19-2668; Rev 1; 1/03

+3.3V, ±15kV ESD-Protected, Fail-Safe,

Hot-Swap, RS-485/RS-422 Transceivers
General Description Features

MAX3070E–MAX3079E
The MAX3070E–MAX3079E 3.3V, ±15kV ESD-protected, ♦ 3.3V Operation
RS-485/RS-422 transceivers feature one driver and one
receiver. These devices include fail-safe circuitry, guar- ♦ Electrostatic Discharge (ESD) Protection for
anteeing a logic-high receiver output when receiver RS-485 I/O Pins
inputs are open or shorted. The receiver outputs a logic ±15kV Human Body Model
high if all transmitters on a terminated bus are disabled ♦ True Fail-Safe Receiver While Maintaining
(high impedance). The MAX3070E–MAX3079E include a
hot-swap capability to eliminate false transitions on the EIA/TIA-485 Compatibility
bus during power-up or hot insertion. ♦ Hot-Swap Input Structure on DE and RE
The MAX3070E/MAX3071E/MAX3072E feature reduced ♦ Enhanced Slew-Rate Limiting Facilitates Error-
slew-rate drivers that minimize EMI and reduce reflec- Free Data Transmission
tions caused by improperly terminated cables, allowing
(MAX3070E–MAX3075E/MAX3079E)
error-free data transmission up to 250kbps. The
MAX3073E/MAX3074E/MAX3075E also feature slew- ♦ Low-Current Shutdown Mode (Except
rate-limited drivers but allow transmit speeds up to MAX3071E/MAX3074E/MAX3077E)
500kbps. The MAX3076E/MAX3077E/MAX3078E driver
♦ Pin-Selectable Full-/Half-Duplex Operation
slew rates are not limited, making transmit speeds up to
16Mbps possible. The MAX3079E slew rate is pin (MAX3079E)
selectable for 250kbps, 500kbps, and 16Mbps. ♦ Phase Controls to Correct for Twisted-Pair
The MAX3072E/MAX3075E/MAX3078E are intended for Reversal (MAX3079E)
half-duplex communications, and the MAX3070E/ ♦ Allow Up to 256 Transceivers on the Bus
MAX3071E/MAX3073E/MAX3074E/MAX3076E/MAX307
7E are intended for full-duplex communications. The ♦ Available in Industry-Standard 8-Pin SO Package
MAX3079E is selectable for half-duplex or full-duplex
operation. It also features independently programmable
receiver and transmitter output phase through
separate pins.
The MAX3070E–MAX3079E transceivers draw 800µA Ordering Information
of supply current when unloaded or when fully loaded
with the drivers disabled. All devices have a 1/8-unit PART TEMP RANGE PIN-PACKAGE
load receiver input impedance, allowing up to 256 MAX3070EEPD -40°C to +85°C 14 Plastic DIP
transceivers on the bus. MAX3070EESD -40°C to +85°C 14 SO
MAX3070EAPD -40°C to +125°C 14 Plastic DIP
Applications MAX3070EASD -40°C to +125°C 14 SO
MAX3071EEPA -40°C to +85°C 8 Plastic DIP
Lighting Systems
MAX3071EESA -40°C to +85°C 8 SO
Industrial Control
MAX3071EAPA -40°C to +125°C 8 Plastic DIP
Telecom MAX3071EASA -40°C to +125°C 8 SO
Security Systems Ordering Information continued at end of data sheet.
Instrumentation

Selector Guide, Pin Configurations, and Typical Operating

Circuits appear at end of data sheet.

________________________________________________________________ Maxim Integrated Products 1

For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
 +3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
ABSOLUTE MAXIMUM RATINGS
MAX3070E–MAX3079E

(All voltages referenced to GND) Continuous Power Dissipation (TA = +70°C)

Supply Voltage (VCC).............................................................+6V 8-Pin SO (derate 5.88mW/°C above +70°C) .................471mW
Control Input Voltage (RE, DE, SLR, 8-Pin Plastic DIP (derate 9.09mW/°C above +70°C) .....727mW
H/F, TXP, RXP)......................................................-0.3V to +6V 14-Pin SO (derate 8.33mW/°C above +70°C) ...............667mW
Driver Input Voltage (DI)...........................................-0.3V to +6V 14-Pin Plastic DIP (derate 10.0mW/°C above +70°C) ...800mW
Driver Output Voltage (Z, Y, A, B) .............................-8V to +13V Operating Temperature Ranges
Receiver Input Voltage (A, B)....................................-8V to +13V MAX307_EE_ _ ................................................-40°C to +85°C
Receiver Input Voltage MAX307_EA_ _ ..............................................-40°C to +125°C
Full Duplex (A, B) ..................................................-8V to +13V Junction Temperature ......................................................+150°C
Receiver Output Voltage (RO)....................-0.3V to (VCC + 0.3V) Storage Temperature Range .............................-65°C to +150°C
Driver Output Current .....................................................±250mA Lead Temperature (soldering, 10s) .................................+300°C

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.

DC ELECTRICAL CHARACTERISTICS
(VCC = 3.3V ±10%, TA =TMIN to TMAX, unless otherwise noted. Typical values are at VCC = 3.3V and TA = +25°C.) (Note 1)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

DRIVER
RL = 100Ω (RS422), Figure 1 2 VCC
Differential Driver Output VOD RL = 54Ω (RS485), Figure 1 1.5 VCC V
No load VCC
Change in Magnitude of
∆VOD RL = 100Ω or 54Ω, Figure 1 (Note 2) 0.2 V
Differential Output Voltage
Driver Common-Mode Output
VOC RL = 100Ω or 54Ω, Figure 1 VCC / 2 3 V
Voltage
Change in Magnitude of
∆VOC RL = 100Ω or 54Ω, Figure 1 (Note 2) 0.2 V
Common-Mode Voltage
Input High Voltage VIH DE, DI, RE, TXP, RXP, H/F 2 V
Input Low Voltage VIL DE, DI, RE, TXP, RXP, H/F 0.8 V
Input Hysteresis VHYS DE, DI, RE, TXP, RXP, H/F 100 mV
Input Current IIN1 DE, DI, RE ±1 µA
Input Impedance First Transition DE 1 10 kΩ
Input Current IIN2 TXP, RXP, H/F internal pulldown 10 40 µA
SRL Input High Voltage VCC - 0.4 V
SRL Input Middle Voltage VCC x 0.4 VCC x 0.6 V
SRL Input Low Voltage 0.4 V
SRL = VCC 75
SRL Input Current µA
SRL = GND -75
Output Leakage (Y and Z) DE = GND, VIN = +12V 125
IO µA
Full Duplex VCC = GND or 3.6V VIN = -7V -100

