs with greater
supported supported. TDP than 185 W
when the ● Rear HDDs greater are not
CPU with are not than 250 W supported.
TDP supported. are not ● A2 GPU
greater supported. cards are
than 270 W ● A2 GPU not
is cards are supported.
configured. not ● Rear drives
supported. are not
● Rear HDDs supported.
are not ● OCP 3.0
supported. NICs
● Supercapa whose rate
citors are is greater
not than 25
supported. Gbit/s are
● OCP 3.0 not
NICs supported.
whose rate ● PCIe NICs
is greater whose rate
than 100 is greater
Gbit/s are than 25
not Gbit/s are
supported. not
● PCIe NICs supported.
whose rate ● Supercapa
is greater citors are
than 100 not
Gbit/s are supported.
not
supported.

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Technical White Paper A Appendix

Configuratio Maximum Maximum Maximum Maximum

n Operating Operating Operating Operating
Temperature Temperature Temperature Temperature
30℃ (86°F) 35°C (95°F) 40°C (104°F) 45°C (113°F)

10 x 2.5" drive ● A2 GPU ● A2 GPU ● 6434/6434 ● CPUs with

pass-through cards are cards are H and TDP
configuration not not CPUs with greater
1 and 2 supported supported. TDP than 185 W
when the ● Rear HDDs greater are not
CPU TDP are not than 250 W supported.
is higher supported. are not ● A2 GPU
than 270 supported. cards are
W. ● A2 GPU not
cards are supported.
not ● The rear
supported. drive is not
● Rear drives supported.
are not ● OCP 3.0
supported. NICs
● Supercapa whose rate
citors are is greater
not than 25
supported. Gbit/s are
● OCP 3.0 not
NICs supported.
whose rate ● PCIe NICs
is greater of 25 Gbit/s
than 100 or higher
Gbit/s are are not
not supported.
supported. ● Supercapa
● PCIe NICs citors are
whose rate not
is greater supported.
than 100
Gbit/s are
not
supported.

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FusionServer 1288H V7 Server
Technical White Paper A Appendix

Configuratio Maximum Maximum Maximum Maximum

n Operating Operating Operating Operating
Temperature Temperature Temperature Temperature
30℃ (86°F) 35°C (95°F) 40°C (104°F) 45°C (113°F)

10 x 2.5" drive ● A2 GPU ● A2 GPU ● 6434/6434 ● CPUs with

pass-through cards are cards are H and TDP
configuration not not CPUs with greater
3 supported supported. TDP than 185 W
when the greater are not
CPU with than 250 W supported.
TDP are not ● A2 GPUs
greater supported. are not
than 270 W ● A2 GPUs supported.
is are not
configured. ● Rear drives
supported. are not
● Rear drives supported.
are not ● OCP 3.0
supported. NICs
● Supercapa whose rate
citors are equals to
not or is
supported. greater
● OCP 3.0 than 25
NICs Gbit/s are
whose rate not
is greater supported.
than 100 ● PCIe NICs
Gbit/s are whose rate
not equals to
supported. or is
● PCIe NICs greater
whose rate than 25
is greater Gbit/s are
than 100 not
Gbit/s are supported.
not ● Supercapa
supported. citors are
not
supported.

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FusionServer 1288H V7 Server
Technical White Paper A Appendix

Configuratio Maximum Maximum Maximum Maximum

n Operating Operating Operating Operating
Temperature Temperature Temperature Temperature
30℃ (86°F) 35°C (95°F) 40°C (104°F) 45°C (113°F)

10 x 2.5" drive ● All ● A2 GPUs ● 6434/6434 ● CPUs with

NVMe configuratio are not H and TDP
configuration ns are supported. CPUs with equals to
supported. TDP or is
greater greater
than 250 W than 185 W
are not are not
supported. supported.
● CPUs with ● A2 GPUs
TDP are not
greater supported.
than 270 W ● OCP 3.0
are not NICs
supported. whose rate
● A2 GPUs equals to
are not or is
supported. greater
● Rear drives than 25
are not Gbit/s are
supported. not
supported.
● Supercapa
citors are ● PCIe NICs
not whose rate
supported. equals to
or is
● OCP 3.0 greater
NICs than 25
whose rate Gbit/s are
equals to not
or is supported.
greater
than 100 ● Rear drives
Gbit/s are are not
not supported.
supported. ● Supercapa
● PCIe NICs citors are
whose rate not
equals to supported.
or is
greater
than 100
Gbit/s are
not
supported.

