SHT1x
Humidity & Temperature
Sensmitter
Application Note
Soldering Procedure
1 Introduction
The SHT 1x precision relative humidity (RH) and temperature sensor requires specific handling during and after the soldering
process to prevent damage to its sensing elements.
The SHT 1x can be soldered using standard reflow ovens (including lead free soldering) at maximum 260°C for 30 seconds.
2 Handling Procedure
2.1 Solder Paste
Please use “No-Clean” solder paste only.
2.2 Recommended Soldering Profile
Convection or IR/Convection VPR
Average ramp-up rate (183°C to Peak) 4°C/second max. 10°C/second max.
Preheat temperature 160(±10)°C 90 seconds max.
Temperature maintained above 183°C 60 seconds
Time within 5°C of actual peak 30 seconds 60 seconds
temperature
Peak temperature 260°C (lead free soldering) 1 233°C (lead free soldering) 2
Ramp-down rate 6°C/second max. 10°C/second max.
Time 25°C to peak temperature 6 minutes max.
Note: All temperatures refer to top side of the package, measured on the package body surface.
2.3 PCB cleaning
Please do not clean or wash the Printed Circuit Board (PCB) after soldering. Due to the use of “No-Clean” solder paste
cleaning is not necessary.
2.4 Post soldering treatment
After the soldering process is completed, a temporary change of the humidity signal can be observed. This is caused by the
extreme temperatures during the soldering process.
For a rapid return of the humidity sensor to its nominal condition it is recommended to store the soldered device for at least 48h
at >74% RH and >20°C.
2.5 Manual soldering
Contact time must be limited to 5 seconds at up to 350°C.
2.6 Soldering Quality
For best connection to the PCB the solder connection should fill the via almost to the top.
2.7 Warning
Exposure of capacitive relative humidity sensors to solvents (e.g. during soldering) may temporarily offset the signal.
Recondition the sensor by heating it up to 100°C for one day may return it to calibration conditions.
1For devices with date code before ‘144’ (=week 14 of 2004) 235°C is peak temperature
2For devices with date code before ‘144’ (=week 14 of 2004) 219°C is peak temperature
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SHTxx Application Note Soldering Procedure
3 Revision history
Date Revision Changes
August 22, 2001 1.0 Initial revision
January 17 , 2002 1.1 added manual soldering instructions, soldering quality
February 19 , 2002 1.11 New CI
June 18, 2002 1.2 Added PCB cleaning paragraph
Oct. 16. 2003 1.3 Added lead free soldering capability
Oct. 17, 2003 1.4 Changed download link
Feb. 02, 2004 1.5 Changed PCB cleaning paragraph, only use “No-Clean” solder paste
Feb. 24, 2004 1.51 Increased peak temperature for reflow to 250°C
May 25, 2005 1.52 Changed company address
September 20, 2005 1.6 Corrected Peak Temperature for lead-free soldering
Sept 22, 2006 1.7 Corrected Peak Temperature for VPR lead-free soldering
Oct 03, 2006 1.8 Sensirion Inc. address added
The latest version of this document and all application notes can be found at:
www.sensirion.com/humidity
Headquarters and Sales Office
SENSIRION AG Phone: + 41 (0)44 306 40 00
Laubisruetistr. 50 Fax: + 41 (0)44 306 40 30
CH-8712 Staefa ZH e-mail:
[email protected]Switzerland http://www.sensirion.com/
SENSIRION Inc Phone: 805-409 4900
Westlake Pl. Ctr. I, suite 240 Fax: 805-435 0467
2801 Townsgate Road e-mail:
[email protected]Westlake Village, CA 91361 http://www.sensirion.com/
USA
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