2 _______________________________________________________________________________________
 +3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
DC ELECTRICAL CHARACTERISTICS (continued)

MAX3070E–MAX3079E
(VCC = 3.3V ±10%, TA =TMIN to TMAX, unless otherwise noted. Typical values are at VCC = 3.3V and TA = +25°C.) (Note 1)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

Driver Short-Circuit Output 0 ≤ VOUT ≤ 12V (Note 3) 40 250
IOSD mA
Current -7V ≤ VOUT ≤ VCC (Note 3) -250 -40
Driver Short-Circuit Foldback (VCC - 1V) ≤ VOUT ≤ 12V (Note 3) 20
IOSDF mA
Output Current -7V ≤ VOUT ≤ 1V (Note 3) -20
Thermal-Shutdown Threshold TTS 175 °C
Thermal-Shutdown Hysteresis TTSH 15 °C
DE = GND, VIN = +12V 125
Input Current (A and B) IA, B µA
VCC = GND or 3.6 VIN = -7V -100
RECEIVER
Receiver Differential Threshold
VTH -7V ≤ VCM ≤ 12V -200 -125 -50 mV
Voltage
Receiver Input Hysteresis ∆VTH VA + VB = 0V 15 mV
RO Output High Voltage VOH IO = -1mA VCC - 0.6 V
RO Output Low Voltage VOL IO = 1mA 0.4 V
Three-State Output Current at
IOZR 0 ≤ VO ≤ VCC ±1 µA
Receiver
Receiver Input Resistance RIN -7V ≤ VCM ≤ 12V 96 kΩ
Receiver Output Short-Circuit
IOSR 0V ≤ VRO ≤ VCC ±80 mA
Current
SUPPLY CURRENT
No load, RE = 0, DE = VCC 0.8 1.5
Supply Current ICC No load, RE = VCC, DE = VCC 0.8 1.5 mA
No load, RE = 0, DE = 0 0.8 1.5
Supply Current in Shutdown
ISHDN RE = VCC, DE = GND 0.05 10 µA
Mode
ESD PROTECTION
ESD Protection for Y, Z, A, and B Human Body Model ±15 kV
Note 1: All currents into the device are positive. All currents out of the device are negative. All voltages are referred to device
ground, unless otherwise noted.
Note 2: ∆VOD and ∆VOC are the changes in VOD and VOC, respectively, when the DI input changes state.
Note 3: The short-circuit output current applies to peak current just prior to foldback current limiting. The short-circuit foldback out-
put current applies during current limiting to allow a recovery from bus contention.

_______________________________________________________________________________________ 3
 +3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
DRIVER SWITCHING CHARACTERISTICS
MAX3070E–MAX3079E

MAX3070E/MAX3071E/MAX3072E/MAX3079E with SRL = UNCONNECTED (250kbps)

(VCC = 3.3V ±10%, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VCC = 3.3V and TA = +25°C.)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

tDPLH 250 1500
Driver Propagation Delay CL= 50pF, RL= 54Ω, Figures 2 and 3 ns
tDPHL 250 1500
Driver Differential Output Rise or
tDR , tDF CL= 50pF, RL= 54Ω, Figures 2 and 3 350 1600 ns
Fall Time
Differential Driver Output Skew
tDSKEW CL= 50pF, RL= 54Ω, Figures 2 and 3 200 ns
|tDPLH - tDPHL|
Maximum Data Rate 250 kbps
Driver Enable to Output High tDZH Figure 4 2500 ns
Driver Enable to Output Low tDZL Figure 5 2500 ns
Driver Disable Time from Low tDLZ Figure 5 100 ns
Driver Disable Time from High tDHZ Figure 4 100 ns
Driver Enable from Shutdown to
tDZH(SHDN) Figure 4 5500 ns
Output High
Driver Enable from Shutdown to
tDZL(SHDN) Figure 5 5500 ns
Output Low
Time to Shutdown tSHDN 50 200 600 ns

RECEIVER SWITCHING CHARACTERISTICS

MAX3070E/MAX3071E/MAX3072E/MAX3079E with SRL = UNCONNECTED (250kbps)
(VCC = 3.3V ±10%, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VCC = 3.3V and TA = +25°C.)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

tRPLH 200
Receiver Propagation Delay CL = 15pF, Figures 6 and 7 ns
tRPHL 200
Receiver Output Skew
tRSKEW CL = 15pF, Figures 6 and 7 30 ns
|tRPLH - tRPHL|
Maximum Data Rate 250 kbps
Receiver Enable to Output Low tRZL Figure 8 50 ns
Receiver Enable to Output High tRZH Figure 8 50 ns
Receiver Disable Time from Low tRLZ Figure 8 50 ns
Receiver Disable Time from High tRHZ Figure 8 50 ns
Receiver Enable from Shutdown
tRZH(SHDN) Figure 8 4000 ns
to Output High
Receiver Enable from Shutdown
tRZL(SHDN) Figure 8 4000 ns
to Output Low
Time to Shutdown tSHDN 50 200 600 ns

4 _______________________________________________________________________________________
 +3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
DRIVER SWITCHING CHARACTERISTICS

MAX3070E–MAX3079E
MAX3073E/MAX3074E/MAX3075E/MAX3079E with SRL = VCC (500kbps)
(VCC = 3.3V ±10%, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VCC = 3.3V and TA = +25°C.)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

tDPLH 180 800
Driver Propagation Delay CL = 50pF, RL = 54Ω, Figures 2 and 3 ns
tDPHL 180 800
Driver Differential Output Rise or
tDR , tDF CL = 50pF, RL = 54Ω, Figures 2 and 3 200 800 ns
Fall Time
Differential Driver Output Skew
tDSKEW CL = 50pF, RL = 54Ω, Figures 2 and 3 100 ns
|tDPLH - tDPHL|
Maximum Data Rate 500 kbps
Driver Enable to Output High tDZH Figure 4 2500 ns
Driver Enable to Output Low tDZL Figure 5 2500 ns
Driver Disable Time from Low tDLZ Figure 5 100 ns
Driver Disable Time from High tDHZ Figure 4 100 ns
Driver Enable from Shutdown to
tDZH(SHDN) Figure 4 4500 ns
Output High
Driver Enable from Shutdown to
tDZL(SHDN) Figure 5 4500 ns
Output Low
Time to Shutdown tSHDN 50 200 600 ns

