Laminate & Prepreg
Manufacturing
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Manufacturing Technology Focus
p Treating p Lay up p Press
p Sandwich copper p High temperature
p Gamma Gauges for Resin
content control for PWB
concept, separate rooms. pressing capability
p On line DCM’s, MMV’s, FTIR’s p Lamination p
Controlled Clean room Finishing
p High Shear mixing equipment, environmentB-stage
with for p High Speed and precise
Dedicated lines, Filtration
control.
Laminate
Humidity and static finishing capability.
systems
p Manufacturing Focus
p Internal contamination Reduction - Controlled environment, Treating technology, handling and lay up
technology.
p Prepreg Consistency - Resin content control, On Line cure monitoring, Redundancy with FTIR, Melt viscosity
and Gelation
p Surface quality - Lay up Technology
p Controlled thickness .
p Cost
p Productivity enhancement through lean manufacturing, Re engineered Processes
p QTA
p Fast turn around capability through cycle time reduction, sophisticated scheduling and equipment capability
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Material Building Blocks
Glass
• Glass fabric is available in different roll widths and thicknesses
• Some glass fabrics are different between North America, Asia Pacific and Europe
• Core constructions are different depending on the region and OEM spec.
Resin
• The resin is determined by what properties are needed to make a particular MLB design
function. ie. Tg, Dk, Df etc.
• The resin must be compatible with the glass fabric
• The resin must be compatible with the copper foil
Copper
• Copper is designated by wt and foil type i.e. Reverse Treat ( RTF ), HTE, Double Treat
or std ED copper foil
• The copper used must be able to achieve good peel strengths so the copper does not
pull away from the glass and resin.
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Woven Glass Fabric
OEM designs are calling out the number of plies of glass to be used
per core layer and even calling out the glass fabric style when
controlled impedance is critical.
It is important that we understand the effect of the glass used in the
construction of the core material we give to an OEM. A 2 ply construction
vs. 1 ply will give you a different Dk and Df based on the retained resin %
of the core.
When programs move from one Region to the other please be aware of the
constructions used in the other Regions. For critical OEM’s and designs we
need to try and keep the electrical properties of the material the same ie
the same construction of core material
On the next slide you will see the different glass styles used in North America
Asia Pacific and Europe.
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Glass Fabric
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Glass Fabric
Glass Weave Warp Fill Warp Fill Fabric Fabric Fabric Fabric
Style Count Count Yarn Yarn Thickness Thickness Nominal Weight Nominal Weight
inches mm OSY g/m2
1067 Plain 70 70 ECD 900-1/0 ECD 900-1/0 0.0013 0.032 0.91 31
106 Plain 56 56 ECD 900-1/0 ECD 900-1/0 0.0015 0.038 0.73 25
1086 Plain 60 60 ECD 450 1/0 ECD 450 1/0 0.0020 0.050 1.60 54
1080 Plain 60 47 ECD 450-1/0 ECD 450-1/0 0.0025 0.064 1.45 49
2113 Plain 60 56 ECE 225-1/0 ECD 450-1/0 0.0029 0.074 2.31 78
2313 Plain 60 64 ECE 225- 1/0 ECD 450-1/0 0.0032 0.080 2.38 81
3313 Plain 61 62 ECDE 300-1/0 ECDE 300-1/0 0.0032 0.081 2.43 82
3070 Plain 70 70 ECDE 300-1/0 ECDE 300-1/0 0.0034 0.086 2.74 93
2116 Plain 60 58 ECE 225-1/0 ECE 225-1/0 0.0038 0.097 3.22 109
1506 Plain 46 45 ECE110-1/1 ECE 110-1/0 0.0056 0.140 4.89 165
