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Notebook Disassembly Guide

The document provides a disassembly procedure for a notebook computer. It consists of 12 steps to remove parts like the bottom door, top case module, battery module, memory module, and more. Proper tools and precautions are described to prevent damage during disassembly. Each step lists the parts removed and includes pictures to illustrate the process.

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Dima Rozhencov
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0% found this document useful (0 votes)
563 views36 pages

Notebook Disassembly Guide

The document provides a disassembly procedure for a notebook computer. It consists of 12 steps to remove parts like the bottom door, top case module, battery module, memory module, and more. Proper tools and precautions are described to prevent damage during disassembly. Each step lists the parts removed and includes pictures to illustrate the process.

Uploaded by

Dima Rozhencov
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd

Disassembly Procedure

Rev. Change History Change Time Originator


V1.0 First Release 2018/08/21 Stephanie

Disassembly Procedure
Please follow the information provided in this section to perform the complete disassembly procedure of the
Notebook. Be sure to use proper tools described before.

A
SUS GX531GS_GM notebook consists of various modules. This chapter describes the procedure for the
complete notebook disassembly and assembly (Assemble document please look up from the last
page). In addition, in between procedures, the detailed disassembly procedure of individual modules will
be provided for your service needs.

The disassembly procedure consists of the following steps:


 Service overview
 Appropriate Tools
 BOTTOM DOOR
 Top Case Module
 Battery Module
 Memory Module
 SSD Module
 IO BOARD
 HINGE COVER
 Thermal & FAN Module
 Main Board
 LCD Module
 Gap Step

2-1 V1.0
Disassembly Procedure

Service Overview
Please pay special attention to the cautions below to prevent any damages to the notebook and also please be
sure to select the appropriate tools described in this section to perform any services desired.

Precautions
Before you perform any service and or repair on the notebook, please follow the steps below first.

1. Be sure that the notebook is powered down.

2. Disconnect the AC plug from the notebook.

3. Remove all rings, watches and any other metal objects from your hands.

4. Always wear a ground strap on your hand to protect the notebook from static discharge.
5. Please refer to “ANSI ESD S20.20” about ESD protection measure.
6. Put disassemble the parts in the functional PE BAG for avoid any damages of the A/B/C/D part.

7. Environment temperature is 20-30 ℃ and humidity is 40% - 70%.


8. Avoid scratching the surface of the machine, please use anti-static and soft materials to put on desk in
repair environment as below photo.

2-2 V1.0
Disassembly Procedure

9. Screw Appearance Criteria.


If the screws have the following damaged appearance, please do not use.
a. Shape deformed
b. Paint scratched off
c. Rusty

d. Damaged head – unable to drive in

e. Damaged unable to securely tighten

BACK

2-3 V1.0
Disassembly Procedure

Appropriate Tools
The illustrations below show the appropriate tools that should be used for the notebook’s service and repair.

Cross Screwdriver
Please according to different screw specification and choose different screwdriver and head.
Below photos are for reference only.

Use a cross screwdriver to fasten/remove screws.

Plastic Blade (PN: 20LT0-0005O000)

Tweezers
Use a pair of tweezers to remove/insert flexible cables.

2-4 V1.0
Disassembly Procedure

Thickness gauge (PN: 20LT0-0002J000)


Thickness compass specification 0.05mm-1.5mm
Use it to measure the gap.

Hand rollers (PN: 20LT0-00082000,order or local buy)


Use the roller to press touch pad mylar.

BACK

2-5 V1.0
Disassembly Procedure

BOTTOM DOOR
The illustrations below show how to remove the Bottom door.

1. Follow below numbers to remove 4 screws on door.


Assembly Notice: Follow the reverse numbers to lock screws.
Screw tightening torque (Kg F-cm): 2.0kg

Screw information:
13GMBKXC030Z-1 SCR
EW M2*3L (K) B-ZN
1 2 34

2. Open door as below picture (90 degree) and take door away.

Open 90 degree

2-6 V1.0
Disassembly Procedure

Snaps as below:

Parts

 Total screw *4 BACK


 GX531GM-1A BOTTOM DOOR ASSY//巨寶精密*1

2-7 V1.0
Disassembly Procedure

TOP case Module


The illustration below shows how to remove the Top case module.