RECEIVER SWITCHING CHARACTERISTICS

MAX3073E/MAX3074E/MAX3075E/MAX3079E with SRL = VCC (500kbps)
(VCC = 3.3V ±10%, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VCC = 3.3V and TA = +25°C.)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

tRPLH 200
Receiver Propagation Delay CL = 15pF, Figures 6 and 7 ns
tRPHL 200
Receiver Output Skew
tRSKEW CL = 15pF, Figures 6 and 7 30 ns
|tRPLH - tRPHL|
Maximum Data Rate 500 kbps
Receiver Enable to Output Low tRZL Figure 8 50 ns
Receiver Enable to Output High tRZH Figure 8 50 ns
Receiver Disable Time from Low tRLZ Figure 8 50 ns
Receiver Disable Time from High tRHZ Figure 8 50 ns
Receiver Enable from Shutdown
tRZH(SHDN) Figure 8 4000 ns
to Output High
Receiver Enable from Shutdown
tRZL(SHDN) Figure 8 4000 ns
to Output Low
Time to Shutdown tSHDN 50 200 600 ns

_______________________________________________________________________________________ 5
 +3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
DRIVER SWITCHING CHARACTERISTICS
MAX3070E–MAX3079E

MAX3076E/MAX3077E/MAX3078E/MAX3079E with SRL = GND (16Mbps)

(VCC = 3.3V ±10%, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VCC = 3.3V and TA = +25°C.)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

tDPLH 50
Driver Propagation Delay CL = 50pF, RL= 54Ω, Figures 2 and 3 ns
tDPHL 50
Driver Differential Output Rise or
tDR , tDF CL = 50pF, RL= 54Ω, Figures 2 and 3 15 ns
Fall Time
Differential Driver Output Skew
tDSKEW CL = 50pF, RL= 54Ω, Figures 2 and 3 8 ns
|tDPLH - tDPHL|
Maximum Data Rate 16 Mbps
Driver Enable to Output High tDZH Figure 4 150 ns
Driver Enable to Output Low tDZL Figure 5 150 ns
Driver Disable Time from Low tDLZ Figure 5 100 ns
Driver Disable Time from High tDHZ Figure 4 100 ns
Driver Enable from Shutdown to
tDZH(SHDN) Figure 4 1250 1800 ns
Output High
Driver Enable from Shutdown to
tDZL(SHDN) Figure 5 1250 1800 ns
Output Low
Time to Shutdown tSHDN 50 200 600 ns

RECEIVER SWITCHING CHARACTERISTICS

MAX3076E/MAX3077E/MAX3078E/MAX3079E with SRL = GND (16Mbps)
(VCC = 3.3V ±10%, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VCC = 3.3V and TA = +25°C.)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

tRPLH 40 75
Receiver Propagation Delay CL = 15pF, Figures 6 and 7 ns
tRPHL 40 75
Receiver Output Skew
tRSKEW CL = 15pF, Figures 6 and 7 8 ns
|tRPLH - tRPHL|
Maximum Data Rate 16 Mbps
Receiver Enable to Output Low tRZL Figure 8 50 ns
Receiver Enable to Output High tRZH Figure 8 50 ns
Receiver Disable Time from Low tRLZ Figure 8 50 ns
Receiver Disable Time from High tRHZ Figure 8 50 ns
Receiver Enable from Shutdown
tRZH(SHDN) Figure 8 1800 ns
to Output High
Receiver Enable from Shutdown
tRZL(SHDN) Figure 8 1800 ns
to Output Low
Time to Shutdown tSHDN 50 200 600 ns

6 _______________________________________________________________________________________
 +3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
Typical Operating Characteristics

MAX3070E–MAX3079E
(VCC = 3.3V, TA = +25°C, unless otherwise noted.)

OUTPUT CURRENT OUTPUT CURRENT

SUPPLY CURRENT vs. TEMPERATURE vs. RECEIVER OUTPUT HIGH VOLTAGE vs. RECEIVER OUTPUT LOW VOLTAGE
1.0 30 35
MAX3070E toc01

MAX3070E toc02

MAX3070E toc03
25 30
0.9
SUPPLY CURRENT (mA)

OUTPUT CURRENT (mA)

OUTPUT CURRENT (mA)

25
DE = VCC 20
0.8
20
15
DE = 0
0.7 15
10
10
0.6
5
5

0.5 0 0
-50 -25 0 25 50 75 100 125 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
TEMPERATURE (°C) OUTPUT HIGH VOLTAGE (V) OUTPUT HIGH VOLTAGE (V)

RECEIVER OUTPUT HIGH VOLTAGE RECEIVER OUTPUT LOW VOLTAGE DRIVER OUTPUT CURRENT
vs. TEMPERATURE vs. TEMPERATURE vs. DIFFERENTIAL OUTPUT VOLTAGE
3.30 0.8 100

MAX3070E toc06
MAX3070E toc05
MAX3070E toc04

IO = -1mA IO = -1mA 90
0.7
3.25 80
OUTPUT LOW VOLTAGE (V)
OUTPUT HIGH VOLTAGE (V)

OUTPUT CURRENT (mA)

0.6
70
3.20
0.5 60

3.15 0.4 50
40
0.3
3.10 30
0.2
20
3.05
0.1 10

3.00 0 0
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
TEMPERATURE (°C) TEMPERATURE (°C) DIFFERENTIAL OUTPUT VOLTAGE (V)

DRIVER DIFFERENTIAL OUTPUT VOLTAGE OUTPUT CURRENT OUTPUT CURRENT

vs. TEMPERATURE vs. TRANSMITTER OUTPUT HIGH VOLTAGE vs. TRANSMITTER OUTPUT LOW VOLTAGE
2.60 160 180
MAX3070E toc08

MAX3070E toc09
XMAX3070E toc07

2.50 RL = 54Ω 140 160

DIFFERENTIAL OUTPUT VOLTAGE (V)

2.40 140
120
OUTPUT CURRENT (mA)

OUTPUT CURRENT (mA)

2.30 120
100
2.20
100
2.10 80
80
2.00 60
60
1.90
40 40
1.80
20 20
1.70
1.60 0 0
-50 -25 0 25 50 75 100 125 -7 -6 -5 -4 -3 -2 -1 0 1 2 3 4 0 2 4 6 8 10 12
TEMPERATURE (°C) OUTPUT HIGH VOLTAGE (V) OUTPUT LOW VOLTAGE (V)

_______________________________________________________________________________________ 7
 +3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
MAX3070E–MAX3079E

Typical Operating Characteristics (continued)

(VCC = 3.3V, TA = +25°C, unless otherwise noted.)

