1.

5A Surface Mount Type・Output Variable・Buck Switching Regulator IC

SI-8008TMX Jan. 2010

◆General description ◆Package

SI-8008TMX attains an oscillation frequency of 300kHz, Package name: TO252-5
and has an integrated miniaturized choke coil, allowing it
to serve as a high efficiency power supply in a compact
TO252-5 (equivalent to SC-63).
SI-8008TMX regulators provides various features and
protection functions (overcurrent and thermal protection)
which are necessary for switching regulators.
Only 6 external components are required, and provides
high efficiency switching regulation without any need for
adjustment.
Device supplies 1.5A output current in a compact surface
mount package.

◆Applications ◆ Specification
SI-8008TMX (variable type)
 DVD recorder, FPD TV
 OA equipment (printers, etc) Input voltage 43V
 On-board local power supplies, Output current 0 - 1.5A
0.8V±2%
Output voltage
(reference voltage)
Efficiency 81%
(MAX) (5V output)

◆Features
 High efficiency 81% (VIN=15V, Io=0.5A)  Built-in drooping-type-overcurrent and thermal
 Shutdown supply current: 1μA(MAX) protection circuits
 Requires only 6 discrete components ●Built-in on-off pin (Active Hi) Off in open
 Built-in reference oscillator (Oscillating
frequency:300kHz(TYP)

Typical application circuit

L 47uH
1 2 C1：220μF
VIN IN SW VO
C2：470μF
SI-8008TM
SI-8008TMX R1 L1：47μH
ADJ 4
C1 Vc GND
R2 C2 Di：SJPB-H6 (Sanken)
220uF 5 3 Di 470uF
IADJ

GN
GND
D

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1. Scope
This specification shall apply to the IC SI-8008TMX for buck switching regulator

2. Outline
Type Semiconductor integrated circuits (monolithic IC)

Structure Resin molding type (transfer molding)

・ DC regulated power supplies

・ Telecommunication on-board local power supplies
Application
・ OA equipment
・ Stabilization of secondary output voltage of switching regulator

3. Absolute maximum ratings

3.1 Absolute maximum ratings
Item Symbol Ratings Unit Conditions
Input voltage VIN 43 V
Output ON/OFF control pin voltage VC VIN V
Glass epoxy board mounting
Allowable dissipation 1 PD1 1.06 W
(900mm2, copper foil area 4.3%)
Glass epoxy board mounting
Allowable dissipation 2 PD2 1.65 W
(900mm2, copper foil area 50%)
The product incorporates the thermal
shut down circuit, and it may operate
when the junction temperature
Junction temperature Tj −30 - 150 °C exceeds 130°C.
It is recommended to design below
125°C for the junction temperature in
operation.
Storage temperature Tstg −40 - 150 °C
Thermal resistance (junction – case) θj-c 6 °C /W
Glass epoxy board mounting
Thermal resistance (junction – ambient) θj-a 95 °C /W
(900mm2, copper foil area 4.3%)

3.2 Recommended operation conditions

Ratings
Item Symbol Unit Conditions
MIN MAX
Input voltage range VIN Vo+3 *1 40 V IO=0 - 1.5A
Output voltage range VO 0.8 - 24 V
Output current range IOUT 0 - 1.5 A VIN≧VO+3V *2
Junction temperature range in operation TjOP −20 - 100 °C
Operation temperature range TOP −20 - 85 °C *2
*1 The minimum value of input voltage range is 4.5V or VO + 3V whichever higher.
IOUT=1A (MAX) when VIN= VO+2 - VO+3V.
*2 It is necessary to use within the thermal derating curve (refer to 4－3).