1. Follow below numbers to remove 19 screws on the bottom case module.


Assembly Notice: Follow the reverse numbers to lock screws.
Screw tightening torque (Kg F-cm): 2.0kg

Screw information:
13050-74906320 SCREW
M2*6L (4.5,0.8) (K)+H T5
KL MACHINE PVD NY

Screw information:
13GMBKXC050Z-1 SCR
EW M2*5L (K) B-ZN

2-8 V1.0
Disassembly Procedure

2. Remove 2 screw on LED FPC and tear off the Mylar with tweezers.
Assembly Notice: Screw tightening torque (Kg F-cm): 0.5kg

Screw information:
13050-70802100 SCREW
M2*2L (3.5,0.5)
(K)#0//KL,MACHINE NY

13NB0GU0L27011
GX501VIK BTM EMI
GASKET

08701-00171000
3. Disconnect the FPC and take it away. GX531GM LED FPC
R1.1

2
. 2
.
1 1
. .

2-9 V1.0
Disassembly Procedure

4. Remove Top case with Plastic Blade.

1. 3.

4. 2.

2. 4.
1.

3.

5. Open Top case and disconnect battery connector/FFC /KB FPC/TP FFC in turn.
Notice: Before disassembly, please be sure to disconnect the battery more than ten seconds in order to
avoid IC damage.

Snaps as below:

2 - 10 V1.0
Disassembly Procedure

6. Disconnect TP FFC.

2 - 11 V1.0
Disassembly Procedure

7. Take the top case away.

Parts
 Total screw *19
 GX531GM TP FFC 12P 0.5,L197.5//XINYA/X18AA1-4227-HF *1
 GX531GM LED FPC R1.1 *1
 GX501VIK BTM EMI GASKET *1
 GX531GS-1A KB TOP CASE HOUS US// *1
(Actual part name depends on different SKU.)

BACK

2 - 12 V1.0
Disassembly Procedure

Battery Module
The illustration below shows how to remove the battery module.
1. Disconnect IO FFC.

2. Follow below numbers to remove 2 screws on the Battery module and take it away.
Assembly Notice: Follow the reverse numbers to lock screws.
Screw tightening torque (Kg F-cm): 2.0kg

Screw information:
13050-00060000 SCREW
M2*3.5L(4.5,0.5)(K) B-ZN

Parts

 Total screw *2
 GX531GM BATT/ATL POLY/C41N1805//DYNA/387175/4S1P/15.4V/50WH *1
(Actual part name depends on different SKU.)

BACK

2 - 13 V1.0
Disassembly Procedure

Memory Module
The illustration shows how to remove the Memory module.

1. Remove memory module.

Parts:

 DDR4 DIMM 260P 4H STD//ARGOSY/D4AS0-26001-1P40 *1


(Actual part name depends on different SKU.)

BACK

2 - 14 V1.0
Disassembly Procedure

SSD Module
The illustration below shows how to remove the SSD module.

1. Use tweezers to tear off the label from SSD.


Please stick the 'WARRANTY VOID' label on SSD when reassemble SSD module.
(PN: 15G10N338000 'WARRANTY VOID' LABEL (15*5MM)//V1.0)

2. Remove 1 screw from SSD and take SSD away. .


Assembly Notice: Follow the reverse numbers to lock screws.
Screw tightening torque (Kg F-cm): 2.0kg

Screw information:
13050-72802100 SCREW
M2*2L (6.2,0.55) (K)

13NR0100T01011
GX531GM TH SSD
PAD//LAIRD

Parts
 Total screw *1
 SSD P3X2 512GB M2 2280 NVME//WD/SDAPNUW-512G-1002/20110000*1 BACK
(Actual part name depends on different SKU.)

2 - 15 V1.0
Disassembly Procedure

IO BOARD
The illustration below shows how to remove the IO board.

1. Remove 2 screws on IO board.


Assembly Notice: Follow the reverse numbers to lock screws.
Screw tightening torque (Kg F-cm): 2.0kg

Screw information:
13050-72802100 SCREW
M2*2L (6.2,0.55) (K)

2. Disconnect IO FFC.

Parts
 Total screw *2
 GX531GS IO BOARD R2.0//GBM(CQ) 2.76*0.81,10L(1)1.05MM *1
(Actual part name depends on different SKU.)

BACK

2 - 16 V1.0
Disassembly Procedure

HINGE COVER
The illustration below shows how to remove the HINGE COVER.