SHUTDOWN CURRENT DRIVER PROPAGATION DELAY DRIVER PROPAGATION DELAY

vs. TEMPERATURE vs. TEMPERATURE (250kbps) vs. TEMPERATURE (500kbps)
2.0 1000 500

MAX3070E toc12
MAX3070E toc11
MAX3070E toc10
1.8

DRIVER PROPAGATION DELAY (ns)

DRIVER PROPAGATION DELAY (ns)
450
1.6 900
SHUTDOWN CURRENT (µA)

tDPLH
tDPLH
1.4 400
tDPHL tDPHL
1.2 800
1.0 350
0.8 700
300
0.6
0.4 600 250
0.2
0 500 200
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125
TEMPERATURE (°C) TEMPERATURE (°C) TEMPERATURE (°C)

DRIVER PROPAGATION DELAY RECEIVER PROPAGATION DELAY RECEIVER PROPAGATION DELAY

vs. TEMPERATURE (16Mbps) vs. TEMPERATURE (250kbps AND 500kbps) vs. TEMPERATURE (16Mbps)
30 150
MAX3070E toc13

MAX3070E toc14

MAX3070E toc15
70
RECEIVER PROPAGATION DELAY (ns)
DRIVER PROPAGATION DELAY (ns)

DRIVER PROPAGATION DELAY (ns)

25
120 60

20 50
tDPLH
90
tDPLH tDPLH 40
15 tDPHL
tDPHL tDPHL
60 30
10
20
30
5
10

0 0 0
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125
TEMPERATURE (°C) TEMPERATURE (°C) TEMPERATURE (°C)

RECEIVER PROPAGATION DELAY

DRIVER PROPAGATION DELAY (250kbps) (250kbps AND 500kbps)
MAX3070E toc16 MAX3070E toc17

VA - VB
DI 1V/div
2V/div

VY - V Z RO
2V/div 2V/div

1µs/div 200ns/div

8 _______________________________________________________________________________________
 +3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
Typical Operating Characteristics (continued)

MAX3070E–MAX3079E
(VCC = 3.3V, TA = +25°C, unless otherwise noted.)

DRIVER PROPAGATION DELAY (500kbps) DRIVER PROPAGATION DELAY (16Mbps) RECEIVER PROPAGATION DELAY (16Mbps)
MAX3070E toc18 MAX3070E toc19 MAX3070E toc20

VA
1V/div
DI
DI 2V/div
2V/div VB
1V/div
VZ
1V/div
VY - VZ
2V/div
VY RO
1V/div 2V/div

400ns/div 10ns/div 20ns/div

Test Circuits and Waveforms

Y 3V

DE
RL/2

Y
VOD
DI VOD RL CL
RL/2 VOC Z

Figure 1. Driver DC Test Load Figure 2. Driver Timing Test Circuit

VCC
DI VCC/2
0
tDPLH tDPHL 1/2 VO

Z
VO
Y
1/2 VO
VDIFF = V (Y) - V (Z)
VO
VDIFF 0 90% 90%
10% 10%
-VO
tDR tDF

tSKEW = | tDPLH - tDPHL |

Figure 3. Driver Propagation Delays

_______________________________________________________________________________________ 9
 +3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
Test Circuits and Waveforms (continued)
MAX3070E–MAX3079E

S1
0 OR 3V D OUT

CL RL = 500Ω
50pF

GENERATOR
50Ω

VCC
DE VCC / 2
tDZH, tDZH(SHDN)
0

0.25V VOH

OUT VOM = (0 + VOH) / 2

0
tDHZ

Figure 4. Driver Enable and Disable Times (tDHZ, tDZH, tDZH(SHDN))

VCC

RL = 500Ω
S1
0 OR 3V D OUT

CL
50pF

GENERATOR 50Ω

VCC
DE VCC / 2
tDZL, tDZL(SHDN)
0

tDLZ
VCC
OUT VOM = (VOL + VCC) / 2
VOL 0.25V

Figure 5. Driver Enable and Disable Times (tDZL, tDLZ, tDLZ(SHDN))

10 ______________________________________________________________________________________
 +3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
Test Circuits and Waveforms (continued)

MAX3070E–MAX3079E
A +1V

B -1V
B RECEIVER
OUTPUT tRPLH
ATE VID R VOH
tRPHL
A VOL 1.5V
RO
THE RISE TIME AND FALL TIME OF INPUTS A AND B < 4ns

Figure 6. Receiver Propagation Delay Test Circuit Figure 7. Receiver Propagation Delays

S1
+1.5V S3
VCC
1kΩ
-1.5V VID R

CL
15pF S2

GENERATOR 50Ω

S1 OPEN S1 CLOSED
S2 CLOSED S2 OPEN
S3 = +1.5V S3 = -1.5V
3V 3V

1.5V
RE RE
0 0

tRZH, tRZH(SHDN)
tRZL, tRZL(SHDN)
VOH VCC
RO
VOH / 2
(VOL + VCC) / 2
RO
0 VOL

S1 OPEN S1 CLOSED
S2 CLOSED S2 OPEN
S3 = +1.5V S3 = -1.5V
3V 3V

1.5V 1.5V
RE
0 RE
0
tRHZ

tRLZ

VCC
VOH
0.25V
RO
RO 0.25V
0 VOL

Figure 8. Receiver Enable and Disable Times

______________________________________________________________________________________ 11
 +3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
Pin Description
MAX3070E–MAX3079E

PIN
MAX3070E MAX3071E MAX3072E
MAX3073E MAX3074E MAX3075E MAX3079E
MAX3076E MAX3077E MAX3078E NAME FUNCTION
HALF- FULL- HALF-
FULL-DUPLEX
DUPLEX DUPLEX DUPLEX
DEVICES
DEVICES MODE MODE
Half-/Full-Duplex Select Pin. Connect H/F to VCC for half-
— — — 1 1 H/F duplex mode; connect to GND or leave unconnected for
full-duplex mode.
Receiver Output. When RE is low and if (A - B) ≥ -50mV,
2 2 1 2 2 RO
RO is high; if (A - B) ≤ -200mV, RO is low.

Receiver Output Enable. Drive RE low to enable RO; RO is

high impedance when RE is high. Drive RE high and DE
3 — 2 3 3 RE
low to enter low-power shutdown mode. RE is a hot-swap
input (see the Hot-Swap Capability section for details).