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NO TE

● When a single fan is faulty, the highest operating temperature is 5°C (41°F) lower than the
rated value.
● When a single fan is faulty, the system performance may be affected.
● It is recommended that servers be deployed at an interval of 1U to reduce server noise and
improve server energy efficiency.
● Liquid-cooled processors are not supported.
● Rear GPU cards are not supported for the 4 x 3.5" drive pass-through configuration.
● Rear HDDs are not supported.

A.4 Nameplate
Certified Model Remarks

H12H-07 Global

A.5 RAS Features

The server supports a variety of Reliability, Availability, and Serviceability (RAS)
features. You can configure these features for better performance.

For details about RAS features, see the FusionServer Sapphire Rapids Platform
Server RAS Feature Technical White Paper.

A.6 Sensor List

Sensor Description Component

Inlet Temp Air inlet temperature Indicator board

Outlet Temp Air outlet temperature BMC card

PCH Temp PCH bridge temperature Mainboard

PCH Status PCH chip fault diagnosis Mainboard

health status

1711 Core Temp Core temperature of the BMC card

BMC management chip

SSD Max Temp Maximum SSD SSD

temperature (reported by
BMA)

CPUN Core Temp CPU core temperature CPUN

N indicates the CPU
number. The value is 1 or
2.

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Sensor Description Component

CPUN DTS Difference between the CPUN

real-time CPU N indicates the CPU
temperature and the CPU number. The value is 1 or
core temperature 2.
threshold

CpuN Margin Difference between the CPUN

real-time CPU N indicates the CPU
temperature and the CPU number. The value is 1 or
Tcontrol threshold 2.

CPUN MEM Temp CPU memory module Memory module

temperature corresponding to CPU N
N indicates the CPU
number. The value is 1 or
2.

CPUN 12V 12 V voltage supplied by Mainboard

the mainboard to the CPU N indicates the CPU
number. The value is 1 or
2.

CPUN Status CPU status detection CPUN

N indicates the CPU
number. The value is 1 or
2.

CPUN Memory CPU memory status Memory module

check corresponding to CPU N
N indicates the CPU
number. The value is 1 or
2.

CPUN UPI Link CPU UPI link fault Mainboard or CPU N

diagnosis health status N indicates the CPU
number. The value is 1 or
2.

CPUN Prochot CPU Prochot CPUN

N indicates the CPU
number. The value is 1 or
2.

CPUN VCCIN CPU VCCIN voltage Mainboard

N indicates the CPU
number. The value is 1 or
2.

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Sensor Description Component

CPUN FIVRA CPU FIVRA voltage Mainboard or CPU N

N indicates the CPU
number. The value is 1 or
2.

CPUN INFAON CPU INFAON voltage CPUN

N indicates the CPU
number. The value is 1 or
2.

CPUN VCCFA CPU VCCFA voltage CPUN

N indicates the CPU
number. The value is 1 or
2.

CPUN VCCD CPU VCCD voltage CPUN

N indicates the CPU
number. The value is 1 or
2.

CPUN VRD Temp CPU VRD temperature Mainboard

N indicates the CPU
number. The value is 1 or
2.

CPUN FIVRA Temp CPU FIVRA temperature CPUN

N indicates the CPU
number. The value is 1 or
2.

CPUN INFAON Temp CPU INFAON CPUN

temperature N indicates the CPU
number. The value is 1 or
2.