1. Close LCD and disconnect speaker cable & LED FFC.

2 - 17 V1.0
Disassembly Procedure

Snaps as below:

2. Remove 2 screws on LED board.


Assembly Notice: Follow the reverse numbers to lock screws.
Screw tightening torque (Kg F-cm): 2.0 kg

Screw information:
3. Disconnect LED FFC.
13050-00060000 SCREW
M2*3.5L(4.5,0.5)(K) B-ZN

4. Remove 4 screws on Speaker.


Assembly Notice: Follow the reverse numbers to lock screws.
Screw tightening torque (Kg F-cm): 2.0kg

Screw information:
13050-72802190 SCREW
M2*2L (8.0,0.5)(K)#1

2 - 18 V1.0
Disassembly Procedure

Parts
 Total screw *6
 GX531GM-1A HINGE COVER SUBASM//DAZHI *1
 GX531GS LED BOARD R2.0//GBM(CQ) 1.3*0.5,10L(1)1.05MM *1
 GX531GM LED FFC 6P 0.5,L53//GOO DONG/G12119-A *1
 GX531GM SPEAKER//ASAP/NB02-034011-024H *1

BACK

2 - 19 V1.0
Disassembly Procedure

Thermal & FAN Module


The illustration below shows how to remove the thermal & fan module.

1. Disconnect Power FFC.


Notice: Thermal pad comes with thermal module.

2. Remove 1 screws on power board.


Assembly Notice: Follow the reverse numbers to lock screws.
Screw tightening torque (Kg F-cm): 2.0kg

Screw information:
13GMBKXC050Z-1 SCREW
M2*5L (K) B-ZN

3. Remove 11 screws on thermal module.


Assembly Notice: Follow the reverse numbers to lock screws.
Screw tightening torque (Kg F-cm): 2.0kg

Screw information:
13GMBK3C040W-1
SCREW M2*4L D4.6 (K)

2 - 20 V1.0
Disassembly Procedure

4. Disconnect Antenna and tear off the mylar.


Notice: Thermal pad comes with thermal module.

13NB0GU0L21011
GX501VIK ANTENNA
TAPE//TENYI

5. Disconnect EDP cable and tear off the mylar.


Notice: Thermal pad comes with thermal module.

13GNTJ10L200-1
K46CM TP EMI
FOIL//GAINTEK

6. Disconnect Fan cable, then take two fans away.

2 - 21 V1.0
Disassembly Procedure

Parts:

 Total screw *12


 GX531GM THERMAL ASSY//AURAS *1
 GX531GM THERMAL CPU FAN//FORCECON *1
 GX531GS THERMAL VGA FAN//FORCECON *1
 GX531GS POWER BOARD R2.0//GBM(CQ) 1.3*0.6,10L(1)1.05MM *1

BACK

2 - 22 V1.0
Disassembly Procedure

Main Board
The illustrations below show how to remove the main board.

1. Disconnect cable and FFC.

a b

a. Remove BATT-LI CR1220.


b.

13NB0GU0L21011
GX501VIK ANTENNA
TAPE//TENYI

c. Disconnect power FFC.

2. Remove 4 screws on MB.


Assembly Notice: Follow the reverse numbers to lock screws.
Screw tightening torque (Kg F-cm): 2.0kg

Screw information:
13050-72802100 SCREW
M2*2L (6.2,0.55) (K)

2 - 23 V1.0
Disassembly Procedure

3. Remove 2 screws on right and left hinge.


Assembly Notice: Follow the reverse numbers to lock screws.
Screw tightening torque (Kg F-cm): 2.0kg

Screw information:
13GMBKXC050Z-1 SCR
EW M2*5L (K) B-ZN

4. Close LCD and remove 2 screws on hinge.


Assembly Notice: Follow the reverse numbers to lock screws.
Screw tightening torque (Kg F-cm): 2.0kg

Screw information:
13GMBKXC050Z-1 SCR
EW M2*5L (K) B-ZN

2 - 24 V1.0
Disassembly Procedure

Parts

 Total screw *8
 GX531GM-1A BOTTOM CASE SUBASM//巨寶精密 *1
 GX531GM POWER FFC 4P 0.5,L196//XINYA/X18AA1-4225-HF *1
 BATT-LI CR1220 3V/35mAH//KTS/BCR1220H2.8AM1ZB *1
 GX531GS MAIN BD._8G/I7-8750H//R2.0 (V8G_SAMSUNG) *1
(Actual part name depends on different SKU.)