Driver Output Enable. Drive DE high to enable driver

outputs. These outputs are high impedance when DE is
4 — 3 4 4 DE low. Drive RE high and DE low to enter low-power
shutdown mode. DE is a hot-swap input (see the Hot-
Swap Capability section for details).
Driver Input. With DE high, a low on DI forces noninverting
5 3 4 5 5 DI output low and inverting output high. Similarly, a high on DI
forces noninverting output high and inverting output low.
Slew-Rate Limit Selector Pin. Connect SRL to ground for
16Mbps communication rate; connect to VCC for 500kbps
— — — 6 6 SRL
communication rate. Leave unconnected for 250kbps
communication rate.
6, 7 4 5 7 7 GND Ground
Transmitter Phase. Connect TXP to ground or leave
— — — 8 8 TXP floating for normal transmitter phase/polarity. Connect to
VCC to invert the transmitter phase/polarity.
9 5 — 9 — Y Noninverting Driver Output
Noninverting Driver Output and Noninverting Receiver
— — — — 9 Y
Input*
10 6 — 10 — Z Inverting Driver Output
— — — — 10 Z Inverting Driver Output and Inverting Receiver Input*
11 7 — 11 — B Inverting Receiver Input
— — — — 11 B Receiver Input Resistors*
— — 7 — — B Inverting Receiver Input and Inverting Driver Output

12 ______________________________________________________________________________________
 +3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
Pin Description (continued)

MAX3070E–MAX3079E
PIN
MAX3070E MAX3071E MAX3072E
MAX3073E MAX3074E MAX3075E MAX3079E
MAX3076E MAX3077E MAX3078E NAME FUNCTION
HALF- FULL- HALF-
FULL-DUPLEX
DUPLEX DUPLEX DUPLEX
DEVICES
DEVICES MODE MODE
12 8 — 12 — A Noninverting Receiver Input
— — — — 12 A Receiver Input Resistors*
Noninverting Receiver Input and Noninverting Driver
— — 6 — — A
Output
Receiver Phase. Connect RXP to GND or leave
— — — 13 13 RXP unconnected for normal transmitter phase/polarity.
Connect to VCC to invert receiver phase/polarity.
Positive Supply VCC = 3.3V ±10%. Bypass VCC to GND
14 1 8 14 14 VCC
with a 0.1µF capacitor.
No Connect. Not internally connected. Can be connected
1, 8, 13 — — — — N.C.
to GND.
*MAX3079E only. In half-duplex mode, the driver outputs serve as receiver inputs. The full-duplex receiver inputs (A and B) still have a
1/8-unit load, but are not connected to the receiver.

Function Tables
MAX3070E/MAX3073E/MAX3076E MAX3071E/MAX3074E/MAX30767E
TRANSMITTING TRANSMITTING
INPUTS OUTPUTS INPUT OUTPUTS
RE DE DI Z Y DI Z Y
X 1 1 0 1 1 0 1
X 1 0 1 0 0 1 0
0 0 X High-Z High-Z
1 0 X Shutdown RECEIVING
INPUTS OUTPUT
RECEIVING A, B RO
INPUTS OUTPUT ≥ -50mV 1
RE DE A, B RO ≤ -200mV 0
0 X ≥ -50mV 1 Open/shorted 1
0 X ≤ -200mV 0
Open/
0 X 1
shorted
1 1 X High-Z
1 0 X Shutdown

______________________________________________________________________________________ 13
 +3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
Function Tables (continued)
MAX3070E–MAX3079E

MAX3072E/MAX3075E/MAX3078E
TRANSMITTING RECEIVING
INPUTS OUTPUTS INPUTS OUTPUTS
RE DE DI B/Z A/Y RE DE A-B RO
X 1 1 0 1 0 X ≥ -50mV 1
X 1 0 1 0 0 X ≤ -200mV 0
0 0 X High-Z High-Z Open/
0 X 1
1 0 X Shutdown shorted
1 1 X High-Z
1 0 X Shutdown

MAX3079E
TRANSMITTING
INPUTS OUTPUTS
TXP RE DE DI Z Y
0 X 1 1 0 1
0 X 1 0 1 0
1 X 1 1 1 0
1 X 1 0 0 1
X 0 0 X High-Z High-Z
X 1 0 X Shutdown

RECEIVING
INPUTS OUTPUTS
H/F RXP RE DE A, B Y, Z RO
0 0 0 X > -50mV X 1
0 0 0 X < -200mV X 0
0 1 0 X > -50mV X 0
0 1 0 X < -200mV X 1
1 0 0 0 X > -50mV 1
1 0 0 0 X < -200mV 0
1 1 0 0 X > -50mV 0
1 1 0 0 X < -200mV 1
0 0 0 X Open/shorted X 1
1 0 0 0 X Open/shorted 1
0 1 0 X Open/shorted X 0
1 1 0 0 X Open/shorted 0
X X 1 1 X X High-Z
X X 1 0 X X Shutdown
X = Don’t care; shutdown mode, driver and receiver outputs are high impedance.

14 ______________________________________________________________________________________
 +3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
Detailed Description than or equal to -200mV, RO is logic low. In the case of