1652 Plain 52 52 ECG 150-1/0 ECG 150-1/0 0.0045 0.114 4.09 142
7628 Plain 44 31 ECG 75-1/0 ECG 75-1/0 0.0068 0.173 6.00 203
Fiberglass Yarn Nomenclature
1st Letter E = E-glass ( electrical grade )
2nd Letter C = Continuous Filaments
3rd Letter Filament Diameter D, E, DE, G
Ist number Yardage in one pound
2nd number Number of strands in a yarn/ strands plied or twisted
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Woven Glass Fabric
106
Warp & Fill Count: 56 x 56 (ends/in)
Thickness: 0.0015” / 0.038 mm
1080
Warp & Fill Count: 60 x 47 (ends/in)
Thickness: 0.0025” / 0.064 mm
Photos courtesy of Isola R & D Laboratories
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Woven Glass Fabric
1067
Warp & Fill Count: 70 x 70 (ends/in)
Thickness: 0.0013” / 0.032 mm
1086
Warp & Fill Count: 60 x 60 (ends/in)
Thickness: 0.002” / 0.050 mm
Photos courtesy of Isola R & D Laboratories
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Woven Glass Fabric
2113
Warp & Fill Count: 60 x 56 (ends/in)
Thickness: 0.0029” / 0.074 mm
2313
Warp & Fill Count: 60 x 64 (ends/in)
Thickness: 0.0032” / 0.080 mm
Photos courtesy of Isola R & D Laboratories
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Woven Glass Fabric
3070
50 x
3070
Warp & Fill Count: 70 x 70 (ends/in)
Thickness: 0.0034” / 0.086 mm
3313
50 x
3313
Warp & Fill Count: 61 x 62 (ends/in)
Thickness: 0.0032” / 0.081 mm
Photos courtesy of Isola R & D Laboratories
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Woven Glass Fabric
2116
Warp & Fill Count: 60 x 58 (ends/in)
Thickness: 0.0038” / 0.097 mm
1652
Warp & Fill Count: 52 x 52 (ends/in)
Thickness: 0.0045” / 0.114 mm
Photos courtesy of Isola R & D Laboratories
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Woven Glass Fabric
1506
Warp & Fill Count: 46 x 45 (ends/in)
Thickness: 0.0056” / 0.140 mm
7628
Warp & Fill Count: 44 x 32 (ends/in)
Thickness: 0.0068” / 0.173 mm
Photos courtesy of Isola R & D Laboratories
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Regional Woven Glass Fabric Styles
North America Asia-Pacific Europe
106 106 106
1080 1035 1080
1067 1078 2113
1086 1080 3070
2113 1067 2116
3313 1086 1634
3070 2313 1647
2116 3313 1651
1652 2116 1501
7628 1501 2165
1506 2157
1652 7628
7628
Isola has Global Std Constructions on the High Performance Materials
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Multilayer Core Manufacturing
Sep. Plate
Copper
2 plies
B-Stage
Copper
Sep. plate
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Typical IS415 0.005” Core Constructions
Core/ Construction Positives Negatives
0.005” Resin %
1 x 1652 42 % Cost/ Thickness/ DS Low Resin/ thick glass
106 / 2113 54 % DS/ Std 2 ply Most Expensive
2 x 1080 56 % Low Cost DS/ Thickness
1 x 2116 54 % Low Cost DS/ Thickness
Dk / Df differences based on retained resin %. The difference can be up to 14 %
At 2 GHz Dk on 42 % = 4.12 Df on 42 % = 0.016
At 2 GHz Dk on 56 % = 3.79 Df on 56 % = 0.0198
Critical that the right core thickness is used by the OEM/ Designer to
meet the impedance criteria.
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Grain Direction
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Grain Direction
24” 24”
Grain Direction
18” or Warp Direction
50” wide glass
50” x 38” untrimmed
48” x 36” trimmed
oversized panels
available
18”
50” wide Glass - Fill Direction
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Copper Foil
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ED Copper Foil Manufacturing
• Copper is electroplated onto a rotating drum.
