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Tiristor

The document provides information on 8 A SCR products including their features, descriptions, and electrical characteristics. Key specifications include on-state current, repetitive peak off-state voltage, triggering gate current, and packaging options. Characteristics such as rms current, average current, surge current, and maximum voltages/currents are specified.

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0% found this document useful (0 votes)
125 views21 pages

Tiristor

The document provides information on 8 A SCR products including their features, descriptions, and electrical characteristics. Key specifications include on-state current, repetitive peak off-state voltage, triggering gate current, and packaging options. Characteristics such as rms current, average current, surge current, and maximum voltages/currents are specified.

Uploaded by

Paula Corina
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd

TN805, TN815

TS820, TYN608
Datasheet

Sensitive and standard 8 A SCRs

Features
A K
• On-state rms current, IT(RMS) 8 A
G
• Repetitive peak off-state voltage, VDRM/VRRM 600 and 800 V
A
• Triggering gate current, IGT 0.2 to 15 mA

Description
G G
TO-220AB TO-220FPAB A
K
A K Available either in sensitive (TS8) or standard (TN8 / TYN) gate triggering levels, the
A
8 A SCR series is suitable to fit all modes of control found in applications such as
A
overvoltage crowbar protection, motor control circuits in power tools and kitchen aids,
inrush current limiting circuits, capacitive discharge ignition and voltage regulation
circuits.
K
A
G IPAK K
A
G
TO-220AB
Available in through-hole or surface-mount packages, they provide an optimized
A performance in a limited space.

K A
Product summary
G DPAK
Voltage (x00)
Order code Sensitivity
VDRM/VRRM Package
IGT
600 V 800 V

TS820-600B X 0.2 mA DPAK

Product status link TS820-600H X 0.2 mA IPAK

TN805, TN815, TS820, TYN608 TS820-600T X 0.2 mA TO-220AB


TS820-600FP X 0.2 mA TO-220FPAB
TN805-600B X 5 mA DPAK
TN815-x00B X X 15 mA DPAK
TN815-800H X 15 mA IPAK
TYN608RG X 15 mA TO-220AB

DS2118 - Rev 9 - November 2021 [Link]


For further information contact your local STMicroelectronics sales office.
TN805, TN815, TS820, TYN608
Characteristics

1 Characteristics

Table 1. Absolute ratings (limiting values)

Value

TN805
Symbol Parameters Unit
TN815 TYN608
TS820

RMS on-state current On-state rms current TC = 110 °C


IT(RMS) 8 A
(180° conduction angle) TO-220FPAB, TC = 91 °C

TC = 110 °C
IT(AV) Average on-state current (180° conduction angle) 5 A
TO-220FPAB, TC = 91 °C

tp = 8.3 ms 73 100
Non repetitive surge peak on-state
ITSM Tj = 25 °C A
current tp = 10 ms 70 95

I2t I2t value for fusing tp = 10 ms Tj = 25 °C 24.5 45 A2s


Critical rate of rise of on-state current
dl/dt F = 60 Hz Tj = 125 °C 50 A/µs
IG = 2 x IGT , tr ≤ 100 ns

IGM Peak gate current tp = 20 µs Tj = 125 °C 4 A

PG(AV) Average gate power dissipation Tj = 125 °C 1 W

Tstg Storage junction temperature range -40 to +150 °C

Tj Operating junction temperature range -40 to +125 °C

VRGM Maximum peak reverse gate voltage (for TN8x5 and TYN608 only) 5 V

Table 2. Sensitive electrical characteristics (Tj = 25 °C, unless otherwise specified)

Symbol Parameter TS820 Unit

IGT Max. 200 µA


VD = 12 V, RL = 140 Ω
VGT Max. 0.8 V

VRG IRG = 10 µA Min. 8 V

VGD VD = VDRM, RL = 3.3 kΩ, RGK = 220 Ω Tj = 125 °C Min. 0.1 V

IH IT = 50 mA, RGK = 1 kΩ Max. 5 mA

IL IG = 1mA, RGK = 1 kΩ Max. 6 mA

dV/dt VD = 65% VDRM, RGK = 220 Ω Tj = 125 °C Min. 5 V/µs

VTM ITM = 16 A, tp = 380 μs Tj = 25 °C Max. 1.6 V

Vt0 Threshold voltage Tj = 125 °C Max. 0.85 V

Rd Dynamic resistance Tj = 125 °C Max. 46 mΩ

IDRM Tj = 25 °C 5 µA
VDRM = VRRM, RGK = 220 Ω Max.
IRRM Tj = 125 °C 1 mA

DS2118 - Rev 9 page 2/20


TN805, TN815, TS820, TYN608
Characteristics

Table 3. Standard electrical characteristics (Tj = 25 °C, unless otherwise specified)

