SHINDENGEN
HVX-2 Series Power MOSFET N-Channel Enhancement type
2SK2333 OUTLINE DIMENSIONS
Case : FTO-220
( F6F70HVX2 ) (Unit : mm)
700V 6A
FEATURES
Input capacitance (Ciss) is small.
Especially, input capacitance
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at 0 biass is small.
The static Rds(on) is small.
The switching time is fast.
Avalanche resistance guaranteed.
APPLICATION
Switching power supply of AC 240V input
High voltage power supply
Inverter
RATINGS
Absolute Maximum Ratings iTc = 25j
Item Symbol Conditions Ratings Unit
Storage Temperature T stg -55`150
Channel Temperature T ch 150
Drain-Source Voltage VDSS 700 V
Gate-Source Voltage VGSS }30
Continuous Drain CurrentiDCj ID 6
Continuous Drain CurrentiPeak) I DP Pulse width
10Ês, Duty cycle
1/100 18 A
Continuous Source CurrentiDCj IS 6
Total Power Dissipation PT 50 W
Repetitive Avalanche Current I AR T ch = 150 6 A
Single Avalanche Energy EAS T ch = 25 190 mJ
Repetitive Avalanche Energy EAR T ch = 25 19
Dielectric Strength Vdis Terminals to case,@AC 1 minute 2 kV
Mounting Torque TOR i Recommended torque F0.3 N¥m j 0.5 N¥m
Copyright & Copy;2000 Shindengen Electric Mfg.Co.Ltd
HVX-2 Series Power MOSFET 2SK2333 ( F6F70HVX2 )
Electrical Characteristics Tc = 25
Item Symbol Conditions Min. Typ. Max. Unit
Drain-Source Breakdown Voltage V(BR)DSS I D = 1mA, VGS = 0V 700 V
Zero Gate Voltage Drain Current I DSS VDS = 700V, VGS = 0V 250 ÊA
Gate-Source Leakage Current I GSS VGS = }30V, VDS = 0V }0. 1
Forward Traconductance gfs I D = 3A, VDS = 10V 3. 0 5. 0 S
Static Drain-Source On-tate Resistance RDS(ON) I D = 3A, VGS = 10V 1. 5 2. 0 ¶
Gate Threshold Voltage VTH I D = 1mA, VDS = 10V 2. 5 3. 0 3. 5 V
Source-Drain Diode Forward Voltage VSD I S = 3A, VGS = 0V 1. 5
Thermal Resistance Æjc junction to case 2. 5 /v
Total Gate Charge Qg VDD = 400V, VGS = 10V, I D = 6A 35 nC
Input Capacitance Ciss 1250
Reverse Transfer Capacitance Crss VDS = 10V, VGS = 0V, f = 1MHZ 250 pF
Output Capacitance C oss 530
Turn-On Time
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Turn-Off Time toff 160 250
Copyright & Copy;2000 Shindengen Electric Mfg.Co.Ltd
2SK2333 Transfer Characteristics
Tc = −55°C
16
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25°C
Drain Current ID [A]
12
100°C
8
150°C
VDS = 25V
pulse test
TYP
0
0 5 10 15 20
Gate-Source Voltage VGS [V]
2SK2333 Static Drain-Source On-state Resistance
10
Static Drain-Source On-state Resistance RDS(ON) [Ω]
ID = 3A
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0.1
VGS = 10V
pulse test
TYP
0.01
-50 0 50 100 150
Case Temperature Tc [°C]
2SK2333 Gate Threshold Voltage
5
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4
Gate Threshold Voltage VTH [V]
VDS = 10V
ID = 1mA
TYP
0
-50 0 50 100 150
Case Temperature Tc [°C]
2SK2333 Safe Operating Area
100
10
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Drain Current ID [A]
100µs
200µs
1
R DS(ON) 1ms
limit
10ms
0.1
DC
Tc = 25°C
Single Pulse
0.01
1 10 100 1000
Drain-Source Voltage VDS [V]
2SK2333 Transient Thermal Impedance
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10
0.1
0.01
Transient Thermal Impedance θjc(t) [°C/W]
0.001
10-4 10-3 10-2 10-1 100 101 102
Time t [s]
2SK2333 Single Avalanche Energy Derating
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100
Single Avalanche Energy Derating [%]
80
60
40
20
0
0 50 100 150
Starting Channel Temperature Tch [°C]
2SK2333 Capacitance
10000
Ciss
1000
Capacitance Ciss Coss Crss [pF]
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Coss
100
Crss
10
Tc=25°C
TYP
1
0 20 40 60 80 100
Drain-Source Voltage VDS [V]
2SK2333 Single Avalanche Current - Inductive Load
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VDD = 100V
VGS = 15V → 0V
Rg = 100Ω
10 IAS = 6A
EAS = 190mJ
EAR = 19mJ
Single Avalanche Current IAS [A]
0.1
0.1 1 10 100
Inductance L [mH]
2SK2333 Power Derating
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100
80
Power Derating [%]
60
40
20
0
0 50 100 150
Case Temperature Tc [°C]
2SK2333 Gate Charge Characteristics
500 20
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VDS
400
Drain-Source Voltage VDS [V]
Gate-Source Voltage VGS [V]
15
VDD = 400V
300 200V
100V
VGS
10
200
5
100
ID = 6A
0 0
0 10 20 30 40 50
Gate Charge Qg [nC]