MAX3070E–MAX3079E
a terminated bus with all transmitters disabled, the
The MAX3070E–MAX3079E high-speed transceivers for
receiver’s differential input voltage is pulled to 0V by
RS-485/RS-422 communication contain one driver and
the termination. With the receiver thresholds of the
one receiver. These devices feature fail-safe circuitry,
MAX3070E family, this results in a logic high with a
which guarantees a logic-high receiver output when the
50mV minimum noise margin. Unlike previous fail-safe
receiver inputs are open or shorted, or when they are
devices, the -50mV to -200mV threshold complies with
connected to a terminated transmission line with all dri-
the ±200mV EIA/TIA-485 standard.
vers disabled (see the Fail-Safe section). The
MAX3070E/MAX3072E/MAX3073E/MAX3075E/ Hot-Swap Capability
MAX3076E/MAX3078E/MAX3079E also feature a hot- (Except MAX3071E/MAX3074E/MAX3077E)
swap capability allowing line insertion without erro-
neous data transfer (see the Hot Swap Capability Hot-Swap Inputs
section). The MAX3070E/MAX3071E/MAX3072E feature When circuit boards are inserted into a hot, or pow-
reduced slew-rate drivers that minimize EMI and ered, backplane, differential disturbances to the data
reduce reflections caused by improperly terminated bus can lead to data errors. Upon initial circuit board
cables, allowing error-free data transmission up to insertion, the data communication processor under-
250kbps. The MAX3073E/MAX3074E/MAX3075E also goes its own power-up sequence. During this period,
offer slew-rate limits allowing transmit speeds up to the processor’s logic-output drivers are high imped-
500kbps. The MAX3076E/MAX3077E/MAX3078Es’ dri- ance and are unable to drive the DE and RE inputs of
ver slew rates are not limited, making transmit speeds these devices to a defined logic level. Leakage cur-
up to 16Mbps possible. The MAX3079E’s slew rate is rents up to ±10µA from the high-impedance state of the
selectable between 250kbps, 500kbps, and 16Mbps processor’s logic drivers could cause standard CMOS
by driving a selector pin with a three-state driver. enable inputs of a transceiver to drift to an incorrect
logic level. Additionally, parasitic circuit board capaci-
The MAX3072E/MAX3075E/MAX3078E are half-duplex tance could cause coupling of V CC or GND to the
transceivers, while the MAX3070E/MAX3071E/ enable inputs. Without the hot-swap capability, these
MAX3073E/MAX3074E/MAX3076E/MAX3077E are full- factors could improperly enable the transceiver’s driver
duplex transceivers. The MAX3079E is selectable or receiver.
between half- and full-duplex communication by driving
a selector pin (SRL) high or low, respectively. When VCC rises, an internal pulldown circuit holds DE
low and RE high. After the initial power-up sequence,
All devices operate from a single 3.3V supply. Drivers are the pulldown circuit becomes transparent, resetting the
output short-circuit current limited. Thermal-shutdown cir- hot-swap tolerable input.
cuitry protects drivers against excessive power dissipa-
tion. When activated, the thermal-shutdown circuitry Hot-Swap Input Circuitry
places the driver outputs into a high-impedance state. The enable inputs feature hot-swap capability. At the
input there are two NMOS devices, M1 and M2
Receiver Input Filtering (Figure 9). When VCC ramps from zero, an internal 10µs
The receivers of the MAX3070E–MAX3075E, and the timer turns on M2 and sets the SR latch, which also
MAX3079E when operating in 250kbps or 500kbps turns on M1. Transistors M2, a 500µA current sink, and
mode, incorporate input filtering in addition to input M1, a 100µA current sink, pull DE to GND through a
hysteresis. This filtering enhances noise immunity with 5kΩ resistor. M2 is designed to pull DE to the disabled
differential signals that have very slow rise and fall state against an external parasitic capacitance up to
times. Receiver propagation delay increases by 25% 100pF that can drive DE high. After 10µs, the timer
due to this filtering. deactivates M2 while M1 remains on, holding DE low
Fail-Safe against three-state leakages that can drive DE high. M1
The MAX3070E family guarantees a logic-high receiver remains on until an external source overcomes the
output when the receiver inputs are shorted or open, or required input current. At this time, the SR latch resets
when they are connected to a terminated transmission and M1 turns off. When M1 turns off, DE reverts to a
line with all drivers disabled. This is done by setting the standard, high-impedance CMOS input. Whenever VCC
receiver input threshold between -50mV and -200mV. If drops below 1V, the hot-swap input is reset.
the differential receiver input voltage (A - B) is greater For RE there is a complementary circuit employing two
than or equal to -50mV, RO is logic high. If A - B is less PMOS devices pulling RE to VCC.

______________________________________________________________________________________ 15
 +3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
operation. Drive H/F high for half-duplex operation. In
MAX3070E–MAX3079E

full-duplex mode, the pin configuration of the driver and

VCC receiver is the same as that of a MAX3070E. In half-
duplex mode, the receiver inputs are switched to the
10µs driver outputs, connecting outputs Y and Z to inputs A
TIMER and B, respectively. In half-duplex mode, the internal
SR LATCH full-duplex receiver input resistors are still connected to
pins 11 and 12.
TIMER
±15kV ESD Protection
As with all Maxim devices, ESD-protection structures
are incorporated on all pins to protect against electro-
static discharges encountered during handling and
assembly. The driver outputs and receiver inputs of the
MAX3070E family of devices have extra protection
against static electricity. Maxim’s engineers have devel-
5kΩ oped state-of-the-art structures to protect these pins
DE against ESD of ±15kV without damage. The ESD struc-
DE
(HOT SWAP)
tures withstand high ESD in all states: normal operation,
100µA shutdown, and powered down. After an ESD event, the
500µA MAX3070E–MAX3079E keep working without latchup or
M1 M2 damage.
ESD protection can be tested in various ways. The
transmitter outputs and receiver inputs of the
MAX3070E–MAX3079E are characterized for protection
Figure 9. Simplified Structure of the Driver Enable Pin (DE) to the following limits:
• ±15kV using the Human Body Model
MAX3079E Programming
The MAX3079E has several programmable operating • ±6kV using the Contact Discharge method specified
modes. Transmitter rise and fall times are programma- in IEC 1000-4-2
ble, resulting in maximum data rates of 250kbps,
500kbps, and 16Mbps. To select the desired data rate, ESD Test Conditions
drive SRL to one of three possible states by using a ESD performance depends on a variety of conditions.
three-state driver: V CC , GND, or unconnected. For Contact Maxim for a reliability report that documents
250kbps operation, set the three-state device in high- test setup, test methodology, and test results.
impedance mode or leave SRL unconnected. For
Human Body Model
500kbps operation, drive SRL high or connect it to VCC.
Figure 10a shows the Human Body Model, and Figure
For 16Mbps operation, drive SRL low or connect it to
10b shows the current waveform it generates when dis-
GND. SRL can be changed during operation without
charged into a low impedance. This model consists of a
interrupting data communications.
100pF capacitor charged to the ESD voltage of interest,
Occasionally, twisted-pair lines are connected backward which is then discharged into the test device through a
from normal orientation. The MAX3079E has two pins that 1.5kΩ resistor.
invert the phase of the driver and the receiver to correct
this problem. For normal operation, drive TXP and RXP IEC 1000-4-2
low, connect them to ground, or leave them unconnect- The IEC 1000-4-2 standard covers ESD testing and
ed (internal pulldown). To invert the driver phase, drive performance of finished equipment. However, it does
TXP high or connect it to VCC. To invert the receiver not specifically refer to integrated circuits. The
phase, drive RXP high or connect it to VCC. Note that the MAX3070E family of devices helps you design equip-
receiver threshold is positive when RXP is high. ment to meet IEC 1000-4-2, without the need for addi-
tional ESD-protection components.
The MAX3079E can operate in full- or half-duplex
mode. Drive the H/F pin low, leave it unconnected The major difference between tests done using the
(internal pulldown), or connect it to GND for full-duplex Human Body Model and IEC 1000-4-2 is higher peak

16 ______________________________________________________________________________________
 +3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers