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4. Electrical characteristics
4.1 Electrical characteristics (Ta=25°C, VOUT=5V, R1=4.2kΩ, R2=0.8kΩ)
Ratings
Item Symbol Unit Conditions
MIN TYP MAX
Reference voltage VADJ 0.784 0.800 0.816 V VIN=15V，IO=0.1A
VIN=15V,
Reference voltage temperature ⊿VADJ/⊿T ±0.1 mV/°C
IO=0.1A, Tc=0 - 100°C
Efficiency *3 η 81 % VIN=15V, IO=0.5A
Switching frequency fO 300 kHz VIN=15V, IO=0.5A
Line regulation VLine 60 80 mV VIN=10 - 30V, IO=0.5A
Load regulation VLoad 10 40 mV VIN=15V, IO=0.2 - 1.5A
Over current protection starting
IS 1.6 A VIN=15V
current
ON/OFF control
voltage VC、IH 2.0 V
(output ON)
ON/OFF control
ON/OFF pin *4 voltage VC、IL 0.8 V
(output OFF)
ON/OFF control
current IC,IH 8 20 μA VC=2V
(output ON)
Shutdown Supply Current 1 Iq 6 mA VIN=15V, IO=0A
VIN=15V
Shutdown Supply Current 2 Iq(off) 1 μA
VC=0V
*3 Efficiency should be calculated by using the following equation: Efficiency should be calculated by using the
following equation: V ･I
η(%)= VIO ･IO ×100
N IN

*4 Output control pin Vc turns off in open. Each input level is equivalent to LS-TTL. Therefore the direct drive by
LS-TTL is available.

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4.2 Typical characteristics (Ta=25°C)

(1) Efficiency
SI-8008TMX Efficiency
SI-8008TM Io－効率
Vout=1v設定
R1=0.2kΩ,R2=0.8kΩ
60

55
Efficiency %

50
効率　%

Vin=5v
45
Vin=10v
40

35
30
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6
Iout　A

SI-8008TMX Efficiency
SI-8008TM Io－効率
Vout=3.3v設定
R1=2.5kΩ,R2=0.8kΩ
85
80
Vin=6v
75
Efficiency %

Vin=10v
効率　%

70 Vin=15v
65 Vin=20v
Vin=30v
60
Vin=40v
55
50
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6
Iout　A

SI-8008TMX Efficiency
SI-8008TM Io－効率
Vout=5v設定
R1=4.2kΩ,R2=0.8kΩ
85
80
75 Vin=8v
Efficiency %

Vin=15v
効率　%

70
Vin=20v
65
Vin=30v
60 Vin=40v
55
50
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6
Iout　A

SI-8008TMX
SI-8008TM Io－効率
Efficiency
Vout=12v設定
R1=11.2kΩ,R2=0.8kΩ
95
90
85 Vin=15v
Efficiency %

80
効率　%

75 Vin=20v
70 Vin=30v
65
60 Vin=40v
55
50
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6
Iout　A

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In case of the setup of VO=5V (R2=0.8kΩ)

(2) Output voltage rising *Load=C.R (5) Overcurrent protection characteristics
6 6

5 5
VIN=8, 10, 20, 30, 40V
Output voltage VO (V)

Output voltage VO (V)

4 4

IO= 0A
3 3
0.1A
0.5A
2 1.0A 2
1.5A
1 1

0 0
0 2 4 6 8 10 0.5 1 1.5 2 2.5 3
Input voltage VIN (V) Output current IO (A)

(3) Load regulation 10 (6) Shutdown supply current

5.06
Shutdown supply current (mA)

5.04
8
5.02 VIN=40V
5.00 30V IO=0A
Output voltage VO (V)

20V 6
4.98
15V
4.96
10V
4.94 4
4.92
8V

4.90 2
4.88
4.86
4.84 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0 10 20 30 40
Input voltage VIN (V)
Output current IO (A)
(4) Thermal shutdown
Output voltage VO (V)

VIN=8V
IO=0.01A

TSD OFF TSD ON

20 40 60 80 100 120 140 160 180

Junction temperature Ta (°C)

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4.3 Thermal derating

Tj(MAX)=125°C
SI-8000TM series Thermal derating curve  100   V 
PD  VO  I O   1  VF  I O 1  O 
 x   VIN 
VO: Output voltage
VIN: Input voltage
Glass epoxy board 30×30mm
IO: Output current
Copper area:
ηx: Efficiency (%)
Copper area VF: Di forward voltage
SFPB66･･0.5V
(IO=1.5A)
Copper area
Allowable power dissipation Pd (W)

Copper area

Copper area

Copper area

Ambient Temperature Ta (°C)

Note 1: As the efficiency is subject to the input voltage and output current, it shall be obtained from the efficiency curve
in page 4 and substituted in percent.
Note 2: Thermal design for Di shall be made separately.