Symbol Parameter TN805 TN815 TYN608 Unit

Min. 0.5 2 2
IGT mA
VD = 12 V, RL = 140 Ω Max. 5 15 15
VGT Max. 1.3 V

VGD VD = VDRM, RL = 3.3 kΩ Tj = 125 °C Min. 0.2 V

IH IT = 100 mA, gate open Max. 25 40 30 mA

IL IG = 1.2 IGT Max. 30 50 70 mA

dV/dt VD = 67% VDRM, gate open Tj = 125 °C Min. 50 150 150 V/µs

VTM ITM = 16 A, tp = 380 μs Tj = 25 °C Max. 1.6 V

Vt0 Threshold voltage Tj = 125 °C Max. 0.85 V

Rd Dynamic resistance Tj = 125 °C Max. 46 mΩ

IDRM Tj = 25 °C 5 µA
VDRM = VRRM Max.
IRRM Tj = 125 °C 2 mA

Table 4. Thermal resistance (maximum values)

Symbol Parameter Value Unit

IPAK / DPAK /
1.3
Rth(j-c) Junction to case (DC) TO-220AB °C/W
TO-220FPAB 4.6

Junction to ambient S(1) = 0.5 cm² DPAK 70

Rth(j-a) TO-220AB /
60 °C/W
Junction to ambient TO-220FPAB
IPAK 100

1. S = Copper surface under tab

DS2118 - Rev 9 page 3/20


TN805, TN815, TS820, TYN608
Characteristics (curves)

1.1 Characteristics curves

Figure 1. Maximum average power dissipation versus Figure 2. Average and DC on-state current versus case
average on-state current temperature

P(W) IT(AV) (A)


8 10
DPAK IPAK
7 α = 180° 9
TO-220AB
D.C.
8
6
7
5
6
α = 180°
4 5

3 4 TO-220FPAB
360°
3
2
2
1 α
1 Tcase (°C)
IT(AV) (A)
0 0
0 1 2 3 4 5 6 0 25 50 75 100 125

Figure 3. Average and DC on-state current versus ambient Figure 4. Relative variation of thermal impedance junction
temperature to case versus pulse duration

IT(AV) (A) K=[Z th(j-c) /Rth(j-c) ]


2.5 1.0
D.C. Recommendedpad layout,
α = 180° FR4 printed circuit board
2.0

0.5
TO-220AB
1.5 TO-220FPAB

1.0

0.2
DPAK
0.5 IPAK

Tamb(°C) tp(s)
0.0 0.1
0 25 50 75 100 125 1E-3 1E-2 1E-1 1E+0

Figure 5. Relative variation of thermal impedance junction Figure 6. Relative variation of gate trigger current and
to ambient versus pulse duration holding current versus junction temperature for TS820

K=[Z th(j-a) /Rth(j-a) ] IGT,IH ,IL [T j ] / IGT,IH ,IL [T j =25°C]


1.00 2.0
Recommended pad layout, 1.8
IGT
FR4 printed circuit board
1.6
1.4
DPAK
1.2
IH & I L
0.10 1.0 R GK = 1kΩ

TO-220AB / IPAK 0.8


TO-220FPAB
0.6
0.4
0.2 Tj(°C)
tp(s)
0.01 0.0
1E-2 1E-1 1E+0 1E+1 1E+2 5E+2 -40 -20 0 20 40 60 80 100 120 140

DS2118 - Rev 9 page 4/20


TN805, TN815, TS820, TYN608
Characteristics (curves)

Figure 7. Relative variation of gate trigger current and Figure 8. Relative variation of holding current versus
holding current versus junction temperature gate-cathode resistance (typical values)

IGT,IH,IL [ Tj ] / IGT,IH,IL [T j =25°C] IH[R GK ] / IH[ RGK =1kΩ]