CPUN VCCFA Temp CPU VCCFA temperature CPUN

N indicates the CPU
number. The value is 1 or
2.

CPUN VCCD Temp CPU VCCD temperature CPUN

N indicates the CPU
number. The value is 1 or
2.

PSN VIN PSU N input voltage PSU N

N indicates the PSU
number. The value is 1 or
2.

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Sensor Description Component

PS$ IIn PSU input current PSUs

PS$ IOut PSU output current PSUs

PS$ POut PSU output power PSUs

PS$ Temp Maximum internal PSUs

temperature of the PSU

PS$ Inlet Temp PSU air inlet temperature PSUs

PSN Status PSU fault status PSU N

N indicates the PSU
number. The value is 1 or
2.

PSN Fan Status PSU fan fault status PSU N

N indicates the PSU
number. The value is 1 or
2.

PSN Temp Status PSU presence status PSU N

N indicates the PSU
number. The value is 1 or
2.

PS Redundancy Redundancy failure due PSUs

to PSU removal

Power Server input power PSUs

Disks Temp Maximum drive Drive

temperature

PowerN PSU input power PSU N

N indicates the PSU
number. The value is 1 or
2.

FANN F Speed Fan speed Fan module N

FANN R Speed N indicates the fan

module number. The
value ranges from 1 to 8.

FANN F Status Fan fault status Fan module N

FANN R Status N indicates the fan ID.

The value ranges from 1
to 8.

FANN F Presence Fan presence Fan module N

FANN R Presence N indicates the fan ID.

The value ranges from 1
to 8.

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Sensor Description Component

DIMMN DIMM status DIMM N

N indicates the DIMM slot
number.

RTC Battery RTC battery status. An RTC battery on the

alarm is generated when mainboard
the voltage is lower than
1 V.

Power Button Power button pressed Mainboard and power

button

Watchdog2 Watchdog Mainboard

Mngmnt Health Management subsystem Management module

health status

UID Button UID button status Mainboard

PwrOk Sig. Drop Voltage dip status Mainboard

PwrOn TimeOut Power-on timeout Mainboard

PwrCap Status Power capping status Mainboard

HDD Backplane Entity presence Drive backplane

HDD BP Status Drive backplane health Drive backplane

status

HDD BP$ Temp Drive backplane Drive backplane

temperature

RiserN Card Entity presence Riser card N

N indicates the riser card
slot number. The value is
1 or 2.

RiserN 12V 12 V voltage supplied by Mainboard

the mainboard to the riser N indicates the riser card
card slot number. The value is
1 or 2.

Riser$ Temp Riser card temperature Riser card

SAS Cable Entity presence SAS cable

LCD Status LCD health status LCD

LCD Presence LCD presence LCD

DISK$ Drive status Drive

RAID Presence RAID controller card RAID controller card

presence

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Sensor Description Component

RAID Temp Temperature of the RAID RAID controller card

controller card

Raid BBU Temp BBU temperature of the Supercapacitor of the

RAID controller card RAID controller card

PCIE Status PCIe status error PCIe card

PCIe$ OP Temp PCIe card optical module PCIe card

temperature

PCIe$ Temp PCIe card chip PCIe card

temperature

PCIe RAID$ Temp Temperature of the PCIe PCIe RAID controller card
RAID controller card

PCIe$ Card BBU BBU status of the PCIe PCIe RAID controller card
RAID controller card

PCIe NIC$ Temp PCIe card chip PCIe card

temperature

PCIe FC$ Temp PCIe card chip PCIe card

temperature

IB$ Temp IB NIC temperature IB card

M2 Adapter Temp M.2 adapter temperature M.2 adapter card

M2Disk1 Status of the M.2 drive on M.2 riser card

the riser card

M2Disk2 Status of the M.2 drive on M.2 riser card

the riser card

AreaIntrusion Listening to the Mainboard

unpacking action

OCP$ OP Temp OCP card optical module OCP 3.0 NICs

temperature

OCP$ Temp OCP card chip OCP 3.0 NICs

temperature

SSD Disk$ Temp SSD temperature SSD

GPU$ Power GPU card power GPU card

GPU$ Temp GPU card temperature GPU card

System Notice Hot restart reminder and N/A

fault diagnosis program
information collection

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Sensor Description Component

System Error System suspension or

restart. Check the
background logs.