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4.4 Reference data

(1) Thermal data

SI-3000KM/KMS　銅箔面積ー熱抵抗
SI-8000TMX Copper area―Thermal resistance

100
90
80
θ j-a　（℃/W）

70
60
50
40
10 100 1000
Copper
銅箔面積　（㎜area (mm22）)

(2) Allowable dissipation

Copper area―Allowable power dissipation =100°C

銅箔面積－許容損失Tjmax=100℃
Allowable power dissipation (W)

1.5
許容損失Pd　(W）

Ta=25℃

1 40℃
60℃

0.5
85℃

0
10 100 1000
銅箔面積　（㎜2）
Copper area (mm2)

・How to obtain junction temperature

Temperature of lead portion of GND terminal:
The junction temperature is obtained by measuring Tc with the thermocouple etc. and substituting it in the following
equation.

Tj  PD  j  C  TC
(θj－C＝6°C/W)

TC measurement point

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5. Block diagram (Pin assignment)

SI-8008TMX
SI-8008TM
Vin SW L VO
1 IN 2
C1 Overcurrent Di C2
PReg 過電流保護
protection
Vc
5
ON/
Reset ﾗｯﾁ &&
Latch
OFF ﾘｾｯﾄ Driver R1
ﾄﾞﾗｲﾊﾞ

Oscillator
発振器
Comparator
ｺﾝﾊﾟﾚｰﾀ Thermal ADJ
過熱保護
Shut down
4

Error amp
ｴﾗｰｱﾝﾌﾟ
R2

Reference
基準電圧
voltage
GND
3

Di：SFPB66 (Sanken)

Recommended pattern The example of solder pattern design

6.0
GND

C1 8008TMX
C2
6.1

Vc Vc
＋ ＋
IN R1

SW R2
Di Vout 2.4 5.88

2.5

1.27 0.47 0.8

* In order to achieve the best operating conditions, the GND line shall be a
1-point GND wiring with No. 3 terminal in the center

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6. Typical application circuit

6.1 Standard circuit diagram
L 47uH
1 2
VIN IN SW VO C1：220μF
SI-8008TMX
SI-8008TM C2：470μF
R1
ADJ 4 L1：47μH * see Fig1
C1 Vc GND C2
R2
220uF 5 3 Di 470uF Di：SFPB66
IADJ
(Sanken)
GN
GND
D

Diode Di
For the diode Di, the Schottky barrier diode must be used.
If a fast recovery diode is used, the IC may be destroyed by applying reverse voltage due to the recovery and ON
voltage.
.
24
L1=125uH
Choke coil L1
・The efficiency may decrease and not reach the rated value if the
20
winding resistance of choke coil is large.
・Since the overcurrent protection start current is around 2.5A, care
L1=68uH
15
L1=100uH should be taken for the self heating of choke coil due to magnetic
saturation in overload and load short.
Vout
V ・Please refer to Fig.1 and select the inductance value when VOUT is set to
10V or higher.
10

L1=47uH

*Fig1choke coil L1
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.5
Iout A

Capacitor C1 and C2
・Since the high ripple current flows in C1 and C2, the capacitors with high frequency and low impedance for
switching power supply should be used. When the impedance of C2 is high, the abnormal switching waveform
can be caused in low temperature conditions.
Please avoid to use capacitors with extremely low direct equivalent resistance (ESR) such as OS capacitors and
tantalum capacitors because the abnormal oscillation can be caused.

Resistors R1, R2
・R1 and R2 are a resistor for setting the output voltage. The output voltage should be set in a way that IADJ may be
1mA or so. The equation to obtain R1 and R2 values is as follows:
・When setting VO=0.8V, R2 should be connected for stable operation.
・Recommended output voltage settings: Vo≧VIN×8%

R1 
VOUT  VADJ   VOUT  0.8 ，R2  VADJ 
0.8
≒ 0.8k 
3
I ADJ 110 I ADJ 110 3
◎In order to achieve the best operating conditions, it is necessary to assign each component with the shortest lines.