MAX3070E–MAX3079E
RC RD
1MΩ 1500Ω IP 100% PEAK-TO-PEAK RINGING
Ir
90% (NOT DRAWN TO SCALE)
CHARGE-CURRENT- DISCHARGE
LIMIT RESISTOR RESISTANCE
AMPS
HIGH- DEVICE 36.8%
VOLTAGE Cs STORAGE UNDER
DC 100pF CAPACITOR TEST
10%
SOURCE
0
0 TIME
tRL
tDL
CURRENT WAVEFORM

Figure 10a. Human Body ESD Test Model Figure 10b. Human Body Current Waveform

RC RD I
50MΩ TO 100MΩ 330Ω 100%
90%
CHARGE-CURRENT- DISCHARGE
LIMIT RESISTOR RESISTANCE IPEAK

HIGH- DEVICE
VOLTAGE Cs STORAGE UNDER
DC 150pF CAPACITOR TEST
SOURCE
10%

tr = 0.7ns TO 1ns t
30ns
60ns

Figure 10c. IEC 1000-4-2 ESD Test Model Figure 10d. IEC 1000-4-2 ESD Generator Current Waveform

current in IEC 1000-4-2, because series resistance is Applications Information

lower in the IEC 1000-4-2 model. Hence, the ESD with-
stand voltage measured to IEC 1000-4-2 is generally 256 Transceivers on the Bus
lower than that measured using the Human Body Model. The standard RS-485 receiver input impedance is 12kΩ
Figure 10c shows the IEC 1000-4-2 model, and Figure (1-unit load), and the standard driver can drive up to 32-
10d shows the current waveform for IEC 1000-4-2 ESD unit loads. The MAX3070E family of transceivers has a
Contact Discharge test. 1/8-unit load receiver input impedance (96kΩ), allowing
The air-gap test involves approaching the device with a up to 256 transceivers to be connected in parallel on one
charged probe. The contact-discharge method connects communication line. Any combination of these devices
the probe to the device before the probe is energized. as well as other RS-485 transceivers with a total of 32-
unit loads or fewer can be connected to the line.
Machine Model
The machine model for ESD tests all pins using a Reduced EMI and Reflections
200pF storage capacitor and zero discharge resis- The MAX3070E/MAX3071E/MAX3072E feature reduced
tance. The objective is to emulate the stress caused slew-rate drivers that minimize EMI and reduce reflec-
when I/O pins are contacted by handling equipment tions caused by improperly terminated cables, allowing
during test and assembly. Of course, all pins require error-free data transmission up to 250kbps. The
this protection, not just RS-485 inputs and outputs. MAX3073E/MAX3074E/MAX3075E offer higher driver
output slew-rate limits, allowing transmit speeds up to
500kbps. The MAX3079E with SRL = VCC or uncon-
nected, are slew-rate limited. With SRL unconnected,
the MAX3079E error-free data transmission is up to
250kbps; with SRL connected to VCC the data transmit
speeds up to 500kbps.

______________________________________________________________________________________ 17
 +3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
Low-Power Shutdown Mode (Except Driver Output Protection
MAX3070E–MAX3079E

MAX3071E/MAX3074E/MAX3077E) Two mechanisms prevent excessive output current and

Low-power shutdown mode is initiated by bringing both power dissipation caused by faults or by bus contention.
RE high and DE low. In shutdown, the devices typically The first, a foldback current limit on the output stage,
draw only 50nA of supply current. provides immediate protection against short circuits over
RE and DE can be driven simultaneously; the parts are the whole common-mode voltage range (see the Typical
guaranteed not to enter shutdown if RE is high and DE Operating Characteristics). The second, a thermal-shut-
is low for less than 50ns. If the inputs are in this state down circuit, forces the driver outputs into a high-imped-
for at least 600ns, the parts are guaranteed to enter ance state if the die temperature becomes excessive.
shutdown. Line Length
Enable times t ZH and t ZL (see the Switching The RS-485/RS-422 standard covers line lengths up to
Characteristics section) assume the part was not in a 4000ft. For line lengths greater than 4000ft, use the
low-power shutdown state. Enable times tZH(SHDN) and repeater application shown in Figure 11.
tZL(SHDN) assume the parts were shut down. It takes
drivers and receivers longer to become enabled from Typical Applications
low-power shutdown mode (tZH(SHDN), tZL(SHDN)) than The MAX3072E/MAX3075E/MAX3078E/MAX3079E
from driver/receiver-disable mode (tZH, tZL). transceivers are designed for bidirectional data commu-
nications on multipoint bus transmission lines. Figures
12 and 13 show typical network applications circuits.
To minimize reflections, terminate the line at both ends
MAX3070E/MAX3071E/MAX3073E/
in its characteristic impedance, and keep stub lengths
MAX3074E/MAX3076E/MAX3077E/
off the main line as short as possible. The slew-rate-lim-
MAX3079E (FULL-DUPLEX)
ited MAX3072E/MAX3075E and the two modes of the
A MAX3079E are more tolerant of imperfect termination.
RO DATA IN
R B 120Ω
RE
DE
Chip Information
Z
DI
TRANSISTOR COUNT: 1228
D DATA OUT
Y 120Ω PROCESS: BiCMOS

Figure 11. Line Repeater for MAX3070E/MAX3071E/MAX3073E/

MAX3074E/MAX3076E/MAX3077E/MAX3079E in Full-Duplex
Mode

120Ω 120Ω
DE
B B
DI
D D
DI
DE A B A B A A

RO R R RO
RE RE

R R
D D
MAX3072E
MAX3075E
MAX3078E
MAX3079E (HALF-DUPLEX) DI DE RO RE DI DE RO RE

Figure 12. Typical Half-Duplex RS-485 Network

18 ______________________________________________________________________________________
 +3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers

MAX3070E–MAX3079E
A Y
120Ω 120Ω
RO R D DI
B
RE
Z
DE
DE
Z B
RE
120Ω 120Ω
DI D R RO
Y
A
Y Z B A Y Z B A

R R MAX3070E
MAX3071E
D D
MAX3073E
MAX3074E
MAX3076E
DI DE RE RO DI DE RE RO
MAX3077E
MAX3079E (FULL-DUPLEX)
NOTE: RE AND DE ON MAX3070E/MAX3073E/MAX3076E/MAX3079E ONLY.