ACPI State ACPI status

SysFWProgress Software processes and

system startup errors

SysRestart System restart causes

Boot Error Boot error

CPU Usage CPU usage

Memory Usage Memory usage

BMC Boot Up BMC startup event

BMC Time Hopping Time hopping

NTP Sync Failed NTP synchronization

failure and recovery
events

SEL Status SEL full or events being

cleared

Op. Log Full Operation log full or

events being cleared

Sec. Log Full Security log full or events

being cleared

Host Loss System monitoring

software (BMA) link loss
detection

ProductID Status Product identification

status

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FusionServer 1288H V7 Server
Technical White Paper B Glossary

B Glossary

B.1 A-E
B
BMC The baseboard management controller (BMC) complies
with the Intelligent Platform Management Interface
(IPMI). It collects, processes, and stores sensor signals,
and monitors the operating status of components. The
BMC provides the hardware status and alarm information
about the managed objects to the management system
so that the management system can implement unified
management of the devices.

E
ejector lever A part on the panel of a device used to facilitate
installation or removal of the device.

Ethernet A baseband local area network (LAN) architecture

developed by Xerox Corporation by partnering with Intel
and DEC. Ethernet uses the Carrier Sense Multiple
Access/Collision Detection (CSMA/CD) access method
and allows data transfer over various cables at 10 Mbit/s.
The Ethernet specification is the basis for the IEEE 802.3
standard.

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B.2 F-J
G
Gigabit Ethernet (GE) An extension and enhancement of traditional shared
media Ethernet standards. It is compatible with 10 Mbit/s
and 100 Mbit/s Ethernet and complies with IEEE 802.3z
standards.

H
hot swap Replacing or adding components without stopping or
shutting down the system.

B.3 K-O
K
KVM A hardware device that provides public keyboard, video
and mouse (KVM).

B.4 P-T
P
panel An external component (including but not limited to
ejector levers, indicators, and ports) on the front or rear
of the server. It seals the front and rear of the chassis to
ensure optimal ventilation and electromagnetic
compatibility (EMC).

Peripheral A computer bus PCI, which uses the existing PCI

Component programming concepts and communication standards,
Interconnect Express but builds a faster serial communication system. Intel is
(PCIe) the main sponsor for PCIe. PCIe is used only for internal
interconnection. A PCI system can be transformed to a
PCIe system by modifying the physical layer instead of
software. PCIe delivers a faster speed and can replace
almost all AGP and PCI buses.

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R
redundancy A mechanism that allows a backup device to
automatically take over services from a faulty device to
ensure uninterrupted running of the system.

redundant array of A storage technology that combines multiple physical

independent disks drives into a logical unit for the purposes of data
(RAID) redundancy and performance improvement.

S
server A special computer that provides services for clients over
a network.

system event log Event records stored in the system used for subsequent
(SEL) fault diagnosis and system recovery.

B.5 U-Z
U
U A unit defined in International Electrotechnical
Commission (IEC) 60297-1 to measure the height of a
cabinet, chassis, or subrack. 1U = 44.45 mm (1.75 in).

UltraPath A point-to-point processor interconnect developed by

Interconnect (UPI) Intel.