2.4 6.0
Tj = 25°C
2.2 5.5 TS8
IGT
TN8 and TYNx8 5.0
2.0
1.8 4.5

1.6 4.0

1.4 3.5

1.2 3.0
IH & IL
1.0 2.5
0.8 2.0
0.6 1.5
0.4 1.0
0.2 Tj(°C) 0.5
RGK (kΩ)
0.0 0.0
-40 -20 0 20 40 60 80 100 120 140 1E-2 1E-1 1E+0 1E+1

Figure 9. Relative variation of dV/dt immunity versus gate- Figure 10. Relative variation of dV/dt immunity versus
cathode resistance (typical values) for TS820 gate-cathode capacitance (typical values) for TS820

dV/dt[R GK ] / dV/dt[ RGK =220Ω] dV/dt[C GK ] / dV/dt[R GK =220Ω]


10.00 15.0
T j = 125°C VD = 0.67 x VDRM
V D = 0.67 x V DRM Tj = 125°C
RGK = 220Ω
12.5

1.00 10.0

7.5

0.10
5.0

2.5
R GK(k Ω)
0.01 CGK(nF)
0 200 400 600 800 1000 1200 1400 1600 1800 2000 0.0
0 20 40 60 80 100 120 140 160 180 200 220

Figure 11. Surge peak on-state current versus number of Figure 12. Non-repetitive surge peak on-state current and
cycles corresponding values of I2t

ITSM(A) ITSM(A), I 2t (A 2s)


100 1000
Tj initial = 25°C
90
80 TYN08 tp=10ms
ITSM
70 One cycle
TYN08
Non repetitive dI/dt limitation
60 Tj initial=25°C
TN8 / TS8
50 100 Sinusoidal pulse width tp < 10 ms TN8 / TS8

40
TYN08
30
Repetitive
I2t
20 TC=110°C

10 TN8 / TS8

0
Number ofcycles t p(ms)
10
1 10 100 1000 0.01 0.10 1.00 10.00

DS2118 - Rev 9 page 5/20


TN805, TN815, TS820, TYN608
Characteristics (curves)

Figure 14. Thermal resistance junction to ambient versus


Figure 13. On-state characteristics (maximum values)
copper surface under tab
ITM(A)
50.0
Rth(j-a) (°C/W)
Tj max.: 100
Vt0 = 0.85 V DPAK
Rd = 46 mΩ 90 Epoxy printed circuit board, copper thickness: 35 µm
10.0 80

Tj=max 70
60
50
1.0 40
Tj=25°C
30
20

VTM(V) 10
SCu (cm²)
0.1 0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 5 10 15 20 25 30 35 40

DS2118 - Rev 9 page 6/20


TN805, TN815, TS820, TYN608
Package information

2 Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: [Link]. ECOPACK is an ST trademark.

2.1 DPAK package information


• Molding compouned resin is halogen free and meets UL94 flammability standard, level V0
• Lead-free package leads plating

Figure 15. DPAK package outline


A

E
b4 c2
L2

D1
D

E1
A1
L4

e b c
e1

L
V2
A2

DS2118 - Rev 9 page 7/20


TN805, TN815, TS820, TYN608
DPAK package information

Table 5. DPAK package mechanical data

Dimensions

Ref. Millimeters Inches(1)

Min. Typ. Max. Min. Typ. Max.

A 2.18 2.40 0.0858 0.0945


A1 0.90 1.10 0.0354 0.0433
A2 0.03 0.23 0.0012 0.0091
b 0.64 0.90 0.0252 0.354
b4 4.95 5.46 0.1949 0.2150
c 0.46 0.61 0.0181 0.0240
c2 0.46 0.60 0.0181 0.0236
D 5.97 6.22 0.2350 0.2449
D1 4.95 5.60 0.1949 0.2205
E 6.35 6.73 0.2500 0.2650
E1 4.32 5.50 0.1701 0.2165
e 2.286 0.0900
e1 4.40 4.70 0.1732 0.1850
H 9.35 10.40 0.3681 0.4094
L 1.00 1.78 0.0394 0.0701
L2 1.27 0.0500
L4 0.60 1.02 0.0236 0.0402

V2(2) -8° +8° -8° +8°

1. Dimensions in inches are given for reference only


2. Degree

Note: This package drawing may slightly differ from the physical package. However, all the specified dimensions are
guaranteed.