Figure 13. Typical Full-Duplex RS-485 Network

Selector Guide
RECEIVER/
HALF/FULL DATA RATE SLEW-RATE LOW-POWER TRANSCEIVERS
PART DRIVER PINS
DUPLEX (Mbps) LIMITED SHUTDOWN ON BUS
ENABLE
MAX3070E Full 0.250 Yes Yes Yes 256 14
MAX3071E Full 0.250 Yes No No 256 8
MAX3072E Half 0.250 Yes Yes Yes 256 8
MAX3073E Full 0.5 Yes Yes Yes 256 14
MAX3074E Full 0.5 Yes No No 256 8
MAX3075E Half 0.5 Yes Yes Yes 256 8
MAX3076E Full 16 No Yes Yes 256 14
MAX3077E Full 16 No No No 256 8
MAX3078E Half 16 No Yes Yes 256 8
MAX3079E Selectable Selectable Selectable Yes Yes 256 14

______________________________________________________________________________________ 19
 +3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
Pin Configurations and Typical Operating Circuits
MAX3070E–MAX3079E

VCC MAX3070E
DE VCC RE
4 14 0.1µF MAX3073E
MAX3076E
N.C. 1 14 VCC 9 Y
5 Rt
RO 2 R 13 N.C. DI D R RO
10
RE 3 12 A Z
12 A
DE 4 11 B 2 Rt
RO R D DI
DI 5 11
10 Z
D B
1, 8, 13
GND 6 9 Y N.C. GND
3 6, 7
GND 7 8 N.C. GND DE
RE
TYPICAL FULL-DUPLEX OPERATING CIRCUIT
DIP/SO

0.1µF
MAX3071E VCC
VCC 1 MAX3074E
MAX3077E
VCC 1 8 A
R 5 Y
RO 2 7 B 3 Rt
DI D R RO
6
DI 3 6 Z Z
D 8 A
GND 4 5 Y
2 Rt
RO R D DI
7
B
DIP/SO
GND
4
GND
TYPICAL FULL-DUPLEX OPERATING CIRCUIT

0.1µF
MAX3072E
MAX3075E DE
MAX3078E
1 8 VCC DI
RO 1 R 8 VCC RO R D
2 7 A A
RE 2 7 B RE Rt Rt
3 6
DE 3 6 A DE
B B
4 5 RO
DI 4 D 5 GND DI D R
GND

RE
DIP/SO
TYPICAL HALF-DUPLEX OPERATING CIRCUIT

NOTE: PIN LABELS Y AND Z ON TIMING, TEST, AND WAVEFORMS DIAGRAMS.

REFER TO PINS A AND B WHEN DE IS HIGH.

20 ______________________________________________________________________________________
 +3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
Pin Configurations and Typical Operating Circuits (continued)

MAX3070E–MAX3079E
VCC RE

MAX3079E
A

TOP VIEW RO

H/F 1 14 VCC B
RXP
RO 2 13 RXP
RE 3 12 A
DE 4 MAX3079E 11 B
H/F
Z
DI 5 10 Z
TXP
SRL 6 9 Y
GND 7 8 TXP
Y

DIP/SO DI

NOTE: SWITCH POSITIONS

INDICATED FOR H/F = GND.
GND DE SRL

______________________________________________________________________________________ 21
 +3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
Ordering Information (continued)
MAX3070E–MAX3079E

PART TEMP RANGE PIN-PACKAGE PART TEMP RANGE PIN-PACKAGE

MAX3072EEPA -40°C to +85°C 8 Plastic DIP MAX3076EEPD -40°C to +85°C 14 Plastic DIP
MAX3072EESA -40°C to +85°C 8 SO MAX3076EESD -40°C to +85°C 14 SO
MAX3072EAPA -40°C to +125°C 8 Plastic DIP MAX3076EAPD -40°C to +125°C 14 Plastic DIP
MAX3072EASA -40°C to +125°C 8 SO MAX3076EASD -40°C to +125°C 14 SO
MAX3073EEPD -40°C to +85°C 14 Plastic DIP MAX3077EEPA -40°C to +85°C 8 Plastic DIP
MAX3073EESD -40°C to +85°C 14 SO MAX3077EESA -40°C to +85°C 8 SO
MAX3073EAPD -40°C to +125°C 14 Plastic DIP MAX3077EAPA -40°C to +125°C 8 Plastic DIP
MAX3073EASD -40°C to +125°C 14 SO MAX3077EASA -40°C to +125°C 8 SO
MAX3074EEPA -40°C to +85°C 8 Plastic DIP MAX3078EEPA -40°C to +85°C 8 Plastic DIP
MAX3074EESA -40°C to +85°C 8 SO MAX3078EESA -40°C to +85°C 8 SO
MAX3074EAPA -40°C to +125°C 8 Plastic DIP MAX3078EAPA -40°C to +125°C 8 Plastic DIP
MAX3074EASA -40°C to +125°C 8 SO MAX3078EASA -40°C to +125°C 8 SO
MAX3075EEPA -40°C to +85°C 8 Plastic DIP MAX3079EEPD -40°C to +85°C 14 Plastic DIP
MAX3075EESA -40°C to +85°C 8 SO MAX3079EESD -40°C to +85°C 14 SO
MAX3075EAPA -40°C to +125°C 8 Plastic DIP MAX3079EAPD -40°C to +125°C 14 Plastic DIP
MAX3075EASA -40°C to +125°C 8 SO MAX3079EASD -40°C to +125°C 14 SO

22 ______________________________________________________________________________________
 +3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
Package Information

MAX3070E–MAX3079E
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)

9LUCSP, 3x3.EPS

______________________________________________________________________________________ 23
 +3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
Package Information (continued)
MAX3070E–MAX3079E

(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)

PDIPN.EPS

24 ______________________________________________________________________________________
 +3.3V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
Package Information (continued)

MAX3070E–MAX3079E
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)

SOICN .EPS
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 0.053 0.069 1.35 1.75
N A1 0.004 0.010 0.10 0.25
B 0.014 0.019 0.35 0.49
C 0.007 0.010 0.19 0.25
e 0.050 BSC 1.27 BSC
E 0.150 0.157 3.80 4.00
E H H 0.228 0.244 5.80 6.20
L 0.016 0.050 0.40 1.27

VARIATIONS:
1
INCHES MILLIMETERS
TOP VIEW DIM MIN MAX MIN MAX N MS012
D 0.189 0.197 4.80 5.00 8 AA
D 0.337 0.344 8.55 8.75 14 AB
D 0.386 0.394 9.80 10.00 16 AC

A C

e B A1 0 -8
L
FRONT VIEW SIDE VIEW

PROPRIETARY INFORMATION
TITLE:

PACKAGE OUTLINE, .150" SOIC

APPROVAL DOCUMENT CONTROL NO. REV.
1
21-0041 B 1

Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.

Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 25

© 2003 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.