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Technical White Paper C Acronyms and Abbreviations

C Acronyms and Abbreviations

C.1 A-E
A
AC alternating current

AES Advanced Encryption Standard New Instruction Set

ARP Address Resolution Protocol

AVX Advanced Vector Extensions

B
BBU backup battery unit

BIOS Basic Input/Output System

BMC baseboard management controller

C
CCC China Compulsory Certification

CD calendar day

CE Conformite Europeenne

CIM Common Information Model

CLI command-line interface

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D
DC direct current

DDR5 Double Data Rate 5

DDDC double device data correction

DEMT Dynamic Energy Management Technology

DIMM dual in-line memory module

DRAM dynamic random-access memory

DVD digital video disc

E
ECC error checking and correcting

ECMA European Computer Manufacturer Association

EDB Execute Disable Bit

EID enclosure ID

EN European Efficiency

ERP enterprise resource planning

ETS European Telecommunication Standards

C.2 F-J
F
FB-DIMM Fully Buffered DIMM

FC Fiber Channel

FCC Federal Communications Commission

FCoE Fibre Channel over Ethernet

FTP File Transfer Protocol

G
GE Gigabit Ethernet

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GPIO General Purpose Input/Output

GPU graphics processing unit

H
HA high availability

HBM high bandwidth memory

HDD hard disk drive

HPC high-performance computing

HTTP Hypertext Transfer Protocol

HTTPS Hypertext Transfer Protocol Secure

I
iBMC intelligent baseboard management controller

IC Industry Canada

ICMP Internet Control Message Protocol

IDC Internet Data Center

IEC International Electrotechnical Commission

IEEE Institute of Electrical and Electronics Engineers

IGMP Internet Group Message Protocol

IOPS input/output operations per second

IP Internet Protocol

IPC Intelligent Power Capability

IPMB Intelligent Platform Management Bus

IPMI Intelligent Platform Management Interface

C.3 K-O
K
KVM keyboard, video, and mouse

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L
LC Lucent Connector

LRDIMM load-reduced dual in-line memory module

LED light emitting diode

LOM LAN on motherboard

M
MAC media access control

MMC module management controller

N
NBD next business day

NC-SI Network Controller Sideband Interface

O
OCP Open Compute Project

C.4 P-T
P
PCIe Peripheral Component Interconnect Express

PDU power distribution unit

PHY physical layer

PMBUS power management bus

POK Power OK

PWM pulse-width modulation

PXE Preboot Execution Environment

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R
RAID redundant array of independent disks

RAS reliability, availability and serviceability

RDIMM registered dual in-line memory module

REACH Registration Evaluation and Authorization of Chemicals

RJ45 registered jack 45

RoHS Restriction of the Use of Certain Hazardous Substances

in Electrical and Electronic Equipment

S
SAS Serial Attached Small Computer System Interface

SATA Serial Advanced Technology Attachment

SCM supply chain management

SDDC single device data correction

SERDES serializer/deserializer

SGMII serial gigabit media independent interface

SMI serial management interface

SMTP Simple Mail Transfer Protocol

SNMP Simple Network Management Protocol

SOL serial over LAN

SONCAP Standards Organization of Nigeria-Conformity

Assessment Program

SSD solid-state drive

SSE Streaming SIMD Extension

T
TACH tachometer signal

TBT Turbo Boost Technology

TCG Trusted Computing Group

TCM trusted cryptography module

TCO total cost of ownership

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TDP thermal design power

TELNET Telecommunication Network Protocol

TET Trusted Execution Technology

TFM TransFlash module

TFTP Trivial File Transfer Protocol

TOE TCP offload engine

TPM trusted platform module

C.5 U-Z
U
UBC Union Bus Connector

UBC DD Union Bus Connector Double Density

UDIMM unbuffered dual in-line memory module

UEFI Unified Extensible Firmware Interface

UID unit identification light

UL Underwriter Laboratories Inc.

UPI UltraPath Interconnect

USB Universal Serial Bus

V
VCCI Voluntary Control Council for Interference by Information
Technology Equipment

VGA Video Graphics Array

VLAN virtual local area network

VRD voltage regulator-down

VROC Virtual RAID on CPU

W
WEEE waste electrical and electronic equipment

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WSMAN Web Service Management

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