ABS1 THRU ABS10

MINI SILICON SURFACE MOUNT BRIDGE RECTIFIER

Reverse Voltage - 100 to 1000 Volts Forward Current - 1.0 Ampere

FEATURES ABS
● Ideal for printed circuit board
● Reliable low cost construction technique
results in inexpensive product

0.177(4.5)
0.169(4.3)
0.252(6.4)
0.236(6.0)
● High temperature soldering guaranteed :

0.010(0.25)
0.006(0.15)
0.006(0.15)
0.002(0.05)
260 °C / 10 seconds / 0.375” ( 9.5mm )
lead length at 5 lbs., ( 2.3 kg ) tension

O
0~10
0.136(3.45) 0.028(0.7) 0.028(0.7)
0.128(3.25) 0.024(0.6) 0.012(0.3)
0.161(4.1)
0.154(3.9)
DETAIL "A", SCALE=20/1

0.059(1.50) MAX.
0.056(1.42)
0.048(1.22)
MECHANICAL DATA A

0.006(0.15)
0.002(0.05)
0.20(5.1)
0.193(4.9)

● Case : Molded Plastic

● Epoxy : Device has UL flammability classification 94V-0 0.033(0.85)
● Mounting Position : Any 0.026(0.65)
1
● Marking : Type Number 2
3
4

Dimensions in inches and (millimeters)

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Ratings at 25 C ambient temperature unless otherwise specified.
Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%.

Characteristic Symbol ABS1 ABS2 ABS4 ABS6 ABS8 ABS10 Unit

Peak Repetitive Reverse Voltage VRRM

Working Peak Reverse Voltage VRWM 100 200 400 600 800 1000 V
DC Blocking Voltage VR

RMS Reverse Voltage VR(RMS) 70 140 280 420 560 700 V

0.8
Average Rectified Output Current -On glass-epoxy P.C.B. IO A
-On aluminum substrate 1.0

Non-Repetitive Peak Forward Surge Current 8.3ms

Single half sine-wave superimposed on rated load IFSM 30 A
(JEDEC Method)

I2t Rating for Fusing (t < 8.3ms) I2t 10 A 2s

Forward Voltage per element @IF = 0.4A VFM 0.95 V

Peak Reverse Current @TA = 25°C 10

IRM µA
At Rated DC Blocking Voltage @TA = 125°C 150

Typical Junction Capacitance per leg (Note 2) Cj 25 pF

R JA 62.5
Typical Thermal Resistance per leg (Note 1) °C/W
R JL 25

Operating and Storage Temperature Range Tj, TSTG -55 to +150 °C

Note: 1. On aluminum suvstrate P.C.B. with an area of 0.8×0.8”(20×20mm) mounted on 0.05×0.05”(1.3×1.3mm) solder pad.
2. On glass epoxy P.C.B. mouted on 0.05×0.05”(1.3×1.3mm) pads.
 ABS1 THRU ABS10
RATINGS AND CHARACTERISTIC CURVES

FIG.1- MAXIMUM FORWARD CURRENT DERATING FIG.2- TYPICAL REVERSE CHARACTERISTICS

CURVE PER BRIDGE ELEMENT
1.6 100

1.4
AVERAGE FORWARD CURRENT. (A)

INSTANTANEOUS REVERSE CURRENT. ( A)

1.2 ALUMINA SUBSTRATE
SIN 50.8mm X 50.8mm 10
1.0 SOLDERING LAND 1mm X 1mm
Tj=100 0C
CONDUCTOR LAYER 20 mm
SUBSTRATE THICKNESS 0.64mm
0.8

0.6 1 Tj=75 0C

0.4

0.2
0.1
0 Tj=25 0C
0 20 40 60 80 100 120 140 160

0.01
0 20 40 60 80 100 120 140
PERCENT OF RATED PEAK REVERSE VOLTAGE. (%)

FIG.3- MAXIMUM NON-REPETITIVE FORWARD FIG.4- TYPICAL JUNCTION CAPACITANCE

SURGE CURRENT 1000
35
PEAK FORWARD SURGE CURRENT. (A)

600
30
JUNCTION CAPACITANCE.(pF)

500
25
Tj=25 0C
400
20
IFSM

15 300
10ms 10ms
10 Ta=40 C 1 Cycle 200
NON-REPETITIVE,
Single Half Sine-Wave
SINE(JEDEC
WAVE, Method)
5 Tj = 25OC BEFORE 100
SURGE CURRENT IS APPLIED
0 0
1 10 100 0.5 1 2 5 10 50 100 200 500 800
0.1 20
NUMBER OF CYCLES (CYCLE)
REVERSE VOLTAGE. (V)

FIG.5- TYPICAL FORWARD CHARACTERISTICS

50
INSTANTANEOUS FORWARD CURRENT. (A)

10

0.1
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
FORWARD VOLTAGE. (V)