• Treatments are applied to:
– Micro-roughen surface for adhesion
– Plate barrier layer
– Coat with anti-tarnish
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Copper Foil
Copper Foil Types Copper wt
ED = standard shiny copper, copper tooth 18 micron = H oz
HTE = High temp elongation shiny copper, copper tooth 35 micron = 1 oz
RTF = reverse treat, low profile copper tooth 70 micron = 2 oz
DT = double treat copper, no black oxide needed
Heavier copper such
The RTF copper foils offer benefits to the fabricator as 3, 4 and 5 oz foil
during processing – more defined etched line, ability used for power supply
for thinner lines and lower copper tooth profile. designs or ground
planes in MLB designs
VLP foils are used for better impedance control
5 and 6 oz Cu for
95+ % of NA is RTF foil. Very small percentage = DT Automotive 4 – L designs
Thicker cores still use some HTE or ED foil. 12 oz Cu used for
Automotive 2 – L designs
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Electrodeposited Copper Foil
Grade Foil Description
1 Standard Electrodeposited
2 High Ductility Electrodeposited
• ED Foil is “Industry 3 High Temperature Elongation
Standard Electrodeposited
4 Annealed Electrodeposited
• Many thicknesses available 5 As Rolled-Wrought
6 Light Cold Rolled-Wrought
– ½, 1 and 2 ounce the 7 Annealed-Wrought
8 As Rolled-Wrought Low-Temperature
most common Annealable
– 3+ available Common Area Nominal Area Area Nominal
Foil Industry Weight Thickness Weight Weight Thickness
– 9, 5, 3 micron Designator Terminology (g/m )
2
(μm)
2
(oz/ft )
2
(g/254 in ) (mils)
E 5 μm 45.1 5.0 0.148 7.4 0.20
Q 9 μm 75.9 9.0 0.249 12.5 0.34
T 12 μm 106.8 12.0 0.350 17.5 0.47
Max. Foil Max. Foil H ½ oz 152.5 17.2 0.500 25.0 0.68
Foil Profile Type Profile Profile (μ M ¾ oz 228.8 25.7 0.750 37.5 1.01
(Microns) Inches)
1 1 oz 305.0 34.3 1 50.0 1.35
S – Standard N/A N/A
L – Low Profile 10.2 400 2 2 oz 610.0 68.6 2 100.0 2.70
V – Very Low Profile 5.1 200 3 3 oz 915.0 103.0 3 150.0 4.05
X – No Treatment or N/A N/A 4 4 oz 1220.0 137.0 4 200.0 5.40
Roughness 5 5 oz 1525.0 172.0 5 250.0 6.75
6 6 oz 1830.0 206.0 6 300.0 8.10
7 7 oz 2135.0 240.0 7 350.0 9.45
10 10 oz 3050.0 343.0 10 500.0 13.50
14 14 oz 4270.0 480.0 14 700.0 18.90
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Copper Surface Profiles
• Matte Side Surface Profile
Matte Side of Standard Grade 1 Foil Matte Side of Low Profile Grade 1 Foil
• Standard vs Drum Side Treated Foil ( DSTFoil )
Laminate Laminate
With Standard With DSTFoil®
Copper Copper
Foil Foil
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DSTF Process Introduction
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DSTF Process Introduction
DSTFoil ® Comparison to Standard Copper Foil
Standard
Copper
DSTFoil®
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DSTF Process Introduction
Standard Foil Clad Laminate DSTFoil ® Clad Laminate
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Definitions
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The Electromagnetic Spectrum employed for RF &
Microwave applications
FM Broadcast Radio
Remote Sensing
VHF TV Begins
VHF TV Begins
Shortwave radio
UHF TV ends
Wireless LAN
Cellular phone
Mobile Radio
Mobile Radio
Bluetooth
DBS
GPS
PCS
3 MHz 10 MHz 30 MHz 100 MHz 300 MHz 1 GHz 3 GHz 10 GHz 30 GHz
30 M 3M 30 cm 3 cm
HF VHF UHF
RF MW
MMW
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Definitions
TG – Glass Transition Temperature; The temperature at which the resin changes from a glass-
like state to an amorphous state changing its mechanical behavior, i.e. expansion rate
DSC – Differential Scanning Calorimetry; A measurement technique used to characterize the
glass transition temperature of a resin by measuring the change in heat given off the resin.