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7. Package information

7.1 Package type and physical dimensions

Unit: mm

*1
８００８ＴＭＸ
*2 *3
ＳＫ
*4

１ ２ ３ ４ ５ *1 Type number
*2 Logo mark
*3 Lot number
1st letter: The last digit of year
2nd letter: Month
(1 to 9 for Jan. to Sept.,O for Oct. N for
Nov. D for Dec.)
3rd letter: day
1 to 9 day: for “1” to “9”
10 to 31 day: for “A” to “Z”
(But, “B”,”I”,”O”,”Q” is removed.
*4 Administer number (Seven digits)

Pin assignment
1． IN
2． SW
3． GND
4． ADJ
5． VC

Products Weight: Approx.0.33g

7.2 Appearance
The body shall be clean and shall not bear any stain, rust or flaw.

7.3 Marking
The part number and lot number shall be clearly marked by laser on the body and shall not be erased easily.

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8 Package specification

Unit: mm

B:2±0.5
C
D
Tape pullout direction C:13.0±0.5

D: 21±0.8

W1：17±0.5
W2：21.5±1

Package amount: 3000pcs/reel

Antistatic nylon bag

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9. Operating precautions

9.1 Parallel operation

The parallel operation to increase the current is not available.

9.2 Thermal shut down

SI-8000TMX series has a thermal protection circuit.
This circuit protects the IC from self heatig by the over load.
This circuit cannot guarantee the long-term reliability against the continuously over load status.

9.3 Precaution for handling

Some terminals can be damaged by static electricity.

9.4 Others
 The contents in this document are subject to changes, for improvement and other purposes, without notice.
Make sure that this is the latest revision of the document before use.
 Application and operation examples described in this document are quoted for the sole purpose of reference for the
use of the products herein and Sanken can assume no responsibility for any infringement of industrial property
rights, intellectual property rights or any other rights of Sanken or any third party which may result from its use.
 When using the products herein, the applicability and suitability of such products for the intended purpose or object
shall be reviewed at the users’ responsibility.
 Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and
defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at
their own risk, preventative measures including safety design of the equipment or systems against any possible
injury, death, fires or damages to the society due to device failure or malfunction.
 Sanken products listed in this document are designed and intended for the use as components in general purpose
electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring
equipment, etc.). Before placing an order, the user’s written consent to the specifications is requested.
When considering the use of Sanken products in the applications where higher reliability is required (transportation
equipment and its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various
safety devices, etc.), please contact your nearest Sanken sales representative to discuss and obtain written
confirmation of your specifications, prior to the use of the products herein.
The use of Sanken products without the written consent of Sanken in the ap
plications where extremely high reliability is required (aerospace equipment, nuclear power control systems, life
support systems, etc.) is strictly prohibited.
 Anti radioactive ray design is not considered for the products listed herein.
 The contents in this document must not be transcribed or copied without Sanken’s written consent.

 This is notification that you, as purchaser of the products/technology, are not allowed to perform any of the
following:
1. Resell or retransfer these products/ technology to any party intending to disturb international peace and security.
2. Use these products/ technology yourself for activities disturbing international peace and security.
3. Allow any other party to use these products/ technology for activities disturbing international peace and security.
Also, as purchaser of these products/ technology, you agree to follow the procedures for the export or transfer of
these products/ technology, under the Foreign Exchange and Foreign Trade Law, when you export or transfer the
products/technology abroad.

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Appendix: Recommended soldering conditions

＜Storage condition＞
Temperature: 5 – 35°C
Humidity: 40 – 70%
Atmosphere: No poisonous gas generation and little dust.
No condensation.
＜Storage period＞
Storage period: 1 year or so in a hermetically sealed condition
(If the long-term storage is expected, please consider vacuum packing or putting silica gel in the airtight container.)
6 months in an unsealed condition
＜Reflow condition＞
* Reflow is limited to twice.

250°C peek
Soldering junction temperature (°C)

25
0
230°C

20
0
180°C

30±10s
150 150°C

90±30s

＜Flow condition＞
* Flow is limited to once.
Peak temperature
ピーク温度
Dip time
ディップ時間 250～255℃
Within 5 sec
ﾄｰﾀﾙ５秒以内
in total
Soldering junction temperature (°C)

250℃

200℃
は
ん
だ 150℃
部
Within
温 10秒以内
10 sec
度
100℃
Preheat (40 – 60 sec)
プリヒート(40～60秒) Jet噴流
flow Cooling
冷却

Time
時間
＜Hand soldering condition＞
Temperature of tip of soldering iron: 380±10°C
Time: 3s +1s/－0s
Number of times: Once

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