Figure 16. DPAK recommended footprint (dimensions are in mm)

12.7

6.7 3.0 3.0

A
4.572
6.7

B 1.6

The device must be positioned within 0.05 A B

DS2118 - Rev 9 page 8/20


TN805, TN815, TS820, TYN608
IPAK package information

2.2 IPAK package information


• Molding compouned resin is halogen free and meets UL94 flammability standard, level V0
• Lead-free package leads plating

Figure 17. IPAK package outline

E A
b4 c2
V1
L2

1.20 ±0.010
Top E-MARK
D

L1
H
A1
b2
e L

b
c
e1

DS2118 - Rev 9 page 9/20


TN805, TN815, TS820, TYN608
IPAK package information

Table 6. IPAK package mechanical data

Dimensions

Ref. MillimetersInches (for reference only)

Min. Typ. Max. Min. Typ. Max.

A 2.20 2.40 0.086 0.094


A1 0.90 1.10 0.035
b 0.64 0.90 0.025 0.035
b2 0.95 0.037
b4 5.20 5.43
c 0.45 0.60
c2 0.46 0.60
D 6 6.20
E 6.40 6.70 0.252 0.263
e 2.28 0.090
e1 4.40 4.60 0.173 0.181
H 16.10 0.634
L 9 9.60 0.354 0.377
L1 0.8 1.20 0.031 0.047
L2 0.80 1.25 0.031 0.049
V1 10° 10°

DS2118 - Rev 9 page 10/20


TN805, TN815, TS820, TYN608
TO-220AB package information

2.3 TO-220AB package information


• Molding compouned resin is halogen free and meets UL94 flammability standard, level V0
• Lead-free package leads plating
• Cooling method: by conduction (C)
• Recommended torque value: 0.55 N·m
• Maximum torque value: 0.70 N·m

Figure 18. TO-220AB package outline

DS2118 - Rev 9 page 11/20


TN805, TN815, TS820, TYN608
TO-220AB package information

Table 7. TO-220AB package mechanical data

Dimensions

Ref. Millimeters Inches (for reference only)

Min. Max. Min. Max.

A 4.40 4.60 0.173 0.181


b 0.61 0.88 0.240 0.035
b1 1.14 1.55 0.045 0.061
c 0.48 0.70 0.019 0.028
D 15.25 15.75 0.600 0.620
D1 1.27 typ. 0.050 typ.
E 10.00 10.40 0.394 0.409
e 2.40 2.70 0.094 0.106
e1 4.95 5.15 0.195 0.203
F 1.23 1.32 0.048 0.052
H1 6.20 6.60 0.244 0.260
J1 2.40 2.72 0.094 0.107
L 13.00 14.00 0.512 0.551
L1 3.50 3.93 0.138 0.155
L20 16.40 typ. 0.646 typ.
L30 28.90 typ. 1.138 typ.
θP 3.75 3.85 0.148 0.152
Q 2.65 2.95 0.104 0.116

DS2118 - Rev 9 page 12/20


TN805, TN815, TS820, TYN608
TO-220AB package information

2.4 TO-220AB package information


• Molding compound resin is halogen free and meets UL94 flammability standard, level V0
• Lead-free plating package leads
• Recommended torque: 0.4 to 0.6 N·m

Figure 19. TO-220AB package outline

DS2118 - Rev 9 page 13/20


TN805, TN815, TS820, TYN608
TO-220AB package information

Table 8. TO-220AB package mechanical data

Dimensions

Ref. Millimeters Inches(1)

Min. Typ. Max. Min. Typ. Max.

A 15.20 15.90 0.5984 0.6260


a1 3.75 0.1476
a2 13.00 14.00 0.5118 0.5512
B 10.00 10.40 0.3937 0.4094
b1 0.61 0.88 0.0240 0.0346
b2 1.23 1.32 0.0484 0.0520
C 4.40 4.60 0.1732 0.1811
c1 0.49 0.70 0.0193 0.0276
c2 2.40 2.72 0.0945 0.1071
e 2.40 2.70 0.0945 0.1063
F 6.20 6.60 0.2441 0.2598
I 3.73 3.88 0.1469 0.1528
L 2.65 2.95 0.1043 0.1161
I2 1.14 1.70 0.0449 0.0669
I3 1.14 1.70 0.0449 0.0669
I4 15.80 16.40 16.80 0.6220 0.6457 0.6614
M 2.6 0.1024

1. Inch dimensions are for reference only.

DS2118 - Rev 9 page 14/20


TN805, TN815, TS820, TYN608
TO-220FPAB package information

2.5 TO-220FPAB package information


• Epoxy meets UL94, V0
• Recommended torque: 0.4 to 0.6 N·m

Figure 20. TO-220FPAB package outline

DS2118 - Rev 9 page 15/20


TN805, TN815, TS820, TYN608
TO-220FPAB package information

Table 9. TO-220FPAB package mechanical data

Dimensions

Ref. Millimeters Inches

Min. Max. Min. Max.