TMA – Thermal Mechanical Analysis; A measurement technique used to characterize the glass
transition temperature of a resin by measuring the changing in thermal expansion of a resin as a
function of temperature.
DMA – Dynamic Mechanical Testing; A measurement technique used to characterize the glass
transition temperature of a resin by measuring the change in modulus of a resin as a function of
temperature.
TD – Decomposition Temperature; The temperature at which the resin begins to decompose,
measured by a weight change the resin sample.
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Definitions
TGA – Thermo-Gravimetric Analysis; A measurement technique used to characterize the
decomposition temperature of a resin by measuring the change in weight as a function of temperature.
CTE – Coefficient of Thermal Expansion; The rate of expansion of a laminate as a function of
temperature change. Typically reported as PPM/°C or %.
T260 – Time-to-Delamination @ 260°C; A measurement conducted on the TMA apparatus in
order to determine a laminate’s resistance to Delamination at 260°C. Delamination is defined as an
irreversible expansion in the z-axis. Measurements are noted in minutes at 260°C before failure.
T288 – Time-to-Delamination @ 288°C; A measurement conducted on the TMA apparatus in
order to determine a laminate’s resistance to Delamination at 288°C. Delamination is defined as an
irreversible expansion in the z-axis. Measurements are noted in minutes at 288°C before failure.
Dk – Permittivity, Relative Dielectric Constant; The property of a material that impedes the
transmission of a electromagnetic wave. The lower the relative dielectric constant, the closer the
performance of the material to that of air. This property is critical to matching the impedance
requirements of certain transmission lines.
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Definitions
Df – Loss Tangent; The property of a material that describes how much of the energy transmitted is
absorbed by the material. The greater the loss tangent, the larger the energy absorption into the
material. This property directly impacts the signal attenuation at high speeds.
Peel Strength; This measurement is taken to evaluate the adhesion of the resin to the copper
cladding, in units of lbf/in or N/m. Measurements are taken after samples have been conditioned in the
following manner: as received, after thermal stress, and after chemical processing.
Thermal Stress; This measurement is taken to evaluate the thermal integrity of laminates after short-
term exposure to solder, 10 seconds at 550°F (288°C). The samples are evaluated for evidence of
blisters and delamination.
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Definitions
TCT – Thermal Cycling Test; this type of reliability test is conducted in order to evaluate a PCB’s
resistance to plated-thru-hole failures when exposed to repeated temperatures extremes. Factors in this
test that vary from OEM-to-OEM include temperature ranges, time at given temperatures, and medium
used to heat and cool the PCB (i.e. liquid or air).
IST – Interconnect Stress Test; an accelerated thermal cycling test that utilizes DC current to
heat the PTH and uses forced air to cool the PTH of a PCB coupon. The benefits of using IST in place
of conventional TCT tests include lower cost, failure detection and results within days.
CAF – Conductive Anodic Filament Growth Failure; a PCB reliability issue related to the growth
of copper containing filament along the resin-to-glass interface
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Isola
RoHS
Halogen Free
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RoHS Compliancy
RoHS Compliancy – Products that are RoHS compliant do not contain
the 6 chemical substances listed on the following slide. These substances are not
to be used in the base chemistry of laminates or prepregs.
A RoHS compliant resin system does not mean that it is Lead Free Assembly
Compatible at 260 C.
ALL Isola Products are RoHS Compliant
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EU RoHS Compliance
Restriction of Hazardous Substances
Legislation bans the following Six substances for shipment to EU countries
effective July 1 -2006
Lead ( Pb )
Mercury ( Hg )
Hexavalent Chromium ( Cr6+) Max Conc. By Wt. < 0.1 %
Polybrominated biphenyl ( PBB )
Polybrominated diphenyl ether ( PBDE )
Cadmium ( Cd ) - - Max Conc. By Wt. < 0.01 %
High End Networking companies exempt until 2010 and beyond
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