BACK

Notice: The notch location of CPU Mylar matches the triangle symbol of CPU.

2 - 25 V1.0
Disassembly Procedure

Notice: If the machine is with backlight K/B, after change the mainboard, please pay attention for below
instructions.

1. How to judge with backlight K/B?


Please check KB whether with backlight if F3/F4 can adjust brightness.

2. How to enable backlight?


Please refer to instructions from SIP to enable K/B backlight. SIP path is as below.
[Link]

2 - 26 V1.0
Disassembly Procedure

Notice: These pictures for your reference for mylar/gasket/sponge etc. of MB.

2 - 27 V1.0
Disassembly Procedure

LCD Module
The illustration below shows how to remove the LCD module.

1. Pry up LCD bezel by hand and take it away.

3.

4. 2.

1.

Snaps as below:

2. Remove 6 screws on hinge.


Assembly Notice: Follow the reverse numbers to lock screws.
Screw tightening torque (Kg F-cm): 2.5kg

Screw information:
13050-B2802040 SCREW
M2.5*2.5L(7.5,0.6)(K) #1

2 - 28 V1.0
Disassembly Procedure

3. Remove right & left hinge with tweezers.


Notice: When you assemble Antenna, White on the left side and black one the right side.
Antenna & EDP cable must well place in the notch of the hinge cover.

13NR0100M04011
13NR0100M03011 GX531GM LCD HINGE
GX531GM LCD HINGE COVER R//萬承精密
COVER L//萬承精密

13NR0100M05021 13NR0100M06021
GX531GM LCD GX531GM LCD
HINGE L//兆利 HINGE R//兆利

2 - 29 V1.0
Disassembly Procedure

4. Remove 2 LCD panel adhesives on the LCD cover.


Notice: Slowly pull the adhesive up about 30 degrees.

Notice: How to remove the LCD adhesive. Please refer to the below information.

Notice: You can download the video from the link below to learn how to remove the
adhesive. (Video name: GL504GS LCD Disassemble )
[Link]

Notice :please slowly pull the adhesive up about 30 degree.

30゜

5. Overturn LCD panel and tear off the tape, then disconnect cable.

2 - 30 V1.0
Disassembly Procedure

6. Remove EDP cable.


Assembly Notice: Please well arrange the cables and put it in the hook slot as below.
Please hold the connectors and carefully pull out the CMOS cable. And don’t pull the cable hard in case
the cable may be tore from the connector.

7. Tear off the tape and disconnect cable from camera, then use tweezers to pry up the camera module.
Disassembly Notice: Due to the camera is very easy to be broken off, please carefully when take it away.

13NR0100L06011
GX531GM LCD MIC
RUBBER//YANGSHUO

2 - 31 V1.0
Disassembly Procedure

8. Remove Antenna.
Assembly Notice: Please well arrange the cables and put it in the hook slot as below.

08701-00200000
GX531GM CAMERA
FPC R1.0

Parts

 Total screw *6
 GX531GM-1A LCD BEZEL SUB ASSY//MPT*1
 GX531GM LCD HINGE L//兆利 *1
 GX531GM LCD HINGE R//兆利 *1
 GX531GM LCD HINGE COVER R//萬承精密 *1
 GX531GM LCD HINGE COVER L//萬承精密 *1
 GX531GM-1A LCD COVER SUB ASSY//DAZHI *1
 GX531GM EDP CABLE//ASAP/LA05LW009-1H *1
 GX531GM CAMERA FPC R1.0//CMI 9.07*0.24,2L(1)0.15MM *1
 CAMERA HD FIX 3.3V ARRAYMIC CR//AZWAVE/AM-7BF56C1-C *1
 GX531GM LCD MIC RUBBER//YANGSHUO *2
 GX531GM WIFI ANTENNA//ASAP/LA9RF125-CS-H *1
 LCD 15.6' FHD WV 2.6 EDP 144HZ//AUO/B156HAN08.2(H/W:4A) *1
(Actual part name depends on different SKU.)

BACK

2 - 32 V1.0
Disassembly Procedure

Gap Step

2 - 33 V1.0
Disassembly Procedure

2 - 34 V1.0
Disassembly Procedure

2 - 35 V1.0
Disassembly Procedure

BACK

2 - 36 V1.0

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