A 4.40 4.60 0.1739 0.1818


B 2.5 2.7 0.0988 0.1067
D 2.50 2.75 0.0988 0.1087
E 0.45 0.70 0.0178 0.0277
F 0.75 1.0 0.0296 0.0395
F1 1.15 1.70 0.0455 0.0672
F2 1.15 1.70 0.0455 0.0672
G 4.95 5.20 0.1957 0.2055
G1 2.40 2.70 0.0949 0.1067
H 10.00 10.40 0.3953 0.4111
L2 16.00 typ. 0.6324 typ.
L3 28.60 30.60 1.1304 1.2095
L4 9.80 10.6 0.3874 0.4190
L5 2.90 3.60 0.1146 0.1423
L6 15.90 16.40 0.6285 0.6482
L7 9.00 9.30 0.3557 0.3676
Dia 3.0 3.20 0.1186 0.1265

DS2118 - Rev 9 page 16/20


TN805, TN815, TS820, TYN608
Ordering information

3 Ordering information

Figure 21. TN8 series

TN 8 05 - 600 B -TR
Standard SCR series
Current
8=8A
Sensitivity
05 = 5 mA
15 = 15 mA
Voltage
600 = 600 V
800 = 800 V
Package
B = DPAK
H = IPAK

Packing mode
Blank = Tube
-TR = Tape and reel

Figure 22. TS8 series

TS 8 20 - 600 B (-TR)

Sensitive SCR series


Current
8=8A
Sensitivity
20 = 200 µA
Voltage
600 = 600 V
Package
B = DPAK
H = IPAK
T = TO-220AB
FP = TO220FPAB
Packing mode
Blank = Tube
-TR = Tape and reel

Figure 23. TYNx08 series

TYN 6 08 RG

Standard SCR series


Voltage
6 = 600 V
Current
8=8A
Packing mode
RG = Tube

DS2118 - Rev 9 page 17/20


TN805, TN815, TS820, TYN608
Ordering information

Table 10. Ordering information

Order code Marking Package Weight Base qty Delivery mode

TN805-600B-TR TN805600 DPAK 0.3 g 2500 Tape and reel


TN815-600B-TR TN815600 DPAK 0.3 g 2500 Tape and reel
TN815-800B-TR TN815800 DPAK 0.3 g 2500 Tape and reel
TN815-800H TN815800 IPAK 0.4 g 75 Tube
TS820-600B TS820600 DPAK 0.3 g 75 Tube
TS820-600B-TR TS820600 DPAK 0.3 g 2500 Tape and reel
TS820-600H TS820600 IPAK 0.4 g 75 Tube
TS820-600T TS820600T TO-220AB 2.3 g 50 Tube
TS820-600FP TS820600 TO-220FPAB 2.0 g 50 Tube
TYN608RG TYN608 TO-220AB 2.3 g 50 Tube

DS2118 - Rev 9 page 18/20


TN805, TN815, TS820, TYN608

Revision history

Table 11. Document revision history

Date Revision Changes

Apr-2002 4A Last update.


TO-220AB delivery mode changed from bulk to tube. ECOPACK statement
13-Feb-2006 5
added.
Alpha definition updated in Figure 1. Thermal resistance, junction to case,
22-Jan-2010 6
updated in Table 5.
10-Oct-2011 7 Added TO-220FPAB package. Removed 700 V and 1000 V products.
Updated DPAK and IPAK package information and reformatted to current
14-May-2014 8
standard.
03-Nov-2021 9 Added TN815-800H product information. Minor text changes.

DS2118 - Rev 9 page 19/20


TN805, TN815, TS820, TYN608

IMPORTANT NOTICE – PLEASE READ CAREFULLY


STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST
products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST
products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of
Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to [Link]/trademarks. All other product or service
names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2021 STMicroelectronics – All rights reserved

DS2118 - Rev 9 page 20/20

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